MC74AC10DG [ONSEMI]
Triple 3-Input NAND Gate;
| 型号： | MC74AC10DG |
| 厂家： | 
ONSEMI |
| 描述： | Triple 3-Input NAND Gate 栅 光电二极管 逻辑集成电路 |
| 文件： | 总8页 (文件大小：87K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MC74AC10, MC74ACT10
Triple 3-Input NAND Gate
High−Performance Silicon−Gate CMOS
Features
• Outputs Source/Sink 24 mA
• ′ACT10 Has TTL Compatible Inputs
• These are Pb−Free Devices
www.onsemi.com
MARKING
DIAGRAMS
14
V
CC
SOIC−14
D SUFFIX
CASE 751A
xxx10G
AWLYWW
14
13
12
11
10
9
8
14
1
1
14
xxx
10
1
2
3
4
5
6
7
TSSOP−14
DT SUFFIX
CASE 948G
GND
ALYWG
1
G
Figure 1. Pinout: 14−Lead Packages Conductors
14
(Top View)
1
xxx
A
= AC or ACT
= Assembly Location
WL or L = Wafer Lot
= Year
WW or W = Work Week
Y
G or G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2015
1
Publication Order Number:
January, 2015 − Rev. 9
MC74AC10/D
MC74AC10, MC74ACT10
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
V
V
V
V
DC Supply Voltage
*0.5 to )7.0
CC
I
DC Input Voltage
*0.5 v V v V )0.5
V
I
CC
DC Output Voltage
(Note 1)
*0.5 v V v V )0.5
V
O
O
CC
I
I
I
I
I
DC Input Diode Current
$20
mA
mA
mA
mA
mA
°C
IK
DC Output Diode Current
$50
$50
$50
$50
OK
O
DC Output Sink/Source Current
DC Supply Current per Output Pin
DC Ground Current per Output Pin
Storage Temperature Range
Lead temperature, 1 mm from Case for 10 Seconds
Junction temperature under Bias
Thermal Resistance (Note 2)
CC
GND
T
T
T
q
*65 to )150
260
STG
°C
L
J
)150
°C
SOIC
TSSOP
125
170
°C/W
JA
P
D
Power Dissipation in Still Air at 85°C
SOIC
TSSOP
125
170
mW
MSL
Moisture Sensitivity
Level 1
F
R
Flammability Rating
Oxygen Index: 30% − 35%
UL 94 V−0 @ 0.125 in
V
ESD
ESD Withstand Voltage
Human Body Model (Note 3)
Machine Model (Note 4)
> 2000
> 200
V
Charged Device Model (Note 5)
> 1000
I
Latch−Up Performance Above V and Below GND at 85°C (Note 6)
$100
mA
Latch−Up
CC
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. I absolute maximum rating must be observed.
O
2. The package thermal impedance is calculated in accordance with JESD51−7.
3. Tested to EIA/JESD22−A114−A.
4. Tested to EIA/JESD22−A115−A.
5. Tested to JESD22−C101−A.
6. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
2.0
4.5
0
Typ
5.0
5.0
−
Max
6.0
Unit
′AC
V
Supply Voltage
V
V
CC
′ACT
5.5
V , V
in out
DC Input Voltage, Output Voltage (Ref. to GND)
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
@ 3.0 V
@ 4.5 V
@ 5.5 V
@ 4.5 V
@ 5.5 V
−
150
40
25
10
8.0
−
−
Input Rise and Fall Time (Note 1)
′AC Devices except Schmitt Inputs
−
−
−
−
−
ns/V
t , t
r
f
−
−
Input Rise and Fall Time (Note 2)
′ACT Devices except Schmitt Inputs
t , t
ns/V
r
f
−
T
J
Junction Temperature (PDIP)
Operating Ambient Temperature Range
Output Current − High
−
140
85
°C
°C
T
A
−40
−
25
−
I
I
−24
24
mA
mA
OH
OL
Output Current − Low
−
−
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
1. V from 30% to 70% V ; see individual Data Sheets for devices that differ from the typical input rise and fall times.
in
CC
2. V from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.
in
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2
MC74AC10, MC74ACT10
DC CHARACTERISTICS
Symbol
74AC
74AC
T
A
=
V
(V)
CC
−40°C to
+85°C
T
= +25°C
Parameter
Unit
Conditions
A
Typ
Guaranteed Limits
V
V
V
3.0
4.5
5.5
1.5
2.25
2.75
2.1
3.15
3.85
2.1
3.15
3.85
V
= 0.1 V
Minimum High Level
Input Voltage
IH
OUT
V
V
V
or V − 0.1 V
CC
3.0
4.5
5.5
1.5
2.25
2.75
0.9
1.35
1.65
0.9
1.35
1.65
V
OUT
= 0.1 V
Maximum Low Level
Input Voltage
IL
or V − 0.1 V
CC
3.0
4.5
5.5
2.99
4.49
5.49
2.9
4.4
5.4
2.9
4.4
5.4
I
= −50 mA
Minimum High Level
Output Voltage
OH
OUT
*V = V or V
IH
IN
IL
3.0
4.5
5.5
−
−
−
2.56
3.86
4.86
2.46
3.76
4.76
−12 mA
−24 mA
−24 mA
V
V
I
OH
V
OL
3.0
4.5
5.5
0.002
0.001
0.001
0.1
0.1
0.1
0.1
0.1
0.1
I
= 50 mA
OUT
Maximum Low Level
Output Voltage
*V = V or V
IN
IL
IH
3.0
4.5
5.5
−
−
−
0.36
0.36
0.36
0.44
0.44
0.44
12 mA
24 mA
24 mA
V
I
OL
I
IN
Maximum Input
Leakage Current
5.5
−
0.1
1.0
mA
V = V , GND
I
CC
I
I
I
5.5
5.5
−
−
−
−
75
mA
mA
V
V
= 1.65 V Max
= 3.85 V Min
†Minimum Dynamic
Output Current
OLD
OHD
CC
OLD
−75
OHD
Maximum Quiescent
Supply Current
5.5
−
4.0
40
mA
V
= V or GND
IN CC
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
NOTE:
I
IN
and I @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V V
.
CC
CC
AC CHARACTERISTICS
Symbol
74AC
74AC
T
A
= −40°C
T
A
= +25°C
C = 50 pF
L
V
(V)
*
Fig.
No.
CC
to +85°C
C = 50 pF
Parameter
Unit
L
Min
Typ
Max
Min
Max
3.3
5.0
1.5
1.5
6.0
4.5
9.5
7.0
1.0
1.0
10.5
8.0
t
t
Propagation Delay
Propagation Delay
ns
ns
3−5
3−5
PLH
3.3
5.0
1.5
1.5
5.5
4.0
8.5
6.0
1.0
1.0
10.0
6.5
PHL
*Voltage Range 3.3 V is 3.3 V 0.3 V.
Voltage Range 5.0 V is 5.0 V 0.5 V.
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3
MC74AC10, MC74ACT10
DC CHARACTERISTICS
Symbol
74ACT
74ACT
T
A
=
V
(V)
CC
−40°C to
+85°C
T
= +25°C
Parameter
Unit
Conditions
A
Typ
Guaranteed Limits
V
V
V
4.5
5.5
1.5
1.5
2.0
2.0
2.0
2.0
V
= 0.1 V
Minimum High Level
Input Voltage
IH
OUT
V
V
V
or V − 0.1 V
CC
4.5
5.5
1.5
1.5
0.8
0.8
0.8
0.8
V
OUT
= 0.1 V
Maximum Low Level
Input Voltage
IL
or V − 0.1 V
CC
4.5
5.5
4.49
5.49
4.4
5.4
4.4
5.4
I
= −50 mA
Minimum High Level
Output Voltage
OH
OUT
*V = V or V
IH
IN
IL
4.5
5.5
−
−
3.86
4.86
3.76
4.76
V
−24 mA
−24 mA
I
I
OH
V
OL
4.5
5.5
0.001
0.001
0.1
0.1
0.1
0.1
= 50 mA
OUT
Maximum Low Level
Output Voltage
V
V
*V = V or V
IN
IL
IH
4.5
5.5
−
−
0.36
0.36
0.44
0.44
24 mA
24 mA
I
OL
I
IN
Maximum Input
Leakage Current
5.5
−
0.1
1.0
mA
V = V , GND
I CC
DI
Additional Max. I /Input
5.5
5.5
5.5
0.6
−
−
−
−
1.5
75
mA
mA
mA
V = V − 2.1 V
CCT
CC
I
CC
I
V
OLD
V
OHD
= 1.65 V Max
†Minimum Dynamic
Output Current
OLD
I
−
−75
= 3.85 V Min
OHD
CC
I
Maximum Quiescent
Supply Current
5.5
−
4.0
40
mA
V = V or GND
IN CC
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
AC CHARACTERISTICS
74ACT
74ACT
T
= −40°C
A
T
= +25°C
V
(V)
*
Fig.
No.
A
CC
to +85°C
C = 50 pF
Symbol
Parameter
Unit
C = 50 pF
L
L
Min
1.0
1.0
Typ
−
Max
9.0
Min
1.0
1.0
Max
10.0
9.5
t
t
Propagation Delay
Propagation Delay
5.0
5.0
ns
ns
3−5
3−5
PLH
−
9.0
PHL
*Voltage Range 5.0 V is 5.0 V 0.5 V.
CAPACITANCE
Symbol
Value
Parameter
Unit
Test Conditions
Typ
4.5
25
C
C
Input Capacitance
Power Dissipation Capacitance
pF
pF
V
V
= 5.0 V
= 5.0 V
IN
CC
PD
CC
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4
MC74AC10, MC74ACT10
ORDERING INFORMATION
†
Device
Package
Shipping
MC74AC10DG
SOIC−14
(Pb−Free)
55 Units/Rail
MC74AC10DR2G
MC74ACT10DR2G
MC74ACT10DTR2G
SOIC−14
(Pb−Free)
2500/Tape & Reel
2500/Tape & Reel
2500/Tape & Reel
SOIC−14
(Pb−Free)
TSSOP−14
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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5
MC74AC10, MC74ACT10
PACKAGE DIMENSIONS
SOIC−14 NB
CASE 751A−03
ISSUE K
NOTES:
D
A
B
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF AT
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD PROTRUSIONS.
14
8
7
A3
E
H
5. MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
L
DETAIL A
1
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
13X b
M
M
B
0.25
A
A1
A3
b
D
E
1.35
0.10
0.19
0.35
8.55
3.80
1.75 0.054 0.068
0.25 0.004 0.010
0.25 0.008 0.010
0.49 0.014 0.019
8.75 0.337 0.344
4.00 0.150 0.157
M
S
S
B
0.25
C
A
DETAIL A
h
A
X 45
_
e
H
h
L
1.27 BSC
0.050 BSC
6.20 0.228 0.244
0.50 0.010 0.019
1.25 0.016 0.049
5.80
0.25
0.40
0
M
A1
e
M
7
0
7
_
_
_
_
SEATING
PLANE
C
SOLDERING FOOTPRINT*
6.50
14X
1.18
1
1.27
PITCH
14X
0.58
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
6
MC74AC10, MC74ACT10
PACKAGE DIMENSIONS
TSSOP−14
CASE 948G
ISSUE B
NOTES:
14X K REF
1. DIMENSIONING AND TOLERANCING PER ANSI
M
S
S
V
Y14.5M, 1982.
0.10 (0.004)
T
U
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH
OR PROTRUSION SHALL NOT EXCEED 0.25
(0.010) PER SIDE.
S
0.15 (0.006) T
U
N
0.25 (0.010)
14
8
2X L/2
M
B
−U−
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
L
N
PIN 1
IDENT.
F
7
1
DETAIL E
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE −W−.
S
K
0.15 (0.006) T
U
A
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
K1
−V−
A
B
C
D
F
4.90
4.30
−−−
0.05
0.50
5.10 0.193 0.200
4.50 0.169 0.177
J J1
1.20
−−− 0.047
0.15 0.002 0.006
0.75 0.020 0.030
SECTION N−N
G
H
J
J1
K
0.65 BSC
0.026 BSC
0.60 0.020 0.024
0.20 0.004 0.008
0.16 0.004 0.006
0.30 0.007 0.012
0.25 0.007 0.010
0.50
0.09
0.09
0.19
−W−
C
K1 0.19
L
M
6.40 BSC
0.252 BSC
0.10 (0.004)
0
8
0
8
_
_
_
_
SEATING
PLANE
−T−
H
G
DETAIL E
D
SOLDERING FOOTPRINT*
7.06
1
0.65
PITCH
14X
0.36
14X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
7
MC74AC10, MC74ACT10
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which
the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or
unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable
copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
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Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
For additional information, please contact your local
Sales Representative
MC74AC10/D
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