MC74AC138_15 [ONSEMI]
1-of-8 Decoder/Demultiplexer;
| 型号： | MC74AC138_15 |
| 厂家： | 
ONSEMI |
| 描述： | 1-of-8 Decoder/Demultiplexer |
| 文件： | 总10页 (文件大小：105K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MC74AC138, MC74ACT138
1-of-8
Decoder/Demultiplexer
The MC74AC138/74ACT138 is a high−speed 1−of−8
decoder/demultiplexer. This device is ideally suited for high−speed
bipolar memory chip select address decoding.
The multiple input enables allow parallel expansion to a 1−of−24
decoder using just three MC74AC138/74ACT138 devices or a
1−of−32 decoder using four MC74AC138/74ACT138 devices and one
inverter.
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MARKING
DIAGRAMS
16
1
• Demultiplexing Capability
SOIC−16
D SUFFIX
CASE 751B
xxx138G
AWLYWW
• Multiple Input Enable for Easy Expansion
• Active LOW Mutually Exclusive Outputs
• Outputs Source/Sink 24 mA
16
1
16
• ′ACT138 Has TTL Compatible Inputs
• These are Pb−Free Devices
xxx
138
TSSOP−16
DT SUFFIX
CASE 948F
16
ALYWG
G
1
V
CC
O
0
O
1
O
2
O
3
O
4
O
5
O
6
1
16
15
14
13
12
11
10
9
xxx
= AC or ACT
A
= Assembly Location
WL or L = Wafer Lot
= Year
WW or W = Work Week
Y
G or G
= Pb−Free Package
(Note: Microdot may be in either location)
1
2
3
4
5
6
7
8
A
0
A
1
A
2
E
1
E
2
E
3
O
7
GND
Figure 1. Pinout: 16−Lead Packages Conductors
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
A
0
A
1
A
2
E E E
1 2 3
O
0
O O O O O O O
1 2 3 4 5 6 7
Figure 2. Logic Symbol
PIN ASSIGNMENT
PIN
A −A
FUNCTION
Address Inputs
Enable Inputs
Enable Input
Outputs
0
2
2
E −E
1
E
3
O −O
0
7
© Semiconductor Components Industries, LLC, 2015
1
Publication Order Number:
January, 2015 − Rev. 7
MC74AC138/D
MC74AC138, MC74ACT138
FUNCTIONAL DESCRIPTION
HIGH. This multiple enabled function allows easy parallel
expansion of the device to a 1−of−32 (5 lines to 32 lines)
decoder with just four MC74AC138/74ACT138 devices
The MC74AC138/74ACT138 high−speed 1−of−8
decoder/demultiplexer accepts three binary weighted inputs
and
one
inverter
(See
Figure
4).
The
(A , A , A ) and, when enabled, provides eight mutually
0
1
2
MC74AC138/74ACT138 can be used as an 8−output
demultiplexer by using one of the active LOW Enable inputs
as the data input and the other Enable inputs as strobes. The
Enable inputs which are not used must be permanently tied
to their appropriate active−HIGH or active−LOW state.
exclusive
MC74AC138/74ACT138 features three Enable inputs, two
active−LOW (E , E ) and one active−HIGH (E ). All
active−LOW
outputs
(O −O ).
The
0
7
1
2
3
outputs will be HIGH unless E and E are LOW and E is
1
2
3
TRUTH TABLE
Inputs
Outputs
E
1
E
2
E
3
A
0
A
1
A
2
O
O
O
O
O
O
O
O
7
0
1
2
3
4
5
6
H
X
X
X
X
X
H
H
H
H
H
H
H
H
X
X
H
X
X
L
X
X
X
X
X
X
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
L
L
L
L
L
L
L
L
H
H
H
H
L
H
L
L
L
H
H
L
L
L
L
L
H
H
H
H
L
H
H
H
H
L
H
H
H
L
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
L
L
L
L
L
L
L
L
H
H
H
H
L
H
L
L
L
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
L
H
H
H
H
L
H
H
H
H
L
H
H
H
L
H
H
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
E
1
E E
2 3
A
2
A
1
A
0
0
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
NOTE: This diagram is provided only for the understanding of logic
operations and should not be used to estimate propagation
delays.
Figure 3. Logic Diagram
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2
MC74AC138, MC74ACT138
A
0
A
1
A
2
′04
A
A
3
4
H
123
123
123
E
123
E
A
A
0
A
E
A
A
A
0
E
A
0
A
A
A
A
A
2
0
1
2
0
1
2
0
1
2
0
1
0
0
0
0
3
0
4
0
5
0
6
0
0
0
0
1
0
2
0
4
0
5
0
6
0
0
0
0
0
0
4
0
5
0
0
7
0
0
0
1
0
2
0
0 0 0 0
3 4 5 6 7
1
2
7
3
7
1
2
3
6
0
0
0
31
Figure 4. Expansion to 1−of−32 Decoding
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3
MC74AC138, MC74ACT138
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
V
V
V
V
DC Supply Voltage
*0.5 to )7.0
CC
I
DC Input Voltage
*0.5 v V v V )0.5
V
I
CC
DC Output Voltage
(Note 1)
*0.5 v V v V )0.5
V
O
O
CC
I
I
I
I
I
DC Input Diode Current
$20
mA
mA
mA
mA
mA
°C
IK
DC Output Diode Current
$50
$50
$50
$50
OK
O
DC Output Sink/Source Current
DC Supply Current per Output Pin
DC Ground Current per Output Pin
Storage Temperature Range
Lead temperature, 1 mm from Case for 10 Seconds
Junction temperature under Bias
Thermal Resistance (Note 2)
CC
GND
T
T
T
q
*65 to )150
260
STG
°C
L
J
)150
°C
SOIC
TSSOP
69.1
103.8
°C/W
JA
P
D
Power Dissipation in Still Air at 65°C (Note 3)
SOIC
TSSOP
500
500
mW
MSL
Moisture Sensitivity
Level 1
F
R
Flammability Rating
Oxygen Index: 30% − 35%
UL 94 V−0 @ 0.125 in
V
ESD
ESD Withstand Voltage
Human Body Model (Note 4)
Machine Model (Note 5)
> 2000
> 200
V
Charged Device Model (Note 6)
> 1000
I
Latch−Up Performance Above V and Below GND at 85°C (Note 7)
$100
mA
Latch−Up
CC
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. I absolute maximum rating must be observed.
O
2. The package thermal impedance is calculated in accordance with JESD51−7.
3. 500 mW at 65°C; derate to 300 mW by 10 mW/ from 65°C to 85°C.
4. Tested to EIA/JESD22−A114−A.
5. Tested to EIA/JESD22−A115−A.
6. Tested to JESD22−C101−A.
7. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
2.0
4.5
0
Typ
5.0
5.0
−
Max
6.0
Unit
′AC
V
V
Supply Voltage
V
V
CC
′ACT
5.5
, V
OUT
DC Input Voltage, Output Voltage (Ref. to GND)
V
CC
IN
V
CC
V
CC
V
CC
V
CC
V
CC
@ 3.0 V
@ 4.5 V
@ 5.5 V
@ 4.5 V
@ 5.5 V
−
150
40
25
10
8.0
−
−
Input Rise and Fall Time (Note 1)
′AC Devices except Schmitt Inputs
−
−
−
−
−
ns/V
t , t
r
f
−
−
Input Rise and Fall Time (Note 2)
′ACT Devices except Schmitt Inputs
t , t
ns/V
r
f
−
T
J
Junction Temperature (PDIP)
Operating Ambient Temperature Range
Output Current − High
−
140
85
°C
°C
T
A
−40
−
25
−
I
I
−24
24
mA
mA
OH
OL
Output Current − Low
−
−
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
1. V from 30% to 70% V ; see individual Data Sheets for devices that differ from the typical input rise and fall times.
IN
CC
2. V from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.
IN
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4
MC74AC138, MC74ACT138
DC CHARACTERISTICS
Symbol
74AC
74AC
T
A
=
V
(V)
CC
T
= +25°C
Parameter
Unit
Conditions
A
−40°C to +85°C
Typ
Guaranteed Limits
V
V
V
3.0
4.5
5.5
1.5
2.25
2.75
2.1
3.15
3.85
2.1
3.15
3.85
V
= 0.1 V
Minimum High Level
Input Voltage
IH
OUT
V
V
V
or V − 0.1 V
CC
3.0
4.5
5.5
1.5
2.25
2.75
0.9
1.35
1.65
0.9
1.35
1.65
V
OUT
= 0.1 V
Maximum Low Level
Input Voltage
IL
or V − 0.1 V
CC
3.0
4.5
5.5
2.99
4.49
5.49
2.9
4.4
5.4
2.9
4.4
5.4
I
= −50 μA
Minimum High Level
Output Voltage
OH
OUT
*V = V or V
IH
IN
IL
3.0
4.5
5.5
−
−
−
2.56
3.86
4.86
2.46
3.76
4.76
−12 mA
−24 mA
−24 mA
V
V
I
OH
V
OL
3.0
4.5
5.5
0.002
0.001
0.001
0.1
0.1
0.1
0.1
0.1
0.1
I
= 50 μA
OUT
Maximum Low Level
Output Voltage
*V = V or V
IN
IL
IH
3.0
4.5
5.5
−
−
−
0.36
0.36
0.36
0.44
0.44
0.44
12 mA
24 mA
24 mA
V
I
OL
I
IN
Maximum Input
Leakage Current
5.5
−
0.1
1.0
μA
V = V , GND
I
CC
I
I
I
5.5
5.5
−
−
−
−
75
mA
mA
V
V
= 1.65 V Max
= 3.85 V Min
†Minimum Dynamic
Output Current
OLD
OHD
CC
OLD
−75
OHD
Maximum Quiescent
Supply Current
5.5
−
8.0
80
μA
V
IN
= V or GND
CC
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
NOTE:
I
IN
and I @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V V
.
CC
CC
AC CHARACTERISTICS
74AC
74AC
T
= +25°C
T
A
= −40°C to +85°C
V
(V)
*
Fig.
A
CC
Symbol
Parameter
Unit
No.
C = 50 pF
C = 50 pF
L
L
Min
Typ
Max
Min
1.5
Max
3.3
5.0
1.5
1.5
8.5
6.5
13.0
9.5
15.0
10.5
Propagation Delay
A to O
t
t
t
t
t
t
ns
ns
ns
ns
ns
ns
3−6
3−6
3−6
3−6
3−6
3−6
PLH
PHL
PLH
PHL
PLH
PHL
1.5
n
n
3.3
5.0
1.5
1.5
8.0
6.0
12.5
9.0
1.5
1.5
14.0
10.5
Propagation Delay
A to O
n
n
3.3
5.0
1.5
1.5
11.0
8.0
15.0
11.0
1.5
1.5
16.0
12.0
Propagation Delay
E or E to O
1
2
n
3.3
5.0
1.5
1.5
9.5
7.0
13.5
9.5
1.5
1.5
15.0
10.5
Propagation Delay
E or E to O
1
2
n
3.3
5.0
1.5
1.5
11.0
8.0
15.5
11.0
1.5
1.5
16.5
12.5
Propagation Delay
E to O
3
n
3.3
5.0
1.5
1.5
8.5
6.0
13.0
8.0
1.5
1.0
14.0
9.5
Propagation Delay
E to O
3
n
*Voltage Range 3.3 V is 3.3 V 0.3 V.
*Voltage Range 5.0 V is 5.0 V 0.5 V.
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5
MC74AC138, MC74ACT138
DC CHARACTERISTICS
Symbol
74ACT
74ACT
T
A
=
V
(V)
CC
T
= +25°C
Parameter
Unit
Conditions
A
−40°C to +85°C
Typ
Guaranteed Limits
V
V
V
4.5
5.5
1.5
1.5
2.0
2.0
2.0
2.0
V
= 0.1 V
Minimum High Level
Input Voltage
IH
OUT
V
V
V
or V − 0.1 V
CC
4.5
5.5
1.5
1.5
0.8
0.8
0.8
0.8
V
OUT
= 0.1 V
Maximum Low Level
Input Voltage
IL
or V − 0.1 V
CC
4.5
5.5
4.49
5.49
4.4
5.4
4.4
5.4
I
= −50 μA
Minimum High Level
Output Voltage
OH
OUT
*V = V or V
IH
IN
IL
4.5
5.5
−
−
3.86
4.86
3.76
4.76
V
V
−24 mA
−24 mA
I
I
OH
V
OL
4.5
5.5
0.001
0.001
0.1
0.1
0.1
0.1
= 50 μA
OUT
Maximum Low Level
Output Voltage
*V = V or V
IN
IL
IH
4.5
5.5
−
−
0.36
0.36
0.44
0.44
V
24 mA
24 mA
I
OL
I
IN
Maximum Input
Leakage Current
5.5
−
0.1
1.0
μA
V = V , GND
I CC
ΔI
Additional Max. I /Input
5.5
5.5
5.5
0.6
−
−
−
−
1.5
75
mA
mA
mA
V = V − 2.1 V
CCT
CC
I
CC
I
V
= 1.65 V Max
†Minimum Dynamic
Output Current
OLD
OLD
OHD
I
−
−75
V
= 3.85 V Min
OHD
CC
I
Maximum Quiescent
Supply Current
5.5
−
8.0
80
μA
V
IN
= V or GND
CC
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
AC CHARACTERISTICS
74ACT
74ACT
T
= +25°C
T
A
= −40°C to +85°C
V
(V)
*
Fig.
A
CC
Symbol
Parameter
Unit
No.
C = 50 pF
C = 50 pF
L
L
Min
Typ
Max
Min
1.5
Max
Propagation Delay
A to O
t
t
t
t
t
t
5.0
5.0
5.0
5.0
5.0
5.0
1.5
7.0
10.5
11.5
ns
ns
ns
ns
ns
ns
3−6
3−6
3−6
3−6
3−6
3−6
PLH
n
n
Propagation Delay
A to O
1.5
2.5
2.0
2.5
2.0
6.5
8.0
7.5
8.0
6.5
10.5
11.5
11.5
12.0
10.5
1.5
2.0
2.0
2.0
1.5
11.5
12.5
12.5
13.0
11.5
PHL
PLH
PHL
PLH
PHL
n
n
Propagation Delay
E or E to O
1
2
n
Propagation Delay
E or E to O
1
2
n
Propagation Delay
E
3 to
O
n
Propagation Delay
E to O
3
n
*Voltage Range 5.0 V is 5.0 V 0.5 V
CAPACITANCE
Value
Symbol
Parameter
Unit
Test Conditions
Typ
4.5
60
C
C
Input Capacitance
Power Dissipation Capacitance
pF
pF
V
V
= 5.0 V
= 5.0 V
IN
CC
PD
CC
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6
MC74AC138, MC74ACT138
ORDERING INFORMATION
Device Order Number
MC74AC138DG
†
Package
Shipping
SOIC−16
(Pb−Free)
48 Units / Rail
2500 Tape & Reel
2500 Tape & Reel
48 Units / Rail
MC74AC138DR2G
MC74AC138DTR2G
MC74ACT138DG
SOIC−16
(Pb−Free)
TSSOP−16
(Pb−Free)
SOIC−16
(Pb−Free)
MC74ACT138DR2G
MC74ACT138DTR2G
SOIC−16
(Pb−Free)
2500 Tape & Reel
2500 Tape & Reel
TSSOP−16
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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7
MC74AC138, MC74ACT138
PACKAGE DIMENSIONS
SOIC−16
D SUFFIX
CASE 751B−05
ISSUE K
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
−A−
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
16
9
8
−B−
P 8 PL
M
S
B
0.25 (0.010)
1
MILLIMETERS
INCHES
MIN
0.386
DIM MIN
MAX
MAX
0.393
0.157
0.068
0.019
0.049
A
B
C
D
F
9.80
3.80
1.35
0.35
0.40
10.00
G
4.00 0.150
1.75 0.054
0.49 0.014
1.25 0.016
F
R X 45
K
_
G
J
1.27 BSC
0.050 BSC
0.19
0.10
0
0.25 0.008
0.25 0.004
0.009
0.009
7
K
M
P
R
C
7
0
_
_
_
_
−T−
SEATING
PLANE
5.80
0.25
6.20 0.229
0.50 0.010
0.244
0.019
J
M
D
16 PL
M
S
S
0.25 (0.010)
T
B
A
SOLDERING FOOTPRINT*
8X
6.40
16X
1.12
1
16
16X
0.58
1.27
PITCH
8
9
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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8
MC74AC138, MC74ACT138
PACKAGE DIMENSIONS
TSSOP−16
DT SUFFIX
CASE 948F
ISSUE B
16X KREF
NOTES:
M
S
S
0.10 (0.004)
T
U
V
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
S
U
0.15 (0.006) T
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH. PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
K
K1
16
9
2X L/2
J1
SECTION N−N
B
−U−
L
J
PIN 1
IDENT.
N
8
0.25 (0.010)
1
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
M
S
0.15 (0.006) T
U
A
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
N
−V−
A
B
C
4.90
4.30
−−−
5.10 0.193 0.200
4.50 0.169 0.177
1.20
F
−−− 0.047
DETAIL E
D
F
0.05
0.50
0.15 0.002 0.006
0.75 0.020 0.030
G
H
J
J1
K
K1
L
0.65 BSC
0.026 BSC
−W−
0.18
0.09
0.09
0.19
0.19
0.28 0.007 0.011
C
0.20 0.004 0.008
0.16 0.004 0.006
0.30 0.007 0.012
0.25 0.007 0.010
0.10 (0.004)
DETAIL E
H
SEATING
PLANE
−T−
6.40 BSC
0.252 BSC
D
G
M
0
8
0
8
_
_
_
_
SOLDERING FOOTPRINT*
7.06
1
0.65
PITCH
16X
0.36
16X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
9
MC74AC138, MC74ACT138
ON Semiconductor and the
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