MC74AC14MR1 [ONSEMI]

AC SERIES, HEX 1-INPUT INVERT GATE, PDSO14, EIAJ, SO-14;
MC74AC14MR1
型号: MC74AC14MR1
厂家: ONSEMI    ONSEMI
描述:

AC SERIES, HEX 1-INPUT INVERT GATE, PDSO14, EIAJ, SO-14

栅 输入元件 光电二极管 逻辑集成电路 触发器
文件: 总8页 (文件大小:126K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
MC74AC14, MC74ACT14  
Hex Inverter Schmitt  
Trigger  
The MC74AC14/74ACT14 contains six logic inverters which  
accept standard CMOS Input signals (TTL levels for MC74ACT14)  
and provide standard CMOS output levels. They are capable of  
transforming slowly changing input signals into sharply defined,  
jitterfree output signals. In addition, they have a greater noise margin  
then conventional inverters.  
http://onsemi.com  
The MC74AC14/74ACT14 has hysteresis between the  
positivegoing and negativegoing input thresholds (typically 1.0 V)  
which is determined internally by transistor ratios and is essentially  
insensitive to temperature and supply voltage variations.  
PDIP14  
SUFFIX N  
CASE 646  
14  
1
SOIC14  
SUFFIX D  
CASE 751A  
Features  
14  
Schmitt Trigger Inputs  
1
Outputs Source/Sink 24 mA  
MC74ACT14 Has TTL Compatible Inputs  
PbFree Packages are Available  
TSSOP14  
SUFFIX DT  
CASE 948G  
14  
14  
1
MAXIMUM RATINGS  
SOEIAJ14  
SUFFIX M  
CASE 965  
Rating  
Symbol  
Value  
Unit  
V
DC Supply Voltage (Referenced to GND)  
DC Input Voltage (Referenced to GND)  
DC Output Voltage (Referenced to GND)  
DC Input Current, per Pin  
V
CC  
0.5 to +7.0  
1
V
in  
0.5 to V +0.5  
V
CC  
V
out  
0.5 to V +0.5  
V
CC  
V
CC  
14  
13  
12  
11  
10  
9
8
I
in  
20  
50  
mA  
mA  
°C  
mJ  
DC Output Sink/Source Current, per Pin  
I
out  
CC  
DC V or GND Current per Output Pin  
I
50  
CC  
Storage Temperature  
T
stg  
65 to +150  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1
2
3
4
5
6
7
GND  
(Top View)  
Figure 1. Pinout: 14Lead Packages  
Conductors  
FUNCTION TABLE  
Input  
A
Output  
O
L
H
H
L
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 4 of this data sheet.  
DEVICE MARKING INFORMATION  
See general marking information in the device marking  
section on page 4 of this data sheet.  
©
Semiconductor Components Industries, LLC, 2011  
1
Publication Order Number:  
August, 2011 Rev. 8  
MC74AC14/D  
MC74AC14, MC74ACT14  
RECOMMENDED OPERATING CONDITIONS  
Symbol  
Parameter  
Min  
2.0  
4.5  
Typ  
5.0  
5.0  
Max  
6.0  
Unit  
V
AC  
V
CC  
Supply Voltage  
ACT  
5.5  
V , V  
DC Input Voltage, Output Voltage (Ref. to GND)  
0
150  
40  
25  
10  
8.0  
V
V
in out  
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
@ 3.0 V  
@ 4.5 V  
@ 5.5 V  
@ 4.5 V  
@ 5.5 V  
Input Rise and Fall Time (Note 1)  
AC Devices except Schmitt Inputs  
ns/V  
t , t  
r
f
f
Input Rise and Fall Time (Note 2)  
ACT Devices except Schmitt Inputs  
t , t  
r
ns/V  
T
Junction Temperature (PDIP)  
Operating Ambient Temperature Range  
Output Current High  
140  
85  
°C  
°C  
J
T
A
40  
25  
I
24  
24  
mA  
mA  
OH  
I
OL  
Output Current Low  
1. V from 30% to 70% V ; see individual Data Sheets for devices that differ from the typical input rise and fall times.  
in  
CC  
2. V from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.  
in  
DC CHARACTERISTICS  
74AC  
74AC  
V
(V)  
CC  
T
= +25°C  
T
= 40°C to +85°C  
Symbol  
Parameter  
Unit  
Conditions  
A
A
Typ  
Guaranteed Limits  
V
OH  
Minimum High Level Output Voltage  
3.0  
4.5  
5.5  
2.99  
4.49  
5.49  
2.9  
4.4  
5.4  
2.9  
4.4  
5.4  
I
= 50 mA  
OUT  
V
*V = V or V  
IN  
IL  
IH  
3.0  
4.5  
5.5  
2.56  
3.86  
4.86  
2.46  
3.76  
4.76  
12 mA  
24 mA  
24 mA  
V
V
I
OH  
V
OL  
Maximum Low Level Output Voltage  
3.0  
4.5  
5.5  
0.002  
0.001  
0.001  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
I
= 50 mA  
OUT  
*V = V or V  
IN  
IL  
IH  
3.0  
4.5  
5.5  
0.36  
0.36  
0.36  
0.44  
0.44  
0.44  
12 mA  
24 mA  
24 mA  
V
I
OL  
I
Maximum Input Leakage Current  
†Minimum Dynamic Output Current  
IN  
5.5  
0.1  
1.0  
mA  
V = V , GND  
I
CC  
I
5.5  
5.5  
5.5  
75  
75  
40  
mA  
mA  
mA  
V
V
V
= 1.65 V Max  
= 3.85 V Min  
OLD  
OLD  
I
OHD  
OHD  
I
Maximum Quiescent Supply Current  
4.0  
= V or GND  
IN CC  
CC  
*All outputs loaded; thresholds on input associated with output under test.  
†Maximum test duration 2.0 ms, one output loaded at a time.  
NOTE:  
I
IN  
and I @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V V  
.
CC  
CC  
AC CHARACTERISTICS (For Figures and Waveforms See Section 3 of the ON Semiconductor FACT Data Book, DL138/D)  
74AC  
74AC  
T
= 40°C to  
V
(V)  
*
Figure  
No.  
A
CC  
T
A
= +25°C C = 50 pF  
Symbol  
Parameter  
Unit  
L
+85°C C = 50 pF  
L
Min  
Typ  
Max  
Min  
Max  
3.3  
5.0  
1.5  
1.5  
9.5  
7.0  
13.5  
10.0  
1.5  
1.5  
15.0  
11.0  
t
t
Propagation Delay  
Propagation Delay  
ns  
ns  
35  
35  
PLH  
3.3  
5.0  
1.5  
1.5  
7.5  
6.0  
11.5  
8.5  
1.5  
1.5  
13.0  
9.5  
PHL  
*Voltage Range 3.3 V is 3.3 V 0.3 V. Voltage Range 5.0 V is 5.0 V 0.5 V.  
http://onsemi.com  
2
 
MC74AC14, MC74ACT14  
INPUT CHARACTERISTICS (unless otherwise specified)  
V
(V)  
CC  
74AC  
74ACT  
Symbol  
Parameter  
Test Conditions  
3.0  
4.5  
5.5  
2.2  
3.2  
3.9  
2.0  
2.0  
V
V
V
V
V
T = Worst Case  
Maximum Positive Threshold  
Minimum Negative Threshold  
Maximum Hysteresis  
t +  
A
3.0  
4.5  
5.5  
0.5  
0.9  
1.1  
0.8  
0.8  
V
T = Worst Case  
A
t  
3.0  
4.5  
5.5  
1.2  
1.4  
1.6  
1.2  
1.2  
V
T = Worst Case  
A
h(max)  
3.0  
4.5  
5.5  
0.3  
0.4  
0.5  
0.4  
0.4  
V
Minimum Hysteresis  
T = Worst Case  
A
h(min)  
DC CHARACTERISTICS  
Symbol  
74ACT  
= +25°C  
74ACT  
T = 40°C to +85°C  
A
V
(V)  
CC  
T
Parameter  
Unit  
Conditions  
A
Typ  
Guaranteed Limits  
V
Minimum High Level Output Voltage  
Maximum Low Level Output Voltage  
Maximum Input Leakage Current  
4.5  
5.5  
4.49  
5.49  
4.4  
5.4  
4.4  
5.4  
I
= 50 mA  
OH  
OUT  
V
V
*V = V or V  
IN  
IL  
IH  
4.5  
5.5  
3.86  
4.86  
3.76  
4.76  
24 mA  
I
OH  
24 mA  
= 50 mA  
OUT  
V
4.5  
5.5  
0.001  
0.001  
0.1  
0.1  
0.1  
0.1  
I
OL  
V
*V = V or V  
IN  
IL  
IH  
4.5  
5.5  
0.36  
0.36  
0.44  
0.44  
V
24 mA  
24 mA  
I
OL  
I
IN  
5.5  
0.1  
1.0  
mA  
V = V , GND  
I CC  
DI  
Additional Max. I /Input  
5.5  
5.5  
5.5  
5.5  
0.6  
1.5  
75  
mA  
mA  
mA  
mA  
V = V 2.1 V  
CCT  
CC  
I
CC  
I
†Minimum Dynamic Output Current  
V
V
V
= 1.65 V Max  
OLD  
OLD  
OHD  
I
75  
40  
= 3.85 V Min  
OHD  
I
Maximum Quiescent Supply Current  
4.0  
= V or GND  
IN CC  
CC  
*All outputs loaded; thresholds on input associated with output under test.  
†Maximum test duration 2.0 ms, one output loaded at a time.  
AC CHARACTERISTICS (For Figures and Waveforms See Section 3 of the ON Semiconductor FACT Data Book, DL138/D)  
74ACT  
74ACT  
T
= 40°C to  
V
(V)  
*
Figure  
No.  
A
CC  
T
A
= +25°C C = 50 pF  
Symbol  
Parameter  
Unit  
L
+85°C C = 50 pF  
L
Min  
Typ  
Max  
Min  
Max  
t
t
Propagation Delay  
Propagation Delay  
5.0  
5.0  
1.5  
11.5  
1.0  
12.5  
ns  
ns  
35  
35  
PLH  
1.5  
10.0  
1.0  
11.0  
PHL  
*Voltage Range 5.0 V is 5.0 V 0.5 V.  
CAPACITANCE  
Symbol  
Parameter  
Value Typ  
Unit  
Test Conditions  
C
Input Capacitance  
Power Dissipation Capacitance  
4.5  
pF  
pF  
V
= 5.0 V  
= 5.0 V  
IN  
CC  
CC  
C
PD  
25  
V
http://onsemi.com  
3
MC74AC14, MC74ACT14  
ORDERING INFORMATION  
Device  
Package  
Shipping  
MC74AC14NG  
PDIP14  
(PbFree)  
25 Units / Rail  
55 Units / Rail  
MC74ACT14NG  
PDIP14  
(PbFree)  
MC74AC14D  
SOIC14  
MC74AC14DG  
SOIC14  
(PbFree)  
MC74AC14DR2G  
MC74ACT14DG  
SOIC14  
(PbFree)  
2500 / Tape & Reel  
55 Units / Rail  
SOIC14  
(PbFree)  
MC74ACT14DR2  
MC74ACT14DR2G  
SOIC14  
SOIC14  
(PbFree)  
MC74AC14DTR2  
MC74AC14DTR2G  
MC74ACT14DTR2  
MC74ACT14DTR2G  
MC74AC14MEL  
TSSOP14*  
TSSOP14*  
TSSOP14*  
TSSOP14*  
SOEIAJ14  
2500 / Tape & Reel  
MC74AC14MELG  
SOEIAJ14  
(PbFree)  
2000 / Tape & Reel  
MC74ACT14MELG  
SOEIAJ14  
(PbFree)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
*This package is inherently PbFree.  
MARKING DIAGRAMS  
PDIP14  
SOIC14  
TSSOP14  
SOEIAJ14  
14  
14  
14  
14  
1
AC  
14  
74AC14  
ALYWG  
MC74AC14N  
AWLYYWWG  
AC14G  
AWLYWW  
ALYWG  
G
1
1
1
14  
14  
14  
14  
1
ACT  
14  
74ACT14  
ALYWG  
MC74ACT14N  
AWLYYWWG  
ACT14G  
AWLYWW  
ALYWG  
G
1
1
1
A
WL, L  
YY, Y  
= Assembly Location  
= Wafer Lot  
= Year  
WW, W = Work Week  
G or G  
= PbFree Package  
(Note: Microdot may be in either location)  
http://onsemi.com  
4
MC74AC14, MC74ACT14  
PACKAGE DIMENSIONS  
PDIP14  
CASE 64606  
ISSUE P  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION L TO CENTER OF LEADS WHEN  
FORMED PARALLEL.  
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.  
5. ROUNDED CORNERS OPTIONAL.  
14  
1
8
7
B
INCHES  
MILLIMETERS  
A
F
DIM  
A
B
C
D
F
MIN  
MAX  
0.770  
0.260  
0.185  
0.021  
0.070  
MIN  
18.16  
6.10  
3.69  
0.38  
1.02  
MAX  
19.56  
6.60  
4.69  
0.53  
1.78  
0.715  
0.240  
0.145  
0.015  
0.040  
L
N
C
G
H
J
K
L
M
N
0.100 BSC  
2.54 BSC  
0.052  
0.008  
0.115  
0.290  
−−−  
0.095  
0.015  
0.135  
0.310  
10  
1.32  
0.20  
2.92  
7.37  
−−−  
0.38  
2.41  
0.38  
3.43  
7.87  
10  
T−  
SEATING  
PLANE  
J
_
_
K
0.015  
0.039  
1.01  
D 14 PL  
H
G
M
M
0.13 (0.005)  
http://onsemi.com  
5
MC74AC14, MC74ACT14  
PACKAGE DIMENSIONS  
SOIC14 NB  
CASE 751A03  
ISSUE K  
NOTES:  
D
A
B
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994.  
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. DIMENSION b DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE PROTRUSION  
SHALL BE 0.13 TOTAL IN EXCESS OF AT  
MAXIMUM MATERIAL CONDITION.  
4. DIMENSIONS D AND E DO NOT INCLUDE  
MOLD PROTRUSIONS.  
14  
8
7
A3  
E
H
5. MAXIMUM MOLD PROTRUSION 0.15 PER  
SIDE.  
L
1
DETAIL A  
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN MAX  
13X b  
M
M
B
0.25  
A
A1  
A3  
b
D
E
1.35  
0.10  
0.19  
0.35  
8.55  
3.80  
1.75 0.054 0.068  
0.25 0.004 0.010  
0.25 0.008 0.010  
0.49 0.014 0.019  
8.75 0.337 0.344  
4.00 0.150 0.157  
M
S
S
B
0.25  
C
A
DETAIL A  
h
A
X 45  
_
e
H
h
L
1.27 BSC  
0.050 BSC  
6.20 0.228 0.244  
0.50 0.010 0.019  
1.25 0.016 0.049  
5.80  
0.25  
0.40  
0
M
A1  
e
M
7
0
7
_
_
_
_
SEATING  
PLANE  
C
SOLDERING FOOTPRINT*  
6.50  
14X  
1.18  
1
1.27  
PITCH  
14X  
0.58  
DIMENSIONS: MILLIMETERS  
*For additional information on our PbFree strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
http://onsemi.com  
6
MC74AC14, MC74ACT14  
PACKAGE DIMENSIONS  
TSSOP14  
CASE 948G01  
ISSUE B  
NOTES:  
14X K REF  
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION A DOES NOT INCLUDE MOLD  
FLASH, PROTRUSIONS OR GATE BURRS.  
MOLD FLASH OR GATE BURRS SHALL NOT  
EXCEED 0.15 (0.006) PER SIDE.  
4. DIMENSION B DOES NOT INCLUDE  
INTERLEAD FLASH OR PROTRUSION.  
INTERLEAD FLASH OR PROTRUSION SHALL  
NOT EXCEED 0.25 (0.010) PER SIDE.  
5. DIMENSION K DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.08 (0.003) TOTAL  
IN EXCESS OF THE K DIMENSION AT  
MAXIMUM MATERIAL CONDITION.  
6. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
M
S
S
V
0.10 (0.004)  
T
U
S
0.15 (0.006) T  
U
N
0.25 (0.010)  
14  
8
2X L/2  
M
B
L
N
U−  
PIN 1  
IDENT.  
F
7
1
DETAIL E  
7. DIMENSION A AND B ARE TO BE  
DETERMINED AT DATUM PLANE W.  
S
K
0.15 (0.006) T  
U
A
V−  
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN MAX  
K1  
A
B
C
D
F
G
H
J
4.90  
4.30  
−−−  
0.05  
0.50  
5.10 0.193 0.200  
4.50 0.169 0.177  
J J1  
1.20  
−−− 0.047  
0.15 0.002 0.006  
0.75 0.020 0.030  
SECTION NN  
0.65 BSC  
0.026 BSC  
0.60 0.020 0.024  
0.20 0.004 0.008  
0.16 0.004 0.006  
0.30 0.007 0.012  
0.25 0.007 0.010  
0.50  
0.09  
0.09  
0.19  
J1  
K
W−  
C
K1 0.19  
L
M
6.40 BSC  
0.252 BSC  
0.10 (0.004)  
0
8
0
8
_
_
_
_
SEATING  
PLANE  
T−  
H
G
DETAIL E  
D
SOLDERING FOOTPRINT*  
7.06  
1
0.65  
PITCH  
01.34X6  
14X  
1.26  
DIMENSIONS: MILLIMETERS  
*For additional information on our PbFree strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
http://onsemi.com  
7
MC74AC14, MC74ACT14  
PACKAGE DIMENSIONS  
SOEIAJ14  
M SUFFIX  
CASE 96501  
ISSUE B  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD  
FLASH OR PROTRUSIONS AND ARE MEASURED  
AT THE PARTING LINE. MOLD FLASH OR  
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)  
PER SIDE.  
L
14  
8
E
Q
1
4. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
H
E
E
_
M
5. THE LEAD WIDTH DIMENSION (b) DOES NOT  
INCLUDE DAMBAR PROTRUSION. ALLOWABLE  
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)  
TOTAL IN EXCESS OF THE LEAD WIDTH  
DIMENSION AT MAXIMUM MATERIAL CONDITION.  
DAMBAR CANNOT BE LOCATED ON THE LOWER  
RADIUS OR THE FOOT. MINIMUM SPACE  
BETWEEN PROTRUSIONS AND ADJACENT LEAD  
TO BE 0.46 ( 0.018).  
L
7
1
DETAIL P  
Z
D
MILLIMETERS  
INCHES  
MIN  
---  
VIEW P  
DIM MIN  
MAX  
MAX  
0.081  
0.008  
0.020  
0.008  
0.413  
0.215  
A
e
A
---  
0.05  
0.35  
0.10  
9.90  
5.10  
2.05  
c
A
1
b
c
0.20 0.002  
0.50 0.014  
0.20 0.004  
10.50 0.390  
5.45 0.201  
D
E
e
b
A
1
1.27 BSC  
0.050 BSC  
H
M
7.40  
0.50  
1.10  
8.20 0.291  
0.85 0.020  
1.50 0.043  
0.323  
0.033  
0.059  
0.13 (0.005)  
E
L
0.10 (0.004)  
L
E
M
0
10  
0.90 0.028  
10  
_
0.035  
0.056  
0
_
_
_
Q
0.70  
---  
1
Z
1.42  
---  
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MC74AC14/D  

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