MC74AC32MR2 [ONSEMI]

AC SERIES, QUAD 2-INPUT OR GATE, PDSO14, EIAJ, SO-14;
MC74AC32MR2
型号: MC74AC32MR2
厂家: ONSEMI    ONSEMI
描述:

AC SERIES, QUAD 2-INPUT OR GATE, PDSO14, EIAJ, SO-14

栅 输入元件 光电二极管 逻辑集成电路 触发器
文件: 总8页 (文件大小:118K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
MC74AC32, MC74ACT32  
Quad 2-Input OR Gate  
Features  
Outputs Source/Sink 24 mA  
ACT32 Has TTL Compatible Inputs  
These Devices are PbFree and are RoHS Compliant  
http://onsemi.com  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
Unit  
V
PDIP14  
N SUFFIX  
CASE 646  
DC Supply Voltage (Referenced to GND)  
DC Input Voltage (Referenced to GND)  
V
CC  
0.5 to +7.0  
14  
V
in  
0.5 to V  
V
CC  
1
+0.5  
DC Output Voltage (Referenced to GND)  
V
out  
0.5 to V  
V
CC  
+0.5  
SOIC14  
D SUFFIX  
CASE 751A  
DC Input Current, per Pin  
I
20  
50  
50  
mA  
mA  
mA  
°C  
in  
14  
DC Output Sink/Source Current, per Pin  
I
I
out  
CC  
1
DC V or GND Current per Output Pin  
CC  
Storage Temperature  
T
stg  
65 to +150  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
RecommendedOperating Conditions may affect device reliability.  
TSSOP14  
DT SUFFIX  
CASE 948G  
14  
1
V
CC  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking  
section on page 5 of this data sheet.  
14  
13  
12  
11  
10  
9
8
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 5 of this data sheet.  
1
2
3
4
5
6
7
GND  
Figure 1. Pinout: 14Lead Packages Conductors  
(Top View)  
©
Semiconductor Components Industries, LLC, 2013  
1
Publication Order Number:  
May, 2013 Rev. 8  
MC74AC32/D  
MC74AC32, MC74ACT32  
RECOMMENDED OPERATING CONDITIONS  
Symbol  
Parameter  
Min  
2.0  
4.5  
0
Typ  
5.0  
5.0  
Max  
6.0  
Unit  
AC  
V
CC  
Supply Voltage  
V
V
ACT  
5.5  
V , V  
in out  
DC Input Voltage, Output Voltage (Ref. to GND)  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
@ 3.0 V  
@ 4.5 V  
@ 5.5 V  
@ 4.5 V  
@ 5.5 V  
150  
40  
25  
10  
8.0  
Input Rise and Fall Time (Note 1)  
AC Devices except Schmitt Inputs  
ns/V  
t , t  
r
f
Input Rise and Fall Time (Note 2)  
ACT Devices except Schmitt Inputs  
t , t  
ns/V  
r
f
T
J
Junction Temperature (PDIP)  
Operating Ambient Temperature Range  
Output Current High  
140  
85  
24  
24  
°C  
°C  
T
A
40  
25  
I
mA  
mA  
OH  
I
OL  
Output Current Low  
1. V from 30% to 70% V ; see individual Data Sheets for devices that differ from the typical input rise and fall times.  
in  
CC  
2. V from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.  
in  
DC CHARACTERISTICS  
74AC  
74AC  
T =  
40°C to  
+85°C  
A
V
(V)  
CC  
T = +25°C  
A
Symbol  
Parameter  
Unit  
Conditions  
Typ  
Guaranteed Limits  
V
3.0  
4.5  
5.5  
1.5  
2.25  
2.75  
2.1  
3.15  
3.85  
2.1  
3.15  
3.85  
V
= 0.1 V  
Minimum High Level  
Input Voltage  
IH  
OUT  
V
V
V
or V 0.1 V  
CC  
V
3.0  
4.5  
5.5  
1.5  
2.25  
2.75  
0.9  
1.35  
1.65  
0.9  
1.35  
1.65  
V
OUT  
= 0.1 V  
Maximum Low Level  
Input Voltage  
IL  
or V 0.1 V  
CC  
V
OH  
3.0  
4.5  
5.5  
2.99  
4.49  
5.49  
2.9  
4.4  
5.4  
2.9  
4.4  
5.4  
I
= 50 mA  
Minimum High Level  
Output Voltage  
OUT  
*V = V or V  
IH  
IN  
IL  
3.0  
4.5  
5.5  
2.56  
3.86  
4.86  
2.46  
3.76  
4.76  
12 mA  
24 mA  
24 mA  
V
V
I
OH  
V
OL  
3.0  
4.5  
5.5  
0.002  
0.001  
0.001  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
I
= 50 mA  
OUT  
Maximum Low Level  
Output Voltage  
*V = V or V  
IN  
IL  
IH  
3.0  
4.5  
5.5  
0.36  
0.36  
0.36  
0.44  
0.44  
0.44  
12 mA  
24 mA  
24 mA  
V
I
OL  
I
IN  
Maximum Input  
Leakage Current  
5.5  
0.1  
1.0  
mA  
V = V , GND  
I
CC  
I
5.5  
5.5  
75  
mA  
mA  
V
V
= 1.65 V Max  
= 3.85 V Min  
†Minimum Dynamic  
Output Current  
OLD  
OLD  
I
75  
OHD  
OHD  
I
Maximum Quiescent  
Supply Current  
CC  
5.5  
4.0  
40  
mA  
V = V or GND  
IN CC  
*All outputs loaded; thresholds on input associated with output under test.  
†Maximum test duration 2.0 ms, one output loaded at a time.  
NOTE:  
I
IN  
and I @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V V  
.
CC  
CC  
http://onsemi.com  
2
 
MC74AC32, MC74ACT32  
AC CHARACTERISTICS (For Figures and Waveforms See Section 3 of the ON Semiconductor FACT Data Book, DL138/D)  
74AC  
74AC  
T = 40°C  
A
T = +25°C  
C = 50 pF  
L
V
(V)  
*
Fig.  
No.  
A
CC  
to +85°C  
Symbol  
Parameter  
Unit  
C = 50 pF  
L
Min  
Typ  
Max  
Min  
Max  
3.3  
5.0  
1.5  
1.5  
7.0  
5.5  
9.0  
7.5  
1.5  
1.0  
10.0  
8.5  
t
t
Propagation Delay  
Propagation Delay  
ns  
ns  
35  
35  
PLH  
3.3  
5.0  
1.5  
1.5  
7.0  
5.0  
8.5  
7.0  
1.0  
1.0  
9.0  
7.5  
PHL  
*Voltage Range 3.3 V is 3.3 V 0.3 V.  
Voltage Range 5.0 V is 5.0 V 0.5 V.  
DC CHARACTERISTICS  
74ACT  
T = +25°C  
74ACT  
T =  
A
V
(V)  
CC  
40°C to  
+85°C  
Symbol  
Parameter  
Unit  
Conditions  
A
Typ  
Guaranteed Limits  
V
4.5  
5.5  
1.5  
1.5  
2.0  
2.0  
2.0  
2.0  
V
= 0.1 V  
Minimum High Level  
Input Voltage  
IH  
OUT  
V
V
V
or V 0.1 V  
CC  
V
4.5  
5.5  
1.5  
1.5  
0.8  
0.8  
0.8  
0.8  
V
OUT  
= 0.1 V  
Maximum Low Level  
Input Voltage  
IL  
or V 0.1 V  
CC  
V
OH  
4.5  
5.5  
4.49  
5.49  
4.4  
5.4  
4.4  
5.4  
I
= 50 mA  
Minimum High Level  
Output Voltage  
OUT  
*V = V or V  
IH  
IN  
IL  
4.5  
5.5  
3.86  
4.86  
3.76  
4.76  
V
24 mA  
24 mA  
I
I
OH  
V
OL  
4.5  
5.5  
0.001  
0.001  
0.1  
0.1  
0.1  
0.1  
= 50 mA  
OUT  
Maximum Low Level  
Output Voltage  
V
V
*V = V or V  
IN  
IL  
IH  
4.5  
5.5  
0.36  
0.36  
0.44  
0.44  
24 mA  
24 mA  
I
OL  
I
IN  
Maximum Input  
Leakage Current  
5.5  
0.1  
1.0  
mA  
V = V , GND  
I CC  
DI  
Additional Max. I /Input  
5.5  
5.5  
5.5  
0.6  
1.5  
75  
mA  
mA  
mA  
V = V 2.1 V  
CCT  
CC  
I
CC  
I
V
OLD  
V
OHD  
= 1.65 V Max  
†Minimum Dynamic  
Output Current  
OLD  
OHD  
I
75  
= 3.85 V Min  
I
Maximum Quiescent  
Supply Current  
CC  
5.5  
4.0  
40  
mA  
V = V or GND  
IN CC  
*All outputs loaded; thresholds on input associated with output under test.  
†Maximum test duration 2.0 ms, one output loaded at a time.  
http://onsemi.com  
3
MC74AC32, MC74ACT32  
AC CHARACTERISTICS (For Figures and Waveforms See Section 3 of the ON Semiconductor FACT Data Book, DL138/D)  
74ACT  
74ACT  
T = 40°C  
A
T = +25°C  
C = 50 pF  
L
V
(V)  
*
Fig.  
No.  
A
CC  
to +85°C  
Symbol  
Parameter  
Unit  
C = 50 pF  
L
Min  
1.0  
1.0  
Typ  
Max  
9.0  
Min  
1.0  
1.0  
Max  
t
t
Propagation Delay  
Propagation Delay  
5.0  
5.0  
10.0  
10.0  
ns  
ns  
36  
36  
PLH  
9.0  
PHL  
*Voltage Range 5.0 V is 5.0 V 0.5 V.  
CAPACITANCE  
Value  
Symbol  
Parameter  
Unit  
Test Conditions  
Typ  
4.5  
20  
C
IN  
Input Capacitance  
pF  
pF  
V
V
= 5.0 V  
= 5.0 V  
CC  
C
PD  
Power Dissipation Capacitance  
CC  
http://onsemi.com  
4
MC74AC32, MC74ACT32  
MARKING DIAGRAMS  
PDIP14  
SOIC14  
TSSOP14  
14  
14  
14  
AC  
AC32G  
AWLYWW  
MC74AC32N  
AWLYYWWG  
32  
ALYWG  
G
1
1
1
14  
14  
14  
ACT  
32  
ACT32G  
AWLYWW  
MC74ACT32N  
AWLYYWWG  
ALYWG  
G
1
1
1
A
L, WL  
Y, YY  
= Assembly Location  
= Wafer Lot  
= Year  
W, WW = Work Week  
G
= PbFree Package  
G
= PbFree Package  
(Note: Microdot may be in either location)  
ORDERING INFORMATION  
Device  
Package  
Shipping  
MC74AC32NG  
PDIP14  
(PbFree)  
25 Units / Rail  
MC74ACT32NG  
MC74AC32DG  
PDIP14  
(PbFree)  
SOIC14  
(PbFree)  
55 Units / Rail  
2500 Units / Reel  
55 Units / Rail  
MC74AC32DR2G  
MC74ACT32DG  
MC74ACT32DR2G  
MC74AC32DTR2G  
MC74ACT32DTR2G  
SOIC14  
(PbFree)  
SOIC14  
(PbFree)  
SOIC14  
(PbFree)  
TSSOP14  
(PbFree)  
2500 Units / Reel  
TSSOP14  
(PbFree)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
http://onsemi.com  
5
MC74AC32, MC74ACT32  
PACKAGE DIMENSIONS  
SOIC14 NB  
CASE 751A03  
ISSUE K  
NOTES:  
D
A
B
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994.  
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. DIMENSION b DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE PROTRUSION  
SHALL BE 0.13 TOTAL IN EXCESS OF AT  
MAXIMUM MATERIAL CONDITION.  
4. DIMENSIONS D AND E DO NOT INCLUDE  
MOLD PROTRUSIONS.  
14  
8
7
A3  
E
H
5. MAXIMUM MOLD PROTRUSION 0.15 PER  
SIDE.  
L
DETAIL A  
1
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN MAX  
13X b  
M
M
B
0.25  
A
A1  
A3  
b
D
E
1.35  
0.10  
0.19  
0.35  
8.55  
3.80  
1.75 0.054 0.068  
0.25 0.004 0.010  
0.25 0.008 0.010  
0.49 0.014 0.019  
8.75 0.337 0.344  
4.00 0.150 0.157  
M
S
S
B
0.25  
C
A
DETAIL A  
h
A
X 45  
_
e
H
h
L
1.27 BSC  
0.050 BSC  
6.20 0.228 0.244  
0.50 0.010 0.019  
1.25 0.016 0.049  
5.80  
0.25  
0.40  
0
M
A1  
e
M
7
0
7
_
_
_
_
SEATING  
PLANE  
C
SOLDERING FOOTPRINT*  
6.50  
14X  
1.18  
1
1.27  
PITCH  
14X  
0.58  
DIMENSIONS: MILLIMETERS  
*For additional information on our PbFree strategy and soldering  
details, please download the ON Semiconductor Soldering and  
MountingTechniques Reference Manual, SOLDERRM/D.  
http://onsemi.com  
6
MC74AC32, MC74ACT32  
PACKAGE DIMENSIONS  
TSSOP14  
CASE 948G01  
ISSUE B  
NOTES:  
14X K REF  
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION A DOES NOT INCLUDE MOLD  
FLASH, PROTRUSIONS OR GATE BURRS.  
MOLD FLASH OR GATE BURRS SHALL NOT  
EXCEED 0.15 (0.006) PER SIDE.  
M
S
S
V
0.10 (0.004)  
T
U
S
0.15 (0.006) T  
U
N
0.25 (0.010)  
14  
4. DIMENSION B DOES NOT INCLUDE  
INTERLEAD FLASH OR PROTRUSION.  
INTERLEAD FLASH OR PROTRUSION SHALL  
NOT EXCEED 0.25 (0.010) PER SIDE.  
5. DIMENSION K DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.08 (0.003) TOTAL  
IN EXCESS OF THE K DIMENSION AT  
MAXIMUM MATERIAL CONDITION.  
6. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
8
2X L/2  
M
B
L
N
U−  
PIN 1  
IDENT.  
F
7
1
DETAIL E  
7. DIMENSION A AND B ARE TO BE  
DETERMINED AT DATUM PLANE W.  
S
K
0.15 (0.006) T  
U
A
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN MAX  
K1  
V−  
A
B
C
D
F
G
H
J
4.90  
4.30  
−−−  
0.05  
0.50  
5.10 0.193 0.200  
4.50 0.169 0.177  
J J1  
1.20  
−−− 0.047  
0.15 0.002 0.006  
0.75 0.020 0.030  
SECTION NN  
0.65 BSC  
0.026 BSC  
0.60 0.020 0.024  
0.20 0.004 0.008  
0.16 0.004 0.006  
0.30 0.007 0.012  
0.25 0.007 0.010  
0.50  
0.09  
0.09  
0.19  
J1  
K
W−  
C
K1 0.19  
L
M
6.40 BSC  
0.252 BSC  
0.10 (0.004)  
0
8
0
8
_
_
_
_
SEATING  
PLANE  
T−  
H
G
DETAIL E  
D
SOLDERING FOOTPRINT*  
7.06  
1
0.65  
PITCH  
01.34X6  
14X  
1.26  
DIMENSIONS: MILLIMETERS  
*For additional information on our PbFree strategy and soldering  
details, please download the ON Semiconductor Soldering and  
MountingTechniques Reference Manual, SOLDERRM/D.  
http://onsemi.com  
7
MC74AC32, MC74ACT32  
PACKAGE DIMENSIONS  
PDIP14  
CASE 64606  
ISSUE P  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION L TO CENTER OF LEADS WHEN  
FORMED PARALLEL.  
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.  
5. ROUNDED CORNERS OPTIONAL.  
14  
1
8
7
B
INCHES  
MILLIMETERS  
A
F
DIM  
A
B
C
D
F
MIN  
MAX  
0.770  
0.260  
0.185  
0.021  
0.070  
MIN  
18.16  
6.10  
3.69  
0.38  
1.02  
MAX  
19.56  
6.60  
4.69  
0.53  
1.78  
0.715  
0.240  
0.145  
0.015  
0.040  
L
N
C
G
H
J
K
L
M
N
0.100 BSC  
2.54 BSC  
0.052  
0.008  
0.115  
0.290  
−−−  
0.095  
0.015  
0.135  
0.310  
10  
1.32  
0.20  
2.92  
7.37  
−−−  
0.38  
2.41  
0.38  
3.43  
7.87  
10  
T−  
SEATING  
PLANE  
J
_
_
K
0.015  
0.039  
1.01  
D 14 PL  
H
G
M
M
0.13 (0.005)  
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