MC74ACT05D [ONSEMI]
Hex Inverter with Open−Drain Outputs; 六反相器具有漏极开路输出
| 型号： | MC74ACT05D |
| 厂家： | 
ONSEMI |
| 描述： | Hex Inverter with Open−Drain Outputs |
| 文件： | 总10页 (文件大小：139K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MC74AC05, MC74ACT05
Hex Inverter with
Open−Drain Outputs
The MC74AC/ACT05 is identical in pinout to the LS05. The device
inputs are compatible with standard CMOS outputs; with pullup
resistors, they are compatible with TTL outputs.
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Features
• Outputs Source/Sink 24 mA
• ′ACT05 Has TTL Compatible Inputs
• Pb−Free Packages are Available
PDIP−14
N SUFFIX
CASE 646
1
V
A
Y
A
Y
A
Y
4
CC
6
6
5
5
4
SOIC−14
D SUFFIX
CASE 751A
14
13
12
11
10
9
8
1
TSSOP−14
DT SUFFIX
CASE 948G
1
1
2
3
4
5
6
7
A
Y
A
Y
A
Y
3
GND
1
1
2
2
3
Top View
SOEIAJ−14
M SUFFIX
CASE 965
Figure 1. Pinout: 14-Lead Packages
1
FUNCTION TABLE
Input A
Output Y
L
H
Z
L
NOTE: Z = High Impedance
2, 4, 6, 8, 10, 12
Y*
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
1, 3, 5, 9, 11, 13
A
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 6 of this data sheet.
PIN 14 = VCC
PIN 7 = GND
* DENOTES OPEN-DRAIN OUTPUTS
Figure 2. Logic Diagram
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
October, 2006 − Rev. 8
MC74AC05/D
MC74AC05, MC74ACT05
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
V
V
DC Supply Voltage (Referenced to GND)
−0.5 to +7.0
CC
V
DC Input Voltage (Referenced to GND)
DC Output Voltage (Referenced to GND)
DC Input Current, per Pin
−0.5 to V + 0.5
V
in
CC
V
out
−0.5 to V + 0.5
V
CC
I
± 20
± 50
mA
mA
mA
°C
in
I
I
DC Output Sink/Source Current, per Pin
out
CC
DC V or GND Current per Output Pin
± 50
CC
T
stg
Storage Temperature
−65 to +150
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
2.0
4.5
0
Typ
5.0
5.0
−
Min
6.0
5.5
Unit
′AC
V
Supply Voltage
V
V
CC
′ACT
VREG
DC Regulated Power Voltage (Ref. to GND)
V
CC
V
V
V
V
V
@ 3.0 V
@ 4.5 V
@ 5.5 V
@ 4.5 V
@ 5.5 V
−
150
40
25
10
8.0
−
−
CC
CC
CC
CC
CC
Input Rise and Fall Time (Note 1)
′AC Devices except Schmitt Inputs
−
−
−
−
−
ns/V
t , t
r
f
f
−
−
Input Rise and Fall Time (Note 2)
′ACT Devices except Schmitt Inputs
t , t
r
ns/V
−
T
Junction Temperature (PDIP)
Operating Ambient Temperature Range
Output Current − HIGH
−
140
85
°C
°C
J
T
A
−40
−
25
−
I
−24
24
mA
mA
OH
I
Output Current − LOW
−
−
OL
1. V from 30% to 70% V ; see individual Data Sheets for devices that differ from the typical input rise and fall times.
in
CC
2. V from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.
in
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2
MC74AC05, MC74ACT05
DC CHARACTERISTICS
74AC
74AC
T = −40°C to +85°C
A
V
(V)
CC
T
A
= +25°C
Symbol
Parameter
Unit
Conditions
Typ
Guaranteed Limits
V
3.0
4.5
5.5
1.5
2.25
2.75
2.1
3.15
3.85
2.1
3.15
3.85
V
= 0.1 V
OUT
Minimum High Level Input Voltage
Maximum Low Level Input Voltage
Maximum Low Level Output Voltage
IH
V
V
V
or V − 0.1 V
CC
V
3.0
4.5
5.5
1.5
2.25
2.75
0.9
1.35
1.65
0.9
1.35
1.65
V
= 0.1 V
OUT
IL
or V − 0.1 V
CC
V
3.0
4.5
5.5
0.002
0.001
0.001
0.1
0.1
0.1
0.1
0.1
0.1
I
= 50 mA
OUT
OL
*V = V or V
IN
IL
IH
3.0
4.5
5.5
−
−
−
0.36
0.36
0.36
0.44
0.44
0.44
12 mA
24 mA
24 mA
V
I
OL
I
Maximum Input Leakage Current
5.5
5.5
−
−
±0.1
±1.0
mA
V = V , GND
IN
I
CC
I
−
75
mA
V
V
V
= 1.65 V Max
†Minimum Dynamic
Output Current
OLD
OHD
OLD
I
5.5
5.5
−
−
−
−75
mA
= 3.85 V Min
OHD
I
Maximum Quiescent Supply Current
4.0
40
mA
= V or GND
IN CC
CC
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
NOTE:
I
and I @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V.
IN CC
AC CHARACTERISTICS
74AC
74AC
V
(V)
*
CC
T
A
= +25°C C = 50 pF
T = −40°C to +85°C C = 50 pF
A L
Symbol
Parameter
Unit
L
Min
Typ
Max
Min
Max
3.3
5.0
1.5
1.5
−
−
8.0
6.0
1.0
1.0
9.0
6.5
t
t
Propagation Delay Output Enable
Propagation Delay Output Enable
ns
ns
PZL
PLZ
3.3
5.0
1.5
1.5
−
−
8.0
6.0
1.0
1.0
9.0
6.5
*Voltage Range 3.3 V is 3.3 V ±0.3 V.
Voltage Range 5.0 V is 5.0 V ±0.5 V.
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3
MC74AC05, MC74ACT05
DC CHARACTERISTICS
74ACT
74ACT
T = −40°C to +85°C
A
V
(V)
CC
T
= +25°C
Symbol
Parameter
Unit
Conditions
A
Typ
Guaranteed Limits
V
Minimum High Level Input Voltage
Maximum Low Level Input Voltage
Maximum Low Level Output Voltage
4.5
5.5
1.5
1.5
2.0
2.0
2.0
2.0
V
= 0.1 V
OUT
CC
IH
V
V
or V − 0.1 V
V
4.5
5.5
1.5
1.5
0.8
0.8
0.8
0.8
V
= 0.1 V
OUT
CC
IL
or V − 0.1 V
V
4.5
5.5
0.001
0.001
0.1
0.1
0.1
0.1
I
= 50 mA
OUT
OL
V
4.5
5.5
−
−
0.36
0.36
0.44
0.44
0.44
*V = V or V
IN IL
OH
IH
I
24 mA
I
Maximum Input Leakage Current
5.5
5.5
−
±0.1
±1.0
mA
V = V , GND
I CC
IN
DI
Additional Max. I /Input
0.6
−
1.5
mA
V = V − 2.1 V
CCT
CC
I
CC
†Minimum Dynamic Output Current
I
5.5
5.5
−
−
−
−
75
−75
mA
mA
V
V
= 1.65 V Max
= 3.85 V Min
OLD
OHD
OLD
OHD
I
I
Maximum Quiescent Supply Current
5.5
−
4.0
40
mA
V
= V or GND
IN CC
CC
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
AC CHARACTERISTICS
74ACT
= +25°C C = 50 pF
74ACT
V
(V)
*
CC
T
A
T = −40°C to +85°C C = 50 pF
A L
Symbol
Parameter
Unit
L
Min
1.5
1.5
Typ
−
Max
8.0
Min
1.0
1.0
Max
8.5
t
t
Propagation Delay Output Enable
Propagation Delay Output Enable
5.0
5.0
ns
ns
PZL
PLZ
−
8.5
9.0
*Voltage Range 5.0 V is 5.0 V ±0.5 V.
CAPACITANCE
Symbol
Parameter
Value Typ
Unit
Test Conditions
C
Input Capacitance
Power Dissipation Capacitance
4.5
30
pF
pF
V
V
= 5.0 V
= 5.0 V
IN
CC
CC
C
PD
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4
MC74AC05, MC74ACT05
ORDERING INFORMATION
Device
†
Package
Shipping
MC74AC05N
PDIP−14
25 Units / Rail
55 Units / Rail
MC74AC05NG
PDIP−14
(Pb−Free)
MC74AC05D
SOIC−14
MC74AC05DG
SOIC−14
(Pb−Free)
MC74AC05DR2
SOIC−14
2500 / Tape & Reel
2000 / Tape & Reel
25 Units / Rail
MC74AC05DR2G
SOIC−14
(Pb−Free)
MC74AC05MEL
SOEIAJ−14
MC74AC05MELG
SOEIAJ−14
(Pb−Free)
MC74ACT05N
PDIP−14
MC74ACT05NG
PDIP−14
(Pb−Free)
MC74ACT05D
SOIC−14
55 Units / Rail
MC74ACT05DG
SOIC−14
(Pb−Free)
MC74ACT05DR2
MC74ACT05DR2G
SOIC−14
SOIC−14
(Pb−Free)
2500 / Tape & Reel
2000 / Tape & Reel
MC74ACT05DTR2
MC74ACT05DTR2G
MC74ACT05MEL
MC74ACT05MELG
TSSOP−14*
TSSOP−14*
SOEIAJ−14
SOEIAJ−14
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*These packages are inherently Pb−Free.
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5
MC74AC05, MC74ACT05
MARKING DIAGRAMS
PDIP−14
SOIC−14
TSSOP−14
SOEIAJ−14
14
14
14
AC05G
AWLYWW
74AC05
ALYWG
MC74AC05N
AWLYYWWG
1
1
1
14
14
14
14
ACT
05
ACT05G
AWLYWW
74ACT05
ALYWG
MC74ACT05N
AWLYYWWG
ALYWG
G
1
1
1
1
A
= Assembly Location
= Year
WL, L = Wafer Lot
YY, Y
WW, W = Work Week
G or G = Pb−Free Package
(Note: Microdot may be in either location)
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6
MC74AC05, MC74ACT05
PACKAGE DIMENSIONS
PDIP−14
CASE 646−06
ISSUE P
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
14
1
8
7
B
INCHES
MILLIMETERS
A
F
DIM
A
B
C
D
F
MIN
MAX
0.770
0.260
0.185
0.021
0.070
MIN
18.16
6.10
3.69
0.38
1.02
MAX
19.56
6.60
4.69
0.53
1.78
0.715
0.240
0.145
0.015
0.040
L
N
C
G
H
J
K
L
M
N
0.100 BSC
2.54 BSC
0.052
0.008
0.115
0.290
−−−
0.095
0.015
0.135
0.310
10
1.32
0.20
2.92
7.37
−−−
0.38
2.41
0.38
3.43
7.87
10
−T−
SEATING
PLANE
J
_
_
K
0.015
0.039
1.01
D 14 PL
H
G
M
M
0.13 (0.005)
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7
MC74AC05, MC74ACT05
PACKAGE DIMENSIONS
SOIC−14
CASE 751A−03
ISSUE H
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
−A−
14
8
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
−B−
P 7 PL
M
M
B
0.25 (0.010)
7
1
G
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
F
R X 45
_
C
A
B
C
D
F
G
J
K
M
P
R
8.55
3.80
1.35
0.35
0.40
8.75 0.337 0.344
4.00 0.150 0.157
1.75 0.054 0.068
0.49 0.014 0.019
1.25 0.016 0.049
0.050 BSC
0.25 0.008 0.009
0.25 0.004 0.009
−T−
SEATING
PLANE
J
M
K
1.27 BSC
D 14 PL
0.19
0.10
0
M
S
S
0.25 (0.010)
T B
A
7
0
7
_
_
_
_
5.80
0.25
6.20 0.228 0.244
0.50 0.010 0.019
SOLDERING FOOTPRINT*
7X
7.04
14X
1.52
1
14X
0.58
1.27
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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8
MC74AC05, MC74ACT05
PACKAGE DIMENSIONS
TSSOP−14
CASE 948G−01
ISSUE A
NOTES:
14X K REF
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
M
S
S
V
0.10 (0.004)
T U
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
S
0.15 (0.006) T U
N
0.25 (0.010)
14
8
2X L/2
M
B
L
N
−U−
PIN 1
IDENT.
F
7
1
DETAIL E
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
S
K
0.15 (0.006) T U
A
−V−
K1
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
A
B
C
D
F
G
H
J
4.90
4.30
−−−
0.05
0.50
5.10 0.193 0.200
4.50 0.169 0.177
J J1
1.20
−−− 0.047
0.15 0.002 0.006
0.75 0.020 0.030
SECTION N−N
0.65 BSC
0.026 BSC
0.60 0.020 0.024
0.20 0.004 0.008
0.16 0.004 0.006
0.30 0.007 0.012
0.25 0.007 0.010
0.50
0.09
0.09
0.19
−W−
C
J1
K
0.10 (0.004)
K1 0.19
L
M
6.40 BSC
0.252 BSC
SEATING
PLANE
−T−
H
G
DETAIL E
0
8
0
8
D
_
_
_
_
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9
MC74AC05, MC74ACT05
PACKAGE DIMENSIONS
SOEIAJ−14
CASE 965−01
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
L
14
8
E
Q
1
H
E
E
_
M
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
L
7
1
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
DETAIL P
Z
D
VIEW P
A
e
c
MILLIMETERS
INCHES
MIN MAX
−−− 0.081
DIM MIN
MAX
2.05
0.20
0.50
0.20
10.50
5.45
A
−−−
0.05
0.35
0.10
9.90
5.10
A
1
b
A
1
b
c
0.002
0.008
0.020
0.008
0.413
0.215
0.014
0.004
0.390
0.201
M
0.13 (0.005)
0.10 (0.004)
D
E
e
1.27 BSC
0.050 BSC
H
7.40
0.50
1.10
8.20
0.85
1.50
0.291
0.020
0.043
0.323
0.033
0.059
E
0.50
L
E
M
0
10
10
0.035
0
0.028
_
_
_
_
Q
1
0.70
−−−
0.90
1.42
Z
−−− 0.056
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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MC74AC05/D
相关型号：
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