MC74ACT11DR2 [ONSEMI]
Triple 3âInput AND Gate; 三重3A ????输入与门
| 型号： | MC74ACT11DR2 |
| 厂家： | 
ONSEMI |
| 描述： | Triple 3âInput AND Gate |
| 文件： | 总9页 (文件大小：131K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MC74AC11, MC74ACT11
Triple 3−Input AND Gate
Features
• Outputs Source/Sink 24 mA
• ′ACT11 Has TTL Compatible Inputs
• Pb−Free Packages are Available
http://onsemi.com
PDIP−14
N SUFFIX
CASE 646
V
CC
14
13
12
11
10
9
8
14
1
SOIC−14
D SUFFIX
CASE 751A
14
1
1
2
3
4
5
6
7
GND
SOEIAJ−14
M SUFFIX
CASE 965
Figure 1. Pinout: 14−Lead Packages Conductors
14
(Top View)
1
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
DC Supply Voltage (Referenced to GND)
V
−0.5 to
+7.0
V
CC
DC Input Voltage (Referenced to GND)
DC Output Voltage (Referenced to GND)
V
−0.5 to
CC
V
V
in
V
+0.5
V
out
−0.5 to
V
+0.5
CC
DC Input Current, per Pin
I
±20
mA
mA
mA
°C
in
DC Output Sink/Source Current, per Pin
I
I
±50
±50
out
CC
DC V or GND Current per Output Pin
CC
Storage Temperature
T
stg
−65 to
+150
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
October, 2006 − Rev. 7
MC74AC11/D
MC74AC11, MC74ACT11
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
2.0
4.5
0
Typ
5.0
5.0
−
Max
6.0
Unit
′AC
V
Supply Voltage
V
V
CC
′ACT
5.5
V , V
in out
DC Input Voltage, Output Voltage (Ref. to GND)
V
CC
V
V
V
V
V
@ 3.0 V
@ 4.5 V
@ 5.5 V
@ 4.5 V
@ 5.5 V
−
150
40
25
10
8.0
−
−
CC
CC
CC
CC
CC
Input Rise and Fall Time (Note 1)
′AC Devices except Schmitt Inputs
−
−
−
−
−
ns/V
t , t
r
f
−
−
Input Rise and Fall Time (Note 2)
′ACT Devices except Schmitt Inputs
t , t
ns/V
r
f
−
T
Junction Temperature (PDIP)
Operating Ambient Temperature Range
Output Current − High
−
140
85
°C
°C
J
T
A
−40
−
25
−
I
I
−24
24
mA
mA
OH
OL
Output Current − Low
−
−
1. V from 30% to 70% V ; see individual Data Sheets for devices that differ from the typical input rise and fall times.
in
CC
2. V from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.
in
DC CHARACTERISTICS
74AC
74AC
T
=
A
V
(V)
CC
T
A
= +25°C
−40°C to
+85°C
Symbol
Parameter
Unit
Conditions
Typ
Guaranteed Limits
V
V
V
3.0
4.5
5.5
1.5
2.25
2.75
2.1
3.15
3.85
2.1
3.15
3.85
V
= 0.1 V
OUT
Minimum High Level
Input Voltage
IH
V
V
V
or V − 0.1 V
CC
3.0
4.5
5.5
1.5
2.25
2.75
0.9
1.35
1.65
0.9
1.35
1.65
V
= 0.1 V
OUT
Maximum Low Level
Input Voltage
IL
or V − 0.1 V
CC
3.0
4.5
5.5
2.99
4.49
5.49
2.9
4.4
5.4
2.9
4.4
5.4
I
= −50 mA
OUT
Minimum High Level
Output Voltage
OH
*V = V or V
IH
IN
IL
3.0
4.5
5.5
−
−
−
2.56
3.86
4.86
2.46
3.76
4.76
−12 mA
−24 mA
−24 mA
V
V
I
I
OH
V
3.0
4.5
5.5
0.002
0.001
0.001
0.1
0.1
0.1
0.1
0.1
0.1
= 50 mA
OUT
Maximum Low Level
Output Voltage
OL
*V = V or V
IN
IL
IH
3.0
4.5
5.5
−
−
−
0.36
0.36
0.36
0.44
0.44
0.44
12 mA
24 mA
24 mA
V
I
OL
I
Maximum Input
Leakage Current
IN
5.5
−
±0.1
±1.0
mA
V = V , GND
I
CC
I
I
I
5.5
5.5
−
−
−
−
75
mA
mA
V
V
= 1.65 V Max
= 3.85 V Min
†Minimum Dynamic
Output Current
OLD
OHD
CC
OLD
OHD
−75
Maximum Quiescent
Supply Current
5.5
−
4.0
40
mA
V
= V or GND
IN CC
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
NOTE:
I
and I @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V V
.
CC
IN
CC
http://onsemi.com
2
MC74AC11, MC74ACT11
AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D)
74AC
74AC
T
= −40°C
A
T
C
= +25°C
= 50 pF
V
(V)
*
Fig.
No.
A
CC
to +85°C
C
Symbol
Parameter
Unit
L
= 50 pF
L
Min
Typ
Max
Min
Max
3.3
5.0
1.5
1.5
5.5
4.0
9.5
8.0
1.0
1.0
10.0
8.5
t
t
Propagation Delay
Propagation Delay
ns
ns
3−5
3−5
PLH
3.3
5.0
1.5
1.5
5.5
4.0
8.5
7.0
1.0
1.0
9.5
7.5
PHL
*Voltage Range 3.3 V is 3.3 V ±0.3 V.
Voltage Range 5.0 V is 5.0 V ±0.5 V.
DC CHARACTERISTICS
74ACT
74ACT
T
=
A
V
(V)
CC
T
A
= +25°C
−40°C to
+85°C
Symbol
Parameter
Unit
Conditions
Typ
Guaranteed Limits
V
V
V
4.5
5.5
1.5
1.5
2.0
2.0
2.0
2.0
V
= 0.1 V
OUT
Minimum High Level
Input Voltage
IH
V
V
V
or V − 0.1 V
CC
4.5
5.5
1.5
1.5
0.8
0.8
0.8
0.8
V
= 0.1 V
OUT
Maximum Low Level
Input Voltage
IL
or V − 0.1 V
CC
4.5
5.5
4.49
5.49
4.4
5.4
4.4
5.4
I
= −50 mA
OUT
Minimum High Level
Output Voltage
OH
*V = V or V
IH
IN
IL
4.5
5.5
−
−
3.86
4.86
3.76
4.76
V
V
V
−24 mA
−24 mA
I
I
OH
V
4.5
5.5
0.001
0.001
0.1
0.1
0.1
0.1
= 50 mA
OUT
Maximum Low Level
Output Voltage
OL
*V = V or V
IN
IL
IH
4.5
5.5
−
−
0.36
0.36
0.44
0.44
24 mA
24 mA
I
OL
I
Maximum Input
Leakage Current
IN
5.5
−
±0.1
±1.0
mA
V = V , GND
I CC
DI
Additional Max. I /Input
5.5
5.5
5.5
0.6
−
−
−
−
1.5
75
mA
mA
mA
V = V − 2.1 V
CCT
CC
I
CC
I
V
V
= 1.65 V Max
†Minimum Dynamic
Output Current
OLD
OLD
OHD
I
I
−
−75
= 3.85 V Min
OHD
CC
Maximum Quiescent
Supply Current
5.5
−
4.0
40
mA
V
= V or GND
IN CC
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
http://onsemi.com
3
MC74AC11, MC74ACT11
AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D)
74ACT
74ACT
T
= −40°C
A
T
C
= +25°C
= 50 pF
V
(V)
*
Fig.
No.
A
CC
to +85°C
C
Symbol
Parameter
Unit
L
= 50 pF
L
Min
1.5
1.5
Typ
−
Max
9.5
Min
1.0
1.0
Max
t
t
Propagation Delay
Propagation Delay
5.0
5.0
10.5
ns
ns
3−5
3−5
PLH
PHL
−
9.5
10.5
*Voltage Range 5.0 V is 5.0 V ±0.5 V.
CAPACITANCE
Symbol
Value
Typ
Parameter
Unit
Test Conditions
C
C
Input Capacitance
Power Dissipation Capacitance
4.5
20
pF
pF
V
V
= 5.0 V
= 5.0 V
IN
CC
CC
PD
http://onsemi.com
4
MC74AC11, MC74ACT11
MARKING DIAGRAMS
PDIP−14
SOIC−14
SOEIAJ−14
14
14
14
1
74AC11
ALYWG
MC74AC11N
AWLYYWWG
AC11G
AWLYWW
1
1
14
14
14
1
MC74ACT11N
AWLYYWWG
ACT11G
AWLYWW
74ACT11
ALYWG
1
1
A
= Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
= Pb−Free Package
G
ORDERING INFORMATION
†
Device
MC74AC11N
Package
Shipping
PDIP−14
MC74AC11NG
PDIP−14
(Pb−Free)
25 Units/Rail
55 Units/Rail
MC74ACT11N
PDIP−14
MC74ACT11NG
PDIP−14
(Pb−Free)
MC74AC11D
SOIC−14
MC74AC11DG
SOIC−14
(Pb−Free)
MC74AC11DR2
SOIC−14
2500/Tape & Reel
55 Units/Rail
MC74AC11DR2G
SOIC−14
(Pb−Free)
MC74ACT11D
SOIC−14
SOIC−14
MC74ACT11DR2
MC74ACT11DR2G
2500/Tape & Reel
SOIC−14
(Pb−Free)
MC74AC11MEL
SOEIAJ−14
MC74AC11MELG
SOEIAJ−14
(Pb−Free)
2000/Tape & Reel
MC74ACT11MEL
SOEIAJ−14
SOEIAJ−14
(Pb−Free)
MC74ACT11MELG
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
5
MC74AC11, MC74ACT11
PACKAGE DIMENSIONS
PDIP−14
CASE 646−06
ISSUE P
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
14
1
8
7
B
INCHES
MILLIMETERS
A
F
DIM
A
B
C
D
F
MIN
MAX
0.770
0.260
0.185
0.021
0.070
MIN
18.16
6.10
3.69
0.38
1.02
MAX
19.56
6.60
4.69
0.53
1.78
0.715
0.240
0.145
0.015
0.040
L
N
C
G
H
J
K
L
M
N
0.100 BSC
2.54 BSC
0.052
0.008
0.115
0.290
−−−
0.095
0.015
0.135
0.310
10
1.32
0.20
2.92
7.37
−−−
0.38
2.41
0.38
3.43
7.87
10
−T−
SEATING
PLANE
J
_
_
K
0.015
0.039
1.01
D 14 PL
H
G
M
M
0.13 (0.005)
http://onsemi.com
6
MC74AC11, MC74ACT11
PACKAGE DIMENSIONS
SOIC−14
CASE 751A−03
ISSUE H
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
−A−
14
8
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
−B−
P 7 PL
M
M
B
0.25 (0.010)
7
1
G
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
F
R X 45
_
C
A
B
C
D
F
G
J
K
M
P
R
8.55
3.80
1.35
0.35
0.40
8.75 0.337 0.344
4.00 0.150 0.157
1.75 0.054 0.068
0.49 0.014 0.019
1.25 0.016 0.049
0.050 BSC
0.25 0.008 0.009
0.25 0.004 0.009
−T−
SEATING
PLANE
J
M
K
1.27 BSC
D 14 PL
0.19
0.10
0
M
S
S
0.25 (0.010)
T
B
A
7
0
7
_
_
_
_
5.80
0.25
6.20 0.228 0.244
0.50 0.010 0.019
SOLDERING FOOTPRINT*
7X
7.04
14X
1.52
1
14X
0.58
1.27
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
7
MC74AC11, MC74ACT11
PACKAGE DIMENSIONS
TSSOP−14
CASE 948G−01
ISSUE B
NOTES:
14X K REF
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
M
S
S
V
0.10 (0.004)
T
U
S
0.15 (0.006) T
U
N
0.25 (0.010)
14
8
2X L/2
M
B
L
N
−U−
PIN 1
IDENT.
F
7
1
DETAIL E
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
S
K
0.15 (0.006) T
U
A
−V−
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
K1
A
B
C
D
F
G
H
J
4.90
4.30
−−−
0.05
0.50
5.10 0.193 0.200
4.50 0.169 0.177
J J1
1.20
−−− 0.047
0.15 0.002 0.006
0.75 0.020 0.030
SECTION N−N
0.65 BSC
0.026 BSC
0.60 0.020 0.024
0.20 0.004 0.008
0.16 0.004 0.006
0.30 0.007 0.012
0.25 0.007 0.010
0.50
0.09
0.09
0.19
J1
K
−W−
C
K1 0.19
L
M
6.40 BSC
0.252 BSC
0.10 (0.004)
0
8
0
8
_
_
_
_
SEATING
PLANE
−T−
H
G
DETAIL E
D
SOLDERING FOOTPRINT*
7.06
1
0.65
PITCH
01.34X6
14X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
8
MC74AC11, MC74ACT11
PACKAGE DIMENSIONS
SOEIAJ−14
CASE 965−01
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
L
14
8
E
Q
1
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
H
E
E
_
M
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
L
7
1
DETAIL P
Z
D
MILLIMETERS
INCHES
MIN MAX
−−− 0.081
VIEW P
DIM MIN
MAX
2.05
0.20
0.50
0.20
10.50
5.45
A
e
A
−−−
0.05
0.35
0.10
9.90
5.10
c
A
1
b
c
0.002
0.008
0.020
0.008
0.413
0.215
0.014
0.004
0.390
0.201
D
E
e
b
A
1
1.27 BSC
0.050 BSC
H
M
7.40
0.50
1.10
8.20
0.85
1.50
0.291
0.020
0.043
0.323
0.033
0.059
0.13 (0.005)
E
0.10 (0.004)
0.50
L
E
M
0
10
10
0.035
0
0.028
_
_
_
_
Q
1
0.70
−−−
0.90
1.42
Z
−−− 0.056
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
For additional information, please contact your local
Sales Representative
MC74AC11/D
相关型号：
©2020 ICPDF网 联系我们和版权申明