MC74ACT241DWR2 [ONSEMI]
Octal Buffer/Line Driver with 3−State Outputs; 八路缓冲器/ 3态输出的线路驱动器
| 型号： | MC74ACT241DWR2 |
| 厂家： | 
ONSEMI |
| 描述： | Octal Buffer/Line Driver with 3−State Outputs |
| 文件： | 总8页 (文件大小：94K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MC74ACT241
Octal Buffer/Line Driver
with 3−State Outputs
The MC74ACT241 is an octal buffer and line driver designed to be
employed as a memory address driver, clock driver and bus oriented
transmitter or receiver which provides improved PC board density.
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MARKING
Features
• 3−State Outputs Drive Bus Lines or Buffer Memory Address
Registers
DIAGRAMS
• Outputs Source/Sink 24 mA
• TTL Compatible Inputs
20
1
• Pb−Free Packages are Available
ACT241
AWLYYWWG
1
SOIC−20W
DW SUFFIX
CASE 751D
V
OE
19
YA
DB
YA
DB
YA
DB
YA
DB
1
CC
2
1
4
2
3
3
2
4
20
18
17
16
15
14
12
13
11
20
ACT
241
1
OE
2
3
YB
4
DA
5
YB
6
DA
7
YB
8
DA
9
YB
10
1
ALYWG
TSSOP−20
DT SUFFIX
CASE 948E
DA
GND
1
1
4
2
3
3
2
4
1
G
Figure 1. Pinout: 20−Lead Packages Conductors
1
(Top View)
TRUTH TABLE
Inputs
OE
Outputs
20
1
D
(Pins 12, 14, 16, 18)
1
1
74ACT241
AWLYWWG
SOEIAJ−20
M SUFFIX
CASE 967
L
L
L
H
X
L
H
Z
H
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
A
WL, L
YY, Y
= Assembly Location
= Wafer Lot
= Year
Z = High Impedance
WW, W = Work Week
TRUTH TABLE
G or G
= Pb−Free Package
Inputs
OE
Outputs
(Note: Microdot may be in either location)
D
(Pins 3, 5, 7, 9)
2
H
H
L
L
H
X
L
H
Z
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
Z = High Impedance
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
December, 2006 − Rev. 5
MC74ACT241/D
MC74ACT241
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
V
V
DC Supply Voltage
*0.5 to )7.0
CC
V
DC Input Voltage
*0.5 v V v V )0.5
V
I
I
CC
V
DC Output Voltage (Note 1)
DC Input Diode Current
*0.5 v V v V )0.5
V
O
O
CC
I
$20
mA
mA
mA
mA
mA
_C
_C
_C
_C/W
IK
I
I
DC Output Diode Current
DC Output Sink/Source Current
DC Supply Current per Output Pin
DC Ground Current per Output Pin
Storage Temperature Range
$50
$50
$50
$100
OK
I
O
CC
I
GND
T
*65 to )150
260
STG
T
Lead temperature, 1 mm from Case for 10 Seconds
Junction temperature under Bias
Thermal Resistance
L
T
)150
J
q
SOIC
TSSOP
96
128
JA
P
Power Dissipation in Still Air at 85_C
SOIC
TSSOP
500
450
mW
D
MSL
Moisture Sensitivity
Flammability Rating
ESD Withstand Voltage
Level 1
F
Oxygen Index: 30% − 35%
UL 94 V−0 @ 0.125 in
R
V
Human Body Model (Note 2)
Machine Model (Note 3)
> 2000
> 200
V
ESD
Charged Device Model (Note 4)
> 1000
I
Latchup Performance
Above V and Below GND at 85_C (Note 5)
$100
mA
Latchup
CC
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. I absolute maximum rating must be observed.
O
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
4.5
0
Typ
Max
Unit
V
V
DC Input Voltage (Referenced to GND)
DC Input Voltage, Output Voltage (Referenced to GND)
Operating Temperature, All Package Types
Input Rise and Fall Time (Note 7)
5.5
CC
V , V
in out
V
V
CC
T
A
−40
25
+85
°C
t , t
r
V
V
= 4.5 V
= 5.5 V
0
0
10
8.0
10
8.0
ns/V
f
CC
CC
I
Output Current − High
Output Current − Low
−
−
−
−
−24
24
mA
mA
OH
I
OL
6. Unused Inputs may not be left open. All inputs must be tied to a high voltage level or low logic voltage level.
7. V from 0.8 V to 2.0 V; refer to individual Data Sheets for devices that differ from the typical input rise and fall times.
in
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2
MC74ACT241
DC CHARACTERISTICS
T
A
= +255C
T
A
= −405C to +855C
V
CC
Typ
Guaranteed Limits
(V)
Symbol
Parameter
Unit
Conditions
V
Minimum High Level Input Voltage
Maximum Low Level Input Voltage
Minimum High Level Output Voltage
4.5
5.5
1.5
1.5
2.0
2.0
2.0
2.0
V
V
V
V
= 0.1 V or
OUT
IH
− 0.1 V
CC
V
4.5
5.5
1.5
1.5
0.8
0.8
0.8
0.8
V
V
V
V
= 0.1 V or
OUT
IL
− 0.1 V
CC
V
4.5
5.5
4.49
5.49
4.4
5.4
4.4
5.4
V
V
I
= −50 mA
OH
OUT
4.5
5.5
−
3.86
4.86
3.76
4.76
V
V
*V = V or V
−24 mA
−24 mA
IN
IL
IH
IH
I
OH
V
Maximum Low Level Output Voltage
Maximum Input Leakage Current
4.5
5.5
0.001
0.001
0.1
0.1
0.1
0.1
V
V
I
= 50 mA
OUT
OL
4.5
5.5
−
0.36
0.36
0.44
0.44
V
V
*V = V or V
24 mA
24 mA
IN
OL
IL
I
I
5.5
5.5
5.5
−
0.6
−
0.1
−
1.0
1.5
5.0
mA
mA
mA
V = V , GND
I CC
IN
DI
Additional Maximum I /Input
V = V − 2.1 V
I CC
CCT
OZ
CC
I
Maximum 3−State Current
0.5
V (OE) = V , V
I IL IH
V = V , GND
I
CC
V
= V , GND
O
CC
I
I
†Minimum Dynamic Output Current
Maximum Quiescent Supply Current
5.5
5.5
−
−
−
75
−75
mA
mA
V
V
= 1.65 V Max
= 3.85 V Min
OLD
OHD
OLD
OHD
I
5.5
8.0
80
mA
V
= V or GND
IN CC
CC
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
AC CHARACTERISTICS tr = tf = 3.0 ns (For Figures and Waveforms, See Figures 2, 3, and 4.)
T
C
= +255C
T
A
= −405C to +855C
A
= 50 pF
C = 50 pF
L
L
V
*
CC
Min
1.5
1.5
1.5
1.5
1.5
2.0
Typ
6.5
7.0
6.0
7.0
8.0
7.0
Max
9.0
Min
Max
10.0
10.0
10.0
11.0
11.5
11.5
(V)
5.0
5.0
5.0
5.0
5.0
5.0
Symbol
Parameter
Unit
t
t
t
Propagation Delay Data to Output
1.5
1.5
1.0
1.5
1.5
1.5
ns
PLH
PHL
PZH
Propagation Delay Data to Output
Output Enable Time
9.0
ns
ns
ns
ns
ns
9.0
t
Output Enable Time
10.0
10.5
10.5
PZL
PHZ
t
Output Disable Time
t
Output Disable Time
PLZ
*Voltage Range 5.0 V is 5.0 V 0.5 V
CAPACITANCE
Symbol
Parameter
Value Typ
Unit
pF
Test Conditions
C
IN
Input Capacitance
4.5
45
V
V
= 5.0 V
= 5.0 V
CC
CC
C
PD
Power Dissipation Capacitance
pF
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3
MC74ACT241
SWITCHING WAVEFORMS
t
t
f
r
3.0 V
GND
50%
INPUT
DATA
t
w
1/f
max
t
t
PHL
PLH
50%
OUTPUT
Figure 2.
3.0 V
GND
OE
1.3 V
1.3 V
1
2
3.0 V
GND
OE
t
t
PZL PLZ
HIGH
IMPEDANCE
OUTPUT Y
(12, 14, 16, 18)
1.3 V
10%
90%
V
V
OL
t
t
PZH PHZ
OH
OUTPUT Y
(3, 5, 7, 9)
1.3 V
HIGH
IMPEDANCE
Figure 3.
450 W
OUTPUT
50 W SCOPE
TEST POINT
INPUT
DEVICE
UNDER
TEST
C *
L
*Includes all probe and jig capacitance
Figure 4. Test Circuit
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4
MC74ACT241
ORDERING INFORMATION
Device
†
Package
Shipping
MC74ACT241DW
MC74ACT241DWG
SOIC−20
38 Units / Rail
SOIC−20
(Pb−Free)
MC74ACT241DWR2
MC74ACT241DWR2G
SOIC−20
1000 / Tape & Reel
2500 / Tape & Reel
2000 / Tape & Reel
SOIC−20
(Pb−Free)
MC74ACT241DTR2
MC74ACT241DTR2G
MC74ACT241MEL
MC74ACT241MELG
TSSOP−20*
TSSOP−20*
SOEIAJ−20
SOEIAJ−20
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*These packages are inherently Pb−Free.
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5
MC74ACT241
PACKAGE DIMENSIONS
SOIC−20W
DW SUFFIX
CASE 751D−05
ISSUE G
NOTES:
D
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
A
q
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
20
11
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
E
B
MILLIMETERS
1
10
DIM MIN
MAX
2.65
0.25
0.49
0.32
12.95
7.60
A
A1
B
C
D
E
2.35
0.10
0.35
0.23
12.65
7.40
20X B
M
S
S
B
0.25
T A
e
1.27 BSC
H
h
10.05
0.25
0.50
0
10.55
0.75
0.90
7
A
L
q
_
_
SEATING
PLANE
18X e
A1
C
T
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6
MC74ACT241
PACKAGE DIMENSIONS
TSSOP−20
DT SUFFIX
CASE 948E−02
ISSUE C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION:
MILLIMETER.
20X K REF
K
M
S
S
V
0.10 (0.004)
T
U
S
U
K1
0.15 (0.006) T
3. DIMENSION A DOES NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
J J1
20
11
2X L/2
B
SECTION N−N
L
−U−
PIN 1
IDENT
0.25 (0.010)
N
1
10
M
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
S
0.15 (0.006) T
U
A
−V−
N
MILLIMETERS
INCHES
DIM MIN
MAX
6.60
4.50
1.20
0.15
0.75
MIN
MAX
0.260
0.177
F
A
B
6.40
4.30
−−−
0.252
0.169
DETAIL E
C
−−− 0.047
0.006
0.030
D
0.05
0.50
0.002
0.020
F
G
H
0.65 BSC
0.026 BSC
−W−
0.27
0.09
0.09
0.19
0.19
0.37
0.20
0.16
0.30
0.25
0.011
0.004
0.004
0.007
0.007
0.015
0.008
0.006
0.012
0.010
C
J
J1
K
G
D
H
K1
L
DETAIL E
6.40 BSC
0.252 BSC
0
0.100 (0.004)
−T− SEATING
M
0
8
8
_
_
_
_
PLANE
SOLDERING FOOTPRINT*
7.06
1
0.65
PITCH
16X
0.36
16X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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7
MC74ACT241
PACKAGE DIMENSIONS
SOEIAJ−20
M SUFFIX
CASE 967−01
ISSUE A
NOTES:
ꢀꢁ1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
L
20
11
E
Q
ꢀꢁ2. CONTROLLING DIMENSION: MILLIMETER.
ꢀꢁ3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
1
H
E
E
_
M
ꢀꢁ4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
L
1
10
ꢀꢁ5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
DETAIL P
Z
D
VIEW P
e
A
c
MILLIMETERS
INCHES
MIN MAX
−−− 0.081
DIM MIN
MAX
2.05
0.20
0.50
0.25
12.80
5.45
A
−−−
0.05
A
1
A
b
1
0.002
0.008
0.020
0.010
0.504
0.215
b
c
0.35
0.15
0.014
0.006
0.486
0.201
M
0.10 (0.004)
0.13 (0.005)
D
E
e
12.35
5.10
1.27 BSC
0.050 BSC
H
7.40
0.50
1.10
8.20
0.85
1.50
0.291
0.020
0.043
0.323
0.033
0.059
E
L
L
E
M
Q
0
10
10
0.035
0
0.028
_
_
_
_
0.70
−−−
0.90
0.81
1
Z
−−− 0.032
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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MC74ACT241/D
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