MC74HC1GU04DBVT1G [ONSEMI]
单无缓冲逆变器;
| 型号： | MC74HC1GU04DBVT1G |
| 厂家： | 
ONSEMI |
| 描述： | 单无缓冲逆变器 栅 栅极 |
| 文件： | 总6页 (文件大小：65K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MC74HC1GU04
Single Unbuffered Inverter
The MC74HC1GU04 is a high speed CMOS unbuffered inverter
fabricated with silicon gate CMOS technology.
The MC74HC1GU04 output drive current is 1/2 compared to
MC74HC series.
• High Speed: t = 7 ns (Typ) at V = 5 V
PD
CC
• Low Power Dissipation: I = 1 mA (Max) at T = 25_C
CC
A
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• High Noise Immunity
MARKING
DIAGRAMS
• Balanced Propagation Delays (t
• Symmetrical Output Impedance (I = I = 2 mA)
= t
)
pLH
pHL
OH
OL
5
• Chip Complexity: FET = 105
• Pb−Free Packages are Available
1
H6d
SC70−5/SC−88A/SOT−353
DF SUFFIX
CASE 419A
Pin 1
5
4
V
CC
NC
IN A
GND
1
2
3
5
H6M
1
SOT23−5/TSOP−5/SC59−5
DT SUFFIX
Pin 1
CASE 483
OUT Y
d
= Date Code
M = Month Code
Figure 1. Pinout
PIN ASSIGNMENT
1
2
3
4
5
NC
IN A
GND
1
IN A
OUT Y
Figure 2. Logic Symbol
OUT Y
V
CC
FUNCTION TABLE
Input A
Output Y
L
H
L
H
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
Semiconductor Components Industries, LLC, 2005
1
Publication Order Number:
January, 2005 − Rev. 8
MC74HC1GU04/D
MC74HC1GU04
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
V
V
V
V
DC Supply Voltage
*0.5 to )7.0
CC
IN
DC Input Voltage
*0.5 to V )0.5
V
CC
DC Output Voltage
*0.5 to V )0.5
V
OUT
CC
I
I
I
I
DC Input Diode Current
DC Output Diode Current
DC Output Sink Current
DC Supply Current per Supply Pin
Storage Temperature Range
$20
$20
mA
mA
mA
mA
_C
IK
OK
$12.5
$25
OUT
CC
T
T
T
q
*65 to )150
260
STG
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature Under Bias
_C
L
J
)150
_C
Thermal Resistance
SC70−5/SC−88A/SOT−353 (Note 1)
350
230
_C/W
JA
SOT23−5/TSOP−5/SC59−5
P
D
Power Dissipation in Still Air at 85_C
SC70−5/SC−88A/SOT−353
SOT23−5/TSOP−5/SC59−5
150
200
mW
MSL
Moisture Sensitivity
Flammability Rating
ESD Withstand Voltage
Level 1
F
R
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
V
ESD
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
u2000
u200
N/A
V
I
Latchup Performance
Above V and Below GND at 125_C (Note 5)
$500
mA
LATCHUP
CC
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
2.0
Max
Unit
V
V
DC Supply Voltage
6.0
CC
IN
V
V
T
DC Input Voltage
0.0
V
CC
V
CC
V
DC Output Voltage
0.0
V
OUT
Operating Temperature Range
Input Rise and Fall Time
*55
)125
_C
ns
A
t , t
V
CC
V
CC
V
CC
V
CC
= 2.0 V
= 3.0 V
= 4.5 V
= 6.0 V
0
0
0
0
1000
600
500
400
r
f
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
Junction
Temperature °C
Time, Hours
1,032,200
419,300
178,700
79,600
Time, Years
80
117.8
47.9
20.4
9.4
90
1
100
110
120
130
140
1
10
100
1000
37,000
4.2
TIME, YEARS
17,800
2.0
Figure 3. Failure Rate vs. Time Junction Temperature
8,900
1.0
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2
MC74HC1GU04
DC ELECTRICAL CHARACTERISTICS
V
CC
T = 25_C
A
T
A
v 85_C
*55_C v T v 125_C
A
Symbol
Parameter
Test Conditions
(V)
Min
Typ
Max
Min
Max
Min
Max
Unit
V
V
V
Minimum High−Level
Input Voltage
2.0
3.0
4.5
6.0
1.7
1.7
1.7
V
IH
2.45
3.60
4.80
2.45
3.60
4.80
2.45
3.60
4.80
Maximum Low−Level
Input Voltage
2.0
3.0
4.5
6.0
0.3
0.5
0.9
0.3
0.5
0.9
0.3
0.5
0.9
V
V
IL
1.20
1.20
1.20
Minimum High−Level
Output Voltage
V
= V or V
= −20 mA
2.0
3.0
4.5
6.0
1.8
2.7
4.0
5.5
2.0
3.0
4.5
5.9
1.8
2.7
4.0
5.5
1.8
2.7
4.0
5.5
OH
IN
IH
IL
I
OH
V
IN
= V or V
IH IL
V
= V or V
= −2 mA
= −2.6 mA
IN
IH
IL
I
4.5
6.0
4.18
5.68
4.33
5.76
4.13
5.63
4.08
5.58
OH
I
OH
V
OL
Maximum Low−Level
Output Voltage
V
= V or V
= 20 mA
2.0
3.0
4.5
6.0
0.0
0.0
0.0
0.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
V
IN
IH
IL
I
OL
V
IN
= V or V
IH IL
V
= V or V
= 2 mA
= 2.6 mA
IN
IH
IL
I
OL
4.5
6.0
0.26
0.26
0.33
0.33
0.40
0.40
I
OL
I
I
Maximum Input
Leakage Current
V
= 6.0 V or GND 6.0
$0.1
$1.0
$1.0
mA
mA
IN
IN
Maximum Quiescent
Supply Current
V
IN
= V or GND
6.0
1.0
10
40
CC
CC
AC ELECTRICAL CHARACTERISTICS (Input t = t = 6.0 ns)
r
f
T
A
= 25_C
Typ
3
T
v 85_C
*55_C v T v 125_C
A
A
Symbol
Parameter
Maximum
Propagation Delay,
Input A or B to Y
Test Conditions
Min
Max
Min
Max
Min
Max
Unit
t
t
,
V
= 5.0 V
C = 15 pF
L
15
20
25
ns
PLH
PHL
CC
V
CC
V
CC
V
CC
V
CC
= 2.0 V
= 3.0 V
= 4.5 V
= 6.0 V
C = 50 pF
L
17
9
7
100
27
20
125
35
25
155
90
35
6.5
17
21
26
t
t
,
Output Transition
Time
V
= 5.0 V
C = 15 pF
4
10
15
20
ns
TLH
THL
CC
L
V
CC
V
CC
V
CC
V
CC
= 2.0 V
= 3.0 V
= 4.5 V
= 6.0 V
C = 50 pF
L
25
16
12
10
125
35
25
155
45
31
200
60
38
21
26
32
C
C
Maximum Input
Capacitance
5
10
10
10
pF
pF
IN
Typical @ 25_C, V = 5.0 V
CC
Power Dissipation Capacitance (Note 6)
10
PD
6. C is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
PD
Average operating current can be obtained by the equation: I
power consumption; P = C ꢀ V
) = C ꢀ V ꢀ f + I . C is used to determine the no−load dynamic
CC(OPR
PD CC in CC PD
2
ꢀ f + I ꢀ V
.
D
PD
CC
in
CC
CC
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3
MC74HC1GU04
t
r
t
f
V
CC
90%
50%
10%
INPUT
OUTPUT
INPUT A
GND
C
L*
t
t
PLH
PHL
OUTPUT Y
90%
50%
10%
t
t
TLH
THL
*Includes all probe and jig capacitance.
A 1−MHz square input wave is recommended for
propagation delay tests.
Figure 4. Switching Waveforms
Figure 5. Test Circuit
DEVICE ORDERING INFORMATION
Device Nomenclature
Device
Logic
Circuit
Indicator Identifier
Temp
Range
Tape and
Reel
Suffix
Device Order
Number
Package
Suffix
Package
Type
Tape and
Reel Size
†
Function
Technology
MC74HC1GU04DFT1
MC
74
HC1G
U04
DF
T1
SC70−5/SC−88A/
SOT−353
178 mm (7 in)
3000 Unit
MC74HC1GU04DFT1G
MC
74
HC1G
U04
DF
T1
SC70−5/SC−88A/
SOT−353
178 mm (7 in)
3000 Unit
(Pb−Free)
MC74HC1GU04DFT2
MC74HC1GU04DFT2G
MC
MC
74
74
HC1G
HC1G
U04
U04
DF
DF
T2
T2
SC70−5/SC−88A/
SOT−353
178 mm (7 in)
3000 Unit
SC70−5/SC−88A/
SOT−353
178 mm (7 in)
3000 Unit
(Pb−Free)
MC74HC1GU04DTT1
MC74HC1GU04DTT1G
MC
MC
74
74
HC1G
HC1G
U04
U04
DT
DT
T1
T1
SOT23−5/TSOP−5/ 178 mm (7 in)
SC59−5 3000 Unit
SOT23−5/TSOP−5/ 178 mm (7 in)
SC59−5
3000 Unit
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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4
MC74HC1GU04
PACKAGE DIMENSIONS
SC70−5/SC−88A/SOT−353
DF SUFFIX
5−LEAD PACKAGE
CASE 419A−02
ISSUE G
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
A
G
INCHES
DIM MIN MAX
MILLIMETERS
5
4
3
MIN
1.80
1.15
0.80
0.10
MAX
2.20
1.35
1.10
0.30
A
B
C
D
G
H
J
0.071
0.045
0.031
0.004
0.087
0.053
0.043
0.012
−B−
S
1
2
0.026 BSC
0.65 BSC
−−−
0.004
0.004
0.004
0.010
0.012
−−−
0.10
0.10
0.10
0.25
0.30
K
N
S
M
M
B
0.2 (0.008)
D 5 PL
0.008 REF
0.20 REF
0.079
0.087
2.00
2.20
N
J
C
K
H
SOLDERING FOOTPRINT*
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
mm
inches
ǒ
Ǔ
SCALE 20:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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5
MC74HC1GU04
PACKAGE DIMENSIONS
SOT23−5/TSOP−5/SC59−5
DT SUFFIX
5−LEAD PACKAGE
CASE 483−02
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
ISSUE C
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. A AND B DIMENSIONS DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
D
5
4
3
B
C
S
1
2
L
MILLIMETERS
INCHES
MIN MAX
G
DIM
A
B
C
D
G
H
J
K
L
MIN
2.90
1.30
0.90
0.25
0.85
0.013
0.10
0.20
1.25
0
MAX
3.10
1.70
1.10
0.50
1.05
0.100
0.26
0.60
1.55
0.1142 0.1220
0.0512 0.0669
0.0354 0.0433
0.0098 0.0197
0.0335 0.0413
0.0005 0.0040
0.0040 0.0102
0.0079 0.0236
0.0493 0.0610
A
J
0.05 (0.002)
H
M
K
M
S
10
0
10
_
_
_
_
2.50
3.00
0.0985 0.1181
SOLDERING FOOTPRINT*
1.9
0.074
0.95
0.037
2.4
0.094
1.0
0.039
0.7
0.028
mm
inches
ǒ
Ǔ
SCALE 10:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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For additional information, please contact your
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MC74HC1GU04/D
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