MC74HC32AN [ONSEMI]

Quad 2-Input OR Gate; 四2输入或门
MC74HC32AN
型号: MC74HC32AN
厂家: ONSEMI    ONSEMI
描述:

Quad 2-Input OR Gate
四2输入或门

逻辑集成电路 栅
文件: 总8页 (文件大小:133K)
中文:  中文翻译
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High–Performance Silicon–Gate CMOS  
The MC74HC32A is identical in pinout to the LS32. The device  
inputs are compatible with Standard CMOS outputs; with pullup  
resistors, they are compatible with LSTTL outputs.  
http://onsemi.com  
Output Drive Capability: 10 LSTTL Loads  
Outputs Directly Interface to CMOS, NMOS and TTL  
Operating Voltage Range: 2 to 6V  
MARKING  
DIAGRAMS  
14  
Low Input Current: 1µA  
PDIP–14  
N SUFFIX  
CASE 646  
MC74HC32AN  
AWLYYWW  
High Noise Immunity Characteristic of CMOS Devices  
In Compliance With the JEDEC Standard No. 7A Requirements  
Chip Complexity: 48 FETs or 12 Equivalent Gates  
1
14  
SOIC–14  
D SUFFIX  
CASE 751A  
HC32A  
AWLYWW  
LOGIC DIAGRAM  
1
A1  
3
1
Y1  
Y2  
Y3  
Y4  
2
B1  
14  
4
5
HC  
32A  
ALYW  
TSSOP–14  
DT SUFFIX  
CASE 948G  
A2  
B2  
6
8
Y = A+B  
1
9
A3  
B3  
A
= Assembly Location  
10  
WL or L = Wafer Lot  
YY or Y = Year  
12  
13  
WW or W = Work Week  
A4  
B4  
11  
FUNCTION TABLE  
PIN 14 = V  
CC  
PIN 7 = GND  
Inputs  
Output  
A
B
Y
Pinout: 14–Lead Packages (Top View)  
L
L
L
H
L
L
H
H
H
V
B4  
13  
A4  
12  
Y4  
11  
B3  
10  
A3  
9
Y3  
8
CC  
H
H
14  
H
ORDERING INFORMATION  
1
2
3
4
5
6
7
Device  
Package  
PDIP–14  
Shipping  
A1  
B1  
Y1  
A2  
B2  
Y2 GND  
MC74HC32AN  
2000 / Box  
55 / Rail  
MC74HC32AD  
SOIC–14  
SOIC–14  
TSSOP–14  
TSSOP–14  
MC74HC32ADR2  
MC74HC32ADT  
MC74HC32ADTR2  
2500 / Reel  
96 / Rail  
2500 / Reel  
Semiconductor Components Industries, LLC, 2000  
1
Publication Order Number:  
March, 2000 – Rev. 7  
MC74HC32A/D  
MC74HC32A  
MAXIMUM RATINGS*  
Symbol  
Parameter  
Value  
Unit  
V
This device contains protection  
circuitry to guard against damage  
due to high static voltages or electric  
fields. However, precautions must  
be taken to avoid applications of any  
voltage higher than maximum rated  
voltages to this high–impedance cir-  
V
DC Supply Voltage (Referenced to GND)  
DC Input Voltage (Referenced to GND)  
DC Output Voltage (Referenced to GND)  
DC Input Current, per Pin  
– 0.5 to + 7.0  
CC  
V
– 0.5 to V  
+ 0.5  
V
in  
CC  
CC  
V
out  
– 0.5 to V  
+ 0.5  
V
I
± 20  
mA  
mA  
mA  
mW  
in  
cuit. For proper operation, V and  
in  
I
I
DC Output Current, per Pin  
± 25  
± 50  
out  
V
should be constrained to the  
out  
range GND (V or V  
)
V
CC  
.
DC Supply Current, V  
and GND Pins  
CC  
in out  
CC  
Unused inputs must always be  
tied to an appropriate logic voltage  
P
D
Power Dissipation in Still Air,  
Plastic DIP†  
SOIC Package†  
TSSOP Package†  
750  
500  
450  
level (e.g., either GND or V ).  
CC  
Unused outputs must be left open.  
T
Storage Temperature  
– 65 to + 150  
C
C
stg  
T
Lead Temperature, 1 mm from Case for 10 Seconds  
Plastic DIP, SOIC or TSSOP Package  
L
260  
*Maximum Ratings are those values beyond which damage to the device may occur.  
Functional operation should be restricted to the Recommended Operating Conditions.  
†Derating — Plastic DIP: – 10 mW/ C from 65 to 125 C  
SOIC Package: – 7 mW/ C from 65 to 125 C  
TSSOP Package: – 6.1 mW/ C from 65 to 125 C  
For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High–Speed CMOS Data Book (DL129/D).  
RECOMMENDED OPERATING CONDITIONS  
Symbol  
Parameter  
Min  
2.0  
0
Max  
Unit  
V
V
CC  
DC Supply Voltage (Referenced to GND)  
DC Input Voltage, Output Voltage (Referenced to GND)  
Operating Temperature, All Package Types  
6.0  
V , V  
in out  
V
CC  
V
T
A
– 55 + 125  
C
t , t  
r f  
Input Rise and Fall Time  
(Figure 1)  
V
CC  
V
CC  
V
CC  
= 2.0 V  
= 4.5 V  
= 6.0 V  
0
0
0
1000  
500  
400  
ns  
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2
MC74HC32A  
DC CHARACTERISTICS (Voltages Referenced to GND)  
Guaranteed Limit  
V
CC  
V
Symbol  
Parameter  
Condition  
–55 to 25°C 85°C 125°C  
Unit  
V
IH  
Minimum High–Level Input  
Voltage  
V
= 0.1V or V  
–0.1V  
2.0  
3.0  
4.5  
6.0  
1.50  
2.10  
3.15  
4.20  
1.50  
2.10  
3.15  
4.20  
1.50  
2.10  
3.15  
4.20  
V
out  
|I | 20µA  
CC  
out  
V
Maximum Low–Level Input  
Voltage  
V
= 0.1V or V  
– 0.1V  
2.0  
3.0  
4.5  
6.0  
0.50  
0.90  
1.35  
1.80  
0.50  
0.90  
1.35  
1.80  
0.50  
0.90  
1.35  
1.80  
V
V
IL  
out  
|I | 20µA  
CC  
out  
V
OH  
Minimum High–Level Output  
Voltage  
V
in  
= V or V  
2.0  
4.5  
6.0  
1.9  
4.4  
5.9  
1.9  
4.4  
5.9  
1.9  
4.4  
5.9  
IH  
IL  
IL  
IL  
IL  
|I | 20µA  
out  
V
=V or V  
IH  
|I | 2.4mA  
out  
3.0  
4.5  
6.0  
2.48  
3.98  
5.48  
2.34  
3.84  
5.34  
2.20  
3.70  
5.20  
in  
in  
|I | 4.0mA  
out  
|I | 5.2mA  
out  
V
OL  
Maximum Low–Level Output  
Voltage  
V
= V or V  
IH  
2.0  
4.5  
6.0  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
V
|I | 20µA  
out  
V
in  
= V or V  
IH  
|I | 2.4mA  
out  
3.0  
4.5  
6.0  
0.26  
0.26  
0.26  
0.33  
0.33  
0.33  
0.40  
0.40  
0.40  
|I | 4.0mA  
out  
|I | 5.2mA  
out  
I
Maximum Input Leakage  
Current  
V
V
= V  
= V  
or GND  
or GND  
6.0  
±0.1  
±1.0  
±1.0  
µA  
µA  
in  
in  
CC  
CC  
I
Maximum Quiescent Supply  
Current (per Package)  
6.0  
1.0  
10  
40  
CC  
in  
I
= 0µA  
out  
NOTE: InformationontypicalparametricvaluescanbefoundinChapter2oftheONSemiconductorHigh–SpeedCMOSDataBook(DL129/D).  
AC CHARACTERISTICS (C = 50pF, Input t = t = 6ns)  
L
r
f
Guaranteed Limit  
V
CC  
V
Symbol  
Parameter  
–55 to 25°C  
85°C  
125°C  
Unit  
t
t
,
Maximum Propagation Delay, Input A or B to Output Y  
(Figures 1 and 2)  
2.0  
3.0  
4.5  
6.0  
75  
30  
15  
13  
95  
40  
19  
16  
110  
55  
22  
ns  
PLH  
PHL  
19  
t
t
,
Maximum Output Transition Time, Any Output  
(Figures 1 and 2)  
2.0  
3.0  
4.5  
6.0  
75  
27  
15  
13  
95  
32  
19  
16  
110  
36  
22  
ns  
TLH  
THL  
19  
C
Maximum Input Capacitance  
10  
10  
10  
pF  
in  
NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the ON  
Semiconductor High–Speed CMOS Data Book (DL129/D).  
Typical @ 25°C, V  
= 5.0 V, V  
= 0 V  
EE  
CC  
C
Power Dissipation Capacitance (Per Buffer)*  
pF  
20  
PD  
2
* Used to determine the no–load dynamic power consumption: P = C  
D
ON Semiconductor High–Speed CMOS Data Book (DL129/D).  
V
f + I  
V
. For load considerations, see Chapter 2 of the  
PD CC  
CC CC  
http://onsemi.com  
3
MC74HC32A  
t
r
t
f
V
CC  
90%  
50%  
10%  
INPUT  
A OR B  
GND  
t
t
PLH  
PHL  
90%  
50%  
10%  
OUTPUT Y  
t
t
THL  
TLH  
Figure 1. Switching Waveforms  
TEST  
POINT  
OUTPUT  
DEVICE  
UNDER  
TEST  
C *  
L
*Includes all probe and jig capacitance  
Figure 2. Test Circuit  
A
B
Y
Figure 3. Expanded Logic Diagram  
(1/4 of the Device)  
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4
MC74HC32A  
PACKAGE DIMENSIONS  
PDIP–14  
N SUFFIX  
CASE 646–06  
ISSUE L  
NOTES:  
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE  
POSITION AT SEATING PLANE AT MAXIMUM  
MATERIAL CONDITION.  
2. DIMENSION L TO CENTER OF LEADS WHEN  
FORMED PARALLEL.  
3. DIMENSION B DOES NOT INCLUDE MOLD  
FLASH.  
4. ROUNDED CORNERS OPTIONAL.  
14  
1
8
7
B
INCHES  
DIM MIN MAX  
0.770 18.16  
MILLIMETERS  
A
F
MIN  
MAX  
19.56  
6.60  
4.69  
0.53  
1.78  
A
B
C
D
F
0.715  
0.240  
0.145  
0.015  
0.040  
0.260  
0.185  
0.021  
0.070  
6.10  
3.69  
0.38  
1.02  
L
C
G
H
J
K
L
0.100 BSC  
2.54 BSC  
0.052  
0.008  
0.115  
0.095  
0.015  
0.135  
1.32  
0.20  
2.92  
2.41  
0.38  
3.43  
J
N
0.300 BSC  
7.62 BSC  
SEATING  
PLANE  
K
M
N
0
10  
0.039  
0
0.39  
10  
1.01  
0.015  
H
G
D
M
SOIC–14  
D SUFFIX  
CASE 751A–03  
ISSUE F  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD PROTRUSION.  
–A–  
14  
1
8
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)  
PER SIDE.  
–B–  
5. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.127 (0.005) TOTAL  
IN EXCESS OF THE D DIMENSION AT  
MAXIMUM MATERIAL CONDITION.  
P 7 PL  
M
M
0.25 (0.010)  
B
7
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN MAX  
G
F
R X 45  
C
A
B
C
D
F
8.55  
3.80  
1.35  
0.35  
0.40  
8.75 0.337 0.344  
4.00 0.150 0.157  
1.75 0.054 0.068  
0.49 0.014 0.019  
1.25 0.016 0.049  
–T–  
SEATING  
PLANE  
J
M
G
J
K
M
P
1.27 BSC  
0.050 BSC  
0.25 0.008 0.009  
0.25 0.004 0.009  
K
D 14 PL  
0.19  
0.10  
0
M
S
S
0.25 (0.010)  
T B  
A
7
0
7
5.80  
0.25  
6.20 0.228 0.244  
0.50 0.010 0.019  
R
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5
MC74HC32A  
PACKAGE DIMENSIONS  
TSSOP–14  
DT SUFFIX  
CASE 948G–01  
ISSUE O  
NOTES:  
14X K REF  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
M
S
S
0.10 (0.004)  
T U  
V
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,  
PROTRUSIONS OR GATE BURRS. MOLD FLASH  
OR GATE BURRS SHALL NOT EXCEED 0.15  
(0.006) PER SIDE.  
4. DIMENSION B DOES NOT INCLUDE INTERLEAD  
FLASH OR PROTRUSION. INTERLEAD FLASH OR  
PROTRUSION SHALL NOT EXCEED  
0.25 (0.010) PER SIDE.  
S
0.15 (0.006) T U  
N
0.25 (0.010)  
14  
8
2X L/2  
M
B
–U–  
5. DIMENSION K DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN  
EXCESS OF THE K DIMENSION AT MAXIMUM  
MATERIAL CONDITION.  
L
N
PIN 1  
IDENT.  
F
7
1
6. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
DETAIL E  
7. DIMENSION A AND B ARE TO BE DETERMINED  
AT DATUM PLANE W.  
S
K
0.15 (0.006) T U  
A
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN MAX  
K1  
–V–  
A
B
C
4.90  
4.30  
–––  
5.10 0.193 0.200  
4.50 0.169 0.177  
J J1  
1.20  
––– 0.047  
D
F
0.05  
0.50  
0.15 0.002 0.006  
0.75 0.020 0.030  
SECTION N–N  
G
H
J
J1  
K
K1  
L
0.65 BSC  
0.026 BSC  
0.60 0.020 0.024  
0.20 0.004 0.008  
0.16 0.004 0.006  
0.30 0.007 0.012  
0.25 0.007 0.010  
0.50  
0.09  
0.09  
0.19  
0.19  
–W–  
C
6.40 BSC  
0.252 BSC  
0.10 (0.004)  
M
0
8
0
8
SEATING  
PLANE  
–T–  
H
G
DETAIL E  
D
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6
MC74HC32A  
Notes  
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7
MC74HC32A  
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are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes  
withoutfurthernoticetoanyproductsherein. SCILLCmakesnowarranty,representationorguaranteeregardingthesuitabilityofitsproductsforanyparticular  
purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,  
including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be  
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SCILLCproductsarenotdesigned, intended, orauthorizedforuseascomponentsinsystemsintendedforsurgicalimplantintothebody, orotherapplications  
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alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.  
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MC74HC32A/D  

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