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MC74LCX07DTG [ONSEMI]

Low-Voltage CMOS Hex Buffer with Open Drain Outputs; 低电压CMOS六缓冲器，具有漏极开路输出
MC74LCX07DTG
型号： MC74LCX07DTG
厂家： ONSEMI    ONSEMI
描述：

Low-Voltage CMOS Hex Buffer with Open Drain Outputs
低电压CMOS六缓冲器，具有漏极开路输出

栅极 触发器 逻辑集成电路 光电二极管
文件： 总6页 (文件大小：83K)
中文：  中文翻译
下载：  下载PDF数据表文档文件
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MC74LCX07  
Low−Voltage CMOS Hex  
Buffer with Open Drain  
Outputs  
With 5 V−Tolerant Inputs  
http://onsemi.com  
MARKING  
The MC74LCX07 is a high performance hex buffer operating from  
a 2.3 to 3.6 V supply. High impedance TTL compatible inputs  
significantly reduce current loading to input drivers. These LCX  
devices have open drain outputs which provide the ability to set output  
levels, or do active−HIGH AND or active−LOW OR functions. A V  
specification of 5.5 V allows MC74LCX07 inputs to be safely driven  
from 5.0 V devices.  
DIAGRAMS  
14  
I
SOIC−14  
D SUFFIX  
CASE 751A  
LCX07G  
AWLYWW  
14  
1
1
Features  
• Designed for 2.3 to 3.6 V V Operation  
CC  
• 5.0 V Tolerant Inputs/Outputs  
14  
• LVTTL Compatible  
• LVCMOS Compatible  
• 24 mA Output Sink Capability  
LCX  
07  
TSSOP−14  
DT SUFFIX  
CASE 948G  
14  
ALYWG  
1
G
1
• Near Zero Static Supply Current (10 mA) Substantially Reduces  
System Power Requirements  
14  
• Latchup Performance Exceeds 500 mA  
• Wired−OR, Wired−AND  
SOEIAJ−14  
M SUFFIX  
CASE 965  
74LCX07  
ALYWG  
14  
• Output Level Can Be Set Externally Without Affecting Speed of  
Device  
1
• ESD Performance: Human Body Model >1500 V;  
1
Machine Model >200 V  
• Pb−Free Packages are Available*  
A
L, WL  
Y, YY  
= Assembly Location  
= Wafer Lot  
= Year  
W, WW = Work Week  
V
A3  
O3  
A4  
O4  
A5  
O5  
CC  
G
G
= Pb−Free Package  
= Pb−Free Package  
14  
13  
12  
11  
10  
9
8
(Note: Microdot may be in either location)  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 2 of this data sheet.  
1
2
3
4
5
6
7
A0  
O0  
A1  
O1  
A2  
O2 GND  
Figure 1. Pinout: 14−Lead (Top View)  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
Semiconductor Components Industries, LLC, 2005  
1
Publication Order Number:  
May, 2005 − Rev. 10  
MC74LCX07/D  
MC74LCX07  
1
2
4
*
*
*
*
*
A0  
A1  
A2  
A3  
A4  
A5  
O0  
O1  
O2  
O3  
O4  
O5  
PIN NAMES  
Pins  
3
Function  
An  
On  
Data Inputs  
Outputs  
5
6
13  
11  
9
12  
10  
8
TRUTH TABLE  
An  
On  
L
H
L
Z
*
* OD  
Figure 2. Logic Diagram  
MAXIMUM RATINGS  
Symbol  
Parameter  
Value  
Condition  
Unit  
V
V
V
V
DC Supply Voltage  
−0.5 to +7.0  
CC  
I
DC Input Voltage  
−0.5 v V v +7.0  
V
I
DC Output Voltage  
−0.5 v V v +7.0  
Output in HIGH or LOW State (Note 1)  
V < GND  
V
O
O
I
I
DC Input Diode Current  
DC Output Diode Current  
−50  
−50  
mA  
mA  
mA  
mA  
mA  
mA  
°C  
IK  
I
V
O
< GND  
OK  
+50  
V > V  
O CC  
I
I
I
DC Output/Sink Current  
+50  
O
DC Supply Current Per Supply Pin  
$100  
$100  
−65 to +150  
CC  
GND  
DC Ground Current Per Ground Pin  
Storage Temperature Range  
T
STG  
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit  
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,  
damage may occur and reliability may be affected.  
1. I absolute maximum rating must be observed.  
O
ORDERING INFORMATION  
Device  
†
Package  
Shipping  
MC74LCX07D  
SOIC−14  
55 Units / Rail  
55 Units / Rail  
MC74LCX07DG  
SOIC−14  
(Pb−Free)  
MC74LCX07DR2  
SOIC−14  
2500 Tape & Reel  
2500 Tape & Reel  
MC74LCX07DR2G  
SOIC−14  
(Pb−Free)  
MC74LCX07DT  
MC74LCX07DTG  
MC74LCX07DTR2  
MC74LCX07DTR2G  
MC74LCX07M  
TSSOP−14*  
TSSOP−14*  
TSSOP−14*  
TSSOP−14*  
SOEIAJ−14  
96 Units / Rail  
96 Units / Rail  
2500 Tape & Reel  
2500 Tape & Reel  
50 Units / Rail  
MC74LCX07MG  
SOEIAJ−14  
(Pb−Free)  
50 Units / Rail  
MC74LCX07MEL  
MC74LCX07MELG  
SOEIAJ−14  
2000 Tape & Reel  
2000 Tape & Reel  
SOEIAJ−14  
(Pb−Free)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
*This package is inherently Pb−Free.  
http://onsemi.com  
2
 
MC74LCX07  
RECOMMENDED OPERATING CONDITIONS  
Symbol  
Parameter  
Min  
Typ  
Max  
Unit  
V
CC  
Supply Voltage  
Operating  
Data Retention Only  
2.0  
1.5  
2.3 to 3.3  
5.5  
5.5  
V
V
V
Input Voltage  
0
0
5.5  
5.5  
V
V
I
Output Voltage  
(HIGH or LOW State)  
O
I
HIGH Level Output Current  
V
CC  
V
CC  
V
CC  
= 3.0 V−3.6 V  
= 2.7 V−3.0 V  
= 2.3 V−2.7 V  
−24  
−12  
−8  
mA  
OH  
I
OL  
LOW Level Output Current  
V
CC  
V
CC  
V
CC  
= 3.0 V−3.6 V  
= 2.7 V−3.0 V  
= 2.3 V−2.7 V  
+24  
+12  
+8  
mA  
T
Operating Free−Air Temperature  
Input Transition Rise or Fall Rate, V from 0.8 V to 2.0 V, V = 3.0 V  
−40  
0
+85  
10  
°C  
A
Dt/DV  
ns/V  
IN  
CC  
DC ELECTRICAL CHARACTERISTICS  
T
A
= −40°C to +85°C  
Min  
1.7  
2.0  
Max  
Symbol  
Characteristic  
Condition  
2.3 V v V v 2.7 V  
Unit  
V
IH  
HIGH Level Input Voltage (Note 2)  
V
CC  
2.7 V v V v 3.6 V  
CC  
V
LOW Level Input Voltage (Note 2)  
LOW Level Output Voltage  
V
V
2.3 V v V v 2.7 V  
0.7  
0.8  
0.2  
0.3  
0.4  
0.4  
0.55  
$5  
10  
IL  
CC  
2.7 V v V v 3.6 V  
CC  
V
OL  
2.3 V v V v 3.6 V; I = 100 mA  
CC  
OL  
V
CC  
= 2.3 V; I = 8 mA  
OL  
V
= 2.7 V; I = 12 mA  
OL  
CC  
CC  
CC  
V
V
= 3.0 V; I = 16 mA  
OL  
= 3.0 V; I = 24 mA  
OL  
I
I
I
Maximum Input Leakage Current  
Power−Off Leakage Current  
2.3 V v V v 3.6 V, 0 V v V v 5.5 V  
mA  
mA  
mA  
I
CC  
I
V
= 0V, V or V = 5.5V  
O I  
OFF  
CC  
CC  
Maximum Quiescent Supply Current  
2.3 V v V v 3.6 V, V = V or GND  
10  
CC  
I
CC  
2.3 V v  
V
CC  
v
3
.
6
V
,
3
.
6
V
v
V
v
5
.
5
V
$
1
0
I
DI  
CC  
Increase in I per Input  
2.3 V v V  
4.5 V v V  
v
v
3.6 V  
5.5 V  
500  
1.0  
mA  
CC  
CC  
mA  
CC  
2. These values of V are used to test DC electrical characteristics only.  
I
AC ELECTRICAL CHARACTERISTICS  
Limits  
T = −405C to +855C  
A
V
CC  
= 3.3 V $ 0.3 V  
V
= 2.7 V  
V
CC  
= 2.5 V $ 0.2 V  
CC  
C = 50 pF  
C = 50 pF  
L
C = 30 pF  
L
L
Min  
Max  
Min  
Max  
Min  
Max  
Symbol  
Parameter  
Propagation Delay  
Input to Output  
Unit  
ns  
t
0.5  
0.5  
3.0  
3.0  
0.8  
0.8  
3.7  
3.7  
0.8  
0.8  
3.8  
3.8  
PLZ  
t
ns  
PZL  
DYNAMIC SWITCHING CHARACTERISTICS  
T
A
= +25°C  
Min  
Typ  
0.9  
0.7  
Max  
Symbol  
Characteristic  
Condition  
= 3.3 V, C = 50 pF, V = 3.3 V, V = 0 V  
Unit  
V
OLP  
Dynamic LOW Peak Voltage (Note 3)  
V
V
CC  
L
IH  
IL  
V
= 2.5 V, C = 30 pF, V =2.5 V, V = 0 V  
L IH IL  
CC  
V
OLV  
Dynamic LOW Valley Voltage (Note 3)  
V
V
= 3.3 V, C = 50 pF, V = 3.3 V, V = 0 V  
−0.8  
−0.6  
V
CC  
L
IH  
IL  
= 2.5 V, C = 30 pF, V = 2.5 V, V = 0 V  
CC  
L
IH  
IL  
3. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is  
measured in the LOW state.  
http://onsemi.com  
3
 
MC74LCX07  
CAPACITIVE CHARACTERISTICS  
Symbol  
Parameter  
Condition  
= 3.3 V, V = 0 V or V  
Typical  
Unit  
pF  
C
C
C
Input Capacitance  
V
V
7
8
IN  
CC  
I
CC  
CC  
Output Capacitance  
= 3.3 V, V = 0 V or V  
pF  
OUT  
PD  
CC  
I
Power Dissipation Capacitance  
10 MHz, V = 3.3 V, V = 0 V or V  
CC  
25  
pF  
CC  
I
V
CC  
Vmi  
Vmi  
An  
On  
0 V  
t
t
PLZ  
PZL  
Vmo  
V
V
LZ  
OL  
PROPAGATION DELAYS  
t
R
= t = 2.5 ns, 10% to 90%; f = 1MHz; t = 500 ns  
F
W
V
CC  
Symbol 3.3 V $ 0.3 V  
2.7 V  
1.5 V  
1.5 V  
2.5 V $ 0.2 V  
Vmi  
1.5 V  
V
CC  
/2  
Vmo  
1.5 V  
V
CC  
/2  
V
LZ  
V
OL  
+ 0.3 V  
V
OL  
+ 0.3 V  
V + 015 V  
OL  
Figure 3. AC Waveforms  
V
CC  
6 V or V ꢀ 2  
CC  
R
GND  
1
PULSE  
GENERATOR  
DUT  
R
T
C
L
R
L
TEST  
SWITCH  
6 V  
t
, t  
PZL PLZ  
Open Collector/Drain t  
and t  
6 V  
PLH  
PHL  
t
, t  
GND  
PZH PHZ  
C = 50 pF at V = 3.3 "0.3 V or equivalent (includes jig and probe capacitance)  
L
CC  
C = 30 pF at V = 2.5 "0.2 V or equivalent (includes jig and probe capacitance)  
L
CC  
R = R = 500 W or equivalent  
L
1
R = Z  
of pulse generator (typically 50 W)  
T
OUT  
Figure 4. Test Circuit  
http://onsemi.com  
4
MC74LCX07  
PACKAGE DIMENSIONS  
SOIC−14  
D SUFFIX  
CASE 751A−03  
ISSUE G  
NOTES:  
−A−  
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
14  
8
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD PROTRUSION.  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)  
PER SIDE.  
−B−  
P 7 PL  
5. DIMENSION D DOES NOT INCLUDE  
DAMBAR PROTRUSION. ALLOWABLE  
DAMBAR PROTRUSION SHALL BE 0.127  
(0.005) TOTAL IN EXCESS OF THE D  
DIMENSION AT MAXIMUM MATERIAL  
CONDITION.  
M
M
B
0.25 (0.010)  
7
1
G
F
R X 45  
_
C
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN MAX  
A
B
C
D
F
G
J
K
M
P
R
8.55  
3.80  
1.35  
0.35  
0.40  
8.75 0.337 0.344  
4.00 0.150 0.157  
1.75 0.054 0.068  
0.49 0.014 0.019  
1.25 0.016 0.049  
0.050 BSC  
0.25 0.008 0.009  
0.25 0.004 0.009  
−T−  
SEATING  
PLANE  
J
M
K
D 14 PL  
M
S
S
A
0.25 (0.010)  
T
B
1.27 BSC  
0.19  
0.10  
0
7
0
7
_
_
_
_
5.80  
0.25  
6.20 0.228 0.244  
0.50 0.010 0.019  
TSSOP−14  
DT SUFFIX  
CASE 948G−01  
ISSUE A  
NOTES:  
14X K REF  
1. DIMENSIONING AND TOLERANCING PER  
M
S
S
V
ANSI Y14.5M, 1982.  
0.10 (0.004)  
T
U
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION A DOES NOT INCLUDE MOLD  
FLASH, PROTRUSIONS OR GATE BURRS.  
MOLD FLASH OR GATE BURRS SHALL NOT  
EXCEED 0.15 (0.006) PER SIDE.  
4. DIMENSION B DOES NOT INCLUDE  
INTERLEAD FLASH OR PROTRUSION.  
INTERLEAD FLASH OR PROTRUSION SHALL  
NOT EXCEED 0.25 (0.010) PER SIDE.  
5. DIMENSION K DOES NOT INCLUDE  
DAMBAR PROTRUSION. ALLOWABLE  
DAMBAR PROTRUSION SHALL BE 0.08  
(0.003) TOTAL IN EXCESS OF THE K  
DIMENSION AT MAXIMUM MATERIAL  
CONDITION.  
S
0.15 (0.006) T U  
N
0.25 (0.010)  
14  
8
2X L/2  
M
B
−U−  
L
N
PIN 1  
IDENT.  
F
7
1
DETAIL E  
6. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
7. DIMENSION A AND B ARE TO BE  
DETERMINED AT DATUM PLANE −W−.  
S
K
0.15 (0.006) T U  
A
K1  
−V−  
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN MAX  
A
B
C
D
F
4.90  
4.30  
−−−  
0.05  
0.50  
5.10 0.193 0.200  
4.50 0.169 0.177  
J J1  
1.20  
−−− 0.047  
0.15 0.002 0.006  
0.75 0.020 0.030  
SECTION N−N  
G
H
J
J1  
K
0.65 BSC  
0.026 BSC  
0.60 0.020 0.024  
0.20 0.004 0.008  
0.16 0.004 0.006  
0.30 0.007 0.012  
0.25 0.007 0.010  
0.50  
0.09  
0.09  
0.19  
−W−  
C
0.10 (0.004)  
K1 0.19  
L
M
6.40 BSC  
0.252 BSC  
SEATING  
PLANE  
−T−  
H
G
DETAIL E  
D
0
8
0
8
_
_
_
_
http://onsemi.com  
5
MC74LCX07  
PACKAGE DIMENSIONS  
SOEIAJ−14  
M SUFFIX  
CASE 965−01  
ISSUE O  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD  
FLASH OR PROTRUSIONS AND ARE MEASURED  
AT THE PARTING LINE. MOLD FLASH OR  
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)  
PER SIDE.  
L
14  
8
E
Q
1
H
E
_
E
M
4. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
L
7
1
5. THE LEAD WIDTH DIMENSION (b) DOES NOT  
INCLUDE DAMBAR PROTRUSION. ALLOWABLE  
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)  
TOTAL IN EXCESS OF THE LEAD WIDTH  
DIMENSION AT MAXIMUM MATERIAL CONDITION.  
DAMBAR CANNOT BE LOCATED ON THE LOWER  
RADIUS OR THE FOOT. MINIMUM SPACE  
BETWEEN PROTRUSIONS AND ADJACENT LEAD  
TO BE 0.46 ( 0.018).  
DETAIL P  
Z
D
VIEW P  
A
e
c
MILLIMETERS  
INCHES  
MIN  
−−−  
DIM MIN  
MAX  
MAX  
0.081  
0.008  
0.020  
0.011  
0.413  
0.215  
A
−−−  
0.05  
0.35  
0.18  
9.90  
5.10  
2.05  
b
A
1
A
1
b
c
0.20 0.002  
0.50 0.014  
0.27 0.007  
M
0.13 (0.005)  
0.10 (0.004)  
D
E
e
10.50 0.390  
5.45 0.201  
1.27 BSC  
0.050 BSC  
H
7.40  
0.50  
1.10  
8.20 0.291  
0.85 0.020  
1.50 0.043  
0.323  
0.033  
0.059  
E
L
L
E
M
0
10  
0.90 0.028  
10  
_
0.035  
0.056  
0
_
_
_
Q
0.70  
−−−  
1
Z
1.42  
−−−  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 800−282−9855 Toll Free  
USA/Canada  
ON Semiconductor Website: http://onsemi.com  
Order Literature: http://www.onsemi.com/litorder  
Literature Distribution Center for ON Semiconductor  
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA  
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada  
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
Japan: ON Semiconductor, Japan Customer Focus Center  
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051  
Phone: 81−3−5773−3850  
For additional information, please contact your  
local Sales Representative.  
MC74LCX07/D  

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