MC74LCX2245DT [ONSEMI]

IC,BUS TRANSCEIVER,SINGLE,8-BIT,LCX/LVC-CMOS,TSSOP,20PIN,PLASTIC;
MC74LCX2245DT
型号: MC74LCX2245DT
厂家: ONSEMI    ONSEMI
描述:

IC,BUS TRANSCEIVER,SINGLE,8-BIT,LCX/LVC-CMOS,TSSOP,20PIN,PLASTIC

光电二极管
文件: 总8页 (文件大小:82K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Low-Voltage CMOS Octal  
Transceiver  
MC74LCX2245  
With 5V–Tolerant Inputs and Outputs  
(3–State, Non–Inverting)  
The MC74LCX2245 is a high performance, non–inverting octal  
transceiver operating from a 2.7 to 3.6V supply. High impedance TTL  
compatible inputs significantly reduce current loading to input drivers  
while TTL compatible outputs offer improved switching noise  
performance. A V specification of 5.5V allows MC74LCX2245  
LOW–VOLTAGE CMOS  
OCTAL TRANSCEIVER  
I
inputs to be safely driven from 5V devices. The MC74LCX2245 is  
designed to reduce output overshoot and undershoot and is suitable for  
memory address driving and all TTL level bus oriented transceiver  
applications; especially those requiring the very quiet outputs.  
Current drive capability is 12mA at both A and B ports. The  
Transmit/Receive (T/R) input determines the direction of data flow  
through the bi–directional transceiver. Transmit (active–HIGH)  
enables data from A ports to B ports; Receive (active–LOW) enables  
data from B to A ports. The Output Enable input, when HIGH,  
disables both A and B ports by placing them in a HIGH Z condition.  
DW SUFFIX  
20–LEAD PLASTIC SOIC  
CASE 751D–05  
Designed for 2.7 to 3.6V V Operation  
CC  
5V Tolerant — Interface Capability With 5V TTL Logic  
Supports Live Insertion and Withdrawal  
M SUFFIX  
20–LEAD PLASTIC SOIC EIAJ  
CASE 967–01  
I  
Specification Guarantees High Impedance When V = 0V  
OFF  
CC  
LVTTL Compatible  
LVCMOS Compatible  
DT SUFFIX  
20–LEAD PLASTIC TSSOP  
CASE 948E–02  
12mA Balanced Output Sink and Source Capability  
Near Zero Static Supply Current in All Three Logic States (10µA)  
Substantially Reduces System Power Requirements  
Latchup Performance Exceeds 500mA  
ESD Performance: Human Body Model >2000V; Machine Model >200V  
PIN NAMES  
V
OE  
19  
B0  
18  
B1  
17  
B2  
16  
B3  
15  
B4  
14  
B5  
13  
B6  
12  
B7  
11  
CC  
Pins  
Function  
20  
OE  
T/R  
A0–A7  
Output Enable Input  
Transmit/Receive Input  
Side A 3–State Inputs or 3–State  
Outputs  
B0–B7  
Side B 3–State Inputs or 3–State  
Outputs  
1
2
3
4
5
6
7
9
8
10  
T/R  
A0  
A1  
A2  
A3  
A4  
A5  
A6  
A7 GND  
Figure 1. 20–Lead Pinout  
(Top View)  
This document contains information on a new product. Specifications and information  
herein are subject to change without notice.  
Semiconductor Components Industries, LLC, 2001  
1
Publication Order Number:  
January, 2001 – Rev. 1  
MC74LCX2245/D  
MC74LCX2245  
OE 19  
T/R 1  
2
A0  
A1  
A2  
A3  
A4  
A5  
A6  
A7  
18  
17  
16  
15  
14  
13  
12  
11  
B0  
B1  
B2  
B3  
B4  
B5  
B6  
B7  
3
4
5
6
7
8
9
Figure 2. Logic Diagram  
INPUTS  
OPERATING MODE  
Non–Inverting  
OE  
T/R  
L
L
L
H
X
B Data to A Bus  
A Data to B Bus  
Z
H
H = High Voltage Level; L = Low Voltage Level; Z = High Impedance State; X = High or Low Voltage Level  
and Transitions are Acceptable; For I reasons, Do Not Float Inputs  
CC  
http://onsemi.com  
2
MC74LCX2245  
ABSOLUTE MAXIMUM RATINGS*  
Symbol  
Parameter  
Value  
Condition  
Unit  
V
V
V
V
DC Supply Voltage  
DC Input Voltage  
DC Output Voltage  
–0.5 to +7.0  
CC  
–0.5 V +7.0  
V
I
I
–0.5 V +7.0  
Output in 3–State  
Note 1.  
V
O
O
–0.5 V V + 0.5  
V
O
CC  
I
I
DC Input Diode Current  
DC Output Diode Current  
–50  
V < GND  
mA  
mA  
mA  
mA  
mA  
mA  
°C  
IK  
I
–50  
+50  
V < GND  
O
OK  
V
O
> V  
CC  
I
I
I
DC Output Source/Sink Current  
DC Supply Current Per Supply Pin  
DC Ground Current Per Ground Pin  
Storage Temperature Range  
±50  
O
±100  
±100  
CC  
GND  
T
–65 to +150  
STG  
*
Absolute maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or  
conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is  
not implied.  
1. Output in HIGH or LOW State. I absolute maximum rating must be observed.  
O
RECOMMENDED OPERATING CONDITIONS  
Symbol  
Parameter  
Min  
Typ  
Max  
Unit  
V
CC  
Supply Voltage  
Operating  
Data Retention Only  
2.0  
1.5  
3.3  
3.3  
3.6  
3.6  
V
V
V
Input Voltage  
0
5.5  
V
V
I
Output Voltage  
(HIGH or LOW State)  
(3–State)  
0
0
V
CC  
O
5.5  
–12  
12  
I
I
I
I
HIGH Level Output Current, V = 3.0V – 3.6V  
mA  
mA  
mA  
mA  
°C  
OH  
OL  
OH  
OL  
CC  
LOW Level Output Current, V = 3.0V – 3.6V  
CC  
HIGH Level Output Current, V = 2.7V – 3.0V  
–8  
CC  
LOW Level Output Current, V = 2.7V – 3.0V  
8
CC  
T
A
Operating Free–Air Temperature  
–40  
0
+85  
10  
t/V  
Input Transition Rise or Fall Rate, V from 0.8V to 2.0V,  
ns/V  
IN  
V
CC  
= 3.0V  
DC ELECTRICAL CHARACTERISTICS  
T
A
= –40°C to +85°C  
Symbol  
Characteristic  
HIGH Level Input Voltage (Note 2.)  
LOW Level Input Voltage (Note 2.)  
HIGH Level Output Voltage  
Condition  
2.7V V 3.6V  
Min  
2.0  
Max  
Unit  
V
V
V
V
IH  
CC  
2.7V V 3.6V  
0.8  
V
IL  
CC  
2.7V V 3.6V; I = –100µA  
V – 0.2  
CC  
V
OH  
CC  
OH  
V
V
V
= 2.7V; I = –4mA  
2.2  
CC  
CC  
CC  
OH  
= 2.7V; I = –8mA  
2.0  
2.4  
2.0  
OH  
= 3.0V; I = –6mA  
OH  
V
CC  
= 3.0V; I = –12mA  
OH  
2. These values of V are used to test DC electrical characteristics only.  
I
http://onsemi.com  
3
MC74LCX2245  
DC ELECTRICAL CHARACTERISTICS (continued)  
T
A
= –40°C to +85°C  
Symbol  
Characteristic  
Condition  
2.7V V 3.6V; I = 100µA  
Min  
Max  
0.2  
Unit  
V
OL  
LOW Level Output Voltage  
V
CC  
OL  
V
V
= 2.7V; I = 4mA  
0.4  
CC  
CC  
CC  
OL  
= 2.7V; I = 8mA  
0.6  
OL  
V
= 3.0V; I = 6mA  
0.55  
0.8  
OL  
V
CC  
= 3.0V; I = 12mA  
OL  
I
I
Input Leakage Current  
3–State Output Current  
2.7V V 3.6V; 0V V 5.5V  
±5.0  
±5.0  
µA  
µA  
I
CC  
I
2.7 V 3.6V; 0V V 5.5V;  
OZ  
CC  
O
V = V or V  
IL  
I
IH  
I
I
Power–Off Leakage Current  
Quiescent Supply Current  
V
= 0V; V or V = 5.5V  
10  
10  
µA  
µA  
µA  
µA  
OFF  
CC  
I
O
2.7 V 3.6V; V = GND or V  
CC  
CC  
I
CC  
2.7 V 3.6V; 3.6 V or V 5.5V  
±10  
500  
CC  
I
O
I  
Increase in I per Input  
2.7 V 3.6V; V = V – 0.6V  
CC IH CC  
CC  
CC  
AC CHARACTERISTICS (Note 3., tR = tF = 2.5ns; CL = 50pF; RL = 500)  
Limits  
T
A
= –40°C to +85°C  
V
= 3.0V to 3.6V  
Max  
V
CC  
= 2.7V  
CC  
Symbol  
Parameter  
Propagation Delay  
Waveform  
Min  
Max  
Unit  
t
t
1
1.5  
1.5  
10.0  
10.0  
11.0  
11.0  
ns  
PLH  
Input to Output  
PHL  
t
t
Output Enable Time to  
High and Low Level  
2
2
1.5  
1.5  
11.5  
11.5  
12.5  
12.5  
ns  
ns  
ns  
PZH  
PZL  
t
t
Output Disable Time From  
High and Low Level  
1.5  
1.5  
7.5  
7.5  
8.5  
8.5  
PHZ  
PLZ  
t
t
Output–to–Output Skew  
(Note 4.)  
1.0  
1.0  
OSHL  
OSLH  
3. These AC parameters are preliminary and may be modified prior to release.  
4. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.  
The specification applies to any outputs switching in the same direction, either HIGH–to–LOW (t  
guaranteed by design.  
) or LOW–to–HIGH (t  
); parameter  
OSHL  
OSLH  
DYNAMIC SWITCHING CHARACTERISTICS  
T
A
= +25°C  
Typ  
Symbol  
Characteristic  
Condition  
= 3.3V, C = 50pF, V = 3.3V, V = 0V  
Min  
Max  
Unit  
V
OLP  
Dynamic LOW Peak Voltage (Note  
5.)  
V
V
0.8  
V
CC  
L
IH  
IL  
V
OLV  
Dynamic LOW Valley Voltage (Note  
5.)  
= 3.3V, C = 50pF, V = 3.3V, V = 0V  
0.8  
V
CC  
L
IH  
IL  
5. Number of outputs defined as “n”. Measured with “n–1” outputs switching from HIGH–to–LOW or LOW–to–HIGH. The remaining output is  
measured in the LOW state.  
http://onsemi.com  
4
MC74LCX2245  
CAPACITIVE CHARACTERISTICS  
Symbol  
Parameter  
Input Capacitance  
Condition  
Typical  
Unit  
pF  
C
C
C
V
V
= 3.3V, V = 0V or V  
7
8
IN  
CC  
I
CC  
CC  
Input/Output Capacitance  
= 3.3V, V = 0V or V  
pF  
I/O  
PD  
CC  
I
Power Dissipation Capacitance  
10MHz, V = 3.3V, V = 0V or V  
CC  
25  
pF  
CC  
I
http://onsemi.com  
5
MC74LCX2245  
2.7V  
0V  
1.5V  
1.5V  
An, Bn  
Bn, An  
t
t
PHL  
PLH  
V
OH  
OL  
1.5V  
1.5V  
V
WAVEFORM 1 - PROPAGATION DELAYS  
= t = 2.5ns, 10% to 90%; f = 1MHz; t = 500ns  
t
R
F
W
2.7V  
0V  
1.5V  
1.5V  
OE, T/R  
t
t
PHZ  
PZH  
V
V
CC  
- 0.3V  
OH  
1.5V  
1.5V  
An, Bn  
An, Bn  
0V  
3.0V  
t
t
PLZ  
PZL  
V + 0.3V  
OL  
GND  
WAVEFORM 2 - OUTPUT ENABLE AND DISABLE TIMES  
= t = 2.5ns, 10% to 90%; f = 1MHz; t = 500ns  
t
R
F
W
Figure 3. AC Waveforms  
V
CC  
6V  
OPEN  
GND  
R
1
PULSE  
GENERATOR  
DUT  
R
T
C
L
R
L
TEST  
SWITCH  
Open  
6V  
t
t
, t  
PLH PHL  
, t  
PZL PLZ  
Open Collector/Drain t  
and t  
6V  
PLH  
PHL  
t
, t  
GND  
PZH PHZ  
C = 50pF or equivalent (Includes jig and probe capacitance)  
L
R = R = 500or equivalent  
L
1
R = Z  
of pulse generator (typically 50)  
T
OUT  
Figure 4. Test Circuit  
http://onsemi.com  
6
MC74LCX2245  
OUTLINE DIMENSIONS  
DW SUFFIX  
PLASTIC SOIC PACKAGE  
CASE 751D–05  
ISSUE E  
D
A
q
NOTES:  
1. DIMENSIONS ARE IN MILLIMETERS.  
2. INTERPRET DIMENSIONS AND TOLERANCES  
PER ASME Y14.5M, 1994.  
20  
11  
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD  
PROTRUSION.  
E
B
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.  
5. DIMENSION B DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE PROTRUSION SHALL  
BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT  
MAXIMUM MATERIAL CONDITION.  
1
10  
MILLIMETERS  
DIM MIN  
MAX  
2.65  
0.25  
0.49  
0.32  
12.95  
7.60  
20X B  
A
A1  
B
C
D
E
2.35  
0.10  
0.35  
0.23  
12.65  
7.40  
M
S
S
B
0.25  
T A  
e
1.27 BSC  
A
H
h
10.05  
0.25  
0.50  
0
10.55  
0.75  
0.90  
7
L
SEATING  
PLANE  
q
_
_
18X e  
A1  
C
T
M SUFFIX  
PLASTIC SOIC EIAJ PACKAGE  
CASE 967–01  
ISSUE O  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD  
FLASH OR PROTRUSIONS AND ARE MEASURED  
AT THE PARTING LINE. MOLD FLASH OR  
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)  
PER SIDE.  
L
E
20  
11  
Q
1
4. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
E H  
_
M
E
5. THE LEAD WIDTH DIMENSION (b) DOES NOT  
INCLUDE DAMBAR PROTRUSION. ALLOWABLE  
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)  
TOTAL IN EXCESS OF THE LEAD WIDTH  
DIMENSION AT MAXIMUM MATERIAL CONDITION.  
DAMBAR CANNOT BE LOCATED ON THE LOWER  
RADIUS OR THE FOOT. MINIMUM SPACE  
BETWEEN PROTRUSIONS AND ADJACENT LEAD  
TO BE 0.46 ( 0.018).  
L
10  
1
DETAIL P  
Z
D
VIEW P  
MILLIMETERS  
INCHES  
MIN  
ĆĆĆ  
e
A
DIM MIN  
MAX  
2.05  
MAX  
0.081  
0.008  
0.020  
0.011  
0.504  
0.215  
c
A
A
ĆĆĆ  
0.05  
0.35  
0.18  
12.35  
5.10  
1
0.20 0.002  
0.50 0.014  
0.27 0.007  
b
c
D
E
e
12.80 0.486  
5.45 0.201  
A
b
1
1.27 BSC  
0.050 BSC  
M
0.10 (0.004)  
0.13 (0.005)  
H
7.40  
0.50  
1.10  
8.20 0.291  
0.85 0.020  
1.50 0.043  
0.323  
0.033  
0.059  
E
L
L
E
M
Q
Z
0
10  
0.90 0.028  
0
10  
_
0.035  
0.032  
_
_
_
0.70  
ĆĆĆ  
1
0.81  
ĆĆĆ  
http://onsemi.com  
7
MC74LCX2245  
OUTLINE DIMENSIONS  
DT SUFFIX  
PLASTIC TSSOP PACKAGE  
CASE 948E–02  
ISSUE A  
20X K REF  
NOTES:  
ąă1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
M
S
S
V
0.10 (0.004)  
T
U
S
U
0.15 (0.006) T  
ąă2. CONTROLLING DIMENSION: MILLIMETER.  
ąă3. DIMENSION A DOES NOT INCLUDE MOLD  
FLASH, PROTRUSIONS OR GATE BURRS. MOLD  
FLASH OR GATE BURRS SHALL NOT EXCEED  
0.15 (0.006) PER SIDE.  
ąă4. DIMENSION B DOES NOT INCLUDE  
INTERLEAD FLASH OR PROTRUSION.  
INTERLEAD FLASH OR PROTRUSION SHALL NOT  
EXCEED 0.25 (0.010) PER SIDE.  
ąă5. DIMENSION K DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN  
EXCESS OF THE K DIMENSION AT MAXIMUM  
MATERIAL CONDITION.  
K
K1  
20  
11  
2X L/2  
J J1  
B
L
–U–  
PIN 1  
IDENT  
SECTION N–N  
1
10  
0.25 (0.010)  
ąă6. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
N
S
ąă7. DIMENSION A AND B ARE TO BE  
DETERMINED AT DATUM PLANE -W-.  
0.15 (0.006) T  
U
M
A
MILLIMETERS  
INCHES  
DIM MIN  
MAX  
6.60  
4.50  
1.20  
0.15  
0.75  
MIN  
MAX  
0.260  
0.177  
0.047  
0.006  
0.030  
–V–  
A
B
6.40  
4.30  
---  
0.252  
0.169  
---  
N
C
D
0.05  
0.50  
0.002  
0.020  
F
F
G
H
0.65 BSC  
0.026 BSC  
DETAIL E  
0.27  
0.09  
0.09  
0.19  
0.19  
0.37  
0.20  
0.16  
0.30  
0.25  
0.011  
0.004  
0.004  
0.007  
0.007  
0.015  
0.008  
0.006  
0.012  
0.010  
J
–W–  
J1  
K
C
K1  
L
6.40 BSC  
0.252 BSC  
0
G
D
M
0
8
8
_
_
_
_
H
DETAIL E  
0.100 (0.004)  
–T– SEATING  
PLANE  
ON Semiconductor and  
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MC74LCX2245/D  

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