MC74LCX245DWG [ONSEMI]

Low-Voltage CMOS Octal Transceiver With 5 V−Tolerant Inputs and Outputs (3−State, Inverting); 低电压CMOS八路收发器可承受5V电压输入和输出(三态,反相)
MC74LCX245DWG
型号: MC74LCX245DWG
厂家: ONSEMI    ONSEMI
描述:

Low-Voltage CMOS Octal Transceiver With 5 V−Tolerant Inputs and Outputs (3−State, Inverting)
低电压CMOS八路收发器可承受5V电压输入和输出(三态,反相)

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MC74LCX245  
Low−Voltage CMOS Octal  
Transceiver  
With 5 V−Tolerant Inputs and Outputs  
(3−State, Inverting)  
http://onsemi.com  
MARKING  
The MC74LCX245 is a high performance, non−inverting octal  
transceiver operating from a 2.3 to 3.6 V supply. High impedance TTL  
compatible inputs significantly reduce current loading to input drivers  
while TTL compatible outputs offer improved switching noise  
DIAGRAMS  
20  
SOIC−20  
DW SUFFIX  
CASE 751D  
performance. A V specification of 5.5 V allows MC74LCX245 inputs  
I
to be safely driven from 5 V devices. The MC74LCX245 is suitable  
for memory address driving and all TTL level bus oriented transceiver  
applications.  
Current drive capability is 24 mA at both A and B ports. The  
Transmit/Receive (T/R) input determines the direction of data flow  
through the bi−directional transceiver. Transmit (active−HIGH)  
enables data from A ports to B ports; Receive (active−LOW) enables  
data from B to A ports. The Output Enable input, when HIGH,  
disables both A and B ports by placing them in a HIGH Z condition.  
LCX245  
AWLYYWW  
20  
1
1
20  
LCX  
245  
ALYW  
TSSOP−20  
DT SUFFIX  
CASE 948E  
20  
Features  
1
1
Designed for 2.3 to 3.6 V V Operation  
CC  
5 V Tolerant − Interface Capability With 5 V TTL Logic  
Supports Live Insertion and Withdrawal  
20  
I  
Specification Guarantees High Impedance When V = 0 V  
CC  
OFF  
SOEIAJ−20  
M SUFFIX  
CASE 967  
1
74LCX245  
AWLYWW  
LVTTL Compatible  
LVCMOS Compatible  
20  
1
24 mA Balanced Output Sink and Source Capability  
Near Zero Static Supply Current in All Three Logic States (10 mA)  
Substantially Reduces System Power Requirements  
A
L, WL  
Y, YY  
= Assembly Location  
= Wafer Lot  
= Year  
Latchup Performance Exceeds 500 mA  
ESD Performance:  
Human Body Model >2000 V  
Machine Model >200 V  
W, WW = Work Week  
Pb−Free Packages are Available*  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 3 of this data sheet.  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
Semiconductor Components Industries, LLC, 2005  
1
Publication Order Number:  
January, 2005 − Rev. 6  
MC74LCX245/D  
MC74LCX245  
OE 19  
T/R 1  
V
OE B0  
B1  
B2  
B3  
B4  
B5  
B6  
B7  
CC  
20  
19  
18  
17  
16  
15  
14  
12  
13  
11  
2
3
4
5
6
7
A0  
A1  
A2  
A3  
A4  
A5  
A6  
A7  
18  
17  
16  
15  
14  
13  
12  
11  
B0  
B1  
B2  
B3  
B4  
B5  
B6  
B7  
1
2
3
4
5
6
7
9
8
10  
T/R A0  
A1  
A2  
A3  
A4  
A5  
A6  
A7 GND  
Figure 1. Pinout (Top View)  
PIN NAMES  
PINS  
FUNCTION  
OE  
Output Enable Input  
T/R  
Transmit/Receive Input  
A0−A7  
B0−B7  
Side A 3−State Inputs or 3−State Outputs  
Side B 3−State Inputs or 3−StateOutputs  
8
9
TRUTH TABLE  
INPUTS  
OPERATING MODE  
Non−Inverting  
OE  
T/R  
L
L
L
H
X
B Data to A Bus  
A Data to B Bus  
Z
H
Figure 2. Logic Diagram  
H = High Voltage Level  
L = Low Voltage Level  
Z = High Impedance State  
X = High or Low Voltage Level and Transitions are Acceptable  
For I reasons, Do Not Float Inputs  
CC  
http://onsemi.com  
2
MC74LCX245  
MAXIMUM RATINGS  
Symbol  
Parameter  
Value  
Condition  
Unit  
V
V
V
V
DC Supply Voltage  
−0.5 to +7.0  
CC  
I
DC Input Voltage  
−0.5 V +7.0  
V
I
DC Output Voltage  
−0.5 V +7.0  
Output in 3−State  
V
O
O
−0.5 V V + 0.5  
Output in HIGH or LOW State (Note 1)  
V
O
CC  
I
I
DC Input Diode Current  
DC Output Diode Current  
−50  
V < GND  
mA  
mA  
mA  
mA  
mA  
mA  
°C  
IK  
I
−50  
+50  
V < GND  
O
OK  
V
O
> V  
CC  
I
I
I
DC Output Source/Sink Current  
DC Supply Current Per Supply Pin  
DC Ground Current Per Ground Pin  
Storage Temperature Range  
±50  
O
±100  
±100  
CC  
GND  
T
−65 to +150  
STG  
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit  
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,  
damage may occur and reliability may be affected.  
1. I absolute maximum rating must be observed.  
O
RECOMMENDED OPERATING CONDITIONS  
Symbol  
Parameter  
Min  
Typ  
Max  
Unit  
V
CC  
Supply Voltage  
Operating  
Data Retention Only  
2.0  
1.5  
2.5, 3.3  
2.5, 3.3  
3.6  
3.6  
V
V
V
Input Voltage  
0
5.5  
V
V
I
Output Voltage  
(HIGH or LOW State)  
(3−State)  
0
0
V
CC  
5.5  
O
I
HIGH Level Output Current  
LOW Level Output Current  
V
V
V
= 3.0 V − 3.6 V  
= 2.7 V − 3.0 V  
= 2.3 V − 2.7 V  
− 24  
− 12  
− 8  
mA  
mA  
OH  
CC  
CC  
CC  
I
OL  
V
CC  
V
CC  
V
CC  
= 3.0 V − 3.6 V  
= 2.7 V − 3.0 V  
= 2.3 V − 2.7 V  
+ 24  
+ 12  
+ 8  
T
Operating Free−Air Temperature  
−40  
0
+85  
10  
°C  
A
Dt/DV  
Input Transition Rise or Fall Rate, V from 0.8 V to 2.0 V, V = 3.0 V  
ns/V  
IN  
CC  
ORDERING INFORMATION  
Device  
Package  
Shipping  
MC74LCX245DW  
MC74LCX245DWG  
SOIC−20  
38 Units / Rail  
38 Units / Rail  
SOIC−20  
(Pb−Free)  
MC74LCX245DWR2  
MC74LCX245DR2G  
SOIC−20  
1000 Tape & Reel  
1000 Tape & Reel  
SOIC−20  
(Pb−Free)  
MC74LCX245DT  
MC74LCX245DTR2  
MC74LCX245M  
TSSOP−20*  
TSSOP−20*  
SOEIAJ−20  
SOEIAJ−20  
75 Units / Rail  
2000 Tape & Reel  
40 Units / Rail  
MC74LCX245MEL  
2000 Tape & Reel  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
*This package is inherently Pb−Free.  
http://onsemi.com  
3
 
MC74LCX245  
DC ELECTRICAL CHARACTERISTICS  
T
A
= −40°C to +85°C  
Symbol  
Characteristic  
Condition  
2.3 V V 2.7 V  
Min  
1.7  
2.0  
Max  
Unit  
V
IH  
HIGH Level Input Voltage (Note 2)  
V
CC  
2.7 V V 3.6 V  
CC  
2.3 V V 2.7 V  
0.7  
0.8  
V
LOW Level Input Voltage (Note 2)  
HIGH Level Output Voltage  
V
V
CC  
IL  
2.7 V V 3.6 V  
CC  
2.3 V V 3.6 V; I = 100 mA  
V
CC  
− 0.2  
V
OH  
CC  
OL  
V
= 2.3 V; I = −8 mA  
1.8  
2.2  
2.4  
2.2  
CC  
OH  
V
CC  
V
CC  
V
CC  
= 2.7 V; I = −12 mA  
OH  
= 3.0 V; I = −18 mA  
OH  
= 3.0 V; I = −24 mA  
OH  
2.3 V V 3.6 V; I = 100 mA  
0.2  
0.6  
0.4  
0.4  
0.55  
±5  
V
LOW Level Output Voltage  
V
CC  
OL  
OL  
V
CC  
= 2.3 V; I = 8 mA  
OL  
V
= 2.7 V; I = 12 mA  
OL  
CC  
CC  
CC  
V
V
= 3.0 V; I = 16 mA  
OL  
= 3.0 V; I = 24 mA  
OL  
I
I
Input Leakage Current  
3−State Output Current  
2.3 V V 3.6 V; 0 V V 5.5 V  
mA  
mA  
I
CC  
I
2.3 V 3.6 V; 0V V 5.5 V;  
±5  
OZ  
CC  
O
V = V or V  
IL  
I
IH  
I
I
Power−Off Leakage Current  
Quiescent Supply Current  
V
= 0 V; V or V = 5.5 V  
10  
10  
mA  
mA  
OFF  
CC  
I
O
2.3 V 3.6 V; V = GND or V  
CC  
CC  
I
CC  
2.3 V 3.6 V; 3.6 V or V 5.5 V  
±10  
500  
CC  
I
O
DI  
CC  
Increase in I per Input  
2.3 V 3.6 V; V = V − 0.6 V  
mA  
CC  
CC  
IH  
CC  
2. These values of V are used to test DC electrical characteristics only.  
I
AC CHARACTERISTICS t = t = 2.5 ns; R = 500 W  
R
F
L
Limits  
= −40°C to +85°C  
T
A
V
CC  
= 3.3 V ± 0.3 V  
V
CC  
= 2.7 V  
V = 2.5 V ± 0.2 V  
CC  
C = 50 pF  
L
C = 30 pF  
L
C = 50 pF  
L
Symbol  
Parameter  
Waveform  
Unit  
Min  
Max  
Min  
Max  
Min  
Max  
t
t
Propagation Delay  
Input to Output  
1
1.5  
1.5  
7.0  
7.0  
1.5  
1.5  
8.0  
8.0  
1.5  
1.5  
8.4  
8.4  
ns  
PLH  
PHL  
t
t
Output Enable Time to  
High and Low Level  
2
2
1.5  
1.5  
8.5  
8.5  
1.5  
1.5  
9.5  
9.5  
1.5  
1.5  
10.5  
10.5  
ns  
ns  
ns  
PZH  
PZL  
t
t
Output Disable Time From  
High and Low Level  
1.5  
1.5  
7.5  
7.5  
1.5  
1.5  
8.5  
8.5  
1.5  
1.5  
9.0  
9.0  
PHZ  
PLZ  
t
t
Output−to−Output Skew  
(Note 3)  
1.0  
1.0  
OSHL  
OSLH  
3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.  
The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (t  
guaranteed by design.  
) or LOW−to−HIGH (t  
); parameter  
OSHL  
OSLH  
http://onsemi.com  
4
 
MC74LCX245  
DYNAMIC SWITCHING CHARACTERISTICS  
T
A
= +25°C  
Symbol  
Characteristic  
Condition  
Min  
Typ  
Max  
Unit  
V
OLP  
Dynamic LOW Peak Voltage (Note 4)  
V
CC  
V
CC  
= 3.3 V, C = 50 pF, V = 3.3 V, V = 0 V  
0.8  
0.6  
V
V
L
IH  
IL  
= 2.5 V, C = 30 pF, V = 2.5 V, V = 0 V  
L
IH  
IL  
V
OLV  
Dynamic LOW Valley Voltage (Note 4)  
V
CC  
V
CC  
= 3.3 V, C = 50 pF, V = 3.3 V, V = 0 V  
−0.8  
−0.6  
V
V
L
IH  
IL  
= 2.5 V, C = 30 pF, V = 2.5 V, V = 0 V  
L
IH  
IL  
4. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is  
measured in the LOW state.  
CAPACITIVE CHARACTERISTICS  
Symbol  
Parameter  
Input Capacitance  
Condition  
= 3.3 V, V = 0 V or V  
Typical  
Unit  
pF  
C
C
C
V
V
7
8
IN  
CC  
I
CC  
CC  
Input/Output Capacitance  
= 3.3 V, V = 0 V or V  
pF  
I/O  
PD  
CC  
I
Power Dissipation Capacitance  
10 MHz, V = 3.3 V, V = 0 V or V  
25  
pF  
CC  
I
CC  
V
CC  
OE, T/R  
An, Bn  
Vmi  
Vmi  
V
CC  
0 V  
Vmi  
Vmi  
t
t
PHZ  
An, Bn  
Bn, An  
PZH  
V
OH  
V
HZ  
0 V  
t
t
PHL  
PLH  
Vmo  
Vmo  
V
OH  
OL  
Vmo  
Vmo  
t
t
PLZ  
PZL  
V
An, Bn  
V
V
LZ  
OL  
WAVEFORM 1 − PROPAGATION DELAYS  
= t = 2.5 ns, 10% to 90%; f = 1 MHz; t = 500 ns  
WAVEFORM 2 − OUTPUT ENABLE AND DISABLE TIMES  
= t = 2.5 ns, 10% to 90%; f = 1 MHz; t = 500 ns  
t
R
t
R
F
W
F
W
V
CC  
Symbol 3.3 V ± 0.3 V  
2.7 V  
1.5 V  
1.5 V  
2.5 V ± 0.2 V  
Vmi  
1.5 V  
1.5 V  
V
/2  
/2  
CC  
CC  
Vmo  
V
V
HZ  
V
LZ  
V
+ 0.3 V  
V
+ 0.3 V  
− 0.3 V  
V
OL  
+ 0.15 V  
− 015 V  
OL  
OL  
V
OH  
− 0.3 V  
V
V
OH  
OH  
Figure 3. AC Waveforms  
http://onsemi.com  
5
 
MC74LCX245  
V
CC  
6 V  
OPEN  
GND  
R
1
PULSE  
GENERATOR  
DUT  
R
T
C
R
L
L
TEST  
SWITCH  
t
t
, t  
Open  
PLH PHL  
, t  
6 V at V = 3.3 0.3 V  
CC  
PZL PLZ  
6 V at V = 2.5 0.2 V  
CC  
Open Collector/Drain t  
and t  
6 V  
PLH  
PHL  
t
, t  
GND  
PZH PHZ  
C = 50 pF at V = 3.3 0.3 V or equivalent (includes jig and probe capacitance)  
L
CC  
C = 30 pF at V = 2.5 0.2 V or equivalent (includes jig and probe capacitance)  
L
CC  
R = R = 500 W or equivalent  
L
1
R = Z  
of pulse generator (typically 50 W)  
T
OUT  
Figure 4. Test Circuit  
http://onsemi.com  
6
MC74LCX245  
PACKAGE DIMENSIONS  
SOIC−20  
DW SUFFIX  
CASE 751D−05  
ISSUE G  
NOTES:  
D
1. DIMENSIONS ARE IN MILLIMETERS.  
2. INTERPRET DIMENSIONS AND TOLERANCES  
PER ASME Y14.5M, 1994.  
A
q
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD  
PROTRUSION.  
20  
11  
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.  
5. DIMENSION B DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE PROTRUSION  
SHALL BE 0.13 TOTAL IN EXCESS OF B  
DIMENSION AT MAXIMUM MATERIAL  
CONDITION.  
E
B
1
10  
MILLIMETERS  
DIM MIN  
MAX  
2.65  
0.25  
0.49  
0.32  
12.95  
7.60  
A
A1  
B
C
D
E
2.35  
0.10  
0.35  
0.23  
12.65  
7.40  
20X B  
M
S
S
B
T
0.25  
A
e
1.27 BSC  
H
h
10.05  
0.25  
0.50  
0
10.55  
0.75  
0.90  
7
A
L
q
_
_
SEATING  
PLANE  
18X e  
A1  
C
T
TSSOP−20  
DT SUFFIX  
CASE 948E−02  
ISSUE B  
NOTES:  
20X K REF  
1. DIMENSIONING AND TOLERANCING  
PER ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION:  
MILLIMETER.  
M
S
S
V
0.10 (0.004)  
T U  
S
0.15 (0.006) T U  
K
3. DIMENSION A DOES NOT INCLUDE  
MOLD FLASH, PROTRUSIONS OR GATE  
BURRS. MOLD FLASH OR GATE BURRS  
SHALL NOT EXCEED 0.15 (0.006) PER  
SIDE.  
4. DIMENSION B DOES NOT INCLUDE  
INTERLEAD FLASH OR PROTRUSION.  
INTERLEAD FLASH OR PROTRUSION  
SHALL NOT EXCEED 0.25 (0.010) PER  
SIDE.  
K1  
20  
11  
2X L/2  
J J1  
B
L
−U−  
PIN 1  
IDENT  
SECTION N−N  
5. DIMENSION K DOES NOT INCLUDE  
DAMBAR PROTRUSION. ALLOWABLE  
DAMBAR PROTRUSION SHALL BE 0.08  
(0.003) TOTAL IN EXCESS OF THE K  
DIMENSION AT MAXIMUM MATERIAL  
CONDITION.  
1
10  
0.25 (0.010)  
N
S
0.15 (0.006) T U  
6. TERMINAL NUMBERS ARE SHOWN  
FOR REFERENCE ONLY.  
7. DIMENSION A AND B ARE TO BE  
DETERMINED AT DATUM PLANE −W−.  
M
A
−V−  
N
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN  
MAX  
0.260  
0.177  
0.047  
0.006  
0.030  
F
A
B
6.40  
4.30  
−−−  
6.60 0.252  
4.50 0.169  
DETAIL E  
C
1.20  
−−−  
D
0.05  
0.50  
0.15 0.002  
0.75 0.020  
−W−  
F
C
G
H
0.65 BSC  
0.026 BSC  
0.27  
0.09  
0.09  
0.19  
0.19  
0.37  
0.011  
0.015  
0.008  
0.006  
0.012  
0.010  
J
0.20 0.004  
0.16 0.004  
0.30 0.007  
0.25 0.007  
G
D
J1  
K
H
DETAIL E  
0.100 (0.004)  
−T− SEATING  
K1  
L
6.40 BSC  
0 8 0 8  
0.252 BSC  
M
_
_
_
_
PLANE  
http://onsemi.com  
7
MC74LCX245  
PACKAGE DIMENSIONS  
SOEIAJ−20  
M SUFFIX  
CASE 967−01  
ISSUE O  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
L
E
20  
11  
Q
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD  
FLASH OR PROTRUSIONS AND ARE MEASURED  
AT THE PARTING LINE. MOLD FLASH OR  
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)  
PER SIDE.  
1
H
E
_
E
M
4. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
L
1
10  
5. THE LEAD WIDTH DIMENSION (b) DOES NOT  
INCLUDE DAMBAR PROTRUSION. ALLOWABLE  
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)  
TOTAL IN EXCESS OF THE LEAD WIDTH  
DIMENSION AT MAXIMUM MATERIAL CONDITION.  
DAMBAR CANNOT BE LOCATED ON THE LOWER  
RADIUS OR THE FOOT. MINIMUM SPACE  
BETWEEN PROTRUSIONS AND ADJACENT LEAD  
TO BE 0.46 ( 0.018).  
DETAIL P  
Z
D
VIEW P  
e
A
c
MILLIMETERS  
INCHES  
MIN  
DIM MIN  
MAX  
2.05  
0.20  
0.50  
0.27  
12.80  
5.45  
MAX  
0.081  
0.008  
0.020  
0.011  
0.504  
0.215  
A
A
1
−−−  
0.05  
0.35  
0.18  
12.35  
5.10  
−−−  
0.002  
0.014  
0.007  
0.486  
0.201  
A
b
1
b
c
M
0.10 (0.004)  
0.13 (0.005)  
D
E
e
1.27 BSC  
0.050 BSC  
H
7.40  
0.50  
1.10  
8.20  
0.85  
1.50  
0.291  
0.020  
0.043  
0.323  
0.033  
0.059  
E
L
L
E
M
Q
0
10  
0
10  
_
0.035  
0.032  
_
_
_
0.70  
−−−  
0.90  
0.81  
0.028  
−−−  
1
Z
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MC74LCX245/D  

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