MC74LVX08DT [ONSEMI]
LOW-VOLTAGE CMOS; 低电压CMOS型号: | MC74LVX08DT |
厂家: | ONSEMI |
描述: | LOW-VOLTAGE CMOS |
文件: | 总5页 (文件大小:137K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SEMICONDUCTOR TECHNICAL DATA
The MC74LVX08 is an advanced high speed CMOS 2–input AND
gate. The inputs tolerate voltages up to 7V, allowing the interface of 5V
systems to 3V systems.
• High Speed: t
= 4.8ns (Typ) at V
= 3.3V
PD
• Low Power Dissipation: I
CC
= 2µA (Max) at T = 25°C
CC
A
LOW–VOLTAGE CMOS
• Power Down Protection Provided on Inputs
• Balanced Propagation Delays
• Low Noise: V
= 0.5V (Max)
OLP
• Pin and Function Compatible with Other Standard Logic Families
• Latchup Performance Exceeds 300mA
• ESD Performance: HBM > 2000V; Machine Model > 200V
D SUFFIX
14–LEAD SOIC PACKAGE
CASE 751A–03
V
A2
13
B2
12
O2
11
A3
10
B3
9
O3
8
CC
14
DT SUFFIX
14–LEAD TSSOP PACKAGE
CASE 948G–01
1
2
3
4
5
6
7
A0
B0
O0
A1
B1
O1
GND
Figure 1. 14–Lead Pinout (Top View)
M SUFFIX
14–LEAD SOIC EIAJ PACKAGE
CASE 965–01
1
A0
3
O0
O1
O2
O3
2
4
B0
A1
6
11
8
PIN NAMES
5
B1
A2
Pins
Function
13
An, Bn
On
Data Inputs
Outputs
12
10
B2
A3
9
B3
FUNCTION TABLE
INPUTS
Figure 2. Logic Diagram
OUTPUTS
On
An
Bn
L
L
H
H
L
H
L
L
L
L
H
H
6/97
Motorola, Inc. 1997
REV 0
MC74LVX08
MAXIMUM RATINGS*
Symbol
Parameter
Value
Unit
V
V
V
DC Supply Voltage
DC Input Voltage
–0.5 to +7.0
–0.5 to +7.0
CC
V
in
V
DC Output Voltage
Input Diode Current
Output Diode Current
DC Output Current, per Pin
–0.5 to V
+0.5
V
out
CC
I
I
I
I
–20
mA
mA
mA
mA
mW
C
IK
±20
±25
OK
out
CC
DC Supply Current, V
Power Dissipation
and GND Pins
±50
CC
P
D
180
T
stg
Storage Temperature
–65 to +150
* Absolute maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or
conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is
not implied.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
2.0
0
Max
3.6
Unit
V
V
CC
DC Supply Voltage
V
in
DC Input Voltage
5.5
V
V
out
DC Output Voltage
0
V
CC
V
T
Operating Temperature, All Package Types
Input Rise and Fall Time
–40
0
+85
100
C
A
∆t/∆V
ns/V
DC ELECTRICAL CHARACTERISTICS
T
A
= 25°C
T = – 40 to 85°C
A
V
CC
V
Symbol
Parameter
Test Conditions
Unit
Min
Typ
Max
Min
Max
V
IH
High–Level Input Voltage
2.0
3.0
3.6
1.5
2.0
2.4
1.5
2.0
2.4
V
V
V
V
Low–Level Input Voltage
2.0
3.0
3.6
0.5
0.8
0.8
0.5
0.8
0.8
V
V
V
IL
High–Level Output Voltage
I
I
I
= –50µA
= –50µA
= –4mA
2.0
3.0
3.0
1.9
2.9
2.58
2.0
3.0
1.9
2.9
2.48
OH
OL
OH
OH
OH
(V = V or V
in IH
)
IL
Low–Level Output Voltage
I
I
I
= 50µA
= 50µA
= 4mA
2.0
3.0
3.0
0.0
0.0
0.1
0.1
0.36
0.1
0.1
0.44
OL
OL
OL
(V = V or V
in IH
)
IL
I
I
Input Leakage Current
V
= 5.5V or GND
3.6
3.6
±0.1
±1.0
µA
µA
in
in
in
Quiescent Supply Current
V
= V
or GND
2.0
20.0
CC
CC
MOTOROLA
2
MC74LVX08
AC ELECTRICAL CHARACTERISTICS (Input t = t = 3.0ns)
r
f
T
A
= 25°C
T = – 40 to 85°C
A
Symbol
Parameter
Test Conditions
Unit
Min
Typ
Max
Min
Max
t
t
,
Propagation Delay, Input to
Output
V
V
= 2.7V
C
C
= 15pF
= 50pF
6.3
8.8
11.4
14.9
1.0
1.0
13.5
17.0
ns
PLH
PHL
CC
L
L
= 3.3 ± 0.3V
C
C
= 15pF
= 50pF
4.8
7.3
7.1
10.6
1.0
1.0
8.5
12.0
CC
L
L
t
t
Output–to–Output Skew
(Note NO TAG)
V
CC
V
CC
= 2.7V
= 3.3 ±0.3V
C
L
C
L
= 50pF
= 50pF
1.5
1.5
1.5
1.5
ns
OSHL
OSLH
1. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
The specification applies to any outputs switching in the same direction, either HIGH–to–LOW (t
guaranteed by design.
) or LOW–to–HIGH (t
OSHL
); parameter
OSLH
CAPACITIVE CHARACTERISTICS
T
A
= 25°C
Typ
4
T = – 40 to 85°C
A
Symbol
Parameter
Unit
pF
Min
Max
Min
Max
C
Input Capacitance
Power Dissipation Capacitance (Note NO TAG)
10
10
in
C
18
pF
PD
2. C
is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
PD
Averageoperatingcurrentcanbeobtainedbytheequation:I
=C
.
V
f
+I
/4(pergate).C
isusedtodeterminetheno–load
CC(OPR)
PD CC in CC
PD
2
dynamic power consumption; P = C
V
f
+ I
in CC
V
CC
D
PD
CC
NOISE CHARACTERISTICS (Input t = t = 3.0ns, C = 50pF, V
= 3.3V, Measured in SOIC Package)
r
f
L
CC
T
A
= 25°C
Symbol
Characteristic
Unit
V
Typ
Max
V
OLP
Quiet Output Maximum Dynamic V
0.3
0.5
–0.5
2.0
OL
V
OLV
Quiet Output Minimum Dynamic V
–0.3
V
OL
V
IHD
Minimum High Level Dynamic Input Voltage
Maximum Low Level Dynamic Input Voltage
V
V
ILD
0.8
V
TEST POINT
V
CC
A or B
OUTPUT
50%
DEVICE
UNDER
TEST
GND
t
t
PHL
PLH
C *
L
O
50% V
CC
* Includes all probe and jig capacitance
Figure 3. Switching Waveforms
Figure 4. Test Circuit
3
MOTOROLA
MC74LVX08
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A–03
ISSUE F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
–A
–
14
1
8
7
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
–B
–
P 7 PL
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
M
M
0.25 (0.010)
B
MILLIMETERS
INCHES
G
F
R X 45°
DIM
A
B
C
D
F
G
J
MIN
8.55
3.80
1.35
0.35
0.40
MAX
8.75
4.00
1.75
0.49
1.25
MIN
MAX
0.344
0.157
0.068
0.019
0.049
C
0.337
0.150
0.054
0.014
0.016
J
M
SEATING
PLANE
K
D 14 PL
1.27 BSC
0.050 BSC
0.19
0.10
0.25
0.25
0.008
0.004
0.009
0.009
M
S
S
0.25 (0.010)
T
B
A
K
M
P
R
0
5.80
0.25
°
7
6.20
0.50
°
0
°
7°
0.244
0.019
0.228
0.010
M SUFFIX
PLASTIC SOIC EIAJ PACKAGE
CASE 965–01
ISSUE O
NOTES:
1
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2
3
CONTROLLING DIMENSION: MILLIMETER.
DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
L
E
14
8
7
Q
1
E H
4
5
TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
E
M
THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
L
1
DETAIL P
Z
D
VIEW P
e
MILLIMETERS
INCHES
A
DIM
A
MIN
---
MAX
2.05
0.20
0.50
0.27
10.50
5.45
MIN
---
MAX
0.081
0.008
0.020
0.011
0.413
0.215
c
A
0.05
0.35
0.18
9.90
5.10
0.002
0.014
0.007
0.390
0.201
1
b
c
D
E
e
b
A
1
M
1.27 BSC
0.050 BSC
0.13 (0.005)
0.10 (0.004)
H
7.40
0.50
1.10
0
8.20
0.85
1.50
10
0.291
0.020
0.043
0
0.323
0.033
0.059
10
E
L
L
M
E
Q
Z
0.70
---
0.90
1.42
0.028
---
0.035
0.056
1
MOTOROLA
4
MC74LVX08
OUTLINE DIMENSIONS
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948G–01
ISSUE O
NOTES:
14X K REF
0.10 (0.004)
1
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
M
S
S
T
U
V
2
3
CONTROLLING DIMENSION: MILLIMETER.
DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
S
0.15 (0.006) T
U
N
0.25 (0.010)
14
4
5
DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
8
7
2X L/2
M
B
L
N
–U–
PIN 1
IDENT.
F
1
6
7
TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
DETAIL E
S
K
0.15 (0.006) T
U
A
MILLIMETERS
INCHES
K1
DIM
A
B
C
D
F
G
H
J
J1
K
MIN
4.90
4.30
–––
0.05
0.50
MAX
5.10
4.50
1.20
0.15
0.75
MIN
MAX
0.200
0.177
0.047
0.006
0.030
–V–
0.193
0.169
–––
0.002
0.020
J J1
SECTION N–N
0.65 BSC
0.026 BSC
0.50
0.09
0.09
0.19
0.19
0.60
0.20
0.16
0.30
0.25
0.020
0.004
0.004
0.007
0.007
0.024
0.008
0.006
0.012
0.010
–W–
C
K1
L
6.40 BSC
0.252 BSC
0.10 (0.004)
M
0
8
0
8
SEATING
PLANE
–T–
H
G
DETAIL E
D
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MC74LVX08/D
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