MC74VHC1G132 [ONSEMI]

2-Input NAND Schmitt-Trigger; 2输入与非施密特触发器
MC74VHC1G132
型号: MC74VHC1G132
厂家: ONSEMI    ONSEMI
描述:

2-Input NAND Schmitt-Trigger
2输入与非施密特触发器

触发器
文件: 总6页 (文件大小:73K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
MC74VHC1G132  
2−Input NAND  
Schmitt−Trigger  
The MC74VHC1G132 is a single gate CMOS Schmitt NAND  
trigger fabricated with silicon gate CMOS technology. It achieves high  
speed operation similar to equivalent Bipolar Schottky TTL while  
maintaining CMOS low power dissipation.  
The internal circuit is composed of three stages, including a buffer  
output which provides high noise immunity and stable output.  
The MC74VHC1G132 input structure provides protection when  
voltages up to 7.0 V are applied, regardless of the supply voltage. This  
allows the MC74VHC1G132 to be used to interface 5.0 V circuits to  
3.0 V circuits.  
http://onsemi.com  
MARKING  
DIAGRAMS  
5
5
1
VD M G  
SC−88A/SOT−353/SC−70  
DF SUFFIX  
G
The MC74VHC1G132 can be used to enhance noise immunity or to  
square up slowly changing waveforms.  
1
5
CASE 419A  
Features  
High Speed: t = 3.6 ns (Typ) at V = 5.0 V  
PD  
CC  
5
VD AYW G  
G
Low Power Dissipation: I = 1.0 mA (Max) at T = 25°C  
CC  
A
1
TSOP−5/SOT−23/SC−59  
DT SUFFIX  
1
Power Down Protection Provided on Inputs  
Balanced Propagation Delays  
Pin and Function Compatible with Other Standard Logic Families  
Chip Complexity: FETs = 68; Equivalent Gates = 16  
Pb−Free Packages are Available  
CASE 483  
VD  
M
A
= Device Code  
= Date Code*  
= Assembly Location  
= Year  
Y
W
G
= Work Week  
= Pb−Free Package  
(Note: Microdot may be in either location)  
*Date Code orientation and/or position may  
vary depending upon manufacturing location.  
5
V
IN B  
IN A  
GND  
1
2
3
CC  
PIN ASSIGNMENT  
1
2
3
4
5
IN B  
IN A  
GND  
4
OUT Y  
OUT Y  
V
CC  
Figure 1. Pinout (Top View)  
FUNCTION TABLE  
Inputs  
Output  
Y
A
B
L
L
L
H
L
H
H
H
L
IN A  
IN B  
&
OUT Y  
H
H
H
Figure 2. Logic Symbol  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 4 of this data sheet.  
©
Semiconductor Components Industries, LLC, 2005  
1
Publication Order Number:  
August, 2005 − Rev. 17  
MC74VHC1G132/D  
MC74VHC1G132  
MAXIMUM RATINGS  
Symbol  
Parameter  
Value  
Unit  
V
DC Supply Voltage  
*0.5 to )7.0  
V
V
CC  
V
DC Input Voltage  
−0.5 to +7.0  
IN  
V
DC Output Voltage  
*0.5 to V )0.5  
V
OUT  
CC  
I
DC Input Diode Current  
DC Output Diode Current  
DC Output Sink Current  
DC Supply Current per Supply Pin  
Storage Temperature Range  
−20  
$20  
mA  
mA  
mA  
mA  
°C  
IK  
I
OK  
I
$12.5  
$25  
OUT  
I
CC  
T
*65 to )150  
260  
STG  
T
Lead Temperature, 1 mm from Case for 10 Seconds  
Junction Temperature Under Bias  
Thermal Resistance  
°C  
L
T
)150  
°C  
J
q
SC70−5/SC−88A (Note 1)  
TSOP−5  
350  
230  
°C/W  
JA  
P
Power Dissipation in Still Air at 85°C  
SC70−5/SC−88A  
TSOP−5  
150  
200  
mW  
D
MSL  
Moisture Sensitivity  
Flammability Rating  
ESD Withstand Voltage  
Level 1  
F
Oxygen Index: 28 to 34  
UL 94 V−0 @ 0.125 in  
R
V
Human Body Model (Note 2)  
Machine Model (Note 3)  
Charged Device Model (Note 4)  
u2000  
u200  
N/A  
V
ESD  
I
Latchup Performance  
Above V and Below GND at 125°C (Note 5)  
$500  
mA  
LATCHUP  
CC  
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit  
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,  
damage may occur and reliability may be affected.  
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.  
2. Tested to EIA/JESD22−A114−A.  
3. Tested to EIA/JESD22−A115−A.  
4. Tested to JESD22−C101−A.  
5. Tested to EIA/JESD78.  
RECOMMENDED OPERATING CONDITIONS  
Symbol  
Parameter  
Min  
2.0  
Max  
5.5  
Unit  
V
V
DC Supply Voltage  
CC  
V
DC Input Voltage  
0.0  
5.5  
V
IN  
V
DC Output Voltage  
0.0  
V
V
OUT  
CC  
T
Operating Temperature Range  
Input Rise and Fall Time  
*55  
)125  
°C  
ns/V  
A
t , t  
r
V
V
= 3.3 V 0.3 V  
= 5.0 V 0.5 V  
No Limit  
No Limit  
f
CC  
CC  
FAILURE RATE OF PLASTIC = CERAMIC  
UNTIL INTERMETALLICS OCCUR  
Device Junction Temperature versus  
Time to 0.1% Bond Failures  
Junction  
Temperature °C  
Time, Hours  
1,032,200  
419,300  
178,700  
79,600  
Time, Years  
117.8  
47.9  
80  
90  
1
100  
110  
120  
130  
140  
20.4  
1
10  
100  
9.4  
1000  
TIME, YEARS  
37,000  
4.2  
Figure 3. Failure Rate vs. Time Junction Temperature  
17,800  
2.0  
8,900  
1.0  
http://onsemi.com  
2
 
MC74VHC1G132  
DC ELECTRICAL CHARACTERISTICS  
T
A
= 25°C  
T
85°C  
−55 T 125°C  
A
A
V
(V)  
CC  
Min  
Typ  
Max  
Min  
Max  
Min  
Max  
Symbol  
Parameter  
Test Conditions  
Unit  
V
Positive Threshold  
Voltage  
3.0  
4.5  
5.5  
1.50  
2.35  
2.80  
1.88  
2.66  
3.21  
2.25  
3.10  
3.70  
1.50  
2.35  
2.80  
2.25  
3.10  
3.70  
1.50  
2.35  
2.80  
2.25  
3.10  
3.70  
V
T+  
V
Negative Threshold  
Voltage  
3.0  
4.5  
5.5  
0.65  
1.10  
1.45  
1.03  
1.62  
2.02  
1.40  
2.10  
2.60  
0.65  
1.10  
1.45  
1.40  
2.10  
2.60  
0.65  
1.10  
1.45  
1.40  
2.10  
2.60  
V
V
V
T−  
V
Hysteresis Voltage  
3.0  
4.5  
5.5  
0.30  
0.40  
0.50  
0.85  
1.05  
1.20  
1.60  
2.00  
2.25  
0.30  
0.40  
0.50  
1.60  
2.00  
2.25  
0.30  
0.40  
0.50  
1.60  
2.00  
2.25  
H
V
= V or GND  
2.0  
1.9  
2.0  
1.9  
1.9  
V
Minimum High−Level  
Output Voltage  
IN  
IN  
CC  
OH  
V
I
= V or V  
3.0  
4.5  
2.9  
4.4  
3.0  
4.5  
2.9  
4.4  
2.9  
4.5  
IH  
IL  
I
= −50mA  
OH  
= −50 mA  
OH  
I
I
= −4 mA  
= −8 mA  
3.0  
4.5  
2.58  
3.94  
2.48  
3.80  
2.34  
3.66  
V
V
OH  
OH  
V
I
= V or V  
2.0  
3.0  
4.5  
0.0  
0.0  
0.0  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
V
Maximum Low−Level  
Output Voltage  
IN  
IH  
IL  
OL  
= 50 mA  
OL  
I
I
= 4 mA  
= 8 mA  
3.0  
4.5  
0.36  
0.36  
0.44  
0.44  
0.52  
0.52  
V
OL  
OL  
I
Maximum Input  
Leakage Current  
V
= 5.5 V or GND  
0 to  
5.5  
0.1  
1.0  
1.0  
mA  
mA  
IN  
IN  
I
Maximum Quiescent  
Supply Current  
V
= V or GND  
5.5  
1.0  
20  
40  
CC  
IN  
CC  
AC ELECTRICAL CHARACTERISTICS C  
= 50 pF, Input t /t = 3.0 ns  
r f  
load  
T
A
= 25°C  
T
A
85°C  
−55 T 125°C  
A
Min  
Typ  
Max  
Min  
Max  
Min  
Max  
Symbol  
Parameter  
Maximum  
Propagation Delay,  
A or B to Y  
Test Conditions  
Unit  
t
,
V
V
= 3.3 0.3 V  
C = 15 pF  
L
4.6  
6.1  
11.9  
15.4  
1.0  
1.0  
14.0  
17.5  
1.0  
1.0  
16.1  
19.6  
ns  
PLH  
CC  
CC  
t
C = 50 pF  
L
PHL  
= 5.0 0.5 V  
C = 15 pF  
L
3.6  
4.3  
7.7  
9.7  
1.0  
1.0  
9.0  
11.0  
1.0  
1.0  
10.3  
12.3  
C = 50 pF  
L
C
Maximum Input  
Capacitance  
5.5  
10  
10  
10  
pF  
pF  
IN  
Typical @ 25°C, V = 5.0 V  
CC  
11  
C
PD  
Power Dissipation Capacitance (Note 6)  
6. C is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.  
PD  
Average operating current can be obtained by the equation: I  
) = C V f + I . C is used to determine the no−load dynamic  
CC(OPR  
PD CC in CC PD  
2
power consumption; P = C V  
f + I V  
.
D
PD  
CC  
in  
CC  
CC  
http://onsemi.com  
3
 
MC74VHC1G132  
TEST POINT  
OUTPUT  
V
CC  
A or B  
50%  
DEVICE  
UNDER  
TEST  
GND  
t
t
PLH  
C *  
L
PHL  
Y
50% V  
CC  
*Includes all probe and jig capacitance  
Figure 4. Switching Waveforms  
Figure 5. Test Circuit  
DEVICE ORDERING INFORMATION  
Device Order Number  
Package Type  
Tape and Reel Size  
MC74VHC1G132DFT1  
SC70−5/SC−88A/SOT−353  
178 mm (7 in)  
3000 Units / Tape & Reel  
M74VHC1G132DFT1G  
MC74VHC1G132DFT2  
M74VHC1G132DFT2G  
MC74VHC1G132DTT1  
M74VHC1G132DTT1G  
SC70−5/SC−88A/SOT−353  
(Pb−Free)  
178 mm (7 in)  
3000 Units / Tape & Reel  
SC70−5/SC−88A/SOT−353  
178 mm (7 in)  
3000 Units / Tape & Reel  
SC70−5/SC−88A/SOT−353  
(Pb−Free)  
178 mm (7 in)  
3000 Units / Tape & Reel  
SOT23−5/TSOP−5SC59−5  
178 mm (7 in)  
3000 Units / Tape & Reel  
SOT23−5/TSOP−5SC59−5  
(Pb−Free)  
178 mm (7 in)  
3000 Units / Tape & Reel  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
http://onsemi.com  
4
MC74VHC1G132  
PACKAGE DIMENSIONS  
SC−88A / SOT−353 / SC70  
CASE 419A−02  
ISSUE H  
NOTES:  
A
1. DIMENSIONING AND TOLERANCING  
PER ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. 419A−01 OBSOLETE. NEW STANDARD  
419A−02.  
G
4. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD FLASH, PROTRUSIONS, OR GATE  
BURRS.  
5
4
3
−B−  
S
INCHES  
DIM MIN MAX  
MILLIMETERS  
MIN  
1.80  
1.15  
0.80  
0.10  
MAX  
2.20  
1.35  
1.10  
0.30  
1
2
A
B
C
D
G
H
J
0.071  
0.045  
0.031  
0.004  
0.087  
0.053  
0.043  
0.012  
0.026 BSC  
0.65 BSC  
M
M
B
D 5 PL  
0.2 (0.008)  
−−−  
0.004  
0.004  
0.004  
0.010  
0.012  
−−−  
0.10  
0.10  
0.10  
0.25  
0.30  
N
K
N
S
0.008 REF  
0.20 REF  
0.079  
0.087  
2.00  
2.20  
J
C
K
H
SOLDERING FOOTPRINT*  
0.50  
0.0197  
0.65  
0.025  
0.65  
0.025  
0.40  
0.0157  
mm  
inches  
ǒ
Ǔ
1.9  
0.0748  
SCALE 20:1  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
http://onsemi.com  
5
MC74VHC1G132  
PACKAGE DIMENSIONS  
TSOP−5 / SOT23−5 / SC59−5  
DT SUFFIX  
CASE 483−02  
ISSUE D  
NOTES:  
D
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. MAXIMUM LEAD THICKNESS INCLUDES  
LEAD FINISH THICKNESS. MINIMUM LEAD  
THICKNESS IS THE MINIMUM THICKNESS  
OF BASE MATERIAL.  
4. A AND B DIMENSIONS DO NOT INCLUDE  
MOLD FLASH, PROTRUSIONS, OR GATE  
BURRS.  
5
4
3
B
C
S
1
2
L
G
A
MILLIMETERS  
INCHES  
MIN MAX  
0.1142 0.1220  
DIM  
A
B
C
D
G
H
J
K
L
MIN  
2.90  
1.30  
0.90  
0.25  
0.85  
0.013  
0.10  
0.20  
1.25  
0
MAX  
3.10  
J
1.70 0.0512 0.0669  
1.10 0.0354 0.0433  
0.50 0.0098 0.0197  
1.05 0.0335 0.0413  
0.100 0.0005 0.0040  
0.26 0.0040 0.0102  
0.60 0.0079 0.0236  
1.55 0.0493 0.0610  
0.05 (0.002)  
H
M
K
M
S
10  
0
10  
_
_
_
_
2.50  
3.00 0.0985 0.1181  
SOLDERING FOOTPRINT*  
1.9  
0.074  
0.95  
0.037  
2.4  
0.094  
1.0  
0.039  
0.7  
0.028  
mm  
inches  
ǒ
Ǔ
SCALE 10:1  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
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PUBLICATION ORDERING INFORMATION  
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Order Literature: http://www.onsemi.com/litorder  
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Phone: 81−3−5773−3850  
For additional information, please contact your  
local Sales Representative.  
MC74VHC1G132/D  

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