MC74VHC244ML2 [ONSEMI]
IC,BUFFER/DRIVER,DUAL,4-BIT,AHC/VHC-CMOS,SOP,20PIN,PLASTIC;
| 型号： | MC74VHC244ML2 |
| 厂家： | 
ONSEMI |
| 描述： | IC,BUFFER/DRIVER,DUAL,4-BIT,AHC/VHC-CMOS,SOP,20PIN,PLASTIC 驱动 光电二极管 逻辑集成电路 |
| 文件： | 总6页 (文件大小：165K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SEMICONDUCTOR TECHNICAL DATA
The MC74VHC244 is an advanced high speed CMOS octal bus buffer
fabricated with silicon gate CMOS technology. It achieves high speed
operation similar to equivalent Bipolar Schottky TTL while maintaining
CMOS low power dissipation.
The MC74VHC244 is a noninverting 3–state buffer, and has two
active–low output enables. This device is designed to be used with 3–state
memory address drivers, etc.
The internal circuit is composed of three stages, including a buffer output
which provides high noise immunity and stable output. The inputs tolerate
voltages up to 7V, allowing the interface of 5V systems to 3V systems.
DW SUFFIX
20–LEAD SOIC PACKAGE
CASE 751D–04
•
•
•
•
•
•
•
•
•
•
•
High Speed: t
= 3.9ns (Typ) at V
= 5V
PD
Low Power Dissipation: I
CC
= 4µA (Max) at T = 25°C
CC
NIH
A
High Noise Immunity: V
Power Down Protection Provided on Inputs
Balanced Propagation Delays
Designed for 2V to 5.5V Operating Range
= V
= 28% V
NIL CC
DT SUFFIX
20–LEAD TSSOP PACKAGE
CASE 948E–02
Low Noise: V
= 0.9V (Max)
OLP
Pin and Function Compatible with Other Standard Logic Families
Latchup Performance Exceeds 300mA
ESD Performance: HBM > 2000V; Machine Model > 200V
Chip Complexity: 136 FETs or 34 Equivalent Gates
M SUFFIX
20–LEAD SOIC EIAJ PACKAGE
CASE 967–01
LOGIC DIAGRAM
ORDERING INFORMATION
2
4
6
8
18
16
14
12
MC74VHCXXXDW
MC74VHCXXXDT
MC74VHCXXXM
SOIC
TSSOP
SOIC EIAJ
A1
A2
A3
A4
YA1
YA2
YA3
YA4
PIN ASSIGNMENT
OEA
1
20
V
CC
DATA
INPUTS
NONINVERTING
OUTPUTS
11
13
9
7
A1
YB4
A2
2
3
4
19
18
17
OEB
YA1
B4
B1
B2
YB1
YB2
YB3
A3
5
16
15
14
13
12
11
YA2
B3
15
17
5
3
B3
B4
YB3
YB4
6
YB2
A4
7
YA3
B2
8
YB1
GND
9
YA4
B1
10
1
OEA
OEB
OUTPUT
ENABLES
19
FUNCTION TABLE
INPUTS
OUTPUTS
YA, YB
OEA, OEB
A, B
L
L
H
L
H
X
L
H
Z
6/97
REV 1
Motorola, Inc. 1997
MC74VHC244
MAXIMUM RATINGS*
Symbol
Parameter
Value
Unit
V
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high–impedance cir-
V
DC Supply Voltage
DC Input Voltage
– 0.5 to + 7.0
– 0.5 to + 7.0
CC
V
V
in
V
DC Output Voltage
Input Diode Current
Output Diode Current
– 0.5 to V
CC
+ 0.5
V
out
I
IK
– 20
mA
mA
mA
mA
mW
cuit. For proper operation, V and
in
I
± 20
± 25
± 50
OK
V
should be constrained to the
out
range GND (V or V
)
V
.
I
DC Output Current, per Pin
DC Supply Current, V and GND Pins
in out
CC
out
CC
Unused inputs must always be
tied to an appropriate logic voltage
I
CC
level (e.g., either GND or V
).
P
D
Power Dissipation in Still Air,
SOIC Packages†
TSSOP Package†
500
450
CC
Unused outputs must be left open.
T
stg
Storage Temperature
– 65 to + 150
C
* Absolute maximum continuous ratings are those values beyond which damage to the device
may occur. Exposure to these conditions or conditions beyond those indicated may adversely
affect device reliability. Functional operation under absolute–maximum–rated conditions is not
implied.
†Derating — SOIC Packages: – 7 mW/ C from 65 to 125 C
TSSOP Package: – 6.1 mW/ C from 65 to 125 C
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
2.0
0
Max
5.5
Unit
V
V
CC
DC Supply Voltage
DC Input Voltage
DC Output Voltage
V
in
5.5
V
V
out
0
V
CC
V
T
A
Operating Temperature, All Package Types
– 40
+ 85
C
t , t
r f
Input Rise and Fall Time
V
CC
V
CC
= 3.3V ±0.3V
=5.0V ±0.5V
0
0
100
20
ns/V
DC ELECTRICAL CHARACTERISTICS
T
A
= 25°C
T = – 40 to 85°C
A
V
CC
V
Symbol
Parameter
Test Conditions
Unit
Min
1.50
Typ
Max
Min
Max
V
IH
Minimum High–Level
Input Voltage
2.0
3.0 to
5.5
1.50
V
V
x 0.7
V
x 0.7
CC
CC
V
Maximum Low–Level
Input Voltage
2.0
3.0 to
5.5
0.50
0.50
V
V
IL
V
x 0.3
V
x 0.3
CC
CC
V
OH
Minimum High–Level
Output Voltage
V
= V or V
IH
2.0
3.0
4.5
1.9
2.9
4.4
2.0
3.0
4.5
1.9
2.9
4.4
in
IL
IL
I
= – 50µA
OH
V
in
= V or V
IH
I
I
= – 4mA
3.0
4.5
2.58
3.94
2.48
3.80
OH
OH
= – 8mA
V
OL
Maximum Low–Level
Output Voltage
V
= V or V
IH IL
= 50µA
2.0
3.0
4.5
0.0
0.0
0.0
0.1
0.1
0.1
0.1
0.1
0.1
V
in
I
OL
V
= V or V
in
in
IH
IL
I
I
= 4mA
= 8mA
3.0
4.5
0.36
0.36
0.44
0.44
OL
OL
I
in
Maximum Input
Leakage Current
V
= 5.5V or GND
0 to 5.5
± 0.1
± 1.0
µA
MOTOROLA
2
MC74VHC244
DC ELECTRICAL CHARACTERISTICS
T
A
= 25°C
T = – 40 to 85°C
A
V
CC
V
Symbol
Parameter
Test Conditions
Min
Typ
Max
Min
Max
Unit
I
Maximum Three–State
Leakage Current
V
= V or V
5.5
± 0.25
± 2.5
µA
OZ
in
IL
= V
IH
or GND
V
out
CC
or GND
I
Maximum Quiescent
Supply Current
V
in
= V
5.5
4.0
40.0
µA
CC
CC
AC ELECTRICAL CHARACTERISTICS (Input t = t = 3.0ns)
r
f
T
A
= 25°C
T
A
= – 40 to 85°C
Symbol
Parameter
Test Conditions
Unit
Min
Typ
Max
Min
1.0
Max
t
t
,
Maximum Propagation Delay,
A to YA or B to YB
V
V
V
= 3.3 ± 0.3V
= 5.0 ± 0.5V
= 3.3 ± 0.3V
C
C
= 15pF
= 50pF
5.8
8.3
8.4
11.9
10.0
13.5
ns
PLH
CC
CC
CC
L
L
1.0
PHL
C
C
= 15pF
= 50pF
3.9
5.4
5.5
7.5
1.0
1.0
6.5
8.5
L
L
t
t
,
Output Enable Time
OEA to YA or OEB to YB
C
C
= 15pF
= 50pF
6.6
9.1
10.6
14.1
1.0
1.0
12.5
16.0
ns
ns
pF
PZL
L
L
R
= 1kΩ
PZH
L
V
R
= 5.0 ± 0.5V
= 1kΩ
C
L
C
L
= 15pF
= 50pF
4.7
6.2
7.3
9.3
1.0
1.0
8.5
10.5
CC
L
t
t
,
Output Disable Time
OEA to YA or OEB to YB
V
R
= 3.3 ± 0.3V
= 1kΩ
C
C
C
C
= 50pF
= 50pF
= 50pF
= 50pF
10.3
14.0
9.2
1.5
1.0
10
1.0
16.0
10.5
1.5
PLZ
CC
L
L
L
L
PHZ
L
V
R
= 5.0 ± 0.5V
= 1kΩ
6.7
1.0
CC
L
t
t
,
Output to Output Skew
V
CC
= 3.3 ± 0.3V
(Note 1.)
OSLH
OSHL
V
= 5.0 ± 0.5V
CC
(Note 1.)
1.0
C
Maximum Input Capacitance
4
6
10
pF
pF
in
C
Maximum Three–State Output
Capacitance (Output in
out
High–Impedance State)
Typical @ 25°C, V
= 5.0V
CC
C
Power Dissipation Capacitance (Note 2.)
pF
19
PD
1. Parameter guaranteed by design. t = |t – t
|, t
= |t
– t |.
PHLm PHLn
OSLH
PLHm PLHn OSHL
2. C
is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
PD
Averageoperatingcurrentcanbeobtainedbytheequation:I
=C
V
f
+I
/8(perbit).C isusedtodeterminetheno–load
PD
CC(OPR)
PD CC in CC
2
dynamic power consumption; P = C
V
f
+ I
in CC
V
.
D
PD
CC
CC
NOISE CHARACTERISTICS (Input t = t = 3.0ns, C = 50pF, V
= 5.0V)
r
f
L
CC
T
A
= 25°C
Symbol
Parameter
Unit
V
Typ
Max
V
OLP
Quiet Output Maximum Dynamic V
0.6
0.9
– 0.9
3.5
OL
V
OLV
Quiet Output Minimum Dynamic V
– 0.6
V
OL
V
IHD
Minimum High Level Dynamic Input Voltage
Maximum Low Level Dynamic Input Voltage
V
V
ILD
1.5
V
3
MOTOROLA
MC74VHC244
SWITCHING WAVEFORMS
V
CC
V
A or B
CC
OEA or OEB
50%
50%
GND
GND
t
t
PLZ
PZL
HIGH
IMPEDANCE
t
t
PHL
PLH
YA or YB
50% V
CC
YA or YB
YA or YB
50% V
CC
V
V
+0.3V
OL
t
t
PHZ
PZH
–0.3V
OH
50% V
CC
HIGH
IMPEDANCE
Figure 1.
Figure 2.
TEST CIRCUITS
TEST POINT
TEST POINT
1 k
OUTPUT
CONNECT TO V
WHEN
.
PZL
CC
AND t
Ω
OUTPUT
TESTING t
PLZ
CONNECT TO GND WHEN
TESTING t AND t
DEVICE
UNDER
TEST
DEVICE
UNDER
TEST
.
PZH
PHZ
C *
C *
L
L
* Includes all probe and jig capacitance
* Includes all probe and jig capacitance
Figure 3. Test Circuit
Figure 4. Test Circuit
INPUT
Figure 5. Input Equivalent Circuit
MOTOROLA
4
MC74VHC244
OUTLINE DIMENSIONS
DW SUFFIX
PLASTIC SOIC PACKAGE
CASE 751D–04
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER
–A–
ANSI Y14.5M, 1982.
20
11
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.150
(0.006) PER SIDE.
10X P
–B–
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
M
M
0.010 (0.25)
B
1
10
MILLIMETERS
INCHES
20X D
DIM
A
B
C
D
MIN
12.65
7.40
2.35
0.35
0.50
MAX
12.95
7.60
2.65
0.49
0.90
MIN
MAX
0.510
0.299
0.104
0.019
0.035
J
0.499
0.292
0.093
0.014
0.020
M
S
S
0.010 (0.25)
T
A
B
F
F
G
J
K
M
P
R
1.27 BSC
0.050 BSC
0.25
0.10
0
0.32
0.25
7
0.010
0.004
0
0.012
0.009
7
R X 45
10.05
0.25
10.55
0.75
0.395
0.010
0.415
0.029
C
SEATING
PLANE
–T–
M
18X G
K
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948E–02
ISSUE A
20X K REF
0.10 (0.004)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
M
S
S
T
U
V
S
0.15 (0.006)
T U
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
K
K1
20
11
2X L/2
J J1
B
L
–U–
PIN 1
IDENT
SECTION N–N
1
10
0.25 (0.010)
N
S
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
0.15 (0.006)
T U
M
A
MILLIMETERS
INCHES
DIM
A
B
C
D
MIN
6.40
4.30
–––
0.05
0.50
MAX
6.60
4.50
1.20
0.15
0.75
MIN
MAX
0.260
0.177
0.047
0.006
0.030
–V–
0.252
0.169
–––
0.002
0.020
N
F
F
G
H
J
J1
K
K1
L
0.65 BSC
0.026 BSC
DETAIL E
0.27
0.09
0.09
0.19
0.19
0.37
0.20
0.16
0.30
0.25
0.011
0.004
0.004
0.007
0.007
0.015
0.008
0.006
0.012
0.010
–W–
C
6.40 BSC
0.252 BSC
G
D
M
0
8
0
8
H
DETAIL E
0.100 (0.004)
–T– SEATING
PLANE
5
MOTOROLA
MC74VHC244
OUTLINE DIMENSIONS
M SUFFIX
PLASTIC SOIC EIAJ PACKAGE
CASE 967–01
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
L
E
20
11
Q
1
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
H
E
E
M
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
L
1
10
DETAIL P
Z
D
VIEW P
MILLIMETERS
INCHES
e
A
DIM
A
1
b
c
D
E
e
MIN
–––
MAX
2.05
0.20
0.50
0.27
12.80
5.45
MIN
MAX
0.081
0.008
0.020
0.011
0.504
0.215
c
–––
0.002
0.014
0.007
0.486
0.201
A
0.05
0.35
0.18
12.35
5.10
A
b
1
1.27 BSC
0.050 BSC
M
0.10 (0.004)
0.13 (0.005)
H
7.40
0.50
1.10
0
8.20
0.85
1.50
10
0.291
0.020
0.043
0
0.323
0.033
0.059
10
E
L
L
M
E
Q
Z
0.70
–––
0.90
0.81
0.028
–––
0.035
0.032
1
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specificallydisclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
datasheetsand/orspecificationscananddovaryindifferentapplicationsandactualperformancemayvaryovertime. Alloperatingparameters,including“Typicals”
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