MC7818BD2TR4 [ONSEMI]
18V FIXED POSITIVE REGULATOR, PSSO2, HEAT SINK, PLASTIC, D2PAK-3;型号: | MC7818BD2TR4 |
厂家: | ONSEMI |
描述: | 18V FIXED POSITIVE REGULATOR, PSSO2, HEAT SINK, PLASTIC, D2PAK-3 |
文件: | 总54页 (文件大小:995K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
THREE–TERMINAL
POSITIVE FIXED
VOLTAGE REGULATORS
These voltage regulators are monolithic integrated circuits designed as
fixed–voltage regulators for a wide variety of applications including local,
on–card regulation. These regulators employ internal current limiting,
thermal shutdown, and safe–area compensation. With adequate heatsinking
they can deliver output currents in excess of 1.0 A. Although designed
primarily as a fixed voltage regulator, these devices can be used with
external components to obtain adjustable voltages and currents.
SEMICONDUCTOR
TECHNICAL DATA
• Output Current in Excess of 1.0 A
• No External Components Required
T SUFFIX
PLASTIC PACKAGE
CASE 221A
• Internal Thermal Overload Protection
• Internal Short Circuit Current Limiting
• Output Transistor Safe–Area Compensation
• Output Voltage Offered in 2% and 4% Tolerance
Heatsink surface
connected to Pin 2.
1
2
2
• Available in Surface Mount D PAK and Standard 3–Lead Transistor
3
Packages
Pin 1. Input
2. Ground
3. Output
D2T SUFFIX
PLASTIC PACKAGE
CASE 936
2
(D PAK)
2
1
3
Heatsink surface (shown as terminal 4 in
case outline drawing) is connected to Pin 2.
DEVICE TYPE/NOMINAL OUTPUT VOLTAGE
STANDARD APPLICATION
MC7805
MC7806
MC7808
MC7809
5.0 V
6.0 V
8.0 V
9.0 V
MC7812
MC7815
MC7818
MC7824
12 V
15 V
18 V
24 V
MC78XX
Input
Output
C **
C *
in
0.33 µF
O
ORDERING INFORMATION
A common ground is required between the input
and the output voltages. The input voltage must
remain typically 2.0 V above the output voltage
even during the low point on the input ripple
voltage.
Output Voltage
Tolerance
Operating
Temperature Range
Device
Package
MC78XXACT
MC78XXACD2T
MC78XXCT
Insertion Mount
Surface Mount
Insertion Mount
Surface Mount
Insertion Mount
Surface Mount
2%
4%
XX,
T = 0° to +125°C
J
These two digits of the type number
indicate nominal voltage.
* C is required if regulator is located an
in
appreciable distance from power supply
filter.
MC78XXCD2T
MC78XXBT
T = – 40° to +125°C
J
** C is not needed for stability; however,
O
MC78XXBD2T
it does improve transient response. Values
XX indicates nominal voltage.
of less than 0.1 µF could cause instability.
3–182
MOTOROLA ANALOG IC DEVICE DATA
MC7800 Series
MAXIMUM RATINGS (T = 25°C unless otherwise noted.)
A
Rating
Symbol
Value
Unit
Input Voltage (5.0 – 18 V)
Input Voltage (24 V)
V
I
35
40
Vdc
Power Dissipation
Case 221A
T
A
= 25°C
P
D
Internally Limited
W
Thermal Resistance, Junction–to–Ambient
Thermal Resistance, Junction–to–Case
R
R
65
5.0
°C/W
°C/W
θJA
θJC
2
Case 936 (D PAK)
= 25°C
T
P
R
R
Internally Limited
See Figure 13
5.0
W
°C/W
°C/W
A
D
θJA
θJA
Thermal Resistance, Junction–to–Ambient
Thermal Resistance, Junction–to–Case
Storage Junction Temperature Range
Operating Junction Temperature
T
–65 to +150
+150
°C
°C
stg
T
J
Representative Schematic Diagram
V
in
MC7800
R
50
24
D
Zener
2
LAT 3A
LAT
R
27.5 k
19
Q
Q
18
17
Q
QNPN
19
Q
20
QNPN
C
3
1.0P
R
1.0 k
14
Q
10
QNPN
R
680
15
R
100 k
R
18
R
0.2
21
600
23
R
100
22
V
out
5.01
Q
QNPN
7
Q
5
QNPN 2
R
30
18 k
R
9.0 k
Q
QNPN
17
12
Q
Sense
9
QNPN 2
R
3.0 k
R
12
29
9.0 k
R
15 k
D
1
Q
6
11
Q
QNPN
15
Zener
QNPN
R
R
25
28
R
1
6.0 k
9.0 k
10.66 k
R
R
10
16
R
17500
20
3340–(3316ACT)
600
R
R
26
27
Q
QNPN
8
3.0 k
9.0 k
R
2
1.56 k
R
3.0 k
9
R
5
R
13
4.5 k
11660
SUB
Q
14
QNPN
Q11 2
Q
C
30P
1
1
C
3.0P
2
N+
QNPN 6
Q
4
QNPN
Q
13
QNPN
Q
3
QNPN
Q
Q
2
16
R
6
QNPN 4
1.0 k
Diode
R
1.8 k
R
8
R
14 k
3
7
5.0 k
This device contains 22 active transistors.
3–183
MOTOROLA ANALOG IC DEVICE DATA
MC7800 Series
ELECTRICAL CHARACTERISTICS (V = 10 V, I = 500 mA, T = T
in
to T
[Note 1], unless otherwise noted.)
high
O
J
low
MC7805B
Typ
MC7805C
Typ
Characteristic
Output Voltage (T = 25°C)
Symbol
Min
Max
Min
Max
Unit
Vdc
Vdc
V
V
4.8
5.0
5.2
4.8
5.0
5.2
J
O
Output Voltage
(5.0 mA ≤ I ≤ 1.0 A, P ≤15 W)
O
O
in
D
7.0 Vdc ≤ V ≤ 20 Vdc
–
4.75
–
5.0
–
5.25
4.75
–
5.0
–
5.25
–
8.0 Vdc ≤ V ≤ 20 Vdc
in
Line Regulation, T = 25°C (Note 2)
Reg
mV
mV
J
line
7.0 Vdc ≤ V ≤ 25 Vdc
–
–
5.0
1.3
100
50
–
–
5.0
1.3
100
50
in
8.0 Vdc ≤ V ≤ 12 Vdc
in
Load Regulation, T = 25°C (Note 2)
Reg
load
J
5.0 mA ≤ I ≤ 1.5 A
–
–
1.3
0.15
100
50
–
–
1.3
0.15
100
50
O
250 mA ≤ I ≤ 750 mA
O
Quiescent Current (T = 25°C)
I
–
3.2
8.0
–
3.2
8.0
mA
mA
J
B
Quiescent Current Change
∆I
B
7.0 Vdc ≤ V ≤ 25 Vdc
–
–
–
–
–
–
–
1.3
0.5
–
–
–
–
–
–
1.3
–
0.5
in
8.0 Vdc ≤ V ≤ 25 Vdc
in
5.0 mA ≤ I ≤ 1.0 A
O
Ripple Rejection
RR
dB
8.0 Vdc ≤ V ≤ 18 Vdc, f = 120 Hz
–
–
68
–
–
–
–
68
–
–
in
Dropout Voltage (I = 1.0 A, T = 25°C)
V – V
I O
2.0
2.0
Vdc
O
J
Output Noise Voltage (T = 25°C)
10 Hz ≤ f ≤ 100 kHz
V
µV/V
O
A
n
–
–
10
–
–
–
–
10
–
–
Output Resistance f = 1.0 kHz
r
0.9
0.9
mΩ
O
Short Circuit Current Limit (T = 25°C)
I
A
A
SC
V
in
= 35 Vdc
–
–
–
0.2
2.2
–
–
–
–
–
–
0.2
2.2
–
–
–
Peak Output Current (T = 25°C)
I
A
J
max
Average Temperature Coefficient of Output Voltage
TCV
–0.3
–0.3
mV/°C
O
ELECTRICAL CHARACTERISTICS (V = 10 V, I = 1.0 A, T = T
to T
[Note 1], unless otherwise noted.)
high
in
O
J
low
MC7805AC
Typ
Characteristic
Symbol
Min
Max
Unit
Vdc
Vdc
Output Voltage (T = 25°C)
V
V
4.9
5.0
5.1
J
O
Output Voltage
O
(5.0 mA ≤ I ≤ 1.0 A, P ≤15 W)
4.8
5.0
5.2
O
in
D
7.5 Vdc ≤ V ≤ 20 Vdc
Line Regulation (Note 2)
Reg
mV
mV
line
7.5 Vdc ≤ V ≤ 25 Vdc, I = 500 mA
–
–
–
–
5.0
1.3
1.3
4.5
50
50
25
50
in
O
8.0 Vdc ≤ V ≤ 12 Vdc
in
8.0 Vdc ≤ V ≤ 12 Vdc, T = 25°C
in
J
J
7.3 Vdc ≤ V ≤ 20 Vdc, T = 25°C
in
Load Regulation (Note 2)
Reg
load
5.0 mA ≤ I ≤ 1.5 A, T = 25°C
–
–
–
1.3
0.8
0.15
100
100
50
O
J
5.0 mA ≤ I ≤ 1.0 A
O
250 mA ≤ I ≤ 750 mA
O
Quiescent Current
(T = 25°C)
J
I
–
–
–
3.2
6.0
6.0
mA
mA
B
Quiescent Current Change
∆I
B
8.0 Vdc ≤ V ≤ 25 Vdc, I = 500 mA
–
–
–
–
–
–
0.8
0.8
0.5
in
O
J
7.5 Vdc ≤ V ≤ 20 Vdc, T = 25°C
in
5.0 mA ≤ I ≤ 1.0 A
O
NOTES: 1. T
= 0°C for MC78XXAC, C
= –40°C for MC78XXB
T
= +125°C for MC78XXAC, C, B
low
low
high
T
2. Load and line regulation are specified at constant junction temperature. Changes in V due to heating effects must be taken into account
O
separately. Pulse testing with low duty cycle is used.
3–184
MOTOROLA ANALOG IC DEVICE DATA
MC7800 Series
ELECTRICAL CHARACTERISTICS (continued) (V = 10 V, I = 1.0 A, T = T
in
to T [Note 1], unless otherwise noted.)
high
O
J
low
MC7805AC
Characteristic
Symbol
Min
Typ
Max
Unit
Ripple Rejection
8.0 Vdc ≤ V ≤ 18 Vdc, f = 120 Hz, I = 500 mA
RR
dB
–
–
68
–
–
in
O
Dropout Voltage (I = 1.0 A, T = 25°C)
V – V
O
2.0
Vdc
O
J
I
Output Noise Voltage (T = 25°C)
10 Hz ≤ f ≤ 100 kHz
V
µV/V
O
A
n
–
–
10
–
–
Output Resistance (f = 1.0 kHz)
r
0.9
mΩ
O
Short Circuit Current Limit (T = 25°C)
I
A
A
SC
V
in
= 35 Vdc
–
–
–
0.2
2.2
–
–
–
Peak Output Current (T = 25°C)
I
A
J
max
Average Temperature Coefficient of Output Voltage
TCV
–0.3
mV/°C
O
ELECTRICAL CHARACTERISTICS (V = 11 V, I = 500 mA, T = T
in
to T
[Note 1], unless otherwise noted.)
high
O
J
low
MC7806B
Typ
MC7806C
Typ
Characteristic
Output Voltage (T = 25°C)
Symbol
Min
Max
Min
Max
Unit
Vdc
Vdc
V
V
5.75
6.0
6.25
5.75
6.0
6.25
J
O
Output Voltage
(5.0 mA ≤ I ≤ 1.0 A, P ≤15 W)
O
O
in
D
8.0 Vdc ≤ V ≤ 21 Vdc
–
5.7
–
6.0
–
6.3
5.7
–
6.0
–
6.3
–
9.0 Vdc ≤ V ≤ 21 Vdc
in
Line Regulation, T = 25°C (Note 2)
Reg
mV
mV
J
line
8.0 Vdc ≤ V ≤ 25 Vdc
–
–
5.5
1.4
120
60
–
–
5.5
1.4
120
60
in
9.0 Vdc ≤ V ≤ 13 Vdc
in
Load Regulation, T = 25°C (Note 2)
Reg
load
J
5.0 mA ≤ I ≤ 1.5 A
–
–
1.3
0.2
120
60
–
–
1.3
0.2
120
60
O
250 mA ≤ I ≤ 750 mA
O
Quiescent Current (T = 25°C)
I
–
3.3
8.0
–
3.3
8.0
mA
mA
J
B
Quiescent Current Change
∆I
B
8.0 Vdc ≤ V ≤ 25 Vdc
–
–
–
–
–
–
–
1.3
0.5
–
–
–
–
–
–
1.3
–
0.5
in
9.0 Vdc ≤ V ≤ 25 Vdc
in
5.0 mA ≤ I ≤ 1.0 A
O
Ripple Rejection
RR
dB
9.0 Vdc ≤ V ≤ 19 Vdc, f = 120 Hz
–
–
65
–
–
–
–
65
–
–
in
Dropout Voltage (I = 1.0 A, T = 25°C)
V – V
I O
2.0
2.0
Vdc
O
J
Output Noise Voltage (T = 25°C)
10 Hz ≤ f ≤ 100 kHz
V
µV/V
O
A
n
–
–
10
–
–
–
–
10
–
–
Output Resistance f = 1.0 kHz
r
0.9
0.9
mΩ
O
Short Circuit Current Limit (T = 25°C)
I
A
A
SC
V
in
= 35 Vdc
–
–
–
0.2
2.2
–
–
–
–
–
–
0.2
2.2
–
–
–
Peak Output Current (T = 25°C)
I
A
J
max
Average Temperature Coefficient of Output Voltage
TCV
–0.3
–0.3
mV/°C
O
NOTES: 1. T
= 0°C for MC78XXAC, C
= –40°C for MC78XXB
T
= +125°C for MC78XXAC, C, B
high
low
low
T
2. Load and line regulation are specified at constant junction temperature. Changes in V due to heating effects must be taken into account
separately. Pulse testing with low duty cycle is used.
O
3–185
MOTOROLA ANALOG IC DEVICE DATA
MC7800 Series
ELECTRICAL CHARACTERISTICS (V = 11 V, I = 1.0 A, T = T
to T
[Note 1], unless otherwise noted.)
high
in
O
J
low
MC7806AC
Typ
Characteristic
Symbol
Min
Max
Unit
Vdc
Vdc
Output Voltage (T = 25°C)
V
V
5.88
6.0
6.12
J
O
Output Voltage
O
(5.0 mA ≤ I ≤ 1.0 A, P ≤15 W)
5.76
6.0
6.24
O
in
D
8.6 Vdc ≤ V ≤ 21 Vdc
Line Regulation (Note 2)
Reg
mV
mV
line
8.6 Vdc ≤ V ≤ 25 Vdc, I = 500 mA
–
–
–
–
5.0
1.4
1.4
4.5
60
60
30
60
in
O
9.0 Vdc ≤ V ≤ 13 Vdc
in
9.0 Vdc ≤ V ≤ 13 Vdc, T = 25°C
in
J
J
8.3 Vdc ≤ V ≤ 21 Vdc, T = 25°C
in
Load Regulation (Note 2)
Reg
load
5.0 mA ≤ I ≤ 1.5 A, T = 25°C
–
–
–
1.3
0.9
0.2
100
100
50
O
J
5.0 mA ≤ I ≤ 1.0 A
O
250 mA ≤ I ≤ 750 mA
O
Quiescent Current
T = 25°C
J
I
–
–
–
3.3
6.0
6.0
mA
mA
B
Quiescent Current Change
∆I
B
9.0 Vdc ≤ V ≤ 25 Vdc, I = 500 mA
–
–
–
–
–
–
0.8
0.8
0.5
in
O
J
8.6 Vdc ≤ V ≤ 21 Vdc, T = 25°C
in
5.0 mA ≤ I ≤ 1.0 A
O
Ripple Rejection
RR
dB
9.0 Vdc ≤ V ≤ 19 Vdc, f = 120 Hz, I = 500 mA
–
–
65
–
–
in
O
Dropout Voltage (I = 1.0 A, T = 25°C)
V – V
I O
2.0
Vdc
O
J
Output Noise Voltage (T = 25°C)
10 Hz ≤ f ≤ 100 kHz
V
µV/V
O
A
n
–
–
10
–
–
Output Resistance (f = 1.0 kHz)
r
0.9
mΩ
O
Short Circuit Current Limit (T = 25°C)
I
A
A
SC
V
in
= 35 Vdc
–
–
–
0.2
2.2
–
–
–
Peak Output Current (T = 25°C)
I
A
J
max
Average Temperature Coefficient of Output Voltage
TCV
–0.3
mV/°C
O
ELECTRICAL CHARACTERISTICS (V = 14 V, I = 500 mA, T = T
in
to T
[Note 1], unless otherwise noted.)
high
O
J
low
MC7808B
Typ
MC7808C
Typ
Characteristic
Output Voltage (T = 25°C)
Symbol
Min
Max
Min
Max
Unit
Vdc
Vdc
V
7.7
8.0
8.3
7.7
8.0
8.3
J
O
O
Output Voltage
(5.0 mA ≤ I ≤ 1.0 A, P ≤15 W)
V
O
D
10.5 Vdc ≤ V ≤ 23 Vdc
–
7.6
–
8.0
–
8.4
7.6
–
8.0
–
8.4
–
in
11.5 Vdc ≤ V ≤ 23 Vdc
in
Line Regulation, T = 25°C, (Note 2)
Reg
mV
mV
mA
J
line
10.5 Vdc ≤ V ≤ 25 Vdc
–
–
6.0
1.7
160
80
–
–
6.0
1.7
160
80
in
11 Vdc ≤ V ≤ 17 Vdc
in
Load Regulation, T = 25°C (Note 2)
Reg
load
J
5.0 mA ≤ I ≤ 1.5 A
–
–
1.4
.22
160
80
–
–
1.4
.22
160
80
O
250 mA ≤ I ≤ 750 mA
O
Quiescent Current (T = 25°C)
I
B
–
3.3
8.0
–
3.3
8.0
J
NOTES: 1. T
= 0°C for MC78XXAC, C
= –40°C for MC78XXB
T
= +125°C for MC78XXAC, C, B
high
low
T
low
2. Load and line regulation are specified at constant junction temperature. Changes in V due to heating effects must be taken into account
O
separately. Pulse testing with low duty cycle is used.
3–186
MOTOROLA ANALOG IC DEVICE DATA
MC7800 Series
ELECTRICAL CHARACTERISTICS (continued) (V = 14 V, I = 500 mA, T = T
in
to T [Note 1], unless otherwise noted.)
high
O
J
low
MC7808B
Typ
MC7808C
Characteristic
Quiescent Current Change
Symbol
∆I
Min
Max
Min
Typ
Max
Unit
mA
B
10.5 Vdc ≤ V ≤ 25 Vdc
–
–
–
–
–
–
–
1.0
0.5
–
–
–
–
–
–
1.0
–
0.5
in
11.5 Vdc ≤ V ≤ 25 Vdc
in
5.0 mA ≤ I ≤ 1.0 A
O
Ripple Rejection
RR
dB
11.5 Vdc ≤ V ≤ 18 Vdc, f = 120 Hz
–
–
62
–
–
–
–
62
–
–
in
Dropout Voltage (I = 1.0 A, T = 25°C)
V – V
I O
2.0
2.0
Vdc
O
J
Output Noise Voltage (T = 25°C)
10 Hz ≤ f ≤ 100 kHz
V
µV/V
O
A
n
–
–
10
–
–
–
–
10
–
–
Output Resistance f = 1.0 kHz
r
0.9
0.9
mΩ
O
Short Circuit Current Limit (T = 25°C)
I
A
A
SC
V
in
= 35 Vdc
–
–
–
0.2
2.2
–
–
–
–
–
–
0.2
2.2
–
–
–
Peak Output Current (T = 25°C)
I
A
J
max
Average Temperature Coefficient of Output Voltage
TCV
–0.4
–0.4
mV/°C
O
ELECTRICAL CHARACTERISTICS (V = 14 V, I = 1.0 A, T = T
to T
[Note 1], unless otherwise noted.)
high
in
O
J
low
MC7808AC
Typ
Characteristic
Symbol
Min
Max
Unit
Vdc
Vdc
Output Voltage (T = 25°C)
V
7.84
8.0
8.16
J
O
O
Output Voltage
V
(5.0 mA ≤ I ≤ 1.0 A, P ≤15 W)
7.7
8.0
8.3
O
D
10.6 Vdc ≤ V ≤ 23 Vdc
in
Line Regulation (Note 2)
Reg
mV
mV
line
10.6 Vdc ≤ V ≤ 25 Vdc, I = 500 mA
–
–
–
–
6.0
1.7
1.7
5.0
80
80
40
80
in
O
11 Vdc ≤ V ≤ 17 Vdc
in
11 Vdc ≤ V ≤ 17 Vdc, T = 25°C
in
J
10.4 Vdc ≤ V ≤ 23 Vdc, T = 25°C
in
J
Load Regulation (Note 2)
Reg
load
5.0 mA ≤ I ≤ 1.5 A, T = 25°C
–
–
–
1.4
1.0
.22
100
100
50
O
J
5.0 mA ≤ I ≤ 1.0 A
O
250 mA ≤ I ≤ 750 mA
O
Quiescent Current
T = 25°C
J
I
–
–
–
3.3
6.0
6.0
mA
mA
B
Quiescent Current Change
∆I
B
11 Vdc ≤ V ≤ 25 Vdc, I = 500 mA
–
–
–
–
–
–
0.8
0.8
0.5
in
O
10.6 Vdc ≤ V ≤ 20 Vdc, T = 25°C
in
J
5.0 mA ≤ I ≤ 1.0 A
O
Ripple Rejection
RR
dB
11.5 Vdc ≤ V ≤ 21.5 Vdc, f = 120 Hz, I = 500 mA
–
–
62
–
–
in
O
Dropout Voltage (I = 1.0 A, T = 25°C)
V – V
I O
2.0
Vdc
O
J
Output Noise Voltage (T = 25°C)
10 Hz ≤ f ≤ 100 kHz
V
µV/V
O
A
n
–
–
10
–
–
Output Resistance f = 1.0 kHz
r
0.9
mΩ
O
Short Circuit Current Limit (T = 25°C)
I
A
A
SC
V
in
= 35 Vdc
–
–
–
0.2
2.2
–
–
–
Peak Output Current (T = 25°C)
I
A
J
max
Average Temperature Coefficient of Output Voltage
TCV
–0.4
mV/°C
O
NOTES: 1. T
= 0°C for MC78XXAC, C
= –40°C for MC78XXB
T
= +125°C for MC78XXAC, C, B
high
low
T
low
2. Load and line regulation are specified at constant junction temperature. Changes in V due to heating effects must be taken into account
O
separately. Pulse testing with low duty cycle is used.
3–187
MOTOROLA ANALOG IC DEVICE DATA
MC7800 Series
ELECTRICAL CHARACTERISTICS (V = 15 V, I = 500 mA, T = T
to T [Note 1], unless otherwise noted.)
high
in
O
J
low
MC7809CT
Characteristic
Symbol
Min
Typ
Max
Unit
Vdc
Vdc
Output Voltage (T = 25°C)
V
V
8.65
9.0
9.35
J
O
Output Voltage
O
(5.0 mA ≤ I ≤ 1.0 A, P ≤15 W)
8.55
9.0
9.45
O
D
11.5 Vdc ≤ V ≤ 24 Vdc
in
Line Regulation, T = 25°C (Note 2)
Reg
mV
mV
J
line
11.5 Vdc ≤ V ≤ 26 Vdc
–
–
6.2
1.8
50
25
in
11.5 Vdc ≤ V ≤ 17 Vdc
in
Load Regulation, T = 25°C (Note 2)
Reg
load
J
5.0 mA ≤ I ≤ 1.5 A
–
–
1.5
0.3
50
25
O
250 mA ≤ I ≤ 750 mA
O
Quiescent Current (T = 25°C)
I
–
3.4
8.0
mA
mA
J
B
Quiescent Current Change
∆I
B
11.5 Vdc ≤ V ≤ 26 Vdc
–
–
–
–
1.0
0.5
in
5.0 mA ≤ I ≤ 1.0 A
O
Ripple Rejection
RR
dB
11.5 Vdc ≤ V ≤ 21.5 Vdc, f = 120 Hz
–
–
61
–
–
in
Dropout Voltage (I = 1.0 A, T = 25°C)
V – V
I O
2.0
Vdc
O
J
Output Noise Voltage (T = 25°C)
10 Hz ≤ f ≤ 100 kHz
V
µV/V
O
A
n
–
–
10
–
–
Output Resistance f = 1.0 kHz
r
1.0
mΩ
O
Short Circuit Current Limit (T = 25°C)
I
A
A
SC
V
in
= 35 Vdc
–
–
–
0.2
2.2
–
–
–
Peak Output Current (T = 25°C)
I
A
J
max
Average Temperature Coefficient of Output Voltage
TCV
–0.5
mV/°C
O
ELECTRICAL CHARACTERISTICS (V = 19 V, I = 500 mA, T = T
in
to T
[Note 1], unless otherwise noted.)
high
O
J
low
MC7812B
Typ
MC7812C
Typ
Characteristic
Output Voltage (T = 25°C)
Symbol
Min
Max
Min
Max
Unit
Vdc
Vdc
V
V
11.5
12
12.5
11.5
12
12.5
J
O
Output Voltage
(5.0 mA ≤ I ≤ 1.0 A, P ≤15 W)
O
O
D
14.5 Vdc ≤ V ≤ 27 Vdc
–
11.4
–
12
–
12.6
11.4
–
12
–
12.6
–
in
15.5 Vdc ≤ V ≤ 27 Vdc
in
Line Regulation, T = 25°C (Note 2)
Reg
mV
mV
J
line
14.5 Vdc ≤ V ≤ 30 Vdc
–
–
7.5
2.2
240
120
–
–
7.5
2.2
240
120
in
16 Vdc ≤ V ≤ 22 Vdc
in
Load Regulation, T = 25°C (Note 2)
Reg
load
J
5.0 mA ≤ I ≤ 1.5 A
–
–
1.6
1.0
240
120
–
–
1.6
1.0
240
120
O
250 mA ≤ I ≤ 750 mA
O
Quiescent Current (T = 25°C)
I
–
3.4
8.0
–
3.4
8.0
mA
mA
J
B
Quiescent Current Change
∆I
B
14.5 Vdc ≤ V ≤ 30 Vdc
–
–
–
–
–
–
–
1.0
0.5
–
–
–
–
–
–
1.0
–
0.5
in
15 Vdc ≤ V ≤ 30 Vdc
in
5.0 mA ≤ I ≤ 1.0 A
O
Ripple Rejection
RR
dB
15 Vdc ≤ V ≤ 25 Vdc, f = 120 Hz
–
–
60
–
–
–
–
60
–
–
in
Dropout Voltage (I = 1.0 A, T = 25°C)
V – V
I O
2.0
2.0
Vdc
O
J
NOTES: 1. T
= 0°C for MC78XXAC, C
= –40°C for MC78XXB
T
= +125°C for MC78XXAC, C, B
high
low
T
low
2.
Load and line regulation are specified at constant junction temperature. Changes in V due to heating effects must be taken into account
separately. Pulse testing with low duty cycle is used.
O
3–188
MOTOROLA ANALOG IC DEVICE DATA
MC7800 Series
ELECTRICAL CHARACTERISTICS (continued) (V = 19 V, I = 500 mA, T = T
in
to T [Note 1], unless otherwise noted.)
high
O
J
low
MC7812B
Typ
MC7812C
Characteristic
Symbol
Min
Max
Min
Typ
Max
Unit
µV/V
Output Noise Voltage (T = 25°C)
V
n
A
O
10 Hz ≤ f ≤ 100 kHz
–
–
10
–
–
–
–
10
–
–
Output Resistance f = 1.0 kHz
r
1.1
1.1
mΩ
O
Short Circuit Current Limit (T = 25°C)
I
A
A
SC
V
in
= 35 Vdc
–
–
–
0.2
2.2
–
–
–
–
–
–
0.2
2.2
–
–
–
Peak Output Current (T = 25°C)
I
A
J
max
Average Temperature Coefficient of Output Voltage
TCV
–0.8
–0.8
mV/°C
O
ELECTRICAL CHARACTERISTICS (V = 19 V, I = 10 A, T = T
to T
[Note 1], unless otherwise noted.)
high
in
O
J
low
MC7812AC
Typ
Characteristic
Symbol
Min
Max
Unit
Vdc
Vdc
Output Voltage (T = 25°C)
V
V
11.75
12
12.25
J
O
Output Voltage
O
(5.0 mA ≤ I ≤ 1.0 A, P ≤15 W)
11.5
12
12.5
O
D
14.8 Vdc ≤ V ≤ 27 Vdc
in
Line Regulation (Note 2)
Reg
mV
mV
line
14.8 Vdc ≤ V ≤ 30 Vdc, I = 500 mA
–
–
–
–
7.5
2.2
2.2
6.0
120
120
60
in
O
16 Vdc ≤ V ≤ 22 Vdc
in
16 Vdc ≤ V ≤ 22 Vdc, T = 25°C
in
J
14.5 Vdc ≤ V ≤ 27 Vdc, T = 25°C
120
in
J
Load Regulation (Note 2)
Reg
load
5.0 mA ≤ I ≤ 1.5 A, T = 25°C
–
–
–
1.6
1.2
1.0
100
100
50
O
J
5.0 mA ≤ I ≤ 1.0 A
O
250 mA ≤ I ≤ 750 mA
O
Quiescent Current
T = 25°C
J
I
–
–
–
3.4
6.0
6.0
mA
mA
B
Quiescent Current Change
∆I
B
15 Vdc ≤ V ≤ 30 Vdc, I = 500 mA
–
–
–
–
–
–
0.8
0.8
0.5
in
O
14.8 Vdc ≤ V ≤ 27 Vdc, T = 25°C
in
J
5.0 mA ≤ I ≤ 1.0 A
O
Ripple Rejection
RR
dB
15 Vdc ≤ V ≤ 25 Vdc, f = 120 Hz, I = 500 mA
–
–
60
–
–
in
O
Dropout Voltage (I = 1.0 A, T = 25°C)
V – V
I O
2.0
Vdc
O
J
Output Noise Voltage (T = 25°C)
10 Hz ≤ f ≤ 100 kHz
V
µV/V
O
A
n
–
–
10
–
–
Output Resistance (f = 1.0 kHz)
r
1.1
mΩ
O
Short Circuit Current Limit (T = 25°C)
I
A
A
SC
V
in
= 35 Vdc
–
–
–
0.2
2.2
–
–
–
Peak Output Current (T = 25°C)
I
A
J
max
Average Temperature Coefficient of Output Voltage
TCV
–0.8
mV/°C
O
NOTES: 1. T
= 0°C for MC78XXAC, C
= –40°C for MC78XXB
T
= +125°C for MC78XXAC, C, B
high
low
low
T
2. Load and line regulation are specified at constant junction temperature. Changes in V due to heating effects must be taken into account
separately. Pulse testing with low duty cycle is used.
O
3–189
MOTOROLA ANALOG IC DEVICE DATA
MC7800 Series
ELECTRICAL CHARACTERISTICS (V = 23 V, I = 500 mA, T = T
in
to T
[Note 1], unless otherwise noted.)
high
O
J
low
MC7815B
Typ
MC7815C
Typ
Characteristic
Output Voltage (T = 25°C)
Symbol
Min
Max
Min
Max
Unit
Vdc
Vdc
V
V
14.4
15
15.6
14.4
15
15.6
J
O
Output Voltage
(5.0 mA ≤ I ≤ 1.0 A, P ≤15 W)
O
O
D
17.5 Vdc ≤ V ≤ 30 Vdc
–
–
15
–
14.25
–
15
–
15.75
–
in
18.5 Vdc ≤ V ≤ 30 Vdc
in
14.25
15.75
Line Regulation, T = 25°C (Note 2)
Reg
mV
mV
J
line
17.5 Vdc ≤ V ≤ 30 Vdc
–
–
8.5
3.0
300
150
–
–
8.5
3.0
300
150
in
20 Vdc ≤ V ≤ 26 Vdc
in
Load Regulation, T = 25°C (Note 2)
Reg
load
J
5.0 mA ≤ I ≤ 1.5 A
–
–
1.8
1.2
300
150
–
–
1.8
1.2
300
150
O
250 mA ≤ I ≤ 750 mA
O
Quiescent Current (T = 25°C)
I
–
3.5
8.0
–
3.5
8.0
mA
mA
J
B
Quiescent Current Change
∆I
B
17.5 Vdc ≤ V ≤ 30 Vdc
–
–
–
–
–
–
–
1.0
0.5
–
–
–
–
–
–
1.0
–
0.5
in
18.5 Vdc ≤ V ≤ 30 Vdc
in
5.0 mA ≤ I ≤ 1.0 A
O
Ripple Rejection
RR
dB
18.5 Vdc ≤ V ≤ 28.5 Vdc, f = 120 Hz
–
–
58
–
–
–
–
58
–
–
in
Dropout Voltage (I = 1.0 A, T = 25°C)
V – V
I O
2.0
2.0
Vdc
O
J
Output Noise Voltage (T = 25°C)
10 Hz ≤ f ≤ 100 kHz
V
µV/V
O
A
n
–
–
10
–
–
–
–
10
–
–
Output Resistance f = 1.0 kHz
r
1.2
1.2
mΩ
O
Short Circuit Current Limit (T = 25°C)
I
A
A
SC
V
in
= 35 Vdc
–
–
–
0.2
2.2
–
–
–
–
–
–
0.2
2.2
–
–
–
Peak Output Current (T = 25°C)
I
A
J
max
Average Temperature Coefficient of Output Voltage
TCV
–1.0
–1.0
mV/°C
O
ELECTRICAL CHARACTERISTICS (V = 23 V, I = 1.0 A, T = T
to T
[Note 1], unless otherwise noted.)
high
in
O
J
low
MC7815AC
Typ
Characteristic
Symbol
Min
Max
Unit
Vdc
Vdc
Output Voltage (T = 25°C)
V
V
14.7
15
15.3
J
O
Output Voltage
O
(5.0 mA ≤ I ≤ 1.0 A, P ≤15 W)
14.4
15
15.6
O
D
17.9 Vdc ≤ V ≤ 30 Vdc
in
Line Regulation (Note 2)
Reg
mV
mV
line
17.9 Vdc ≤ V ≤ 30 Vdc, I = 500 mA
–
–
–
–
8.5
3.0
3.0
7.0
150
150
75
in
O
20 Vdc ≤ V ≤ 26 Vdc
in
20 Vdc ≤ V ≤ 26 Vdc, T = 25°C
in
J
17.5 Vdc ≤ V ≤ 30 Vdc, T = 25°C
150
in
J
Load Regulation (Note 2)
Reg
load
5.0 mA ≤ I ≤ 1.5 A, T = 25°C
–
–
–
1.8
1.5
1.2
100
100
50
O
J
5.0 mA ≤ I ≤ 1.0 A
O
250 mA ≤ I ≤ 750 mA
O
Quiescent Current
T = 25°C
J
I
–
–
–
3.5
6.0
6.0
mA
mA
B
Quiescent Current Change
∆I
B
17.5 Vdc ≤ V ≤ 30 Vdc, I = 500 mA
–
–
–
–
–
–
0.8
0.8
0.5
in
O
J
17.5 Vdc ≤ V ≤ 30 Vdc, T = 25°C
in
5.0 mA ≤ I ≤ 1.0 A
O
NOTES: 1. T
= 0°C for MC78XXAC, C
= –40°C for MC78XXB
T
= +125°C for MC78XXAC, C, B
high
low
low
T
2. Load and line regulation are specified at constant junction temperature. Changes in V due to heating effects must be taken into account
separately. Pulse testing with low duty cycle is used.
O
3–190
MOTOROLA ANALOG IC DEVICE DATA
MC7800 Series
ELECTRICAL CHARACTERISTICS (continued) (V = 23 V, I = 1.0 A, T = T
in
to T [Note 1], unless otherwise noted.)
high
O
J
low
MC7815AC
Characteristic
Symbol
Min
Typ
Max
Unit
Ripple Rejection
18.5 Vdc ≤ V ≤ 28.5 Vdc, f = 120 Hz, I = 500 mA
RR
dB
–
–
58
–
–
in
Dropout Voltage (I = 1.0 A, T = 25°C)
O
V – V
O
2.0
Vdc
O
J
I
Output Noise Voltage (T = 25°C)
10 Hz ≤ f ≤ 100 kHz
V
µV/V
O
A
n
–
–
10
–
–
Output Resistance f = 1.0 kHz
r
1.2
mΩ
O
Short Circuit Current Limit (T = 25°C)
I
A
A
SC
V
in
= 35 Vdc
–
–
–
0.2
2.2
–
–
–
Peak Output Current (T = 25°C)
I
A
J
max
Average Temperature Coefficient of Output Voltage
TCV
–1.0
mV/°C
O
ELECTRICAL CHARACTERISTICS (V = 27 V, I = 500 mA, T = T
in
to T
[Note 1], unless otherwise noted.)
high
O
J
low
MC7818B
Typ
MC7818C
Typ
Characteristic
Output Voltage (T = 25°C)
Symbol
Min
Max
Min
Max
Unit
Vdc
Vdc
V
V
17.3
18
18.7
17.3
18
18.7
J
O
Output Voltage
(5.0 mA ≤ I ≤ 1.0 A, P ≤15 W)
O
O
in
D
21 Vdc ≤ V ≤ 33 Vdc
–
17.1
–
18
–
18.9
17.1
–
18
–
18.9
–
22 Vdc ≤ V ≤ 33 Vdc
in
Line Regulation, T = 25°C (Note 2)
Reg
mV
mV
J
line
21 Vdc ≤ V ≤ 33 Vdc
–
–
9.5
3.2
360
180
–
–
9.5
3.2
360
180
in
24 Vdc ≤ V ≤ 30 Vdc
in
Load Regulation, T = 25°C (Note 2)
Reg
load
J
5.0 mA ≤ I ≤ 1.5 A
–
–
2.0
1.5
360
180
–
–
2.0
1.5
360
180
O
250 mA ≤ I ≤ 750 mA
O
Quiescent Current (T = 25°C)
I
–
3.5
8.0
–
3.5
8.0
mA
mA
J
B
Quiescent Current Change
∆I
B
21 Vdc ≤ V ≤ 33 Vdc
–
–
–
–
–
–
–
1.0
0.5
–
–
–
–
–
–
1.0
–
0.5
in
22 Vdc ≤ V ≤ 33 Vdc
in
5.0 mA ≤ I ≤ 1.0 A
O
Ripple Rejection
RR
dB
22 Vdc ≤ V ≤ 33 Vdc, f = 120 Hz
–
–
57
–
–
–
–
57
–
–
in
Dropout Voltage (I = 1.0 A, T = 25°C)
V – V
iI O
2.0
2.0
Vdc
O
J
Output Noise Voltage (T = 25°C)
10 Hz ≤ f ≤ 100 kHz
V
µV/V
O
A
n
–
–
10
–
–
–
–
10
–
–
Output Resistance f = 1.0 kHz
r
1.3
1.3
mΩ
O
Short Circuit Current Limit (T = 25°C)
I
A
A
SC
V
in
= 35 Vdc
–
–
–
0.2
2.2
–
–
–
–
–
–
0.2
2.2
–
–
–
Peak Output Current (T = 25°C)
I
A
J
max
Average Temperature Coefficient of Output Voltage
TCV
–1.5
–1.5
mV/°C
O
NOTES: 1. T
= 0°C for MC78XXAC, C
= –40°C for MC78XXB
T
= +125°C for MC78XXAC, C, B
high
low
low
T
2. Load and line regulation are specified at constant junction temperature. Changes in V due to heating effects must be taken into account
separately. Pulse testing with low duty cycle is used.
O
3–191
MOTOROLA ANALOG IC DEVICE DATA
MC7800 Series
ELECTRICAL CHARACTERISTICS (V = 27 V, I = 10 A, T = T
to T
[Note 1], unless otherwise noted.)
high
in
O
J
low
MC7818AC
Typ
Characteristic
Symbol
Min
Max
Unit
Vdc
Vdc
Output Voltage (T = 25°C)
V
V
17.64
18
18.36
J
O
Output Voltage
O
(5.0 mA ≤ I ≤ 1.0 A, P ≤15 W)
17.3
18
18.7
O
in
D
21 Vdc ≤ V ≤ 33 Vdc
Line Regulation (Note 2)
Reg
mV
mV
line
21 Vdc ≤ V ≤ 33 Vdc, I = 500 mA
–
–
–
–
9.5
3.2
3.2
8.0
180
180
90
in
O
24 Vdc ≤ V ≤ 30 Vdc
in
24 Vdc ≤ V ≤ 30 Vdc, T = 25°C
in
J
20.6 Vdc ≤ V ≤ 33 Vdc, T = 25°C
180
in
J
Load Regulation (Note 2)
Reg
load
5.0 mA ≤ I ≤ 1.5 A, T = 25°C
–
–
–
2.0
1.8
1.5
100
100
50
O
J
5.0 mA ≤ I ≤ 1.0 A
O
250 mA ≤ I ≤ 750 mA
O
Quiescent Current
T = 25°C
J
I
–
–
–
3.5
6.0
6.0
mA
mA
B
Quiescent Current Change
∆I
B
21 Vdc ≤ V ≤ 33 Vdc, I = 500 mA
–
–
–
–
–
–
0.8
0.8
0.5
in
O
J
21 Vdc ≤ V ≤ 33 Vdc, T = 25°C
in
5.0 mA ≤ I ≤ 1.0 A
O
Ripple Rejection
RR
dB
22 Vdc ≤ V ≤ 32 Vdc, f = 120 Hz, I = 500 mA
–
–
57
–
–
in
O
Dropout Voltage (I = 1.0 A, T = 25°C)
V – V
I O
2.0
Vdc
O
J
Output Noise Voltage (T = 25°C)
10 Hz ≤ f ≤ 100 kHz
V
µV/V
O
A
n
–
–
10
–
–
Output Resistance f = 1.0 kHz
r
1.3
mΩ
O
Short Circuit Current Limit (T = 25°C)
I
A
A
SC
V
in
= 35 Vdc
–
–
–
0.2
2.2
–
–
–
Peak Output Current (T = 25°C)
I
A
J
max
Average Temperature Coefficient of Output Voltage
TCV
–1.5
mV/°C
O
ELECTRICAL CHARACTERISTICS (V = 33 V, I = 500 mA, T = T
in
to T
[Note 1], unless otherwise noted.)
high
O
J
low
MC7824B
Typ
MC7824C
Typ
Characteristic
Output Voltage (T = 25°C)
Symbol
Min
Max
Min
Max
Unit
Vdc
Vdc
V
23
24
25
23
24
25
J
O
O
Output Voltage
(5.0 mA ≤ I ≤ 1.0 A, P ≤15 W)
V
O
in
D
27 Vdc ≤ V ≤ 38 Vdc
–
22.8
–
24
–
25.2
22.8
–
24
–
25.2
–
28 Vdc ≤ V ≤ 38 Vdc
in
Line Regulation, T = 25°C (Note 2)
Reg
mV
mV
mA
J
line
27 Vdc ≤ V ≤ 38 Vdc
–
–
11.5
3.8
480
240
–
–
11.5
3.8
480
240
in
30 Vdc ≤ V ≤ 36 Vdc
in
Load Regulation, T = 25°C (Note 2)
Reg
load
J
5.0 mA ≤ I ≤ 1.5 A
–
–
2.1
1.8
480
240
–
–
2.1
1.8
480
240
O
250 mA ≤ I ≤ 750 mA
O
Quiescent Current (T = 25°C)
I
B
–
3.6
8.0
–
3.6
8.0
J
NOTES: 1. T
= 0°C for MC78XXAC, C
= –40°C for MC78XXB
T
= +125°C for MC78XXAC, C, B
high
low
low
T
2. Load and line regulation are specified at constant junction temperature. Changes in V due to heating effects must be taken into account
separately. Pulse testing with low duty cycle is used.
O
3–192
MOTOROLA ANALOG IC DEVICE DATA
MC7800 Series
ELECTRICAL CHARACTERISTICS (continued) (V = 33 V, I = 500 mA, T = T
in
to T [Note 1], unless otherwise noted.)
high
O
J
low
MC7824B
Typ
MC7824C
Characteristic
Quiescent Current Change
Symbol
∆I
Min
Max
Min
Typ
Max
Unit
mA
B
27 Vdc ≤ V ≤ 38 Vdc
–
–
–
–
–
–
–
1.0
0.5
–
–
–
–
–
–
1.0
–
0.5
in
28 Vdc ≤ V ≤ 38 Vdc
in
5.0 mA ≤ I ≤ 1.0 A
O
Ripple Rejection
RR
dB
28 Vdc ≤ V ≤ 38 Vdc, f = 120 Hz
–
–
54
–
–
–
–
54
–
–
in
Dropout Voltage (I = 1.0 A, T = 25°C)
V – V
I O
2.0
2.0
Vdc
O
J
Output Noise Voltage (T = 25°C)
10 Hz ≤ f ≤ 100 kHz
V
µV/V
O
A
n
–
–
10
–
–
–
–
10
–
–
Output Resistance f = 1.0 kHz
r
1.4
1.4
mΩ
O
Short Circuit Current Limit (T = 25°C)
I
A
A
SC
V
in
= 35 Vdc
–
–
–
0.2
2.2
–
–
–
–
–
–
0.2
2.2
–
–
–
Peak Output Current (T = 25°C)
I
A
J
max
Average Temperature Coefficient of Output Voltage
TCV
–2.0
–2.0
mV/°C
O
ELECTRICAL CHARACTERISTICS (V = 33 V, I = 1.0 A, T = T
to T
[Note 1], unless otherwise noted.)
high
in
O
J
low
MC7824AC
Typ
Characteristic
Symbol
Min
Max
Unit
Vdc
Vdc
Output Voltage (T = 25°C)
V
23.5
24
24.5
J
O
O
Output Voltage
V
(5.0 mA ≤ I ≤ 1.0 A, P ≤15 W)
23
24
25
O
D
27.3 Vdc ≤ V ≤ 38 Vdc
in
Line Regulation (Note 2)
Reg
mV
mV
line
27 Vdc ≤ V ≤ 38 Vdc, I = 500 mA
–
–
–
–
11.5
3.8
3.8
10
240
240
120
240
in
O
30 Vdc ≤ V ≤ 36 Vdc
in
30 Vdc ≤ V ≤ 36 Vdc, T = 25°C
in
J
26.7 Vdc ≤ V ≤ 38 Vdc, T = 25°C
in
J
Load Regulation (Note 2)
Reg
load
5.0 mA ≤ I ≤ 1.5 A, T = 25°C
–
–
–
2.1
2.0
1.8
100
100
50
O
J
5.0 mA ≤ I ≤ 1.0 A
O
250 mA ≤ I ≤ 750 mA
O
Quiescent Current
T = 25°C
J
I
–
–
–
3.6
6.0
6.0
mA
mA
B
Quiescent Current Change
∆I
B
27.3 Vdc ≤ V ≤ 38 Vdc, I = 500 mA
–
–
–
–
–
–
0.8
0.8
0.5
in
O
J
27.3 Vdc ≤ V ≤ 38 Vdc, T = 25°C
in
5.0 mA ≤ I ≤ 1.0 A
O
Ripple Rejection
RR
dB
28 Vdc ≤ V ≤ 38 Vdc, f = 120 Hz, I = 500 mA
–
–
54
–
–
in
O
Dropout Voltage (I = 1.0 A, T = 25°C)
V – V
I O
2.0
Vdc
O
J
Output Noise Voltage (T = 25°C)
10 Hz ≤ f ≤ 100 kHz
V
µV/V
O
A
n
–
–
10
–
–
Output Resistance (f = 1.0 kHz)
r
1.4
mΩ
O
Short Circuit Current Limit (T = 25°C)
I
A
A
SC
V
in
= 35 Vdc
–
–
–
0.2
2.2
–
–
–
Peak Output Current (T = 25°C)
I
A
J
max
Average Temperature Coefficient of Output Voltage
TCV
–2.0
mV/°C
O
NOTES: 1. T
= 0°C for MC78XXAC, C
= –40°C for MC78XXB
T
= +125°C for MC78XXAC, C, B
high
low
low
T
2. Load and line regulation are specified at constant junction temperature. Changes in V due to heating effects must be taken into account
separately. Pulse testing with low duty cycle is used.
O
3–193
MOTOROLA ANALOG IC DEVICE DATA
MC7800 Series
Figure 1. Peak Output Current as a Function of
Input/Output Differential Voltage (MC78XXC, AC, B)
Figure 2. Ripple Rejection as a Function of
Output Voltages (MC78XXC, AC)
3.0
80
70
60
50
40
T = – 40°C
J
2.5
2.0
1.5
1.0
0.5
0
T = 0°C
J
f = 120 Hz
T = 25°C
J
PART #
V
in
I
= 20 mA
O
MC7805C = 10 V
MC7806C = 11 V
MC7808C = 14 V
MC7812C = 19 V
MC7815C = 23 V
MC7818C = 27 V
MC7824C = 33 V
∆V = 1.0 V(RMS)
in
T = 85°C
J
T = 125°C
J
4.0 6.0 8.0 10
12
15
20
25
30
35
40
4.0 6.0 8.0
10 12
14
16
18
20 22
24
V –V , INPUT/OUPUT VOLTAGE DIFFERENTIAL (V)
in out
V , OUTPUT VOLTAGE (V)
O
Figure 3. Ripple Rejection as a Function of
Frequency (MC78XXC, AC)
Figure 4. Output Voltage as a Function of
Junction Temperature (MC7805C, AC, B)
80
70
60
50
V = 20 V
in
O
5.0
I
= 5.0 mA
MC78XXB, C, AC
V = 8.0 V to 18 V
in
I
= 500 mA
O
4.9
4.8
f = 120 Hz
T = 25°C
A
40
30
0.01
0.1
1.0
10
– 60
– 20
20
60
100
140
180
f, FREQUENCY (kHz)
T , JUNCTION TEMPERATURE (°C)
J
Figure 5. Output Impedance as a Function of
Output Voltage (MC78XXC, AC)
Figure 6. Quiescent Current as a Function of
Temperature (MC78XXC, AC, B)
10
6.0
4.0
3.0
2.0
1.0
0
V = 10 V
in
5.0
V = 5.0 V
O
f = 120 Hz
I = 20 mA
L
3.0
2.0
I
= 500 mA
L
O
C = 0 µF
1.0
0.5
0.3
0.2
0.1
4.0
8.0
12
16
20
24
–75
–50
–25
0
25
50
75
100
125
V , OUTPUT VOLTAGE (V)
O
T , JUNCTION TEMPERATURE (°C)
J
3–194
MOTOROLA ANALOG IC DEVICE DATA
MC7800 Series
APPLICATIONS INFORMATION
Design Considerations
The MC7800 Series of fixed voltage regulators are
designed with Thermal Overload Protection that shuts down
the circuit when subjected to an excessive power overload
condition, Internal Short Circuit Protection that limits the
maximum current the circuit will pass, and Output Transistor
Safe–Area Compensation that reduces the output short
circuit current as the voltage across the pass transistor is
increased.
In many low current applications, compensation
capacitors are not required. However, it is recommended
that the regulator input be bypassed with a capacitor if the
regulator is connected to the power supply filter with long
wire lengths, or if the output load capacitance is large. An
input bypass capacitor should be selected to provide good
high–frequency characteristics to insure stable operation
under all load conditions. A 0.33 µF or larger tantalum,
mylar, or other capacitor having low internal impedance at
high frequencies should be chosen. The bypass capacitor
should be mounted with the shortest possible leads directly
across the regulators input terminals. Normally good
construction techniques should be used to minimize ground
loops and lead resistance drops since the regulator has no
external sense lead.
Figure 7. Current Regulator
Figure 8. Adjustable Output Regulator
MC7805
Input
Output
MC7805
R
0.33 µF
Input
Constant
Current to
Grounded
Load
I
O
7
4
2
3
0.33 µF
6
0.1 µF
The MC7800 regulators can also be used as a current source when
connected as above. In order to minimize dissipation the MC7805C is
chosen in this application. Resistor R determines the current as follows:
10 k
1.0 k
MC1741G
5.0 V
R
I
O
=
+ I
B
V = 7.0 V to 20 V
O
IN
V
= V ≥ 2.0 V
O
I
B
3.2 mA over line and load changes.
The addition of an operational amplifier allows adjustment to higher or
intermediate values while retaining regulation characteristics. The
minimumvoltageobtainablewiththisarrangementis2.0Vgreaterthanthe
regulator voltage.
For example, a 1.0 A current source would require R to be a 5.0 Ω,
10 W resistor and the output voltage compliance would be the input
voltage less 7.0 V.
Figure 9. Current Boost Regulator
Figure 10. Short Circuit Protection
MJ2955
or Equiv.
MJ2955 or Equiv.
R
SC
R
Source
R
Source
Input
Input
0.33 µF
0.33 µF
R
MC78XX
2N6049
or Equiv.
Output
R
MC78XX
≥ 10 µF
1.0 µF
1.0 µF
Output
1.0 µF
≥ 10 µF
XX = 2 digits of type number indicating voltage.
XX = 2 digits of type number indicating voltage.
The circuit of Figure 9 can be modified to provide supply protection against
The MC7800 series can be current boosted with a PNP transistor. The
MJ2955 provides current to 5.0 A. Resistor R in conjunction with the V
of the PNP determines when the pass transistor begins conducting; this
circuitisnotshortcircuitproof.Input/outputdifferentialvoltageminimumis
shortcircuits byaddingashortcircuitsenseresistor,R ,andanadditional
BE
sc
PNP transistor. The current sensing PNP must be able to handle the short
circuit current of the three–terminal regulator. Therefore, a four–ampere
plastic power transistor is specified.
increased by V of the pass transistor.
BE
3–195
MOTOROLA ANALOG IC DEVICE DATA
MC7800 Series
Figure 11. Worst Case Power Dissipation versus
Ambient Temperature (Case 221A)
Figure 12. Input Output Differential as a Function
of Junction Temperature (MC78XXC, AC, B)
2.5
20
16
12
8.0
4.0
0
I
= 1.0 A
O
θ
θ
T
= 5°C/W
= 65°C/W
JC
JA
I
= 500 mA
= 200 mA
O
θ
= 0°C/W
= 150°C
HS
2.0
1.5
1.0
0.5
J(max)
I
O
θ
= 5°C/W
I
= 20 mA
HS
O
I
O
= 0 mA
θ
= 15°C/W
HS
∆V = 2% of V
O
O
No Heatsink
25
– – – Extended Curve for MC78XXB
0
–75
–50
–25
0
50
75
100
125
150
–50
–25
0
25
50
75
100
125
T , JUNCTION TEMPERATURE (°C)
J
T , AMBIENT TEMPERATURE (°C)
A
2
Figure 13. D PAK Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
80
70
3.5
P
for T = 50°C
A
D(max)
3.0
2.5
2.0
1.5
1.0
Free Air
Mounted
Vertically
2.0 oz. Copper
60
50
40
30
L
Minimum
Size Pad
L
R
θJA
0
5.0
10
15
20
25
30
L, LENGTH OF COPPER (mm)
DEFINITIONS
Line Regulation – The change in output voltage for a
change in the input voltage. The measurement is made under
conditions of low dissipation or by using pulse techniques such
that the average chip temperature is not significantly affected.
Load Regulation – The change in output voltage for a
change in load current at constant chip temperature.
Maximum Power Dissipation – The maximum total
device dissipation for which the regulator will operate within
specifications.
Quiescent Current – That part of the input current that is
not delivered to the load.
Output Noise Voltage – The rms AC voltage at the
output, with constant load and no input ripple, measured over
a specified frequency range.
Long Term Stability – Output voltage stability under
accelerated life test conditions with the maximum rated
voltage listed in the devices’ electrical characteristics and
maximum power dissipation.
3–196
MOTOROLA ANALOG IC DEVICE DATA
Tape and Reel Options
In Brief . . .
Motorola offers the convenience of Tape and Reel
packaging for our growing family of standard integrated circuit
products. Reels are available to support the requirements of
both first and second generation pick–and–place equipment.
The packaging fully conforms to the latest EIA–481A
specification. The antistatic embossed tape provides a
secure cavity, sealed with a peel–back cover tape.
Page
Tape and Reel Configurations . . . . . . . . . . . . . . . . . . . . . 12–2
Tape and Reel Information Table . . . . . . . . . . . . . . . . . . . 12–4
Analog MPQ Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12–5
12–1
MOTOROLA ANALOG IC DEVICE DATA
Tape and Reel Configurations
Mechanical Polarization
SOIC and Micro–8
DEVICES
PLCC DEVICES
Typical
Typical
PIN 1
User Direction of Feed
User Direction of Feed
2
DPAK and D PAK
DEVICES
Typical
User Direction of Feed
SOT–23 (5 Pin)
DEVICES
Typical
SOT–89 (3 Pin)
DEVICES
Typical
SOT–89 (5 Pin)
DEVICES
Typical
User Direction of Feed
User Direction of Feed
User Direction of Feed
12–2
MOTOROLA ANALOG IC DEVICE DATA
Tape and Reel Configurations (continued)
TO–92 Reel Styles
STYLE A
(Preferred)
STYLE E
Carrier Strip
Carrier Strip
Rounded
Side
Flat Side
Adhesive Tape
Adhesive Tape
Feed
Feed
Rounded side of transistor and adhesive tape visible.
Flat side of transistor and adhesive tape visible.
TO–92 Ammo Pack Styles
STYLE P
(Preferred)
STYLE M
Adhesive Tape On
Top Side
Adhesive Tape On
Top Side
Feed
Feed
Rounded Side
Flat Side
Carrier
Strip
Carrier
Strip
Flat side of transistor and
adhesive tape visible.
Rounded side of transistor and
adhesive tape visible.
Label
Label
Style P ammo pack is equivalent to Styles A and B of reel pack
dependent on feed orientation from box.
Style M ammo pack is equivalent to Style E of reel
pack dependent on feed orientation from box.
TO–92 EIA Radial Tape in Fan Fold Box or On Reel
H2A
H2A
H2B
H2B
H
W2
H4
H5
T1
L1
H1
W1
W
L
T
T2
F1
F2
D
P2
P1
P2
P
12–3
MOTOROLA ANALOG IC DEVICE DATA
Tape and Reel Information Table
(1)
Devices
per Reel
Tape Width
(mm)
Reel Size
(inch)
Device
Suffix
Package
SO–8, SOP–8
SO–14
SO–16
12
16
16
2,500
2,500
2,500
13
13
13
R2
R2
R2
SO–16L, SO–8+8L WIDE
SO–20L WIDE
SO–24L WIDE
SO–28L WIDE
SO–28L WIDE
16
24
24
24
32
1,000
1,000
1,000
1,000
1,000
13
13
13
13
13
R2
R2
R2
R2
R3
Micro–8
12
2,500
13
R2
PLCC–20
PLCC–28
PLCC–44
16
24
32
1,000
500
500
13
13
13
R2
R2
R2
PLCC–52
PLCC–68
PLCC–84
32
44
44
500
250
250
13
13
13
R2
R2
R2
(2)
TO–226AA (TO–92)
18
2,000
13
RA, RE, RP, or RM
(Ammo Pack) only
DPAK
16
24
8
2,500
800
13
13
7
RK
R4
TR
T1
2
D PAK
SOT–23 (5 Pin)
3,000
1,000
SOT–89 (3/5 Pin)
(1)
12
7
Minimum order quantity is 1 reel. Distributors/OEM customers may break lots or reels at their option, however broken reels may not be returned.
Integrated circuits in TO–226AA packages are available in Styes A and E only, with optional “Ammo Pack” (Suffix RP or RM). The RA and RP configurations
are preferred. For ordering information please contact your local Motorola Semiconductor Sales Office.
(2)
12–4
MOTOROLA ANALOG IC DEVICE DATA
Analog MPQ Table
Tape/Reel and Ammo Pack
Package Type
Package Code
MPQ
PLCC
Case 775
Case 776
Case 777
0802
0804
0801
1000/reel
500/reel
500/reel
SOIC
Case 751
Case 751A
Case 751B
Case 751G
Case 751D
Case 751E
Case 751F
0095
0096
0097
2003
2005
2008
2009
2500/reel
2500/reel
2500/reel
1000/reel
1000/reel
1000/reel
1000/reel
Micro–8
Case 846A
–
2500/reel
TO–92
Case 29
Case 29
0031
0031
2000/reel
2000/Ammo Pack
DPAK
Case 369A
–
–
–
–
–
2500/reel
800/reel
2
D PAK
Case 936
SOT–23 (5 Pin)
Case 1212
3000/reel
1000/reel
1000/reel
SOT–89 (3 Pin)
Case 1213
SOT–89 (5 Pin)
Case 1214
12–5
MOTOROLA ANALOG IC DEVICE DATA
12–6
MOTOROLA ANALOG IC DEVICE DATA
Packaging Information
In Brief . . .
The packaging availability for each device type is indicated
on the individual data sheets and the Selector Guide. All of the
outline dimensions for the packages are given in this section.
The maximum power consumption an integrated circuit
can tolerate at a given operating ambient temperature can be
found from the equation:
T
– T
A
J(max)
P
=
D(TA)
R
θJA(Typ)
where:
P
= Power Dissipation allowable at a given
operating ambient temperature. This must
be greater than the sum of the products of
the supply voltages and supply currents at
the worst case operating condition.
D(TA)
T
= Maximum operating Junction Temperature
as listed in the Maximum Ratings Section.
J(max)
See individual data sheets for T
information.
J(max)
T
A
= Maximum desired operating Ambient
Temperature
R
= Typical Thermal Resistance Junction-to-
Ambient
θJA(Typ)
13–1
MOTOROLA ANALOG IC DEVICE DATA
Case Outline Dimensions
LP, P, Z SUFFIX
CASE 29-04
NOTES:
Plastic Package
(TO-226AA/TO-92)
ISSUE AD
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
4. DIMENSION F APPLIES BETWEEN P AND L.
DIMENSION D AND J APPLY BETWEEN L AND K
MINIMUM. LEAD DIMENSION IS UNCONTROLLED
IN P AND BEYOND DIMENSION K MINIMUM.
A
B
R
P
INCHES
DIM MIN MAX
MILLIMETERS
L
MIN
4.45
4.32
3.18
0.41
0.41
1.15
2.42
0.39
MAX
5.20
5.33
4.19
0.55
0.48
1.39
2.66
0.50
–––
F
SEATING
PLANE
A
B
C
D
F
G
H
J
0.175 0.205
0.170 0.210
0.125 0.165
0.016 0.022
0.016 0.019
0.045 0.055
0.095 0.105
0.015 0.020
K
1
2
3
D
X X
G
K
L
N
P
0.500
0.250
0.080 0.105
––– 0.100
––– 12.70
–––
J
H
V
6.35
2.04
–––
2.93
3.43
–––
2.66
2.54
–––
C
SECTION X–X
R
V
0.115
0.135
–––
–––
1
–––
N
N
KC, T SUFFIX
CASE 221A-06
Plastic Package
ISSUE Y
SEATING
PLANE
–T–
C
NOTES:
T
F
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
–B–
S
2. CONTROLLING DIMENSION: INCH.
INCHES
DIM MIN MAX
0.560 0.625 14.23 15.87
MILLIMETERS
MIN MAX
4
4
Q
A
A
B
C
D
F
U
0.380 0.420
0.140 0.190
0.020 0.045
0.139 0.155
0.100 BSC
9.66 10.66
1
2
3
3.56
0.51
3.53
4.82
1.14
3.93
H
L
–Y–
G
H
J
2.54 BSC
K
––– 0.280
0.012 0.045
–––
0.31
7.11
1.14
1
2
3
K
L
N
Q
R
S
0.500 0.580 12.70 14.73
R
0.045 0.070
0.200 BSC
1.15
5.08 BSC
1.77
J
0.100 0.135
2.54
2.04
0.51
5.97
0.00
3.42
2.92
1.39
6.47
1.27
G
0.080
0.115
D 3 PL
0.020 0.055
0.235 0.255
0.000 0.050
T
U
M
M
0.25 (0.010)
B
Y
N
13–2
MOTOROLA ANALOG IC DEVICE DATA
TH SUFFIX
CASE 314A-03
Plastic Package
ISSUE D
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
–T–
Y14.5M, 1982.
B
–P–
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION D DOES NOT INCLUDE
INTERCONNECT BAR (DAMBAR) PROTRUSION.
DIMENSION D INCLUDING PROTRUSION SHALL
NOT EXCEED 0.043 (1.092) MAXIMUM.
C
E
Q
OPTIONAL
CHAMFER
INCHES
DIM MIN MAX
MILLIMETERS
MIN MAX
A
U
F
A
B
C
D
E
F
0.572 0.613 14.529 15.570
0.390 0.415 9.906 10.541
0.170 0.180 4.318 4.572
0.025 0.038 0.635 0.965
0.048 0.055 1.219 1.397
0.570 0.585 14.478 14.859
L
K
1
5
G
J
K
L
Q
S
0.067 BSC
1.702 BSC
G
0.015 0.025 0.381 0.635
0.730 0.745 18.542 18.923
0.320 0.365 8.128 9.271
0.140 0.153 3.556 3.886
0.210 0.260 5.334 6.604
0.468 0.505 11.888 12.827
5X J
S
5X D
M
M
0.014 (0.356)
T P
U
NOTES:
T, TV SUFFIX
CASE 314B-05
Plastic Package
ISSUE J
C
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
B
–P–
OPTIONAL
CHAMFER
Q
F
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION D DOES NOT INCLUDE
INTERCONNECT BAR (DAMBAR) PROTRUSION.
DIMENSION D INCLUDING PROTRUSION SHALL
NOT EXCEED 0.043 (1.092) MAXIMUM.
E
A
INCHES
DIM MIN MAX
A
B
C
D
E
MILLIMETERS
MIN MAX
0.613 14.529 15.570
0.415 9.906 10.541
U
L
S
V
0.572
0.390
0.170
0.025
0.048
0.850
0.067 BSC
0.166 BSC
0.015
0.900
0.320
0.320 BSC
0.140
–––
0.468
–––
0.090
W
K
0.180 4.318
0.038 0.635
0.055 1.219
4.572
0.965
1.397
F
0.935 21.590 23.749
1
G
H
J
K
L
N
Q
S
1.702 BSC
4.216 BSC
5
0.025 0.381
1.100 22.860 27.940
0.635
5X J
0.365 8.128
9.271
G
M
0.24 (0.610)
T
H
N
8.128 BSC
5X D
0.153 3.556
0.620
0.505 11.888 12.827
0.735 ––– 18.669
0.110 2.286 2.794
3.886
––– 15.748
M
M
0.10 (0.254)
T P
U
V
W
SEATING
PLANE
–T–
B
–Q–
SEATING
PLANE
T SUFFIX
–T–
CASE 314C–01
Plastic Package
ISSUE A
C
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
A
K
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION D DOES NOT INCLUDE
INTERCONNECT BAR (DAMBAR) PROTRUSION.
DIMENSION D INCLUDING PROTRUSION SHALL
NOT EXCEED 10.92 (0.043) MAXIMUM.
1
2 3 4 5
INCHES
DIM MIN MAX
0.625 15.59
MILLIMETERS
L
MIN
MAX
15.88
10.67
4.83
1
A
B
C
D
E
G
J
0.610
0.380
0.160
0.020
0.035
5
0.420
0.190
0.040
0.055
9.65
4.06
0.51
0.89
1.02
1.40
0.067 BSC
1.702 BSC
0.015
0.500
0.355
0.139
0.025
––– 12.70
0.370
0.147
0.38
0.64
–––
9.40
3.73
K
L
Q
9.02
3.53
G
D 5 PL
M
M
0.356 (0.014)
T Q
J
13–3
MOTOROLA ANALOG IC DEVICE DATA
T, T1 SUFFIX
CASE 314D-03
Plastic Package
ISSUE D
SEATING
PLANE
–T–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
C
–Q–
B
Y14.5M, 1982.
E
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION D DOES NOT INCLUDE
INTERCONNECT BAR (DAMBAR) PROTRUSION.
DIMENSION D INCLUDING PROTRUSION SHALL
NOT EXCEED 10.92 (0.043) MAXIMUM.
U
A
S
INCHES
DIM MIN MAX
MILLIMETERS
MIN MAX
L
A
B
C
D
E
G
H
J
0.572
0.390
0.170
0.025
0.048
0.613 14.529 15.570
0.415 9.906 10.541
0.180 4.318
0.038 0.635
0.055 1.219
1
2
3
4 5
K
4.572
0.965
1.397
0.067 BSC
1.702 BSC
0.087
0.015
1.020
0.320
0.140
0.105
0.543
0.112 2.210
0.025 0.381
2.845
0.635
1
2
3
4
K
L
Q
U
S
1.065 25.908 27.051
5
0.365 8.128
0.153 3.556
0.117 2.667
9.271
3.886
2.972
J
G
H
0.582 13.792 14.783
D 5 PL
M
M
0.356 (0.014)
T Q
DT-1 SUFFIX
CASE 369-07
Plastic Package
(DPAK)
C
B
R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
V
ISSUE K
E
INCHES
DIM MIN MAX
MILLIMETERS
4
MIN
5.97
6.35
2.19
0.69
0.84
0.94
MAX
6.35
6.73
2.38
0.88
1.01
1.19
4
A
B
C
D
E
F
G
H
J
0.235 0.250
0.250 0.265
0.086 0.094
0.027 0.035
0.033 0.040
0.037 0.047
0.090 BSC
0.034 0.040
0.018 0.023
0.350 0.380
0.175 0.215
0.050 0.090
0.030 0.050
A
1
2
3
S
–T–
SEATING
PLANE
2.29 BSC
1
2
3
K
0.87
0.46
8.89
4.45
1.27
0.77
1.01
0.58
9.65
5.46
2.28
1.27
K
R
S
J
F
V
H
D 3 PL
G
M
0.13 (0.005)
T
DT SUFFIX
CASE 369A-13
Plastic Package
(DPAK)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
SEATING
PLANE
–T–
C
B
ISSUE Y
INCHES
DIM MIN MAX
MILLIMETERS
E
V
R
MIN
5.97
6.35
2.19
0.69
0.84
0.94
MAX
6.35
6.73
2.38
0.88
1.01
1.19
A
B
C
D
E
F
G
H
J
K
L
R
S
U
V
Z
0.235 0.250
0.250 0.265
0.086 0.094
0.027 0.035
0.033 0.040
0.037 0.047
0.180 BSC
4
4
Z
1
A
K
S
1
2
3
3
4.58 BSC
U
0.034 0.040
0.018 0.023
0.87
0.46
2.60
1.01
0.58
2.89
0.102
0.114
0.090 BSC
0.175 0.215
0.020 0.050
2.29 BSC
F
J
4.45
0.51
0.51
0.77
3.51
5.46
1.27
–––
1.27
–––
L
H
0.020
0.030 0.050
0.138 –––
–––
D 2 PL
M
G
0.13 (0.005)
T
13–4
MOTOROLA ANALOG IC DEVICE DATA
DP1, N, P, P1 SUFFIX
CASE 626-05
Plastic Package
ISSUE K
8
5
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
–B–
1
4
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
MILLIMETERS
DIM MIN MAX
9.40 10.16 0.370 0.400
INCHES
MIN MAX
F
A
B
C
D
F
–A–
NOTE 2
6.10
3.94
0.38
1.02
6.60 0.240 0.260
4.45 0.155 0.175
0.51 0.015 0.020
1.78 0.040 0.070
L
G
H
J
K
L
2.54 BSC
0.100 BSC
1.27 0.030 0.050
0.30 0.008 0.012
8
C
0.76
0.20
2.92
1
J
3.43
0.115
0.135
–T–
SEATING
PLANE
7.62 BSC
0.300 BSC
N
M
N
–––
10
–––
10
0.76
1.01 0.030 0.040
M
D
K
G
H
M
M
M
0.13 (0.005)
T A
B
N, P, N-14, P2 SUFFIX
CASE 646-06
Plastic Package
ISSUE L
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
4. ROUNDED CORNERS OPTIONAL.
14
1
8
B
7
INCHES
DIM MIN MAX
0.770 18.16
MILLIMETERS
A
F
MIN
MAX
19.56
6.60
4.69
0.53
1.78
A
B
C
D
F
0.715
0.240
0.145
0.015
0.040
0.260
0.185
0.021
0.070
6.10
3.69
0.38
1.02
L
14
1
C
G
H
J
K
L
0.100 BSC
2.54 BSC
0.052
0.008
0.115
0.095
0.015
0.135
1.32
0.20
2.92
2.41
0.38
3.43
J
N
0.300 BSC
7.62 BSC
SEATING
PLANE
K
M
N
0
10
0.039
0
0.39
10
1.01
0.015
H
G
D
M
DP2, N, P, PC SUFFIX
CASE 648-08
Plastic Package
ISSUE R
NOTES:
–A–
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
16
1
9
8
B
S
INCHES
DIM MIN MAX
0.770 18.80
MILLIMETERS
MIN
MAX
19.55
6.85
4.44
0.53
1.77
F
A
B
C
D
F
0.740
0.250
0.145
0.015
0.040
C
L
0.270
0.175
0.021
0.70
6.35
3.69
0.39
1.02
16
1
SEATING
PLANE
–T–
G
H
J
K
L
M
S
0.100 BSC
0.050 BSC
2.54 BSC
1.27 BSC
K
M
0.008
0.015
0.130
0.305
10
0.21
0.38
3.30
7.74
10
H
J
0.110
0.295
0
2.80
7.50
0
G
D 16 PL
0.020
0.040
0.51
1.01
M
M
0.25 (0.010)
T A
13–5
MOTOROLA ANALOG IC DEVICE DATA
B, P, P2, V SUFFIX
CASE 648C-03
Plastic Package
(DIP–16)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. INTERNAL LEAD CONNECTION BETWEEN 4 AND
5, 12 AND 13.
–A–
ISSUE C
16
1
9
8
–B–
INCHES
DIM MIN MAX
0.840 18.80
MILLIMETERS
L
MIN
MAX
21.34
6.60
4.69
0.53
A
B
C
D
E
F
0.740
0.240
0.145
0.015
0.050 BSC
0.040
0.100 BSC
0.008
0.115
0.300 BSC
0
0.260
0.185
0.021
6.10
3.69
0.38
NOTE 5
16
1
1.27 BSC
C
0.70
1.02
1.78
G
J
K
L
M
N
2.54 BSC
0.015
0.135
0.20
2.92
0.38
3.43
–T–
SEATING
PLANE
M
N
7.62 BSC
K
10
0.040
0
10
E
0.015
0.39
1.01
J 16 PL
F
G
D 16 PL
M
S
0.13 (0.005)
T B
M
S
0.13 (0.005)
T A
–A–
P SUFFIX
NOTES:
CASE 648E–01
Plastic Package
(DIP–16)
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION A AND B DOES NOT INCLUDE MOLD
PROTRUSION.
5. MOLD FLASH OR PROTRUSIONS SHALL NOT
EXCEED 0.25 (0.010).
R
16
1
9
8
ISSUE O
–B–
6. ROUNDED CORNER OPTIONAL.
M
P
L
INCHES
DIM MIN MAX
0.760 18.80
MILLIMETERS
F
MIN
MAX
19.30
6.60
4.44
0.53
1.77
A
B
C
D
F
0.740
0.245
0.145
0.015
0.050
0.260
0.175
0.021
0.070
6.23
3.69
0.39
1.27
16
J
1
C
G
H
J
K
L
M
P
0.100 BSC
0.050 BSC
2.54 BSC
1.27 BSC
0.21
3.05
7.50
0
5.08 BSC
7.62 BSC
0.39 0.88
–T–
SEATING
PLANE
0.008
0.015
0.140
0.305
10
0.38
3.55
7.74
10
S
0.120
0.295
0
K
H
G
0.200 BSC
0.300 BSC
0.015 0.035
R
S
D 13 PL
M
S
S
0.25 (0.010)
T B
A
P SUFFIX
CASE 649-03
Plastic Package
ISSUE D
P
A
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
13
24
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
L
Q
B
MILLIMETERS
DIM MIN MAX
INCHES
MIN
MAX
1.265
0.540
0.205
0.020
0.060
1
A
B
C
D
F
31.50
13.21
4.70
0.38
1.02
32.13 1.240
13.72 0.520
5.21 0.185
0.51 0.015
1.52 0.040
12
M
J
H
F
C
G
H
J
K
L
M
N
P
2.54 BSC
0.100 BSC
1.65
0.20
2.92
14.99
–––
2.16 0.065
0.30 0.008
3.43
15.49 0.590
10 –––
0.085
0.012
0.135
0.610
10
24
N
0.115
1
K
0.51
0.13
0.51
1.02 0.020
0.38 0.005
0.76 0.020
0.040
0.015
0.030
D
G
SEATING
PLANE
Q
13–6
MOTOROLA ANALOG IC DEVICE DATA
A, B, N, P SUFFIX
CASE 707-02
Plastic Package
ISSUE C
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D),
SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM
MATERIAL CONDITION, IN RELATION TO
SEATING PLANE AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
18
10
9
B
1
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
A
MILLIMETERS
DIM MIN MAX
INCHES
MIN
MAX
0.915
0.260
0.180
0.022
0.070
L
A
B
C
D
F
22.22
6.10
3.56
0.36
1.27
23.24 0.875
6.60 0.240
4.57 0.140
0.56 0.014
1.78 0.050
C
18
1
G
H
J
K
L
2.54 BSC
0.100 BSC
K
N
1.02
0.20
2.92
1.52 0.040
0.30 0.008
3.43
0.060
0.012
0.135
J
M
F
D
SEATING
PLANE
0.115
H
G
7.62 BSC
0.300 BSC
M
N
0
0.51
15
0
15
0.040
1.02 0.020
P SUFFIX
CASE 710-02
Plastic Package
ISSUE B
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D), SHALL
BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL
CONDITION, IN RELATION TO SEATING PLANE
AND EACH OTHER.
28
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
1
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
28
1
15
A
B
C
D
F
36.45 37.21 1.435 1.465
13.72 14.22 0.540 0.560
B
3.94
0.36
1.02
5.08 0.155 0.200
0.56 0.014 0.022
1.52 0.040 0.060
14
G
H
J
K
L
2.54 BSC
0.100 BSC
2.16 0.065 0.085
0.38 0.008 0.015
1.65
0.20
2.92
L
C
A
3.43
0.115
0.135
15.24 BSC
0.600 BSC
N
M
N
0
0.51
15
0
15
1.02 0.020 0.040
J
M
G
H
F
K
SEATING
PLANE
D
P SUFFIX
CASE 711-03
Plastic Package
ISSUE C
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D), SHALL
BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL
CONDITION, IN RELATION TO SEATING PLANE
AND EACH OTHER.
40
1
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
40
21
20
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
B
A
B
C
D
F
51.69 52.45 2.035 2.065
13.72 14.22 0.540 0.560
3.94
0.36
1.02
5.08 0.155 0.200
0.56 0.014 0.022
1.52 0.040 0.060
1
G
H
J
K
L
2.54 BSC
0.100 BSC
2.16 0.065 0.085
0.38 0.008 0.015
L
A
1.65
0.20
2.92
C
3.43
0.115
0.135
N
15.24 BSC
0.600 BSC
M
N
0
0.51
15
0
15
J
1.02 0.020 0.040
K
SEATING
PLANE
M
H
G
F
D
13–7
MOTOROLA ANALOG IC DEVICE DATA
F, P, P-3 SUFFIX
CASE 724-03
Plastic Package
(NDIP–24)
NOTES:
1. CHAMFERED CONTOUR OPTIONAL.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
24
ISSUE D
1
4. CONTROLLING DIMENSION: INCH.
–A–
INCHES
DIM MIN MAX
1.265 31.25
MILLIMETERS
MIN
MAX
32.13
6.85
4.44
0.51
24
1
13
12
A
B
C
D
E
F
1.230
0.250
0.145
0.015
0.050 BSC
0.040
–B–
0.270
0.175
0.020
6.35
3.69
0.38
1.27 BSC
1.02
L
C
0.060
1.52
G
J
K
L
M
N
0.100 BSC
2.54 BSC
0.007
0.110
0.012
0.140
0.18
2.80
0.30
3.55
NOTE 1
–T–
SEATING
PLANE
K
0.300 BSC
7.62 BSC
N
M
0
15
0
15
E
0.020
0.040
0.51
1.01
G
J 24 PL
F
M
M
0.25 (0.010)
T B
D 24 PL
M
M
0.25 (0.010)
T A
H, P, DP SUFFIX
CASE 738-03
Plastic Package
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
–A–
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
20
1
11
B
INCHES
DIM MIN MAX
1.010 1.070 25.66
MILLIMETERS
10
MIN
MAX
27.17
6.60
A
B
C
D
E
F
0.240 0.260
0.150 0.180
0.015 0.022
0.050 BSC
6.10
3.81
0.39
L
4.57
0.55
C
1.27 BSC
0.050 0.070
0.100 BSC
1.27
1.77
20
G
2.54 BSC
1
J
0.008 0.015
0.21
2.80
7.62 BSC
0
0.51
0.38
3.55
K
L
M
N
0.110
0.140
–T–
SEATING
PLANE
K
M
0.300 BSC
0
15
15
1.01
0.020 0.040
N
E
J 20 PL
G
F
M
M
0.25 (0.010)
T B
D 20 PL
M
M
0.25 (0.010)
T A
D, D1, D2 SUFFIX
CASE 751-05
Plastic Package
(SO-8, SOP-8)
ISSUE R
NOTES:
D
A
E
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS ARE IN MILLIMETERS.
3. DIMENSION D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
C
8
1
5
4
M
M
0.25
B
H
MILLIMETERS
8
h X 45
B
C
DIM MIN
MAX
1.75
0.25
0.49
0.25
5.00
4.00
e
1
A
A1
B
C
D
E
1.35
0.10
0.35
0.18
4.80
3.80
A
SEATING
PLANE
e
H
h
1.27 BSC
0.10
L
5.80
0.25
0.40
0
6.20
0.50
1.25
7
A1
B
L
M
S
S
0.25
C B
A
13–8
MOTOROLA ANALOG IC DEVICE DATA
D SUFFIX
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
CASE 751A-03
Plastic Package
(SO-14)
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
–A–
ISSUE F
14
1
8
7
–B–
P 7 PL
M
M
0.25 (0.010)
B
MILLIMETERS
DIM MIN MAX
INCHES
14
1
MIN
MAX
0.344
0.157
0.068
0.019
0.049
F
A
B
C
D
F
8.55
3.80
1.35
0.35
0.40
8.75 0.337
4.00 0.150
1.75 0.054
0.49 0.014
1.25 0.016
R X 45
G
C
G
J
K
M
P
1.27 BSC
0.050 BSC
–T–
SEATING
PLANE
J
M
0.19
0.10
0
0.25 0.008
0.25 0.004
0.009
0.009
7
K
D 14 PL
7
0
M
S
S
0.25 (0.010)
T B
A
5.80
0.25
6.20 0.228
0.50 0.010
0.244
0.019
R
–A–
D SUFFIX
NOTES:
CASE 751B-05
Plastic Package
(SO-16)
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
16
9
ISSUE J
–B–
P 8 PL
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
M
S
0.25 (0.010)
B
1
8
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
G
MILLIMETERS
DIM MIN MAX
9.80 10.00 0.386 0.393
INCHES
MIN MAX
16
1
A
B
C
D
F
F
K
3.80
1.35
0.35
0.40
4.00 0.150 0.157
1.75 0.054 0.068
0.49 0.014 0.019
1.25 0.016 0.049
R X 45
C
G
J
K
M
P
1.27 BSC
0.050 BSC
0.25 0.008 0.009
0.25 0.004 0.009
–T–
SEATING
PLANE
0.19
0.10
0
J
M
D
16 PL
7
0
7
5.80
0.25
6.20 0.229 0.244
0.50 0.010 0.019
M
S
S
0.25 (0.010)
T B
A
R
DW, FP SUFFIX
–A–
NOTES:
CASE 751D-04
Plastic Package
(SO-20L, SO–20)
ISSUE E
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
20
11
4. MAXIMUM MOLD PROTRUSION 0.150
(0.006) PER SIDE.
10X P
–B–
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
M
M
0.010 (0.25)
B
1
10
J
F
20X D
MILLIMETERS
DIM MIN MAX
12.65 12.95 0.499 0.510
INCHES
MIN MAX
M
S
S
0.010 (0.25) T A
B
A
B
C
D
F
20
7.40
2.35
0.35
0.50
7.60 0.292 0.299
2.65 0.093 0.104
0.49 0.014 0.019
0.90 0.020 0.035
1
R X 45
G
J
K
M
P
1.27 BSC
0.050 BSC
0.32 0.010 0.012
0.25 0.004 0.009
C
0.25
0.10
0
SEATING
PLANE
7
0
7
–T–
10.05 10.55 0.395 0.415
18X G
R
0.25
0.75 0.010 0.029
K
M
13–9
MOTOROLA ANALOG IC DEVICE DATA
DW SUFFIX
CASE 751E-04
Plastic Package
(SO-24L,
SOP (16+4+4)L)
ISSUE E
–A–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
24
13
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
–B– 12X P
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
M
M
0.010 (0.25)
B
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
1
12
24X D
24
J
MILLIMETERS
DIM MIN MAX
INCHES
M
S
S
0.010 (0.25)
T A
B
1
MIN
MAX
0.612
0.299
0.104
0.019
0.035
A
B
C
D
F
15.25
7.40
2.35
0.35
0.41
15.54 0.601
7.60 0.292
2.65 0.093
0.49 0.014
0.90 0.016
F
R X 45
G
J
K
M
P
1.27 BSC
0.050 BSC
0.23
0.13
0
0.32 0.009
0.29 0.005
0.013
0.011
8
C
K
–T–
SEATING
8
0
M
10.05
0.25
10.55 0.395
0.75 0.010
0.415
0.029
PLANE
R
22X G
DW SUFFIX
CASE 751F-04
NOTES:
Plastic Package
(SO-28L, SOIC–28)
ISSUE E
28
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE
1
–A–
15
28
14X P
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
M
M
0.010 (0.25)
B
–B–
1
MILLIMETERS
DIM MIN MAX
INCHES
14
MIN
MAX
0.711
0.299
0.104
0.019
0.035
M
A
B
C
D
F
17.80
7.40
2.35
0.35
0.41
18.05 0.701
7.60 0.292
2.65 0.093
0.49 0.014
0.90 0.016
28X D
R
X 45
M
S
S
0.010 (0.25)
T A
B
G
J
K
M
P
1.27 BSC
0.050 BSC
0.23
0.13
0
0.32 0.009
0.29 0.005
0.013
0.011
8
C
8
0
–T–
SEATING
PLANE
10.01
0.25
10.55 0.395
0.75 0.010
0.415
0.029
26X G
F
R
K
J
DW SUFFIX
CASE 751G-02
Plastic Package
(SO-16L, SOP–16L,
SOP-8+8L)
ISSUE A
–A–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
16
9
–B–
8X P
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
M
M
0.010 (0.25)
B
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
1
8
J
16X D
16
MILLIMETERS
DIM MIN MAX
10.15 10.45 0.400
INCHES
M
S
S
0.010 (0.25)
T A
B
MIN
MAX
1
A
B
C
D
F
0.411
F
7.40
2.35
0.35
0.50
7.60 0.292 0.299
2.65 0.093 0.104
0.49 0.014 0.019
0.90 0.020 0.035
R X 45
G
J
K
M
P
1.27 BSC
0.050 BSC
0.32 0.010 0.012
0.25 0.004 0.009
0.25
0.10
0
C
7
0
7
–T–
M
10.05 10.55 0.395 0.415
0.25 0.75 0.010 0.029
SEATING
14X G
K
PLANE
R
13–10
MOTOROLA ANALOG IC DEVICE DATA
D SUFFIX
16
CASE 751K–01
Plastic Package
(SO–16)
NOTES:
1
1
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2
3
CONTROLLING DIMENSION: MILLIMETER.
DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
–A–
ISSUE O
4
5
MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
16
9
DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
M
–B–
P
MILLIMETERS
DIM MIN MAX
INCHES
F
MIN
MAX
0.393
0.157
0.068
0.019
0.049
A
B
C
D
F
9.80
3.80
1.35
0.35
0.40
10.00 0.368
4.00 0.150
1.75 0.054
0.49 0.014
1.25 0.016
1
8
G
R X 45
G
J
K
M
P
1.27 BSC
0.050 BSC
0.19
0.10
0
0.25 0.008
0.25 0.004
7
0.009
0.009
7
C
SEATING
PLANE
–T–
0
5.80
0.25
6.20 0.229
0.50 0.010
0.244
0.019
14 X D
J
K
R
M
S
S
0.25 (0.010)
T A
B
–A–
DW SUFFIX
CASE 751N–01
Plastic Package
(SOP–16L)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
T
16
9
ISSUE O
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
M
M
–B–
P
0.010 (0.25)
B
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
1
8
16
J
F
MILLIMETERS
DIM MIN MAX
10.15 10.45 0.400
INCHES
13X D
1
MIN
MAX
A
B
C
D
F
0.411
M
S
S
0.010 (0.25)
T A
B
7.40
2.35
0.35
0.50
7.60 0.292 0.299
2.65 0.093 0.104
0.49 0.014 0.019
0.90 0.020 0.035
G
J
K
M
P
R
S
T
1.27 BSC
0.050 BSC
0.32 0.010 0.012
0.25 0.004 0.009
R X 45
0.25
0.10
0
7
0
7
C
10.05 10.55 0.395 0.415
0.25 0.75 0.010 0.029
2.54 BSC
3.81 BSC
–T–
SEATING
PLANE
M
S
0.100 BSC
0.150 BSC
K
9X G
13–11
MOTOROLA ANALOG IC DEVICE DATA
CASE 762-01
Plastic Medium Power Package
(SIP-9)
ISSUE C
9
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
Q
1
M
M
0.25 (0.010)
T A
–A–
MILLIMETERS
DIM MIN MAX
22.40 23.00 0.873 0.897
INCHES
MIN MAX
–C–
U
V
A
B
C
D
E
M
X
6.40
3.45
0.40
9.35
1.40
6.60 0.252 0.260
3.65 0.135 1.143
0.55 0.015 0.021
9.60 0.368 0.377
1.60 0.055 0.062
S
W
E
F
Y
G
H
J
2.54 BSC
0.100 BSC
1.51
1.71 0.059 0.067
0.360 0.400 0.014 0.015
R
B
N
K
M
N
Q
R
S
U
V
W
X
Y
3.95
30 BSC
2.50
3.15
13.60 13.90 0.535 0.547
1.65 1.95 0.064 0.076
22.00 22.20 0.866 0.874
0.55
2.89 BSC
4.20 0.155 0.165
30 BSC
2.70 0.099 0.106
3.45 0.124 0.135
9
1
SEATING
PLANE
–T–
K
M
M
0.25 (0.010)
T C
J
H
G
F
0.75 0.021 0.029
0.113 BSC
0.75 0.025 0.029
D 9 PL
0.65
2.70
M
M
0.25 (0.010)
T A
2.80 0.106
0.110
FN SUFFIX
CASE 775-02
Plastic Package
(PLCC-20)
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
1
ISSUE C
M
S
S
0.007 (0.180) T L–M
N
B
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
M
S
S
N
0.007 (0.180) T L–M
Y BRK
–N–
U
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
D
–L–
Z
–M–
W
D
20
1
S
S
S
0.010 (0.250) T L–M
N
G1
X
V
VIEW D–D
INCHES
DIM MIN MAX
MILLIMETERS
MIN
9.78
9.78
4.20
2.29
0.33
MAX
10.03
10.03
4.57
2.79
0.48
M
S
S
S
A
R
0.007 (0.180) T L–M
N
A
B
C
E
0.385
0.385
0.165
0.090
0.013
0.395
0.395
0.180
0.110
0.019
Z
M
S
0.007 (0.180) T L–M
N
F
M
S
S
H
0.007 (0.180) T L–M
N
G
H
J
0.050 BSC
1.27 BSC
C
0.026
0.020
0.025
0.350
0.350
0.042
0.042
0.042
–––
0.032
–––
–––
0.356
0.356
0.048
0.048
0.056
0.020
10
0.66
0.51
0.64
8.89
8.89
1.07
1.07
1.07
–––
2
0.81
–––
–––
9.04
9.04
1.21
1.21
1.42
0.50
10
E
0.004 (0.100)
K1
K
K
R
U
V
W
X
Y
Z
G
–T– SEATING
J
PLANE
VIEW S
M
S
S
0.007 (0.180) T L–M
N
G1
F
S
S
S
0.010 (0.250) T L–M
N
VIEW S
2
G1 0.310
K1 0.040
0.330
–––
7.88
1.02
8.38
–––
13–12
MOTOROLA ANALOG IC DEVICE DATA
FN SUFFIX
CASE 776-02
Plastic Package
(PLCC–28)
ISSUE D
1
M
S
S
0.007 (0.180)
T L–M
N
B
Z
Y BRK
D
–N–
M
S
S
0.007 (0.180)
T L–M
N
U
–M–
–L–
W
D
S
S
S
0.010 (0.250)
T L–M
N
X
G1
V
28
1
VIEW D–D
M
S
S
S
A
0.007 (0.180)
0.007 (0.180)
T L–M
N
M
S
S
H
0.007 (0.180)
T L–M
N
Z
M
S
T L–M
N
R
K1
C
E
0.004 (0.100)
SEATING
PLANE
G
K
–T–
VIEW S
J
M
S
S
0.007 (0.180)
T L–M
N
F
G1
S
S
S
0.010 (0.250)
T L–M
N
VIEW S
NOTES:
INCHES
DIM MIN MAX
MILLIMETERS
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE
MOLD FLASH. ALLOWABLE MOLD FLASH IS
0.010 (0.250) PER SIDE.
MIN
MAX
12.57
12.57
4.57
2.79
0.48
A
B
C
E
0.485
0.485
0.165
0.090
0.013
0.495 12.32
0.495 12.32
0.180
0.110
0.019
4.20
2.29
0.33
F
G
H
J
0.050 BSC
1.27 BSC
4. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
0.026
0.020
0.025
0.450
0.450
0.042
0.042
0.042
–––
0.032
–––
–––
0.456
0.456
0.048
0.048
0.056
0.020
10
0.66
0.51
0.64
11.43
11.43
1.07
1.07
1.07
–––
0.81
–––
–––
11.58
11.58
1.21
1.21
1.42
0.50
10
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
K
R
U
V
W
X
Y
Z
2
2
G1 0.410
K1 0.040
0.430 10.42
––– 1.02
10.92
–––
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
13–13
MOTOROLA ANALOG IC DEVICE DATA
FN SUFFIX
CASE 777-02
Plastic Package
(PLCC)
M
S
S
0.007(0.180)
T
L–M
N
B
M
S
S
0.007(0.180)
T
L–M
N
U
1
ISSUE C
D
–N–
Z
Y BRK
–M–
–L–
X
G1
S
S
S
0.010 (0.25)
T
L–M
N
VIEW D–D
H
V
W
D
M
S
S
0.007(0.180)
T
L–M
N
44
1
M
M
S
S
S
S
A
R
0.007(0.180)
0.007(0.180)
T
T
L–M
L–M
N
N
K1
Z
K
J
C
F
E
M
S
S
0.007(0.180)
VIEW S
T
L–M
N
0.004 (0.10)
G
SEATING
PLANE
–T–
INCHES
DIM MIN MAX
MILLIMETERS
MIN MAX
G1
VIEW S
A
B
C
E
0.685 0.695 17.40 17.65
0.685 0.695 17.40 17.65
S
S
S
0.010 (0.25)
T
L–M
N
0.165 0.180
0.090 0.110
0.013 0.019
0.050 BSC
4.20
2.29
0.33
4.57
2.79
0.48
NOTES:
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE
TOP AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
F
1. DATUMS –L–, –M–, AND –N– ARE DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010
(0.25) PER SIDE.
G
H
J
1.27 BSC
0.026 0.032
0.66
0.51
0.64
0.81
–––
–––
0.020
0.025
–––
–––
K
R
U
V
W
X
Y
Z
0.650 0.656 16.51 16.66
0.650 0.656 16.51 16.66
0.042 0.048
0.042 0.048
0.042 0.056
––– 0.020
1.07
1.07
1.07
–––
2
1.21
1.21
1.42
0.50
10
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
2
10
G1 0.610 0.630 15.50 16.00
K1 0.040 ––– 1.02 –––
NOTES:
M SUFFIX
CASE 803C
PRELIMINARY
Plastic Package
6
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
–A–
7
8
CONTROLLING DIMENSION: MILLIMETER.
DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
–F–
9
MAXIMUM MOLD PROTRUSION 0.15 (0.008) PER
SIDE.
20
1
11
10
10 DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.006) TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
K
–B–
1
J
20
G
MILLIMETERS
DIM MIN MAX
INCHES
MIN
MAX
0.504
0.215
0.081
0.020
0.032
S 10 PL
A
B
C
D
E
F
12.35
5.10
1.95
0.35
–––
12.80 0.486
5.45 0.201
2.05 0.077
0.50 0.014
M
M
0.13 (0.005)
B
N
0.81
12.40*
–––
0.488*
G
H
J
K
L
M
N
S
1.15
0.59
0.18
1.10
0.05
0
1.39 0.045
0.81 0.023
0.27 0.007
1.50 0.043
0.20 0.001
0.055
0.032
0.011
0.059
0.008
10
C
0.10 (0.004)
E
L
M
10
0
D 20 PL
–T–
SEATING
PLANE
0.50
7.40
0.85 0.020
8.20 0.291
0.033
0.323
M
S
S
0.13 (0.005)
T B
A
*APPROXIMATE
13–14
MOTOROLA ANALOG IC DEVICE DATA
TV SUFFIX
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
CASE 821C-04
Plastic Package
(15-Pin ZIP)
ISSUE D
1
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION R DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
15
5. MOLD FLASH OR PROTRUSIONS SHALL NOT
EXCEED 0.010 (0.250).
6. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION SHALL
BE 0.003 (0.076) TOTAL IN EXCESS OF THE D
DIMENSION. AT MAXIMUM MATERIAL CONDITION.
SEATING
PLANE
–T–
C
E
M
B
–Q–
INCHES
DIM MIN MAX
MILLIMETERS
MIN MAX
–P–
U
A
B
C
D
E
0.684 0.694 17.374 17.627
0.784 0.792 19.914 20.116
0.173 0.181 4.395 4.597
0.024 0.031 0.610 0.787
0.058 0.062 1.473 1.574
Y
K
V
A
R
G
H
J
K
L
0.050 BSC
0.169 BSC
0.018 0.024 0.458 0.609
0.700 0.710 17.780 18.034
1.270 BSC
4.293 BSC
S
0.200 BSC
5.080 BSC
PIN 15
M
R
S
U
V
Y
0.148 0.151 3.760 3.835
0.416 0.426 10.567 10.820
0.157 0.167 3.988 4.242
PIN 1
H
L
G
0.105
0.868 REF
0.625 0.639 15.875 16.231
0.115 2.667 2.921
15X D
15X J
22.047 REF
S
M
M
Q
0.010 (0.254)
T P
0.024 (0.610)
T
T SUFFIX
CASE 821D-03
Plastic Package
ISSUE C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION R DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
1
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
15
5. MOLD FLASH OR PROTRUSIONS SHALL NOT
EXCEED 0.010 (0.250).
6. DELETED
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION SHALL
BE 0.003 (0.076) TOTAL IN EXCESS OF THE D
DIMENSION. AT MAXIMUM MATERIAL CONDITION.
SEATING
PLANE
Q
–L–
–T–
C
B
E
INCHES
DIM MIN MAX
MILLIMETERS
MIN MAX
–P–
U
A
B
C
D
E
F
0.681 0.694 17.298 17.627
0.784 0.792 19.914 20.116
0.173 0.181 4.395 4.597
0.024 0.031 0.610 0.787
0.058 0.062 1.473 1.574
0.016 0.023 0.407 0.584
A
R
K
G
H
J
K
Q
R
U
Y
0.050 BSC
0.110 BSC
0.018 0.024 0.458 0.609
1.078 1.086 27.382 27.584
0.148 0.151 3.760 3.835
0.416 0.426 10.567 10.820
1.270 BSC
2.794 BSC
Y
PIN 1
PIN 15
H
G
0.110 BSC
0.503 REF
2.794 BSC
12.776 REF
7X F
15X D
15X J
S
M
L
0.010 (0.254)
T P
M
0.024 (0.610)
T
13–15
MOTOROLA ANALOG IC DEVICE DATA
FTB SUFFIX
CASE 824D–01
Plastic Package
(TQFP–44)
1
ISSUE O
L
–T–, –U–, –Z–
–Z–
44
34
33
1
AE
G
AE
DETAIL AA
–T–
L
–U–
F
PLATING
BASE METAL
DETAIL AA
J
11
23
N
12
22
D
M
S
S
0.20 (0.008)
AC T–U
Z
A
SECTION AE–AE
M
S
S
0.20 (0.008)
AB T–U
Z
Z
0.05 (0.002) T–U
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
M
S
S
0.20 (0.008)
AC T–U
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U– AND –Z– TO BE DETERMINED AT
DATUM PLANE –AB–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –AC–.
M
DETAIL AD
–AB–
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE DETERMINED
AT DATUM PLANE –AB–.
E
C
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL NOT
CAUSE THE D DIMENSION TO EXCEED 0.530
(0.021).
0.10 (0.004)
–AC–
H
Y
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
A
B
C
D
E
9.950 10.050 0.392 0.396
9.950 10.050 0.392 0.396
1.400 1.600 0.055 0.063
0.300 0.450 0.012 0.018
1.350 1.450 0.053 0.057
0.300 0.400 0.012 0.016
R
F
G
H
J
K
L
M
N
Q
R
S
V
W
X
Y
0.800 BSC
0.031 BSC
K
0.050 0.150 0.002 0.006
0.090 0.200 0.004 0.008
0.450 0.550 0.018 0.022
8.000 BSC
12 REF
Q
W
X
0.315 BSC
12 REF
VIEW AD
0.090 0.160 0.004 0.006
1
5
1
5
0.100 0.200 0.004 0.008
11.900 12.100 0.469 0.476
11.900 12.100 0.469 0.476
0.200 REF
1.000 REF
12 REF
0.008 REF
0.039 REF
12 REF
13–16
MOTOROLA ANALOG IC DEVICE DATA
FB SUFFIX
CASE 824E–02
Plastic Package
(QFP)
44
1
ISSUE A
S
–L–, –M–, –N–
M
S
S
S
S
0.20 (0.008)
0.20 (0.008)
T L–M
H L–M
N
N
A
M
0.05 (0.002) L–M
PIN 1
IDENT
J1
J1
G
44
34
33
1
VIEW Y
3 PL
F
PLATING
BASE METAL
–L–
–M–
J
B1
D
M
VIEW Y
S
S
0.20 (0.008)
T L–M
N
SECTION J1–J1
11
23
G 40X
44 PL
12
22
–N–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –L–, –M– AND –N– TO BE DETERMINED
AT DATUM PLANE –H–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –T–.
M
VIEW P
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –H–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.530 (0.021).
E
DATUM
C
–H–
PLANE
0.01 (0.004)
–T–
W
Y
MILLIMETERS
DIM MIN MAX
INCHES
MIN
MAX
0.398
0.398
0.087
A
B
C
D
E
9.90
9.90
2.00
0.30
2.00
0.30
10.10 0.390
10.10 0.390
2.21 0.079
0.45 0.0118 0.0177
2.10 0.079
0.40 0.012
1
0.083
0.016
F
R R1
R R2
G
J
K
M
S
V
W
Y
A1
0.80 BSC
0.031 BSC
0.13
0.65
5
0.23 0.005
0.95 0.026
10
0.009
0.037
10
DATUM
PLANE
–H–
5
12.95
12.95
0.000
5
13.45 0.510
13.45 0.510
0.210 0.000
0.530
0.530
0.008
10
K
10
5
2
A1
0.450 REF
0.170 0.005
1.600 REF
0.130
0.300
0.300 0.005
0.018 REF
0.007
0.063 REF
B1 0.130
C1
R1
R2 0.130
1
2
C1
VIEW P
0.005
0.012
0.012
10
5
0
10
7
5
0
7
13–17
MOTOROLA ANALOG IC DEVICE DATA
FB SUFFIX
CASE 840F–01
Plastic Package
ISSUE O
64
1
L
–Z–
64
49
1
48
–T–, –U–, –Z–
P
AE
AE
L
B
V
G
–U–
–T–
DETAIL AA
DETAIL AA
16
33
32
17
BASE
METAL
A
N
M
S
S
S
S
0.20 (0.008)
AB T–U
Z
Z
0.050 (0.002) T–U
S
D
F
M
0.20 (0.008)
AC T–U
M
J
C
E
SECTION AE–AE
–AB–
0.10 (0.004)
–AC–
Y
H
DETAIL AD
MILLIMETERS
DIM MIN MAX
INCHES
MIN
MAX
0.396
0.396
0.063
0.011
0.057
0.009
NOTES:
A
B
C
D
E
F
9.950 10.050 0.392
9.950 10.050 0.392
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
1.400
0.170
1.350
0.170
1.600 0.055
0.270 0.007
1.450 0.053
0.230 0.007
Q
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U– AND –Z– TO BE DETERMINED
AT DATUM PLANE –AC–.
G
H
J
K
L
M
N
P
0.500 BSC
0.020 BSC
R
0.050
0.090
0.450
0.150 0.002
0.200 0.004
0.550 0.018
0.006
0.008
0.022
K
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –AC–.
7.500 BSC
12° REF
0.090 0.160 0.004
0.250 BSC 0.010 BSC
0.295 BSC
12° REF
0.006
W
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.25 (0.010 ) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350 (0.014).
X
°
°
5
Q
R
S
V
W
X
Y
1°
0.100
5
1°
0.200 0.004
DETAIL AD
0.008
0.476
0.476
11.900 12.100 0.469
11.900 12.100 0.469
0.200 REF
1.000 REF
12 REF
0.008 REF
0.039 REF
°
12 REF
°
13–18
MOTOROLA ANALOG IC DEVICE DATA
DM SUFFIX
CASE 846A–02
Plastic Package
(Micro–8)
8
1
ISSUE C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
–A–
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
–B–
K
MILLIMETERS
INCHES
PIN 1 ID
G
DIM MIN
MAX
3.10
3.10
1.10
MIN
0.114
0.114
MAX
0.122
0.122
D 8 PL
A
B
C
D
G
H
J
2.90
2.90
–––
M
S
S
0.08 (0.003)
T B
A
––– 0.043
0.25
0.40 0.010 0.016
0.65 BSC
0.026 BSC
0.15 0.002 0.006
0.23 0.005 0.009
5.05 0.187 0.199
0.70 0.016 0.028
0.05
0.13
4.75
0.40
SEATING
PLANE
–T–
K
L
0.038 (0.0015)
C
L
J
H
13–19
MOTOROLA ANALOG IC DEVICE DATA
FB SUFFIX
CASE 848B-04
Plastic Package
(TQFP–52)
1
52
ISSUE C
L
39
27
26
40
B
B
DETAIL A
–B–
–A–
L
–A–, –B–, –D–
DETAIL A
14
52
1
13
–D–
F
B
M
S
S
S
0.20 (0.008)
H A–B
D
D
0.05 (0.002) A–B
J
N
V
M
S
0.20 (0.008)
C A–B
BASE METAL
D
DETAIL C
M
M
C
M
S
S
0.02 (0.008)
C A–B
D
E
SECTION B–B
DATUM
PLANE
–H–
0.10 (0.004)
H
SEATING
PLANE
–C–
G
MILLIMETERS
DIM MIN MAX
INCHES
NOTES:
MIN
MAX
0.398
0.398
0.096
0.015
0.083
0.013
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS –A–, –B– AND –D– TO BE DETERMINED AT
DATUM PLANE –H–.
U
A
B
C
D
E
9.90
9.90
2.10
0.22
2.00
0.22
10.10 0.390
10.10 0.390
2.45 0.083
0.38 0.009
2.10 0.079
0.33 0.009
F
G
H
J
K
L
0.65 BSC
0.026 BSC
R
–––
0.13
0.65
0.25
0.23 0.005
0.95 0.026
–––
0.010
0.009
0.037
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –C–.
Q
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE DETERMINED
AT DATUM PLANE –H–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT.
7.80 REF
0.307 REF
M
N
Q
R
S
5
0.13
0
0.13
12.95
0.13
0
12.95
0.35
1.6 REF
10
5
10
0.007
7
0.17 0.005
7
0.30 0.005
13.45 0.510
––– 0.005
K
T
0
W
X
0.012
0.530
–––
T
U
V
W
X
–––
0
–––
DETAIL C
13.45 0.510
0.45 0.014
0.530
0.018
0.063 REF
13–20
MOTOROLA ANALOG IC DEVICE DATA
FB SUFFIX
CASE 848D–03
Plastic Package
ISSUE C
1
52
4X
4X TIPS
0.20 (0.008) H L–M N
0.20 (0.008) T L–M N
–X–
X=L, M, N
52
1
40
C
L
39
AB
AB
G
3X VIEW Y
–L–
–M–
B1
VIEW Y
B
V
V1
BASE METAL
F
PLATING
13
14
27
26
J
U
–N–
A1
S1
D
M
S
S
0.13 (0.005)
T L–M
N
A
S
SECTION AB–AB
ROTATED 90 CLOCKWISE
4X θ2
4X θ3
C
0.10 (0.004) T
–H–
–T–
SEATING
PLANE
VIEW AA
MILLIMETERS
INCHES
MIN MAX
0.394 BSC
0.197 BSC
0.394 BSC
0.197 BSC
DIM MIN
MAX
10.00 BSC
5.00 BSC
A
A1
B
B1
C
C1
C2
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
S
0.05 (0.002)
10.00 BSC
5.00 BSC
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –L–, –M– AND –N– TO BE DETERMINED
AT DATUM PLANE –H–.
W
–––
0.05
1.30
0.20
0.45
0.22
1.70
––– 0.067
2 X R R1
0.20 0.002 0.008
1.50 0.051 0.059
0.40 0.008 0.016
0.75 0.018 0.030
0.35 0.009 0.014
θ1
E
F
0.25 (0.010)
C2
θ
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –T–.
G
0.65 BSC
0.026 BSC
GAGE PLANE
J
K
R1
S
S1
U
0.07
0.08
12.00 BSC
6.00 BSC
0.09
12.00 BSC
6.00 BSC
0.20 REF
1.00 REF
0.20 0.003 0.008
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.25 (0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE -H-.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE LEAD WIDTH TO EXCEED 0.46
(0.018). MINIMUM SPACE BETWEEN
0.50 REF
0.020 REF
0.20 0.003 0.008
K
E
0.472 BSC
0.236 BSC
0.16 0.004 0.006
C1
V
0.472 BSC
0.236 BSC
0.008 REF
0.039 REF
Z
V1
W
Z
VIEW AA
PROTRUSION AND ADJACENT LEAD OR
PROTRUSION 0.07 (0.003).
θ
0
0
12
5
7
0
7
–––
–––
θ1
θ2
θ3
0
12
5
REF
13
REF
13
13–21
MOTOROLA ANALOG IC DEVICE DATA
B SUFFIX
CASE 858–01
Plastic Package
ISSUE O
42
1
NOTES:
–A–
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH. MAXIMUM MOLD FLASH 0.25 (0.010).
42
1
22
21
–B–
INCHES
DIM MIN MAX
MILLIMETERS
MIN MAX
L
A
B
C
D
F
G
H
J
1.435 1.465 36.45 37.21
0.540 0.560 13.72 14.22
0.155 0.200
0.014 0.022
0.032 0.046
0.070 BSC
3.94
0.36
0.81
1.778 BSC
7.62 BSC
5.08
0.56
1.17
H
C
K
0.300 BSC
0.008 0.015
0.20
2.92
0.38
3.43
–T–
K
L
0.115
0.135
SEATING
PLANE
0.600 BSC
15.24 BSC
N
G
M
N
0
15
0
0.51
15
1.02
M
F
0.020 0.040
J 42 PL
D 42 PL
M
S
0.25 (0.010)
T B
M
S
0.25 (0.010)
T A
B SUFFIX
CASE 859–01
Plastic Package
(SDIP)
ISSUE O
56
1
–A–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
56
29
28
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH. MAXIMUM MOLD FLASH 0.25 (0.010)
–B–
INCHES
DIM MIN MAX
MILLIMETERS
1
MIN
MAX
52.45
14.22
5.08
A
B
C
D
E
2.035
0.540
0.155
0.014
2.065 51.69
0.560 13.72
0.200
0.022
L
3.94
0.36
0.56
H
C
0.035 BSC
0.89 BSC
F
0.032
0.046
0.81
1.17
G
H
J
K
L
0.070 BSC
0.300 BSC
1.778 BSC
7.62 BSC
–T–
K
0.008
0.115
0.015
0.135
0.20
2.92
0.38
3.43
SEATING
PLANE
0.600 BSC
15.24 BSC
N
G
M
F
M
N
0
15
0
0.51
15
1.02
0.020
0.040
E
J 56 PL
D 56 PL
M
S
0.25 (0.010)
T A
M
S
0.25 (0.010)
T B
13–22
MOTOROLA ANALOG IC DEVICE DATA
FB, FTB SUFFIX
CASE 873-01
Plastic Package
(TQFP–32)
1
ISSUE A
L
17
24
25
16
B
B
P
–B–
–A–
L
V
B
–A–, –B–, –D–
DETAIL A
DETAIL A
32
9
1
8
F
BASE
METAL
–D–
A
M
S
S
0.20 (0.008)
C
A–B
D
0.05 (0.002) A–B
N
J
S
M
S
S
0.20 (0.008)
H A–B
D
D
M
S
S
0.20 (0.008)
C
A–B
D
DETAIL C
M
SECTION B–B
VIEW ROTATED 90 CLOCKWISE
E
C
DATUM
PLANE
–H–
–C–
SEATING
PLANE
0.01 (0.004)
M
H
G
U
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
A
B
C
D
E
F
G
H
J
K
L
M
N
P
Q
R
S
6.95
6.95
1.40
7.10 0.274 0.280
7.10 0.274 0.280
1.60 0.055 0.063
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS –A–, –B– AND –D– TO BE DETERMINED AT
DATUM PLANE –H–.
T
0.273 0.373 0.010 0.015
1.30
0.273
0.80 BSC
–––
0.119
0.33
5.6 REF
6
0.119
0.40 BSC
5
0.15
8.85
0.15
5
8.85
1.00 REF
1.50 0.051 0.059
R
––– 0.010
–––
–H–
0.031 BSC
DATUM
PLANE
0.20
––– 0.008
0.197 0.005 0.008
0.57 0.013 0.022
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –C–.
0.220 REF
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE DETERMINED
AT DATUM PLANE –H–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT.
K
8
6
8
Q
0.135 0.005 0.005
0.016 BSC
10
X
10
5
DETAIL C
0.25 0.006 0.010
9.15 0.348 0.360
0.25 0.006 0.010
T
U
V
X
11
9.15 0.348 0.360
0.039 REF
5
11
13–23
MOTOROLA ANALOG IC DEVICE DATA
T SUFFIX
CASE 894-03
Plastic Package
(23-Pin SZIP)
ISSUE B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
1
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION R DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
5. MOLD FLASH OR PROTRUSIONS SHALL NOT
EXCEED 0.010 (0.250).
23
6. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.003 (0.076) TOTAL IN EXCESS OF
THE D DIMENSION AT MAXIMUM MATERIAL
CONDITION.
C
E
INCHES
DIM MIN MAX
MILLIMETERS
MIN MAX
B
L
K
Y
A
B
C
D
E
0.684
1.183
0.175
0.026
0.058
0.165
0.694 17.374 17.627
1.193 30.048 30.302
0.179
0.031
0.062
0.175
V
–N–
4.445
0.660
1.473
4.191
4.547
0.787
1.574
4.445
M
A
U
F
P
S
F
G
H
J
K
L
M
N
P
0.050 BSC
0.169 BSC
1.270 BSC
4.293 BSC
0.356 0.508
0.014
0.625
0.770
0.148
0.148
0.020
H
0.639 15.875 16.231
0.790 19.558 20.066
0.152
0.152
R
W
3.760
3.760
3.861
3.861
–T–
SEATING
PLANE
0.390 BSC
9.906 BSC
23X J
R
S
U
V
W
Y
0.416
0.157
0.105
0.868 REF
0.200 BSC
0.700
0.424 10.566 10.770
0.167
0.115
3.988
2.667
4.242
2.921
PIN 1
M
0.024 (0.610)
T
PIN 23
22.047 REF
5.080 BSC
G
0.710 17.780 18.034
23X D
M
S
S
0.010 (0.254)
T Q
N
13–24
MOTOROLA ANALOG IC DEVICE DATA
FTA SUFFIX
CASE 932–02
Plastic Package
(TQFP–48)
ISSUE D
1
48
P
4X
0.200 (0.008) AB T–U
Z
DETAIL Y
9
A
A1
48
37
AE
AE
1
36
–T–
–U–
V1
B
V
B1
–T–, –U–, –Z–
12
25
DETAIL Y
13
24
–Z–
S1
M
TOP & BOTTOM
S
R
4X
GAUGE PLANE
0.200 (0.008) AC T–U
Z
0.250 (0.010)
E
C
H
0.080 (0.003) AC
G
–AB–
–AC–
W
Q
K
AD
DETAIL AD
X
BASE METAL
MILLIMETERS
DIM MIN MAX
7.000 BSC
INCHES
MIN
MAX
NOTES:
A
A1
B
0.276 BSC
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
3.500 BSC
7.000 BSC
3.500 BSC
1.400 1.600 0.055 0.063
0.170 0.270 0.007 0.011
0.138 BSC
0.276 BSC
0.138 BSC
N
J
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
AT DATUM PLANE –AB–.
B1
C
D
E
1.350 1.450 0.053 0.057
0.170 0.230 0.007 0.009
F
D
F
G
H
J
K
M
N
P
0.500 BASIC
0.020 BASIC
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –AC–.
0.050 0.150 0.002 0.006
0.090 0.200 0.004 0.008
0.500 0.700 0.020 0.028
12 REF
0.090 0.160 0.004 0.006
0.250 BASIC 0.010 BASIC
M
S
S
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350 (0.014).
0.080 (0.003)
AC T–U
Z
12 REF
SECTION AE–AE
Q
R
1
5
1
5
0.150 0.250 0.006 0.010
S
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
0.354 BSC
0.177 BSC
0.354 BSC
0.177 BSC
0.008 REF
0.039 REF
S1
V
V1
W
X
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
13–25
MOTOROLA ANALOG IC DEVICE DATA
D2T SUFFIX
CASE 936–03
Plastic Package
ISSUE B
1
2
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
3
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS
A AND K.
TERMINAL 4
4. DIMENSIONS U AND V ESTABLISH A MINIMUM
MOUNTING SURFACE FOR TERMINAL 4.
5. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH OR GATE PROTRUSIONS. MOLD FLASH
AND GATE PROTRUSIONS NOT TO EXCEED
0.025 (0.635) MAXIMUM.
K
U
A
S
V
B
H
F
1
2
3
INCHES
DIM MIN MAX
0.403 9.804 10.236
MILLIMETERS
MIN MAX
A
B
C
D
E
F
0.386
0.356
0.170
0.026
0.045
J
D
0.368 9.042
0.180 4.318
0.036 0.660
0.055 1.143
9.347
4.572
0.914
1.397
G
M
0.010 (0.254)
T
0.051 REF
0.100 BSC
0.539 0.579 13.691 14.707
0.125 MAX
0.050 REF
1.295 REF
2.540 BSC
–T–
E
G
H
J
K
L
M
N
P
R
S
U
V
OPTIONAL
CHAMFER
3.175 MAX
1.270 REF
0.000
0.088
0.018
0.058
5
0.010 0.000
0.254
2.591
0.660
1.981
0.102 2.235
0.026 0.457
0.078 1.473
REF
5 REF
C
0.116 REF
0.200 MIN
0.250 MIN
2.946 REF
5.080 MIN
6.350 MIN
M
L
P
N
R
D2T SUFFIX
CASE 936A–02
Plastic Package
(D PAK)
1
NOTES:
2
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS
A AND K.
5
ISSUE A
TERMINAL 6
4. DIMENSIONS U AND V ESTABLISH A MINIMUM
MOUNTING SURFACE FOR TERMINAL 6.
5. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH OR GATE PROTRUSIONS. MOLD FLASH
AND GATE PROTRUSIONS NOT TO EXCEED
0.025 (0.635) MAXIMUM.
U
A
V
S
K
B
H
1
2
3
4
5
INCHES
DIM MIN MAX
0.403 9.804 10.236
MILLIMETERS
MIN MAX
A
B
C
D
E
G
H
K
L
M
N
P
R
S
0.386
0.356
0.170
0.026
0.045
0.067 BSC
0.539
0.050 REF
0.000
0.088
0.018
0.058
5
0.116 REF
0.200 MIN
0.250 MIN
0.368 9.042
0.180 4.318
0.036 0.660
0.055 1.143
1.702 BSC
0.579 13.691 14.707
1.270 REF
9.347
4.572
0.914
1.397
D
M
0.010 (0.254)
T
G
–T–
E
OPTIONAL
CHAMFER
0.010 0.000
0.254
2.591
0.660
1.981
0.102 2.235
0.026 0.457
0.078 1.473
REF
5 REF
2.946 REF
5.080 MIN
6.350 MIN
U
V
C
M
L
P
N
R
13–26
MOTOROLA ANALOG IC DEVICE DATA
20
DT, DTB SUFFIX
CASE 948E–02
Plastic Package
(TSSOP–20)
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
1
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
20X K REF
K
M
S
S
0.10 (0.004)
T U
V
S
K1
0.15 (0.006) T U
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
J J1
20
11
2X L/2
B
SECTION N–N
L
–U–
PIN 1
IDENT
0.25 (0.010)
N
10
1
MILLIMETERS
DIM MIN MAX
INCHES
MIN
MAX
0.260
0.177
0.047
0.006
0.030
M
A
B
C
6.40
4.30
–––
6.60 0.252
4.50 0.169
1.20
S
0.15 (0.006) T U
–––
A
D
F
0.05
0.50
0.15 0.002
0.75 0.020
N
–V–
G
H
J
J1
K
K1
L
0.65 BSC
0.026 BSC
F
0.27
0.09
0.09
0.19
0.19
0.37
0.011
0.015
0.008
0.006
0.012
0.010
0.20 0.004
0.16 0.004
0.30 0.007
0.25 0.007
DETAIL E
C
6.40 BSC
0.252 BSC
M
0
8
0
8
–W–
G
D
H
0.100 (0.004)
–T– SEATING
DETAIL E
PLANE
DTB SUFFIX
CASE 948F–01
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
Plastic Package
1
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
(TSSOP–16, TSSOP–16L)
ISSUE O
16X KREF
M
S
S
0.10 (0.004)
T U
V
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
S
0.15 (0.006) T U
K
K1
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
16
9
2X L/2
J1
SECTION N–N
B
–U–
L
J
PIN 1
IDENT.
8
1
N
MILLIMETERS
DIM MIN MAX
INCHES
0.25 (0.010)
MIN
MAX
0.200
0.177
0.047
0.006
0.030
A
B
C
4.90
4.30
–––
5.10 0.193
4.50 0.169
1.20
S
M
0.15 (0.006) T U
A
–––
D
F
0.05
0.50
0.15 0.002
0.75 0.020
–V–
N
G
H
J
J1
K
K1
L
0.65 BSC
0.026 BSC
0.18
0.09
0.09
0.19
0.19
0.28 0.007
0.20 0.004
0.16 0.004
0.30 0.007
0.25 0.007
0.011
0.008
0.006
0.012
0.010
F
DETAIL E
DETAIL E
6.40 BSC
0.252 BSC
0
C
M
0
8
8
0.10 (0.004)
–W–
H
SEATING
PLANE
–T–
D
G
13–27
MOTOROLA ANALOG IC DEVICE DATA
DTB SUFFIX
CASE 948G–01
Plastic Package
(TSSOP–14)
ISSUE O
14
1
NOTES:
14X K REF
1
DIMENSIONING AND TOLERANCING PER ANSI
M
S
S
Y14.5M, 1982.
0.10 (0.004)
T U
V
2
3
CONTROLLING DIMENSION: MILLIMETER.
DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
S
0.15 (0.006) T U
N
0.25 (0.010)
14
4
5
8
2X L/2
M
B
L
N
–U–
PIN 1
IDENT.
F
7
1
6
7
TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
DETAIL E
S
K
0.15 (0.006) T U
A
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
K1
–V–
A
B
C
4.90
4.30
–––
5.10 0.193 0.200
4.50 0.169 0.177
1.20
J J1
––– 0.047
D
F
0.05
0.50
0.15 0.002 0.006
0.75 0.020 0.030
SECTION N–N
G
H
J
J1
K
K1
L
0.65 BSC
0.026 BSC
0.60 0.020 0.024
0.20 0.004 0.008
0.16 0.004 0.006
0.30 0.007 0.012
0.25 0.007 0.010
0.50
0.09
0.09
0.19
0.19
–W–
C
6.40 BSC
0.252 BSC
0.10 (0.004)
M
0
8
0
8
SEATING
PLANE
–T–
H
G
DETAIL E
D
13–28
MOTOROLA ANALOG IC DEVICE DATA
DTB SUFFIX
CASE 948H–01
Plastic Package
ISSUE O
24
1
24X KREF
M
S
S
0.10 (0.004)
T U
V
S
0.15 (0.006) T U
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
24
13
2X L/2
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
B
–U–
L
PIN 1
IDENT.
12
1
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
S
0.15 (0.006) T U
A
–V–
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
MILLIMETERS
DIM MIN MAX
7.90 0.303
INCHES
MIN
MAX
C
A
B
7.70
4.30
–––
0.311
4.50 0.169 0.177
1.20 ––– 0.047
C
0.10 (0.004)
D
F
G
H
J
J1
K
K1
L
0.05
0.50
0.65 BSC
0.27
0.09
0.09
0.19
0.19
0.15 0.002 0.006
0.75 0.020 0.030
SEATING
PLANE
–T–
G
H
D
0.026 BSC
0.011 0.015
0.37
0.20 0.004 0.008
0.16 0.004 0.006
0.30 0.007 0.012
0.25 0.007 0.010
6.40 BSC
0.252 BSC
M
0
8
0
8
–W–
DETAIL E
N
0.25 (0.010)
K
M
K1
N
J1
F
DETAIL E
SECTION N–N
J
13–29
MOTOROLA ANALOG IC DEVICE DATA
DTB SUFFIX
CASE 948J–01
Plastic Package
(TSSOP–8)
8
1
ISSUE O
NOTES:
8x KREF
1
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
M
S
S
0.10 (0.004)
T U
V
2
3
CONTROLLING DIMENSION: MILLIMETER.
DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
S
0.15 (0.006) T U
K
K1
8
5
2X L/2
4
5
DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
J J1
B
–U–
L
PIN 1
IDENT.
SECTION N–N
4
1
N
6
7
0.25 (0.010)
S
0.15 (0.006) T U
A
M
–V–
MILLIMETERS
INCHES
DIM MIN
MAX
3.10
4.50 0.169
1.20 –––
0.15 0.002
0.75 0.020
MIN
0.114
MAX
0.122
0.177
0.047
0.006
0.030
N
A
B
C
2.90
4.30
–––
F
D
F
0.05
0.50
DETAIL E
G
H
J
J1
K
K1
L
0.65 BSC
0.026 BSC
0.50
0.09
0.09
0.19
0.19
0.60 0.020
0.20 0.004
0.16 0.004
0.30 0.007
0.25 0.007
0.024
0.008
0.006
0.012
0.010
–W–
C
0.10 (0.004)
G
SEE DETAIL E
SEATING
PLANE
–T–
D
6.40 BSC
0.252 BSC
M
0
8
0
8
H
M SUFFIX
CASE 967–01
Plastic Package
(EIAJ–20)
20
1
ISSUE O
NOTES:
1
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2
3
CONTROLLING DIMENSION: MILLIMETER.
DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
L
E
20
11
Q
1
4
5
TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
H
E
E
M
THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
L
1
10
DETAIL P
Z
D
VIEW P
MILLIMETERS
INCHES
MIN MAX
––– 0.081
e
A
DIM MIN
MAX
c
A
A
–––
0.05
0.35
0.18
2.05
0.20 0.002 0.008
0.50 0.014 0.020
0.27 0.007
1
b
c
0.011
D
E
e
12.35 12.80 0.486 0.504
A
b
1
5.10
5.45 0.201 0.215
1.27 BSC
0.050 BSC
8.20 0.291 0.323
0.85 0.020 0.033
1.50 0.043 0.059
M
0.10 (0.004)
0.13 (0.005)
H
7.40
0.50
1.10
0
0.70
–––
E
L
L
E
M
Q
10
0.90 0.028 0.035
0.81 ––– 0.032
10
0
1
Z
13–30
MOTOROLA ANALOG IC DEVICE DATA
FTB SUFFIX
CASE 976–01
Plastic Package
(TQFP–20)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
AT DATUM PLANE –AB–.
20
1
ISSUE O
4X
9
0.200 (0.008) AB T–U Z
5. DIMENSIONS S AND V TO BE DETERMINED AT
DATUM PLANE –AC–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350 (0.014).
A
A1
DETAIL Y
20
16
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
15
1
–T–
–U–
MILLIMETERS
DIM MIN MAX
4.000 BSC
INCHES
MIN MAX
0.157 BSC
0.079 BSC
0.157 BSC
0.079 BSC
V
B
A
A1
B
2.000 BSC
4.000 BSC
2.000 BSC
1.400 1.600 0.055 0.063
0.170 0.270 0.007 0.011
B1
B1
C
D
E
11
5
V1
1.350 1.450 0.053 0.057
0.170 0.230 0.007 0.009
F
G
H
J
K
M
N
P
0.650 BSC
0.026 BSC
0.050 0.150 0.002 0.006
0.090 0.200 0.004 0.008
0.500 0.700 0.020 0.028
12 REF
0.090 0.160 0.004 0.006
0.250 BSC 0.010 BSC
6
10
12 REF
–Z–
S1
Q
R
S
S1
V
V1
W
X
1
5
1
5
S
0.150 0.250 0.006 0.010
6.000 BSC
3.000 BSC
6.000 BSC
3.000 BSC
0.200 REF
1.000 REF
0.236 BSC
0.118 BSC
0.236 BSC
0.118 BSC
0.008 REF
0.039 REF
4X
0.200 (0.008) AB T–U Z
DETAIL AD
J
N
–AB–
–AC–
F
D
0.080 (0.003) AC
S
S
S
0.080 (0.003)
AC T–U
Z
M
SECTION AE–AE
TOP & BOTTOM
R
–T–, –U–, –Z–
C
H
E
AE
G
AE
W
K
X
GAUGE
PLANE
Q
0.250 (0.010)
DETAIL AD
DETAIL Y
13–31
MOTOROLA ANALOG IC DEVICE DATA
FTA SUFFIX
CASE 977–01
Plastic Package
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
24
1
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
AT DATUM PLANE –AB–.
4X
5. DIMENSIONS S AND V TO BE DETERMINED AT
DATUM PLANE –AC–.
9
0.200 (0.008) AB T–U Z
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350 (0.014).
A
A1
24
DETAIL Y
19
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
1
18
–T–
–U–
MILLIMETERS
DIM MIN MAX
4.000 BSC
INCHES
MIN MAX
0.157 BSC
0.079 BSC
0.157 BSC
0.079 BSC
A
A1
B
2.000 BSC
4.000 BSC
2.000 BSC
1.400 1.600 0.055 0.063
0.170 0.270 0.007 0.011
V
B
B1
C
D
E
B1
13
6
1.350 1.450 0.053 0.057
0.170 0.230 0.007 0.009
V1
F
G
H
J
K
M
N
P
0.500 BSC
0.020 BSC
0.050 0.150 0.002 0.006
0.090 0.200 0.004 0.008
0.500 0.700 0.020 0.028
12 REF
0.090 0.160 0.004 0.006
0.250 BSC 0.010 BSC
12 REF
7
12
Q
R
S
S1
V
V1
W
X
1
5
1
5
–Z–
S1
0.150 0.250 0.006 0.010
6.000 BSC
3.000 BSC
6.000 BSC
3.000 BSC
0.200 REF
1.000 REF
0.236 BSC
0.118 BSC
0.236 BSC
0.118 BSC
0.008 REF
0.039 REF
S
4X
0.200 (0.008) AB T–U Z
DETAIL AD
–T–, –U–, –Z–
–AB–
–AC–
AE
AE
0.080 (0.003) AC
M
TOP & BOTTOM
P
R
G
DETAIL Y
C
E
J
N
F
W
GAUGE
Q
D
PLANE
H
K
0.250 (0.010)
X
S
S
S
0.080 (0.003)
AC T–U
Z
DETAIL AD
SECTION AE–AE
13–32
MOTOROLA ANALOG IC DEVICE DATA
N SUFFIX
CASE 1212–01
Plastic Package
(SOT–23)
1
ISSUE O
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
A2
B
A
E
D
S
0.05
3. DATUM C IS A SEATING PLANE.
A1
MILLIMETERS
5
1
4
3
DIM MIN
MAX
0.10
1.30
0.50
0.25
3.00
3.10
1.80
L
A1
A2
B
C
D
E
E1
e
e1
L
0.00
1.00
0.30
0.10
2.80
2.50
1.50
0.95 BSC
1.90 BSC
0.20
0.45
2
E1
C
L1
B
5X
C
M
S
S
0.10
C B
A
e
e1
–––
0.75
L1
H SUFFIX
1
CASE 1213–01
Plastic Package
(SOT–89)
ISSUE O
NOTES:
A
D
A2
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCING
PER ASME Y14.5M, 1994.
C
B
D1
3. DATUM C IS A SEATING PLANE.
MILLIMETERS
DIM MIN
MAX
1.60
0.57
0.52
0.50
4.60
1.70
4.25
2.60
E1
E
A2
B
B1
C
D
D1
E
1.40
0.37
0.32
0.30
4.40
1.50
–––
L1
B
C
M
S
S
0.10
C B
A
E1
e
e1
L1
2.40
1.50 BSC
3.00 BSC
0.80 –––
B1 2X
e
M
S
S
0.10
C B
A
e1
13–33
MOTOROLA ANALOG IC DEVICE DATA
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