MCH5839 [ONSEMI]

Single P-Channel Power MOSFET;
MCH5839
型号: MCH5839
厂家: ONSEMI    ONSEMI
描述:

Single P-Channel Power MOSFET

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中文:  中文翻译
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MCH5839  
Power MOSFET  
–20V, 266m, –1.5A, Single P-Channel  
with Schottky Diode  
MCH5839 is a P-Channel Power MOSFET, with Schottky Diode for  
general-purpose switching device applications.  
www.onsemi.com  
Features  
Composite type with a P-Channel silicon MOSFET and a schottky  
barrier diode contained in one package facilitating high-density  
mounting  
MOSFET  
V
R
DS  
(on) Max  
I
Max  
D
DSS  
Pb-Free, Halogen Free and RoHS compliance  
266m@ 4.5V  
413m@ 2.5V  
645m@ 1.8V  
[MOSFET]  
Low On-resistance  
20V  
1.5A  
ESD Diode-Protected Gate  
1.8V drive  
[SBD]  
Short reverse recovery time  
Low forward voltage  
SCHOTTKY DIODE  
V
V
Max  
I
RRM  
F
FSM  
3A  
0.46V  
15V  
Typical Applications  
DC/DC Converter  
ELECTRICAL CONNECTION  
P-Channel  
SPECIFICATIONS  
ABSOLUTE MAXIMUM RATING at Ta = 25C (Note 1)  
5
4
Parameter  
Symbol  
Value  
Unit  
1:Gate  
[MOSFET]  
2 :Source  
3:Anode  
4:Cathode  
5:Drain  
Drain to Source Voltage  
Gate to Source Voltage  
Drain Current (DC)  
V
V
20  
10  
V
V
A
DSS  
GSS  
I
1.5  
D
1
2
3
Drain Current (Pulse)  
I
6  
A
DP  
PW 10s, duty cycle 1%  
Power Dissipation  
PACKING TYPE : TL  
MARKING  
When mounted on ceramic substrate  
(1000mm2 0.8mm) 1unit  
P
0.8  
W
D
YD  
Junction Temperature  
Storage Temperature  
Tj  
150  
C  
C  
Tstg  
55 to +125  
TL  
[SBD]  
Repetitive Peak Reverse Voltage  
Nonrepetitive Peak Reverse Surge Voltage  
Average Output Current  
V
V
15  
15  
1
V
V
A
RRM  
RSM  
ORDERING INFORMATION  
See detailed ordering and shipping  
information on page 6 of this data sheet.  
I
O
Surge Forward Current  
50Hz sine wave, 1cycle  
A
I
3
FSM  
Junction Temperature  
Storage Temperature  
Tj  
55 to +125  
55 to +125  
C  
C  
Tstg  
Note 1 : Stresses exceeding those listed in the Maximum Ratings table may damage  
the device. If any of these limits are exceeded, device functionality should not  
be assumed, damage may occur and reliability may be affected.  
THERMAL RESISTANCE RATINGS  
Parameter  
Junction to Ambient  
Symbol  
Value  
Unit  
R
JA  
156.2  
C/W  
When mounted on ceramic substrate  
(1000mm2 0.8mm) 1unit  
© Semiconductor Components Industries, LLC, 2015  
August 2015 - Rev. 1  
1
Publication Order Number :  
MCH5839/D  
MCH5839  
ELECTRICAL CHARACTERISTICS at Ta 25C (Note 2)  
Parameter Symbol  
Value  
typ  
Conditions  
Unit  
min  
max  
[MOSFET]  
Drain to Source Breakdown Voltage  
Zero-Gate Voltage Drain Current  
Gate to Source Leakage Current  
Gate Threshold Voltage  
V(  
)
I =1mA, V =0V  
GS  
20  
V
A  
A  
V
BR DSS  
D
I
I
V
=20V, V =0V  
GS  
1  
DSS  
GSS  
DS  
GS  
DS  
DS  
V
V
V
=8V, V =0V  
DS  
10  
V
(th)  
=10V, I =1mA  
0.4  
1.4  
GS  
D
Forward Transconductance  
g
=10V, I =750mA  
1.9  
205  
295  
430  
120  
26  
S
FS  
D
R
DS  
R
DS  
R
DS  
(on)1  
(on)2  
(on)3  
I =750mA, V =4.5V  
D GS  
266  
413  
645  
m  
m  
m  
pF  
pF  
pF  
ns  
ns  
ns  
ns  
nC  
nC  
nC  
V
Static Drain to Source On-State  
Resistance  
I =300mA, V =2.5V  
D GS  
I =100mA, V =1.8V  
D
GS  
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
Turn-ON Delay Time  
Rise Time  
Ciss  
Coss  
Crss  
V
=10V, f=1MHz  
DS  
20  
t (on)  
d
5.3  
t
9.7  
r
See specified Test Circuit  
Turn-OFF Delay Time  
Fall Time  
t (off)  
d
16  
t
14  
f
Total Gate Charge  
Gate to Source Charge  
Gate to Drain “Miller” Charge  
Forward Diode Voltage  
[SBD]  
Qg  
1.7  
Qgs  
Qgd  
V
=10V, V =4.5V, I =1.5A  
GS  
0.28  
0.47  
0.89  
DS  
D
V
I =1.5A, V =0V  
S GS  
1.2  
SD  
Reverse Voltage  
V
V
I =0.5mA  
15  
V
V
R
F
R
Forward Voltage  
I =0.5A  
F
0.4  
13  
0.46  
90  
Reverse Current  
I
V =6V  
R
A  
pF  
ns  
R
Interterminal Capacitance  
Reverse Recovery Time  
C
V =10V, f=1MHz  
R
t
rr  
I =I =100mA, See specified Test Circuit  
F R  
10  
Note 2 : Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted.  
Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
Switching Time Test Circuit  
t Test Circuit  
rr  
(MOSFET)  
(SBD)  
Duty10%  
V = --10V  
DD  
V
IN  
0V  
--4.5V  
I = --750mA  
D
V
IN  
50  
100  
10  
R =13.3  
L
D
V
OUT  
10s  
PW=10s  
D.C.1%  
--5V  
G
t
rr  
MCH5839  
P.G  
50  
S
www.onsemi.com  
2
MCH5839  
www.onsemi.com  
3
MCH5839  
www.onsemi.com  
4
MCH5839  
www.onsemi.com  
5
MCH5839  
PACKAGE DIMENSIONS  
unit : mm  
SC-88AFL / MCPH5  
CASE 419AP  
ISSUE O  
1 : Gate  
2 : Source  
3 : Anode  
4 : Cathode  
5 : Drain  
Recommended  
Soldering Footprint  
0.4  
0.65 0.65  
ORDERING INFORMATION  
Device  
Marking  
YD  
Package  
Shipping (Qty / Packing)  
3,000 / Tape & Reel  
MCH5839-TL-H  
MCH5839-TL-W  
SC-88AFL / MCPH5  
(Pb-Free / Halogen Free)  
† For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D. http://www.onsemi.com/pub_link/Collateral/BRD8011-D.PDF  
Note on usage : Since the MCH5839 is a MOSFET product, please avoid using this device in the vicinity  
of highly charged objects.  
ON Semiconductor and the ON logo are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiariesin the United States  
and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of  
SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. SCILLC reserves the right to make changes without  
further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitabilityof its products for any particular purpose,  
nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including  
without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can  
and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each  
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are  
not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applicationsintended to support or  
sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers,  
employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of,  
directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was  
negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all  
applicable copyright laws and is not for resale in any manner.  
www.onsemi.com  
6

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