MGB15N43CLT4 [ONSEMI]

15A, 460V, N-CHANNEL IGBT, D2PAK-3;
MGB15N43CLT4
型号: MGB15N43CLT4
厂家: ONSEMI    ONSEMI
描述:

15A, 460V, N-CHANNEL IGBT, D2PAK-3

汽车点火 双极性晶体管
文件: 总8页 (文件大小:94K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
MGP15N43CL,  
MGB15N43CL  
Preferred Device  
Ignition IGBT  
15 Amps, 430 Volts  
N–Channel TO–220 and D2PAK  
http://onsemi.com  
This Logic Level Insulated Gate Bipolar Transistor (IGBT) features  
monolithic circuitry integrating ESD and Over–Voltage clamped  
protection for use in inductive coil drivers applications. Primary uses  
include Ignition, Direct Fuel Injection, or wherever high voltage and  
high current switching is required.  
15 AMPERES  
430 VOLTS (Clamped)  
VCE(on) = 1.8 m  
Gate–Emitter ESD Protection  
N–Channel  
Temperature Compensated Gate–Collector Voltage Clamp Limits  
Stress Applied to Load  
C
Integrated ESD Diode Protection  
Low Threshold Voltage to Interface Power Loads to Logic or  
Microprocessor Devices  
G
Low Saturation Voltage  
High Pulsed Current Capability  
4
E
4
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Rating  
Collector–Emitter Voltage  
Collector–Gate Voltage  
Gate–Emitter Voltage  
Symbol  
Value  
460  
460  
22  
Unit  
1
2
3
V
CES  
V
CER  
V
DC  
V
DC  
V
DC  
A
DC  
2
D PAK  
TO–220AB  
CASE 221A  
STYLE 9  
CASE 418B  
STYLE 3  
V
GE  
1
2
Collector Current–Continuous  
I
C
15  
3
MARKING DIAGRAMS  
& PIN ASSIGNMENTS  
@ T = 25°C  
C
Total Power Dissipation @ T = 25°C  
Derate above 25°C  
P
D
136  
1.0  
Watts  
W/°C  
C
4
4
Cathode  
Collector  
Operating and Storage Temperature  
Range  
T , T  
–55 to  
175  
°C  
J
stg  
G15N43CL  
YWW  
UNCLAMPED DRAIN–TO–SOURCE AVALANCHE  
CHARACTERISTICS (TJ t150°C)  
G15N43CL  
YWW  
Characteristic  
Symbol  
Value  
Unit  
1
3
Single Pulse Collector–to–Emitter  
Avalanche Energy  
E
AS  
mJ  
Anode  
Anode  
2
1
Gate  
3
Cathode  
Emitter  
V
CC  
= 50 V, V = 5 V, Pk I =  
300  
150  
GE  
L
14.2 A, L = 3 mH, Starting T = 25°C  
J
2
G15N43CL = Device Code  
V
CC  
= 50 V, V = 5 V, Pk I =  
GE L  
Collector  
Y
WW  
= Year  
10 A, L = 3 mH, Starting T = 150°C  
J
= Work Week  
ORDERING INFORMATION  
Device  
Package  
TO–220  
D2PAK  
Shipping  
MGP15N43CL  
50 Units/Rail  
MGB15N43CLT4  
800 Tape & Reel  
Preferred devices are recommended choices for future use  
and best overall value.  
Semiconductor Components Industries, LLC, 2001  
1
Publication Order Number:  
November, 2001– Rev. 4  
MGP15N43CL/D  
MGP15N43CL, MGB15N43CL  
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Value  
1.0  
Unit  
Thermal Resistance, Junction to Case  
Thermal Resistance, Junction to Ambient  
R
°C/W  
θ
JC  
JA  
JA  
L
TO–220  
R
R
62.5  
50  
θ
θ
2
D PAK  
Maximum Lead Temperature for Soldering Purposes, 1/8from case for 5 seconds  
T
275  
°C  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
C
Characteristic  
OFF CHARACTERISTICS  
Collector–Emitter Clamp Voltage  
Symbol  
Test Conditions  
Min  
Typ  
Max  
Unit  
BV  
I
I
C
= 2 mA  
400  
430  
460  
40  
V
DC  
CES  
T = –40°C to 175°C  
J
V
CE  
= 300 V,  
Zero Gate Voltage Collector Current  
µA  
DC  
CES  
V
GE  
= 0, T = 25°C  
J
V
CE  
= 300 V,  
200  
V
GE  
= 0, T = 150°C  
J
Reverse Collector–Emitter Leakage Current  
Gate–Emitter Clamp Voltage  
I
V
= –24 V  
= 5 mA  
17  
1.0  
22  
mA  
ECS  
CE  
BV  
I
V
DC  
GES  
G
Gate–Emitter Leakage Current  
ON CHARACTERISTICS (Note 1.)  
Gate Threshold Voltage  
I
V
= 10 V  
2.0  
µA  
DC  
GES  
GE  
V
GE(th)  
I
= 1 mA  
1.2  
1.5  
2.1  
V
DC  
C
V
GE  
= V  
CE  
Threshold Temperature Coefficient (Negative)  
Collector–to–Emitter On–Voltage  
4.4  
mV/°C  
V
V
I
C
= 6 A, V = 4 V  
1.8  
1.8  
V
DC  
V
DC  
CE(on)  
CE(on)  
GE  
Collector–to–Emitter On–Voltage  
I
C
= 10 A,  
V
GE  
= 4.5 V,  
T = 150°C  
J
Forward Transconductance  
DYNAMIC CHARACTERISTICS  
Input Capacitance  
gfs  
V
CE  
= 5 V, I = 6 A  
8.0  
15  
Mhos  
pF  
C
C
V
= 15 V  
= 0 V  
950  
100  
8.0  
ISS  
CC  
Output Capacitance  
C
OSS  
C
RSS  
V
GE  
Transfer Capacitance  
f = 1 MHz  
SWITCHING CHARACTERISTICS (Note 1.)  
Turn–Off Delay Time  
t
V
= 300 V,  
= 10 A  
14  
7.0  
0.5  
4.5  
µSec  
µSec  
nC  
d(off)  
CC  
I
C
Fall Time  
t
f
R
= 1 k,  
G
L = 300 µH  
V = 10 V,  
CC  
Turn–On Delay Time  
Rise Time  
t
d(on)  
I
C
= 6.5 A  
t
r
R
= 1 k,  
G
R = 1 Ω  
L
Q
T
Q
1
Q
2
V
= 300 V  
TBD  
TBD  
TBD  
Gate Charge  
CC  
I
C
= 15 A  
V
= 5 V  
GE  
1. Pulse Test: Pulse Width v 300 µS, Duty Cycle v 2%.  
http://onsemi.com  
2
MGP15N43CL, MGB15N43CL  
45  
40  
35  
30  
25  
20  
15  
10  
5
45  
V
= 10.0 V  
V
= 10.0 V  
V
GE  
= 4.0 V  
GE  
GE  
40  
35  
30  
25  
20  
15  
10  
5
V
= 4.0 V  
GE  
V
= 5.0 V  
V
= 5.0 V  
GE  
GE  
V
GE  
= 3.0 V  
V
GE  
= 3.0 V  
T = 25°C  
j
T = 150°C  
j
0
0
0
1
2
3
4
5
6
7
8
0
1
2
3
4
5
6
7
8
V
CE,  
COLLECTOR TO EMITTER VOLTAGE (VOLTS)  
V
CE,  
COLLECTOR TO EMITTER VOLTAGE (VOLTS)  
Figure 1. Output Characteristics  
Figure 2. Output Characteristics  
30  
25  
20  
15  
10  
5
3.0  
2.8  
V
GE  
= 15 V  
V
= 10 V  
CE  
2.5  
2.3  
2.0  
1.8  
1.5  
1.3  
1.0  
0.8  
0.5  
0.3  
0.0  
I
C
= 15 A  
I
C
= 10 A  
I = 5 A  
C
T = 150°C  
j
T = 25°C  
j
T = –40°C  
j
0
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
–50 –25  
0
25  
50  
75  
100  
125 150  
V
GE,  
GATE TO EMITTER VOLTAGE (VOLTS)  
T , JUNCTION TEMPERATURE (°C)  
j
Figure 3. Transfer Characteristics  
Figure 4. Collector–to–Emitter Saturation Voltage  
versus Junction Temperature  
2.5  
10000  
1000  
2.0  
1.5  
1.0  
0.5  
0.0  
I
C
= 1 mA  
C
ISS  
Mean + 4 σ  
Mean – 4 σ  
Mean  
100  
10  
C
C
OSS  
RSS  
1
0
20 40 60 80 100 120 140 160 180 200  
–50  
–25  
0
25  
50  
75  
100  
125 150  
TEMPERATURE (°C)  
V
CE,  
COLLECTOR TO EMITTER VOLTAGE (VOLTS)  
Figure 5. Capacitance Variation  
Figure 6. Threshold Voltage versus Temperature  
http://onsemi.com  
3
MGP15N43CL, MGB15N43CL  
20  
18  
16  
14  
12  
10  
20  
18  
16  
14  
12  
10  
V
V
= 300 V  
= 5.0 V  
CC  
GE  
t
d(off)  
T = 25°C  
J
t
d(off)  
L = 300 mH  
t
f
t
f
8
6
4
2
0
8
6
4
2
0
V
CC  
V
GE  
= 300 V  
= 5.0 V  
T = 150°C  
J
I
C
= 10 A  
L = 300 µH  
250  
500  
750  
1000  
250  
500  
750  
1000  
R , GATE RESISTANCE (OHMS)  
G
R , GATE RESISTANCE (OHMS)  
G
Figure 7. Switching Speed versus Gate Resistance  
Figure 8. Switching Speed versus Gate Resistance  
25  
20  
15  
25  
20  
15  
V
V
R
= 300 V  
= 5.0 V  
= 1000 Ω  
CC  
GE  
t
d(off)  
G
I
C
= 10 A  
t
d(off)  
L = 300 µH  
t
f
10  
5
10  
5
t
f
V
V
R
300 V  
= 5.0 V  
= 1000 Ω  
CC =  
GE  
G
T = 150°C  
J
L = 300 mH  
0
0
–50  
–25  
0
25  
50  
75  
100  
125  
150  
0
2
4
6
8
10  
12  
14  
16  
T , CASE TEMPERATURE (°C)  
C
I , COLLECTOR CURRENT (AMPS)  
C
Figure 9. Switching Speed versus Case Temperature  
Figure 10. Total Switching Losses  
versus Collector Current  
20  
30  
18  
16  
14  
12  
10  
8
25  
V
V
R
= 50 V  
= 5.0 V  
= 1000 Ω  
CC  
GE  
25°C  
3.0 mH  
6.0 mH  
G
20  
15  
10  
5
150°C  
V
CC  
V
GE  
= 50 V  
= 5.0 V  
6
4
R
= 1000 Ω  
G
2
0
0
0
1
2
3
4
5
6
7
8
9
10  
0
25  
50  
75  
100  
125  
150  
175  
INDUCTOR (mH)  
TEMPERATURE (°C)  
Figure 11. Latch Current versus Inductor (Typical)  
Figure 12. Latch Current versus Temperature (Typical)  
http://onsemi.com  
4
MGP15N43CL, MGB15N43CL  
PACKAGE DIMENSIONS  
TO–220 THREE–LEAD  
TO–220AB  
CASE 221A–09  
ISSUE AA  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
SEATING  
PLANE  
–T–  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION Z DEFINES A ZONE WHERE ALL  
BODY AND LEAD IRREGULARITIES ARE  
ALLOWED.  
C
B
F
T
S
4
1
INCHES  
DIM MIN MAX  
MILLIMETERS  
MIN  
14.48  
9.66  
4.07  
0.64  
3.61  
2.42  
2.80  
0.46  
12.70  
1.15  
4.83  
2.54  
2.04  
1.15  
5.97  
0.00  
1.15  
---  
MAX  
15.75  
10.28  
4.82  
0.88  
3.73  
2.66  
3.93  
0.64  
14.27  
1.52  
5.33  
3.04  
2.79  
1.39  
6.47  
1.27  
---  
A
K
Q
Z
A
B
C
D
F
0.570  
0.380  
0.160  
0.025  
0.142  
0.095  
0.110  
0.018  
0.500  
0.045  
0.190  
0.100  
0.080  
0.045  
0.235  
0.000  
0.045  
---  
0.620  
0.405  
0.190  
0.035  
0.147  
0.105  
0.155  
0.025  
0.562  
0.060  
0.210  
0.120  
0.110  
0.055  
0.255  
0.050  
---  
2
3
U
H
G
H
J
K
L
L
R
N
Q
R
S
T
V
J
G
D
U
V
Z
N
0.080  
2.04  
STYLE 9:  
PIN 1. GATE  
2. COLLECTOR  
3. EMITTER  
4. COLLECTOR  
http://onsemi.com  
5
MGP15N43CL, MGB15N43CL  
PACKAGE DIMENSIONS  
D2PAK  
CASE 418B–03  
ISSUE D  
C
E
V
–B–  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
4
INCHES  
DIM MIN MAX  
MILLIMETERS  
A
MIN  
8.64  
9.65  
4.06  
0.51  
1.14  
MAX  
9.65  
10.29  
4.83  
0.89  
1.40  
A
B
C
D
E
G
H
J
0.340  
0.380  
0.160  
0.020  
0.045  
0.380  
0.405  
0.190  
0.035  
0.055  
S
1
2
3
–T–  
SEATING  
PLANE  
K
0.100 BSC  
2.54 BSC  
0.080  
0.018  
0.090  
0.575  
0.045  
0.110  
0.025  
0.110  
0.625  
0.055  
2.03  
0.46  
2.79  
0.64  
J
G
K
S
V
2.29  
14.60  
1.14  
2.79  
15.88  
1.40  
H
D 3 PL  
M
M
T B  
0.13 (0.005)  
STYLE 3:  
PIN 1. ANODE  
2. CATHODE  
3. ANODE  
4. CATHODE  
http://onsemi.com  
6
MGP15N43CL, MGB15N43CL  
Notes  
http://onsemi.com  
7
MGP15N43CL, MGB15N43CL  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes  
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular  
purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,  
including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be  
validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.  
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MGP15N43CL/D  

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