MICROFJ-30020-TSV [ONSEMI]
Silicon Photomultipliers (SiPM), High PDE and Timing Resolution Sensors in a TSV Package;
| 型号： | MICROFJ-30020-TSV |
| 厂家： | 
ONSEMI |
| 描述： | Silicon Photomultipliers (SiPM), High PDE and Timing Resolution Sensors in a TSV Package 光电二极管 |
| 文件： | 总12页 (文件大小：702K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
J-Series SiPM Sensors
Silicon Photomultipliers
(SiPM), High PDE and
Timing Resolution Sensors
in a TSV Package
www.onsemi.com
ON Semiconductor’s J-Series low-light sensors feature a high PDE
(photon detection efficiency) that is achieved using a high-volume,
P-on-N silicon foundry process. The J-Series sensors incorporate
major improvements in the transit time spread which results in
a significant improvement in the timing performance of the sensor.
J-Series sensors are available in different sizes (3 mm, 4 mm and
6 mm) and use a TSV (Through Silicon Via) process to create
a package with minimal deadspace, that is compatible with industry
standard lead-free, reflow soldering processes.
The J-Series Silicon Photomultipliers (SiPM) combine high
performance with the practical advantages of solid-state technology:
low operating voltage, excellent temperature stability, robustness,
compactness, output uniformity, and low cost. For more information
on the J-Series sensors please refer to the website.
ORDERING INFORMATION
See detailed ordering and shipping information on page 11 of
this data sheet.
Table 1. GENERAL PARAMETERS
Parameter (Note 1)
Minimum
24.2
1
Typical
Maximum
24.7
Unit
V
V
Breakdown Voltage (Vbr) (Note 2)
Overvoltage (OV)
6
Operating Voltage (Vop = Vbr + OV))
Spectral Range (Note 3)
25.2
200
30.7
V
900
nm
nm
mV/°C
Peak PDE Wavelength (lp)
420
Temperature dependence of Vbr
21.5
1. All measurements made at 21°C unless otherwise stated.
2. The breakdown voltage (Vbr) is defined as the value of the voltage intercept of a straight line fit to a plot of √I vs V, where I is the current and
V is the bias voltage.
3. The range where PDE > 2.0% at Vbr + 6.0 V.
Table 2. PHYSICAL PARAMETERS
3 mm
4 mm
40035
6 mm
60035
30020, 30035
3.07 × 3.07 mm
Parameter
2
2
2
Active Area
3.93 × 3.93 mm
6.07 × 6.07 mm
No. of Microcells
30020: 14,410
30035: 5,676
40035: 9,260
60035: 22,292
Microcell Fill Factor
30020: 62%
30035: 75%
40035: 75%
60035: 75%
© Semiconductor Components Industries, LLC, 2017
1
Publication Order Number:
December, 2018 − Rev. 6
MICROJ−SERIES/D
J−Series SiPM Sensors
Table 3. PERFORMANCE PARAMETERS
30035
40035
60035
Unit
Overvoltage
+2.5 V
38
+6 V
50
+2.5 V
+6 V
50
+2.5 V
38
+6 V
50
Parameter (Note 4)
PDE (Note 5)
Unit
%
38
50
2
Dark Count Rate
50
150
150
50
150
kHz/mm
6
6
6
6
6
6
Gain (anode-cathode)
2.9 × 10
6.3 × 10
2.9 × 10
6.3 × 10
2.9 × 10
6.3 × 10
mA
Dark Current − typical
0.23
0.31
90
1.9
3.00
110
0.35
0.45
90
3.0
4.0
110
0.9
1.25
180
7.5
12.0
250
Dark Current − maximum
Rise Time (Note 6) − anode-cathode output
Microcell Recharge Time Constant (Note 7)
Capacitance (Note 8) (anode output)
Capacitance (Note 8) (fast output)
Fast Output Pulse Width (FWHM)
Crosstalk
ps
ns
pF
pF
ns
%
45
48
50
1070
40
1800
70
4140
160
3.0
1.5
1.7
8
25
8
25
8
25
Afterpulsing
0.75
5.0
0.75
5.0
0.75
5.0
%
30020
Overvoltage
+2.5 V
30
+5 V
38
Parameter (Note 4)
PDE (Note 5)
Unit
%
2
Dark Count Rate
50
125
kHz/mm
6
6
Gain (anode-cathode)
1.0 × 10
1.9 × 10
mA
Dark Current − typical
0.1
0.2
130
0.45
0.72
160
Dark Current − maximum
Rise Time (Note 6) − anode-cathode output
Microcell Recharge Time Constant (Note 7)
Capacitance (Note 8) (anode output)
Capacitance (Note 8) (fast output)
Fast Output Pulse Width (FWHM)
Crosstalk
ps
ns
pF
pF
ns
%
15
1040
50
1.4
2.5
7.5
5.0
Afterpulsing
0.75
%
4. All measurements made at 21°C unless otherwise stated.
5. PDE does not contain afterpulsing or crosstalk, and is quoted at the peak wavelength (l ).
p
6. Measured as time to go from 10% to 90% of the peak amplitude and measured over a 1 W series output resistor.
7. RC charging time constant of the microcell (τ).
8. Capacitance values are for the complete TSV package.
Table 4. TVS PACKAGE SPECIFICS
3 mm
4 mm
40035
6 mm
60035
30020, 30035
3.16 × 3.16 mm
2
2
2
Package Dimensions
4.00 × 4.00 mm
6.13 × 6.13 mm
Recommended Operating Temperature Range
Soldering Conditions
−40°C − +85°C
Reflow Solder
Glass
Cover Material
Cover Refractive Index
1.53 @ 436 nm
MSL3*
Moisture Sensitivity Level
Tape & reel
Cut tape
MSL4*
Maximum Average Current
10 mA
10 mA
15 mA
*Please refer to the TSV Handling and Soldering guide for more information on MSL for different delivery options.
www.onsemi.com
2
J−Series SiPM Sensors
PERFORMANCE PLOTS
Figure 1. Photon Detection Efficiency (PDE)
(MicroFJ−60035−TSV)
Figure 2. PDE vs. Overvoltage
Figure 3. PDE vs. Crosstalk
(MicroFJ−60035−TSV)
(MicroFJ−60035−TSV)
www.onsemi.com
3
J−Series SiPM Sensors
Figure 4. Gain vs. Overvoltage
(MicroFJ−30035−TSV)
Figure 5. Fast Output Pulse Shape
(MicroFJ−30035, MicroFJ−40035, MicroFJ−60035
Figure 6. Standard Output Pulse Shape
(MicroFJ−30035, MicroFJ−40035, MicroFJ−60035
Vbr + 2.5 V, 10 W Sense Resistor)
Vbr + 2.5 V, 10 W Sense Resistor)
www.onsemi.com
4
J−Series SiPM Sensors
EVALUATION BOARD OPTIONS
SMA BIASING BOARD (MicroFJ−SMA−XXXXX)
circuit schematic is shown in Figure 8. Please consult the
Readout and Biasing Application Note for further
information on biasing. The SMTPA board electrical
schematics are available to download in the AND9808/D.
The MicroFJ−SMA is a printed circuit board (PCB) that
can facilitate the evaluation of the J-Series sensors. The
board has three female SMA connectors for connecting the
bias voltage, the standard output from the anode and the fast
output signal. The output signals can be connected directly
to a 50 W-terminated oscilloscope for viewing. The biasing
and output signal tracks are laid out in such a way as to
preserve the fast timing characteristics of the sensor.
The MicroFJ−SMA is recommended for users who
require a plug-and-play set-up to quickly evaluate J-Series
TSV sensors with optimum timing performance. The board
also allows the standard output from the anode to be
observed at the same time as the fast output. The outputs can
be connected directly to the oscilloscope or measurement
device, but external preamplification may be required to
boost the signal. The table below lists the SMA board
connections. The SMA board electrical schematics are
available to download in the AND9808/D document.
Figure 7. Top View of the SMTPA Board
Showing the Pin Numbering
MicroFJ−SMA−XXXXX
Output
Vbias
Fout
Function
Positive bias input (cathode)
Fast output
Sout
Standard output (anode)
Figure 8. SMTPA Circuit Schematic
PIN ADAPTER (MicroFJ−SMTPA−XXXXX)
The TSV Pin Adapter board (SMTPA) is a small PCB
board that houses the TSV sensor and has through-hole pins
to allow its use with standard sockets or probe clips. This
product is useful for those needing a quick way to evaluate
the TSV package without the need for specialist
surface-mount soldering. While this is a ‘quick fix’ suitable
for many evaluations, it should be noted that the timing
performance from this board will not be optimized and if the
best possible timing performance is required, the
MicroFJ−SMA−XXXXX is recommended. The SMTPA
MicroFJ−SMTPA−XXXXX
Pin No.
Connection
Anode
1
2
3
4
5
Fast output
Cathode
Ground
No connect
www.onsemi.com
5
J−Series SiPM Sensors
CIRCUIT SCHEMATICS
An SiPM is formed of a large number (hundreds or
(e.g. all of the anodes) summed together (Figure 10). The
array of microcells can thus be considered as a single
photodiode sensor with three terminals: anode, cathode and
fast output, as shown in Figure 11.
thousands) of microcells. Each microcell (Figure 9) is an
avalanche photodiode with its own quench resistor and a
capacitively coupled fast output. These microcells are
arranged in a close-packed array with all of the like terminals
Figure 9. Circuit Schematic of the
ON Semiconductor SiPM Microcell,
showing Details of the Fast Output
Figure 10. Simplified Circuit Schematic of the
ON Semiconductor SiPM showing only a 12 Microcell
Example. Typically, SiPM Sensors have Hundreds or
Thousands of Microcells
Figure 11. ON Semiconductor SiPM
Component Symbol
TILING OF THE TSV PACKAGE
For the J-Series, ON Semiconductor has developed a
market-leading, high-performance package using a TSV
process. It is a chip-scale package that is compatible with
lead-free, reflow soldering processes. The glass cover is
ideal for coupling to scintillators or fibre optic elements.
The dead-space between the sensor active area and the
edge of the package has been minimized, resulting in
a package that can be tiled on 4 sides with high fill-factor.
This allows multiple sensors to be configured into unique
layouts for a wide range of custom applications. The
distance between sensor packages can be as little as 200 mm
when tiled, but actual alignment and placement tolerances
will depend on the accuracy of the user’s assembly process.
An Application Note is available that gives advice on
creating arrays of the TSV sensors.
www.onsemi.com
6
J−Series SiPM Sensors
PACKAGE DIMENSIONS
(All Dimensions in mm)
MicroFJ−300XX−TSV
TOP VIEW
BOTTOM VIEW
Pin Assignments
Pin Number
MicroFJ−300XX−TSV
Anode
B1
B3
Fast output
Cathode
A1, C3
All others
No Connect*
SIDE VIEW
*The ‘No Connect’ pins are electrically isolated and should be soldered to a ground (or bias) plane to help with heat dissipation.
The MicroFJ−300XX−TSV−A2 CAD, and solder footprint, is available to download here.
www.onsemi.com
7
J−Series SiPM Sensors
PACKAGE DIMENSIONS
(All Dimensions in mm)
MicroFJ−40035−TSV
TOP VIEW
BOTTOM VIEW
Pin Assignments
Pin Number
MicroFJ−40035−TSV
Anode
B1, C1
B4, C4
A1, D4
Fast output
Cathode
All others
No Connect*
SIDE VIEW
*The ‘No Connect’ pins are electrically isolated and should be soldered to a ground (or bias) plane to help with heat dissipation.
The MicroFJ−40035−TSV CAD, and solder footprint, is available to download here.
www.onsemi.com
8
J−Series SiPM Sensors
PACKAGE DIMENSIONS
(All Dimensions in mm)
MicroFJ−60035−TSV
TOP VIEW
BOTTOM VIEW
Pin Assignments
Pin Number
MicroFJ−60035−TSV
Anode
C1, D1
A1, F6
C6, D6
Cathode
Fast output
All others
No Connect*
SIDE VIEW
*The ‘No Connect’ pins are electrically isolated and should be soldered to a ground (or bias) plane to help with heat dissipation.
The MicroFJ−60035−TSV CAD, and solder footprint, is available to download here.
www.onsemi.com
9
J−Series SiPM Sensors
MicroFJ−SMA−60035 Board
TOP VIEW
BOTTOM VIEW
SIDE VIEW
The complete CAD for the SMA boards can be downloaded from the website: 3 mm, 4 mm and 6 mm versions.
MicroFJ−SMTPA−60035 Board
TOP VIEW
SIDE VIEW
BOTTOM VIEW
The complete CAD for the SMTPA boards can be downloaded from the website: 3 mm and 6 mm versions.
www.onsemi.com
10
J−Series SiPM Sensors
ORDERING INFORMATION
Table 5. ORDERING INFORMATION
Sensor
Active
Area
Delivery
Option
(Note 9)
Microcell Size
(No. of Microcells)
Product Code
3 mm Sensors
Description
MICROFJ−30020−TSV
20 mm
(14,410)
3.07 × 3.07 mm
4-side tileable, chip scale package with
through-silicon vias (TSV)
TR1, TR
PK
MICROFJ−SMA−30020−GEVB
TSV sensor mounted onto a PCB with
three SMA connectors for bias, standard
output and fast output
MICROFJ−SMTPA−30020−GEVB
MICROFJ−30035−TSV
TSV sensor mounted onto a pin adapter
board
PK
TR1, TR
PK
35 mm
(5,676)
4-side tileable, chip scale package with
through-silicon vias (TSV)
MICROFJ−SMA−30035−GEVB
TSV sensor mounted onto a PCB with
three SMA connectors for bias, standard
output and fast output
MICROFJ−SMTPA−30035−GEVB
TSV sensor mounted onto a pin adapter
board
PK
4 mm Sensors
MICROFJ−40035−TSV
35 mm
3.93 × 3.93 mm
6.07 × 6.07 mm
4-side tileable, chip scale package with
through-silicon vias (TSV)
TR1, TR
PK
(9,260)
MICROFJ−SMA−40035−GEVB
TSV sensor mounted onto a PCB with
three SMA connectors for bias, standard
output and fast output.
6 mm Sensors
MICROFJ−60035−TSV
35 mm
(22,292)
4-side tileable, chip scale package with
through-silicon vias (TSV)
TR1, TR
PK
MICROFJ−SMA−60035−GEVB
MICROFJ−SMTPA−60035−GEVB
TSV sensor mounted onto a PCB with
three SMA connectors for bias, standard
output and fast output
TSV sensor mounted onto a pin adapter
board
PK
9. The two-letter delivery option code should be appended to the order number, e.g.) to receive a MICROFJ−60035−TSV on tape and reel, use
MICROFJ−60035−TSV−TR. The codes are as follows:
PK = ESD Package
TR1 = Tape
TR = Tape and Reel
There is a minimum order quantity (MOQ) of 3000 for the tape and reel (TR) option. Quantities less than this are available on tape (−TR1).
The TR option is only available in multiples of the MOQ.
www.onsemi.com
11
J−Series SiPM Sensors
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MICROJ−SERIES/D
相关型号：
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Silicon Photomultipliers (SiPM), High PDE and Timing Resolution Sensors in a TSV Package
ONSEMI
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