MJD340_11 [ONSEMI]

High Voltage Power Transistors; 高电压功率晶体管
MJD340_11
型号: MJD340_11
厂家: ONSEMI    ONSEMI
描述:

High Voltage Power Transistors
高电压功率晶体管

晶体 晶体管
文件: 总5页 (文件大小:120K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
MJD340 (NPN)  
MJD350 (PNP)  
High Voltage Power  
Transistors  
DPAK For Surface Mount Applications  
http://onsemi.com  
Designed for line operated audio output amplifier, switchmode  
power supply drivers and other switching applications.  
SILICON  
Features  
POWER TRANSISTORS  
0.5 AMPERE  
300 VOLTS, 15 WATTS  
Lead Formed for Surface Mount Applications in Plastic Sleeves  
(No Suffix)  
Electrically Similar to Popular MJE340 and MJE350  
300 V (Min) V  
CEO(sus)  
4
0.5 A Rated Collector Current  
Epoxy Meets UL 94 V0 @ 0.125 in  
2
1
ESD Ratings: Human Body Model, 3B u 8000 V  
3
Machine Model, C u 400 V  
DPAK  
CASE 369C  
STYLE 1  
These are PbFree Packages  
MAXIMUM RATINGS  
Rating  
CollectorEmitter Voltage  
CollectorBase Voltage  
EmitterBase Voltage  
Symbol  
Max  
300  
300  
3
Unit  
Vdc  
Vdc  
Vdc  
Adc  
MARKING DIAGRAM  
V
CEO  
V
CB  
AYWW  
J3x0G  
V
EB  
I
C
0.5  
0.75  
Collector Current Continuous  
Peak  
A
Y
= Assembly Location  
= Year  
P
P
15  
W
Total Power Dissipation @ T = 25°C  
D
C
0.12  
W/°C  
Derate above 25°C  
WW = Work Week  
J3x0 = Device Code  
x= 4 or 5  
Total Power Dissipation (Note 1)  
D
1.56  
0.012  
W
W/°C  
@ T = 25°C  
A
G
= PbFree Package  
Derate above 25°C  
Operating and Storage Junction  
Temperature Range  
T , T  
65 to +150  
°C  
J
stg  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 4 of this data sheet.  
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Max  
8.33  
80  
Unit  
°C/W  
°C/W  
Thermal Resistance, JunctiontoCase  
R
q
JC  
Thermal Resistance, JunctiontoAmbient  
(Note 1)  
R
q
JA  
Leading Temperature for Soldering Purpose  
T
L
260  
°C  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. These ratings are applicable when surface mounted on the minimum pad  
sizes recommended.  
© Semiconductor Components Industries, LLC, 2011  
1
Publication Order Number:  
January, 2011 Rev. 8  
MJD340/D  
 
MJD340 (NPN) MJD350 (PNP)  
ELECTRICAL CHARACTERISTICS (T = 25_C unless otherwise noted)  
C
Characteristic  
Symbol  
Min  
Max  
Unit  
OFF CHARACTERISTICS  
CollectorEmitter Sustaining Voltage (Note 2)  
(I = 1 mA, I = 0)  
V
300  
V
CEO(sus)  
C
B
Collector Cutoff Current  
(V = 300 V, I = 0)  
I
0.1  
0.1  
mA  
mA  
CEO  
CB  
E
Emitter Cutoff Current  
(V = 3 V, I = 0)  
I
EBO  
BE  
C
ON CHARACTERISTICS (Note 2)  
DC Current Gain  
h
30  
240  
1
V
V
FE  
(I = 50 mA, V = 10 V)  
C
CE  
CollectorEmitter Saturation Voltage  
(I = 100 mA, I = 10 mA)  
V
CE(sat)  
C
B
BaseEmitter On Voltage  
(I = 1 A, V = 10 V)  
V
1.5  
BE(on)  
C
CE  
DYNAMIC CHARACTERISTICS  
Current Gain — Bandwidth Product  
f
T
10  
MHz  
(I = 50 mA, V = 10 V, f = 10 MHz)  
C
CE  
2. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2%.  
TYPICAL CHARACTERISTICS  
MJD340  
300  
200  
V
CE  
= 2 V  
V
CE  
= 10 V  
T = 150°C  
J
100  
70  
+100°C  
+ꢀ25°C  
50  
30  
20  
-ꢀ55°C  
10  
1
2
3
5
7
10  
20  
30  
50  
70  
100  
200  
300  
500  
I , COLLECTOR CURRENT (mAdc)  
C
Figure 1. DC Current Gain  
http://onsemi.com  
2
 
MJD340 (NPN) MJD350 (PNP)  
MJD340  
1
0.8  
0.6  
0.4  
0.2  
T = 25°C  
J
V
@ I /I = 10  
C B  
BE(sat)  
V
BE  
@ V = 10 V  
CE  
V
@ I /I = 10  
C B  
CE(sat)  
I /I = 5  
C B  
0
10  
20 30  
50  
100  
200 300  
500  
I , COLLECTOR CURRENT (mA)  
C
Figure 2. “On” Voltages  
MJD350  
MJD350  
1
200  
1
T = 150°C  
J
T = 25°C  
J
0.8  
0.6  
0.4  
0.2  
0
25°C  
100  
70  
V
@ I /I = 10  
C B  
BE(sat)  
V
BE  
@ V = 10 V  
CE  
-ꢀ55°C  
50  
I /I = 10  
B
C
30  
20  
V
V
= 2 V  
CE  
= 10 V  
CC  
V
CE(sat)  
I /I = 5  
C B  
10  
5
7
10  
20 30  
50 70 100  
200 300  
500  
5
7
10  
20 30  
50 70 100  
200 300 500  
I , COLLECTOR CURRENT (mA)  
C
I , COLLECTOR CURRENT (mA)  
C
Figure 3. DC Current Gain  
Figure 4. “On” Voltages  
1
0.7  
0.5  
D = 0.5  
0.3  
0.2  
0.2  
P
(pk)  
0.1  
R
R
= r(t) R  
q
JC  
q
q
JC(t)  
= 8.33°C/W MAX  
0.05  
JC  
0.1  
D CURVES APPLY FOR POWER  
PULSE TRAIN SHOWN  
0.01  
0.07  
0.05  
t
1
READ TIME AT t  
t
2
1
T
- T = P q  
C (pk) JC(t)  
J(pk)  
DUTY CYCLE, D = t /t  
1 2  
0.03  
0.02  
SINGLE PULSE  
0.01  
0.01 0.02 0.03 0.05  
0.1  
0.2 0.3  
0.5  
1
2
3
5
10  
20 30 50  
100  
200 300 500  
1 k  
t, TIME (ms)  
Figure 5. Thermal Response  
http://onsemi.com  
3
 
MJD340 (NPN) MJD350 (PNP)  
1000  
500  
There are two limitations on the power handling ability of  
a transistor: average junction temperature and second  
100 ms  
300  
200  
breakdown. Safe operating area curves indicate I V  
500 ms  
C
CE  
1 ms  
dc  
limits of the transistor that must be observed for reliable  
operation; i.e., the transistor must not be subjected to greater  
dissipation than the curves indicate.  
100  
50  
30  
20  
The data of Figure 6 is based on T  
variable depending on conditions. Second breakdown pulse  
= 150_C; T is  
J(pk)  
C
10  
5
limits are valid for duty cycles to 10% provided T  
J(pk)  
v 150_C.  
T
may be calculated from the data in  
J(pk)  
3
2
Figure 5. At high case temperatures, thermal limitations will  
reduce the power that can be handled to values less than the  
limitations imposed by second breakdown.  
1
10  
20 30  
50 70 100  
200 300  
500 700 1000  
V
CE  
, COLLECTOR-EMITTER VOLTAGE (VOLTS)  
Figure 6. Active Region Safe Operating Area  
T
A
T
C
2.5 25  
2
20  
1.5 15  
T
A
T
1
0.5  
0
10  
5
C
0
25  
50  
75  
100  
125  
150  
T, TEMPERATURE (°C)  
Figure 7. Power Derating  
ORDERING INFORMATION  
Device  
Package  
Shipping  
MJD340G  
DPAK  
75 Units / Rail  
1800 / Tape & Reel  
2500 / Tape & Reel  
75 Units / Rail  
(PbFree)  
MJD340RLG  
MJD340T4G  
MJD350G  
DPAK  
(PbFree)  
DPAK  
(PbFree)  
DPAK  
(PbFree)  
MJD350T4G  
DPAK  
(PbFree)  
2500 / Tape & Reel  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
http://onsemi.com  
4
 
MJD340 (NPN) MJD350 (PNP)  
PACKAGE DIMENSIONS  
DPAK  
CASE 369C01  
ISSUE D  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ASME  
Y14.5M, 1994.  
2. CONTROLLING DIMENSION: INCHES.  
3. THERMAL PAD CONTOUR OPTIONAL WITHIN DI-  
MENSIONS b3, L3 and Z.  
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD  
FLASH, PROTRUSIONS, OR BURRS. MOLD  
FLASH, PROTRUSIONS, OR GATE BURRS SHALL  
NOT EXCEED 0.006 INCHES PER SIDE.  
5. DIMENSIONS D AND E ARE DETERMINED AT THE  
OUTERMOST EXTREMES OF THE PLASTIC BODY.  
6. DATUMS A AND B ARE DETERMINED AT DATUM  
PLANE H.  
C
A
D
A
E
c2  
b3  
B
4
2
L3  
L4  
Z
H
DETAIL A  
1
3
INCHES  
DIM MIN MAX  
0.086 0.094  
A1 0.000 0.005  
0.025 0.035  
b2 0.030 0.045  
b3 0.180 0.215  
MILLIMETERS  
MIN  
2.18  
0.00  
0.63  
0.76  
4.57  
0.46  
0.46  
5.97  
6.35  
MAX  
2.38  
0.13  
0.89  
1.14  
5.46  
0.61  
0.61  
6.22  
6.73  
A
b2  
c
b
b
M
0.005 (0.13)  
C
H
e
c
0.018 0.024  
c2 0.018 0.024  
GAUGE  
SEATING  
PLANE  
L2  
PLANE  
C
D
E
e
0.235 0.245  
0.250 0.265  
0.090 BSC  
2.29 BSC  
9.40 10.41  
1.40 1.78  
2.74 REF  
0.51 BSC  
0.89 1.27  
H
L
L1  
L2  
0.370 0.410  
0.055 0.070  
0.108 REF  
L
A1  
L1  
0.020 BSC  
DETAIL A  
L3 0.035 0.050  
ROTATED 905 CW  
L4  
Z
−−− 0.040  
0.155 −−−  
−−−  
3.93  
1.01  
−−−  
STYLE 1:  
PIN 1. BASE  
SOLDERING FOOTPRINT*  
2. COLLECTOR  
3. EMITTER  
4. COLLECTOR  
6.20  
3.0  
0.244  
0.118  
2.58  
0.101  
5.80  
1.6  
0.063  
6.172  
0.243  
0.228  
mm  
inches  
ǒ
Ǔ
SCALE 3:1  
*For additional information on our PbFree strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 8002829855 Toll Free  
USA/Canada  
Europe, Middle East and Africa Technical Support:  
Phone: 421 33 790 2910  
Japan Customer Focus Center  
Phone: 81357733850  
ON Semiconductor Website: www.onsemi.com  
Order Literature: http://www.onsemi.com/orderlit  
Literature Distribution Center for ON Semiconductor  
P.O. Box 5163, Denver, Colorado 80217 USA  
Phone: 3036752175 or 8003443860 Toll Free USA/Canada  
Fax: 3036752176 or 8003443867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
For additional information, please contact your local  
Sales Representative  
MJD340/D  

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