MM5Z5V1ST5G [ONSEMI]
500 mW Tight Tolerance Zener Diode Voltage Regulator;
| 型号： | MM5Z5V1ST5G |
| 厂家： | 
ONSEMI |
| 描述： | 500 mW Tight Tolerance Zener Diode Voltage Regulator 二极管 |
| 文件： | 总4页 (文件大小：93K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MM5ZxxxST1G Series,
SZMM5ZxxxST1G Series
Zener Voltage Regulators
300 mW SOD−523 Surface Mount
This series of Zener diodes is packaged in a SOD−523 surface
mount package. They are designed to provide voltage regulation
protection and are especially attractive in situations where space is at a
premium. They are well suited for applications such as cellular
phones, hand held portables, and high density PC boards.
http://onsemi.com
SOD−523
CASE 502
Specification Features
• Standard Zener Breakdown Voltage Range −2.4 V to 18 V
• Steady State Power Rating of 200 mW
• Small Body Outline Dimensions:
1
2
0.047″ x 0.032″ (1.20 mm x 0.80 mm)
Cathode
Anode
• Low Body Height: 0.028″ (0.7 mm)
• ESD Rating of Class 3 (> 16 kV) per Human Body Model
MARKING DIAGRAM
• Tight Tolerance V
Z
• SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
XX MG
G
2
1
• These Devices are Pb−Free and are RoHS Compliant*
XX = Specific Device Code
Mechanical Characteristics
CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94, V−0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
M
Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Device Meets MSL 1 Requirements
ORDERING INFORMATION
MAXIMUM RATINGS
†
Device
Package
Shipping
Rating
Symbol
Max
Unit
MM5ZxxxST1G
SOD−523**
3,000 /
Total Device Dissipation FR−5 Board,
P
Tape & Reel
D
(Note 1) @ T = 25°C
300
1.5
mW
A
SZMM5ZxxxST1G SOD−523**
SZMM5ZxxxST5G SOD−523**
3,000 /
Tape & Reel
Derate above 25°C
mW/°C
Thermal Resistance from
Junction−to−Ambient
R
390
°C/W
q
JA
8,000 /
Tape & Reel
Junction and Storage Temperature Range
T , T
J
−65 to
+150
°C
stg
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−4 Minimum Pad.
**This package is inherently Pb−Free.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 2 of
this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2013
1
Publication Order Number:
July, 2013 − Rev. 9
MM5Z2V4ST1/D
MM5ZxxxST1G Series, SZMM5ZxxxST1G Series
ELECTRICAL CHARACTERISTICS
(T = 25°C unless otherwise noted,
A
I
V = 0.9 V Max. @ I = 10 mA for all types)
F
F
I
F
Symbol
Parameter
V
Reverse Zener Voltage @ I
Reverse Current
Z
ZT
I
ZT
Z
Maximum Zener Impedance @ I
Reverse Current
ZT
ZK
ZT
V
Z
V
R
V
I
V
F
R
ZT
I
I
Z
ZK
Maximum Zener Impedance @ I
ZK
I
Reverse Leakage Current @ V
Reverse Voltage
R
R
V
R
I
F
Forward Current
V
Forward Voltage @ I
F
F
Figure 1. Zener Voltage Regulator
QV
Maximum Temperature Coefficient of V
Z
Z
C
Max. Capacitance @V = 0 and f = 1 MHz
R
ELECTRICAL CHARACTERISTICS (V = 0.9 Max @ I = 10 mA for all types)
F
F
Z
ZT
Zener Voltage
VZ
Max
IR @ VR
d
@ I
/dt (mV/k)
VZ
I = IZT
Z
I
Z
Z
ZK
= 5 mA
ZT1
@ 10%
Mod W
Max
Test
Current
Izt mA
C pF Max @
= 1.0
mA W
Max
Device
Marking
V = 0
R
Min
2.43
2.67
3.32
3.60
3.89
4.17
4.55
4.98
5.49
6.06
6.65
7.28
8.02
8.85
11.74
15.85
17.56
Max
2.63
2.91
3.53
3.85
4.16
4.43
4.75
5.2
mA
V
Min
−3.5
−3.5
−3.5
−3.5
−3.5
−3.5
−3.5
−2.7
−2.0
0.4
Max
0
f = 1 MHz
450
450
450
450
450
450
260
225
200
185
155
140
135
130
130
105
100
Device*
MM5Z2V4ST1G
MM5Z2V7ST1G
MM5Z3V3ST1G
MM5Z3V6ST1G
MM5Z3V9ST1G
MM5Z4V3ST1G
MM5Z4V7ST1G/T5G
MM5Z5V1ST1G
MM5Z5V6ST1G
MM5Z6V2ST1G
MM5Z6V8ST1G
MM5Z7V5ST1G
MM5Z8V2ST1G
MM5Z9V1ST1G
MM5Z12VST1G
MM5Z16VST1G
MM5Z18VST1G
T2
T3
T5
T6
T7
T8
T9
TA
TC
TE
TF
TG
TH
TK
TN
TU
TW
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
1000
1000
1000
1000
1000
1000
800
500
200
100
160
160
160
160
80
100
100
95
90
90
90
80
60
40
10
15
15
15
15
25
40
45
120
100
5.0
5.0
3.0
3.0
3.0
2.0
1.0
3.0
2.0
1.0
0.7
0.5
0.1
1.0
1.0
1.0
1.0
1.0
1.0
2.0
2.0
2.0
4.0
4.0
5.0
5.0
6.0
8.0
0
0
0
−2.5
0
0.2
1.2
2.5
3.7
4.5
5.3
6.2
7.0
10
14
16
5.73
6.33
6.93
7.6
1.2
2.5
8.36
9.23
12.24
16.51
18.35
3.2
3.8
6.0
80
0.05 11.2
0.05 12.6
10.4
12.4
80
*Include SZ-prefix devices where applicable.
http://onsemi.com
2
MM5ZxxxST1G Series, SZMM5ZxxxST1G Series
TYPICAL CHARACTERISTICS
100
80
60
40
20
0
0
25
50
75
100
125
150
TEMPERATURE (°C)
Figure 2. Steady State Power Derating
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3
MM5ZxxxST1G Series, SZMM5ZxxxST1G Series
PACKAGE DIMENSIONS
SOD−523
CASE 502
ISSUE E
−X−
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
−Y−
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
E
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PRO-
TRUSIONS, OR GATE BURRS.
1
2
2X b
MILLIMETERS
M
0.08
X Y
DIM
A
b
c
D
E
HE
L
MIN
0.50
0.25
0.07
1.10
0.70
1.50
NOM
0.60
0.30
0.14
1.20
0.80
1.60
0.30 REF
0.20
MAX
0.70
0.35
0.20
1.30
0.90
1.70
TOP VIEW
A
L2
0.15
0.25
c
HE
RECOMMENDED
SOLDERING FOOTPRINT*
SIDE VIEW
1.80
2X
0.48
2X
0.40
2X
L
PACKAGE
OUTLINE
DIMENSION: MILLIMETERS
2X
L2
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
BOTTOM VIEW
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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MM5Z2V4ST1/D
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