MM74HCT32MX [ONSEMI]
四通道2输入OR门;
| 型号： | MM74HCT32MX |
| 厂家： | 
ONSEMI |
| 描述： | 四通道2输入OR门 栅 光电二极管 逻辑集成电路 触发器 |
| 文件： | 总7页 (文件大小：224K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
www.onsemi.com
Quad 2-Input OR Gate
MM74HCT32
14
1
SOIC−14 NB
CASE 751A−03
General Description
The MM74HCT32 is a logic function fabricated by using advanced
silicon−gate CMOS technology, which provides the inherent benefits
of CMOS — low quiescent power and wide power supply range. This
device is input and output characteristic and pin−out compatible with
standard 74LS logic families. All inputs are protected from static
14
1
TSSOP−14 WB
CASE 948G
discharge damage by internal diodes to V and ground.
CC
MM74HCT devices are intended to interface between TTL and
NMOS components and standard CMOS devices. These parts are also
plug−in replacements for LS−TTL devices and can be used to reduce
power consumption in existing designs.
MARKING DIAGRAM
14
HCT32A
AWLYWW
Features
• TTL, LS Pin−out and Threshold Compatible
1
• Fast Switching: t , t = 10 ns (Typ.)
SOIC−14 NB
PLH PHL
• Low Power: 10 mW at DC
14
• High Fan−out, 10 LS−TTL Loads
HCT
32A
ALYW
• These Devices are Pb−Free, Halide Free and are RoHS Compliant
Connection Diagram
1
TSSOP−14
HCT32A = Specific Device Code
A
WL, L
Y
= Assembly Location
= Wafer Lot
= Year
WW, W = Work Week
ORDERING INFORMATION
See detailed ordering and shipping information on page 3 of
this data sheet.
Figure 1. Pin Assignments for SOIC and TSSOP
Logic Diagram
Figure 2. Logic Diagram
© Semiconductor Components Industries, LLC, 1987
1
Publication Order Number:
November, 2022 − Rev. 2
MM74HCT32/D
MM74HCT32
ABSOLUTE MAXIMUM RATINGS (Note 1)
Symbol
Parameter
Rating
V
CC
Supply Voltage
–0.5 to +7.0 V
V
IN
DC Input Voltage
–0.5 to V + 0.5 V
CC
V
DC Output Voltage
Clamp Diode Current
DC Output Current, per Pin
–0.5 to V + 0.5 V
OUT
CC
I , I
IK OK
20 mA
25 mA
I
OUT
I
DC V or GND Current, per Pin
50 mA
CC
CC
T
Storage Temperature Range
Power Dissipation
–65°C to +150°C
500 mW
STG
P
S.O. Package Only
D
T
L
Lead Temperature (Soldering 10 Seconds)
260°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Unless otherwise specified all voltages are referenced to ground.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
4.5
0
Max
Unit
V
V
CC
Supply Voltage
5.5
V , V
IN OUT
DC Input or Output Voltage
Operating Temperature Range
Input Rise or Fall Times
V
CC
V
T
A
–40
−
+85
500
°C
ns
t , t
r
f
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
DC CHARACTERISTICS (V = 5 V 10% (unless otherwise specified))
CC
T
A
= 25°C
T = −40°C to 85°C
A
Typ
−
Guaranteed Limits
Symbol
Parameter
Conditions
Unit
V
V
IH
Minimum HIGH Level Input Voltage
Maximum LOW Level Input Voltage
Minimum HIGH Level Output Voltage
2.0
0.8
− 0.1
2.0
0.8
V
IL
−
V
V
OH
V
CC
V
CC
V − 0.1
CC
V
V
IN
= V or V , |I | = 20 mA
IL OUT
IH
V
V
= V or V , |I
CC
| = 4.0 mA,
4.2
3.98
3.84
IN
IH
= 4.5 V
IL OUT
V
V
= V or V , |I
CC
| = 4.8 mA,
5.2
4.98
4.84
IN
IH
= 5.5 V
IL OUT
V
OL
Maximum LOW Level Voltage
0
0.1
0.1
V
V
IN
= V , |I
| = 20 mA
IH OUT
V
V
= V , |I
CC
| = 4.0 mA,
| = 4.8 mA,
IH OUT
0.2
0.26
0.33
IN
IH OUT
= 4.5 V
V
V
= V , |I
= 5.5 V
0.2
0.26
0.33
IN
CC
I
Maximum Input Current
V
IN
V
IN
V
IN
= V or GND, V or V
−
−
−
0.1
2.0
1.2
1.0
20
mA
mA
IN
CC
IH
IL
I
Maximum Quiescent Supply Current
= V or GND, I
= 0 mA
CC
CC
OUT
= 2.4 V or 0.5 V (Note 2)
1.4
mA
2. This is measured per input with all other inputs held at V or ground.
CC
www.onsemi.com
2
MM74HCT32
AC CHARACTERISTICS (V = 5.0 V, t = t = 6 ns, C = 15 pF, T = 25°C (unless otherwise noted))
CC
r
f
L
A
Symbol
, t
Parameter
Conditions
Typ
Guaranteed Limit
Unit
t
Maximum Propagation Delay
10
−
ns
PLH PHL
AC CHARACTERISTICS (V = 5.0 V 10%, t = t = 6 ns, C = 15 pF (unless otherwise noted))
CC
r
f
L
T
A
= 25°C
T = −40°C to 85°C
A
Typ
12
8
Guaranteed Limits
Symbol
, t
Parameter
Conditions
Unit
ns
t
Maximum Propagation Delay
Maximum Output Rise & Fall Time
Power Dissipation Capacitance
Maximum Input Capacitance
20
25
19
−
PLH PHL
t
, t
15
−
ns
THL TLH
C
PD
(Note 3)
48
5
pF
pF
C
IN
10
10
3. C determines the no load dynamic power consumption, P = C
V
2 f + I V , and the no load dynamic current consumption,
CC CC
PD
D
PD CC
I
S
= C
V
f + I
.
PD CC
CC
ORDERING INFORMATION
Part Number
†
Package
Shipping
MM74HCT32M
SOIC−14, Case 751A−03
(Pb−Free, Halide−Free)
55 Units / Tube
MM74HCT32MX
SOIC−14, Case 751A−03
(Pb−Free, Halide−Free)
2500 Units / Tape & Reel
2500 Units / Tape & Reel
MM74HCT32MTCX
TSSOP−14, Case 948G−01
(Pb−Free, Halide Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
www.onsemi.com
3
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOIC−14 NB
CASE 751A−03
ISSUE L
14
1
DATE 03 FEB 2016
SCALE 1:1
NOTES:
D
A
B
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF AT
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD PROTRUSIONS.
14
8
7
A3
E
H
5. MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
L
DETAIL A
1
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
13X b
M
M
B
0.25
A
A1
A3
b
D
E
1.35
0.10
0.19
0.35
8.55
3.80
1.75 0.054 0.068
0.25 0.004 0.010
0.25 0.008 0.010
0.49 0.014 0.019
8.75 0.337 0.344
4.00 0.150 0.157
M
S
S
B
0.25
C A
DETAIL A
h
A
X 45
_
e
H
h
L
1.27 BSC
0.050 BSC
6.20 0.228 0.244
0.50 0.010 0.019
1.25 0.016 0.049
5.80
0.25
0.40
0
0.10
M
A1
e
M
7
0
7
_
_
_
_
SEATING
PLANE
C
GENERIC
MARKING DIAGRAM*
SOLDERING FOOTPRINT*
6.50
14
14X
1.18
XXXXXXXXXG
AWLYWW
1
1
XXXXX = Specific Device Code
A
WL
Y
= Assembly Location
= Wafer Lot
= Year
1.27
PITCH
WW
G
= Work Week
= Pb−Free Package
14X
0.58
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
STYLES ON PAGE 2
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42565B
SOIC−14 NB
PAGE 1 OF 2
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
SOIC−14
CASE 751A−03
ISSUE L
DATE 03 FEB 2016
STYLE 1:
STYLE 2:
CANCELLED
STYLE 3:
STYLE 4:
PIN 1. NO CONNECTION
2. CATHODE
PIN 1. COMMON CATHODE
2. ANODE/CATHODE
3. ANODE/CATHODE
4. NO CONNECTION
5. ANODE/CATHODE
6. NO CONNECTION
7. ANODE/CATHODE
8. ANODE/CATHODE
9. ANODE/CATHODE
10. NO CONNECTION
11. ANODE/CATHODE
12. ANODE/CATHODE
13. NO CONNECTION
14. COMMON ANODE
PIN 1. NO CONNECTION
2. ANODE
3. ANODE
4. NO CONNECTION
5. ANODE
6. NO CONNECTION
7. ANODE
8. ANODE
9. ANODE
10. NO CONNECTION
11. ANODE
12. ANODE
13. NO CONNECTION
14. COMMON CATHODE
3. CATHODE
4. NO CONNECTION
5. CATHODE
6. NO CONNECTION
7. CATHODE
8. CATHODE
9. CATHODE
10. NO CONNECTION
11. CATHODE
12. CATHODE
13. NO CONNECTION
14. COMMON ANODE
STYLE 5:
STYLE 6:
STYLE 7:
STYLE 8:
PIN 1. COMMON CATHODE
2. ANODE/CATHODE
3. ANODE/CATHODE
4. ANODE/CATHODE
5. ANODE/CATHODE
6. NO CONNECTION
7. COMMON ANODE
8. COMMON CATHODE
9. ANODE/CATHODE
10. ANODE/CATHODE
11. ANODE/CATHODE
12. ANODE/CATHODE
13. NO CONNECTION
14. COMMON ANODE
PIN 1. CATHODE
2. CATHODE
3. CATHODE
4. CATHODE
5. CATHODE
6. CATHODE
7. CATHODE
8. ANODE
PIN 1. ANODE/CATHODE
2. COMMON ANODE
3. COMMON CATHODE
4. ANODE/CATHODE
5. ANODE/CATHODE
6. ANODE/CATHODE
7. ANODE/CATHODE
8. ANODE/CATHODE
9. ANODE/CATHODE
10. ANODE/CATHODE
11. COMMON CATHODE
12. COMMON ANODE
13. ANODE/CATHODE
14. ANODE/CATHODE
PIN 1. COMMON CATHODE
2. ANODE/CATHODE
3. ANODE/CATHODE
4. NO CONNECTION
5. ANODE/CATHODE
6. ANODE/CATHODE
7. COMMON ANODE
8. COMMON ANODE
9. ANODE/CATHODE
10. ANODE/CATHODE
11. NO CONNECTION
12. ANODE/CATHODE
13. ANODE/CATHODE
14. COMMON CATHODE
9. ANODE
10. ANODE
11. ANODE
12. ANODE
13. ANODE
14. ANODE
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42565B
SOIC−14 NB
PAGE 2 OF 2
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TSSOP−14 WB
CASE 948G
ISSUE C
14
DATE 17 FEB 2016
1
SCALE 2:1
NOTES:
14X K REF
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
M
S
S
V
0.10 (0.004)
T U
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
S
0.15 (0.006) T U
N
0.25 (0.010)
14
8
2X L/2
M
B
L
N
−U−
PIN 1
IDENT.
F
7
1
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
DETAIL E
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
S
K
0.15 (0.006) T U
A
−V−
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
K1
A
B
C
D
F
G
H
J
4.90
4.30
−−−
0.05
0.50
5.10 0.193 0.200
4.50 0.169 0.177
J J1
1.20
−−− 0.047
0.15 0.002 0.006
0.75 0.020 0.030
SECTION N−N
0.65 BSC
0.026 BSC
0.60 0.020 0.024
0.20 0.004 0.008
0.16 0.004 0.006
0.30 0.007 0.012
0.25 0.007 0.010
0.50
0.09
0.09
0.19
J1
K
−W−
C
K1 0.19
L
M
6.40 BSC
0.252 BSC
0.10 (0.004)
0
8
0
8
_
_
_
_
SEATING
PLANE
−T−
H
G
DETAIL E
D
GENERIC
MARKING DIAGRAM*
14
SOLDERING FOOTPRINT
XXXX
XXXX
ALYWG
G
7.06
1
1
A
L
= Assembly Location
= Wafer Lot
Y
W
G
= Year
= Work Week
= Pb−Free Package
0.65
PITCH
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
01.34X6
14X
1.26
DIMENSIONS: MILLIMETERS
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98ASH70246A
TSSOP−14 WB
PAGE 1 OF 1
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
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and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
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vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
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相关型号：
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