MM74HCU04MX [ONSEMI]
六路逆变器;
| 型号： | MM74HCU04MX |
| 厂家： | 
ONSEMI |
| 描述： | 六路逆变器 PC 栅 光电二极管 逻辑集成电路 触发器 |
| 文件： | 总8页 (文件大小：268K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
www.onsemi.com
Hex Inverter
MM74HCU04
14
1
SOIC−14 NB
CASE 751A−03
General Description
The MM74HCU04 inverters utilize advanced silicon−gate CMOS
technology to achieve operating speeds similar to LS−TTL gates with
the low power consumption of standard CMOS integrated circuits.
The MM74HCU04 is an unbuffered inverter. It has high noise
immunity and the ability to drive 15 LS−TTL loads. The 74HCU logic
family is functionally as well as pin−out compatible with the standard
74LS logic family. All inputs are protected from damage due to static
14
1
TSSOP−14 WB
CASE 948G
MARKING DIAGRAM
discharge by internal diode clamps to V and ground.
CC
14
Features
XXXXX
AWLYWW
• Typical Propagation Delay: 7 ns
• Fanout of 15 LS−TTL Loads
1
• Quiescent Power Consumption: 10 mA Maximum at Room
Temperature
SOIC−14
• Low Input Current: 1 mA Maximum
• These Devices are Pb−Free, Halide Free and are RoHS Compliant
14
XX
XXX
ALYW
Connection Diagram
1
TSSOP−14 WB
XXXXX = Specific Device Code
A
= Assembly Location
WL, L = Wafer Lot
= Year
Y
WW, W = Work Week
SCHEMATIC DIAGRAM
Top View
Figure 1. Pin Assignments for SOIC and TSSOP
ORDERING INFORMATION
See detailed ordering and shipping information on page 4 of
this data sheet.
© Semiconductor Components Industries, LLC, 2008
1
Publication Order Number:
November, 2022 − Rev. 2
MM74HCU04/D
MM74HCU04
ABSOLUTE MAXIMUM RATINGS (Note 1)
Symbol
Parameter
Rating
V
CC
Supply Voltage
–0.5 to +7.0 V
V
IN
DC Input Voltage
–0.5 to V + 0.5 V
CC
V
DC Output Voltage
Clamp Diode Current
DC Output Current, per Pin
–0.5 to V + 0.5 V
OUT
CC
I , I
IK OK
20 mA
25 mA
I
OUT
I
DC V or GND Current, per Pin
50 mA
CC
CC
T
Storage Temperature Range
Power Dissipation
–65°C to +150°C
500 mW
STG
P
S.O. Package Only
D
T
L
Lead Temperature (Soldering 10 Seconds)
260°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Unless otherwise specified all voltages are referenced to ground.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
2
Max
Unit
V
V
CC
Supply Voltage
6
V
, V
DC Input or Output Voltage
Operating Temperature Range
0
V
V
IN OUT
CC
T
A
–55
+125
°C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
www.onsemi.com
2
MM74HCU04
DC ELECTRICAL CHARACTERISTICS
T
= −40°C
T = −55°C
A
to 125°C
A
to 85°C
T
A
= 25°C
V
CC
(V)
Typ
−
Guaranteed Limits
Symbol
Parameter
Conditions
Unit
V
IH
Minimum HIGH Level Input Voltage
2.0
1.7
3.6
4.8
0.3
0.8
1.1
1.8
4.0
5.5
3.98
1.7
3.6
4.8
0.3
0.8
1.1
1.8
4.0
5.5
3.84
1.7
3.6
4.8
0.3
0.8
1.1
1.8
4.0
5.5
3.7
V
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
4.5
−
−
V
IL
Maximum LOW Level Input Voltage
Minimum HIGH Level Output Voltage
−
V
V
−
−
V
OH
V
= V or V ,
OUT
2.0
4.5
6.0
4.2
IN
IH
IL
|I
| ≤ 20 mA
V
|I
= GND,
OUT
IN
| ≤ 4.0 mA
6.0
V
OUT
= GND,
5.7
5.48
5.34
5.2
IN
|I
| ≤ 5.2 mA
V
OL
Maximum LOW Level Output Voltage
2.0
4.5
6.0
4.5
V
OUT
= V or V ,
0
0
0.2
0.5
0.2
0.5
0.2
0.5
0.5
0.4
V
IN
IH
IL
|I
| ≤ 20 mA
0
0.5
0.5
V
OUT
= V
,
0.2
0.26
0.33
IN
CC
|I
| ≤ 6.0 mA
6.0
V
OUT
= V
,
0.2
0.26
0.33
0.4
IN
CC
|I
| ≤ 7.8 mA
I
Maximum Input Current
6.0
6.0
V
V
= V or GND
−
−
0.1
2.0
1.0
20
1.0
40
mA
mA
IN
IN
CC
I
Maximum Quiescent Supply Current
= V or
CC
CC
IN
GND, I
= 0 mA
OUT
2. For a power supply of 5 V 10% the worst case output voltages (V , and V ) occur for HC at 4.5 V. Thus the 4.5 V values should be used
OH
OL
when designing with this supply. Worst case V and V occur at V = 5.5 V and 4.5 V respectively. (The V value at 5.5 V is 3.85 V.) The
IH
IL
CC
IH
worst case leakage current (I , I , and I ) occur for CMOS at the higher voltage and so the 6.0 V values should be used.
IN CC
OZ
AC ELECTRICAL CHARACTERISTICS (V = 5 V, T = 25°C, C = 15 pF, t = t = 6 ns)
CC
A
L
r
f
Symbol
, t
Parameter
Conditions
Typ
Guaranteed Limit
Unit
t
Maximum Propagation Delay
7
13
ns
PHL PLH
AC ELECTRICAL CHARACTERISTICS (V = 2.0 V to 6.0 V, C = 50 pF, t = t = 6 ns, unless otherwise specified)
CC
L
r
f
T
= −40°C
T = −55°C
A
to 125°C
A
to 85°C
T
A
= 25°C
V
CC
(V)
2.0
4.5
6.0
2.0
4.5
6.0
Typ
49
9.9
8.4
30
8
Guaranteed Limits
Symbol
, t
Parameter
Conditions
Unit
t
Maximum Propagation Delay
82
16
14
75
15
13
−
103
21
18
95
19
16
−
120
ns
PHL PLH
24
20
110
22
19
−
t
, t
Maximum Output Rise and Fall Time
ns
TLH THL
7
C
PD
Power Dissipation Capacitance (Note 3)
Maximum Input Capacitance
(per gate)
90
8
pF
pF
C
IN
15
15
15
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2
3. C determines the no load dynamic power consumption, P = C
V
f + I
V
, and the no load dynamic current consumption,
PD
D
PD CC
CC CC
I
= C
V
f + I
.
S
PD CC
CC
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3
MM74HCU04
ORDERING INFORMATION
Part Number
†
Package
Shipping
MM74HCU04M
SOIC−14, Case 751A−03
(Pb−Free, Halide−Free)
55 Units / Tube
MM74HCU04MX
SOIC−14, Case 751A−03
(Pb−Free, Halide−Free)
2500 Units / Tape & Reel
2500 Units / Tape & Reel
MM74HCU04MTCX
TSSOP−14, Case 948G−01
(Pb−Free, Halide Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Typical Applications
Figure 2. Crystal Oscillator
Figure 3. Stable RC Oscillator
Figure 4. Schmitt Trigger
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4
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOIC−14 NB
CASE 751A−03
ISSUE L
14
1
DATE 03 FEB 2016
SCALE 1:1
NOTES:
D
A
B
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF AT
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD PROTRUSIONS.
14
8
7
A3
E
H
5. MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
L
DETAIL A
1
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
13X b
M
M
B
0.25
A
A1
A3
b
D
E
1.35
0.10
0.19
0.35
8.55
3.80
1.75 0.054 0.068
0.25 0.004 0.010
0.25 0.008 0.010
0.49 0.014 0.019
8.75 0.337 0.344
4.00 0.150 0.157
M
S
S
B
0.25
C A
DETAIL A
h
A
X 45
_
e
H
h
L
1.27 BSC
0.050 BSC
6.20 0.228 0.244
0.50 0.010 0.019
1.25 0.016 0.049
5.80
0.25
0.40
0
0.10
M
A1
e
M
7
0
7
_
_
_
_
SEATING
PLANE
C
GENERIC
MARKING DIAGRAM*
SOLDERING FOOTPRINT*
6.50
14
14X
1.18
XXXXXXXXXG
AWLYWW
1
1
XXXXX = Specific Device Code
A
WL
Y
= Assembly Location
= Wafer Lot
= Year
1.27
PITCH
WW
G
= Work Week
= Pb−Free Package
14X
0.58
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
STYLES ON PAGE 2
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42565B
SOIC−14 NB
PAGE 1 OF 2
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
SOIC−14
CASE 751A−03
ISSUE L
DATE 03 FEB 2016
STYLE 1:
STYLE 2:
CANCELLED
STYLE 3:
STYLE 4:
PIN 1. NO CONNECTION
2. CATHODE
PIN 1. COMMON CATHODE
2. ANODE/CATHODE
3. ANODE/CATHODE
4. NO CONNECTION
5. ANODE/CATHODE
6. NO CONNECTION
7. ANODE/CATHODE
8. ANODE/CATHODE
9. ANODE/CATHODE
10. NO CONNECTION
11. ANODE/CATHODE
12. ANODE/CATHODE
13. NO CONNECTION
14. COMMON ANODE
PIN 1. NO CONNECTION
2. ANODE
3. ANODE
4. NO CONNECTION
5. ANODE
6. NO CONNECTION
7. ANODE
8. ANODE
9. ANODE
10. NO CONNECTION
11. ANODE
12. ANODE
13. NO CONNECTION
14. COMMON CATHODE
3. CATHODE
4. NO CONNECTION
5. CATHODE
6. NO CONNECTION
7. CATHODE
8. CATHODE
9. CATHODE
10. NO CONNECTION
11. CATHODE
12. CATHODE
13. NO CONNECTION
14. COMMON ANODE
STYLE 5:
STYLE 6:
STYLE 7:
STYLE 8:
PIN 1. COMMON CATHODE
2. ANODE/CATHODE
3. ANODE/CATHODE
4. ANODE/CATHODE
5. ANODE/CATHODE
6. NO CONNECTION
7. COMMON ANODE
8. COMMON CATHODE
9. ANODE/CATHODE
10. ANODE/CATHODE
11. ANODE/CATHODE
12. ANODE/CATHODE
13. NO CONNECTION
14. COMMON ANODE
PIN 1. CATHODE
2. CATHODE
3. CATHODE
4. CATHODE
5. CATHODE
6. CATHODE
7. CATHODE
8. ANODE
PIN 1. ANODE/CATHODE
2. COMMON ANODE
3. COMMON CATHODE
4. ANODE/CATHODE
5. ANODE/CATHODE
6. ANODE/CATHODE
7. ANODE/CATHODE
8. ANODE/CATHODE
9. ANODE/CATHODE
10. ANODE/CATHODE
11. COMMON CATHODE
12. COMMON ANODE
13. ANODE/CATHODE
14. ANODE/CATHODE
PIN 1. COMMON CATHODE
2. ANODE/CATHODE
3. ANODE/CATHODE
4. NO CONNECTION
5. ANODE/CATHODE
6. ANODE/CATHODE
7. COMMON ANODE
8. COMMON ANODE
9. ANODE/CATHODE
10. ANODE/CATHODE
11. NO CONNECTION
12. ANODE/CATHODE
13. ANODE/CATHODE
14. COMMON CATHODE
9. ANODE
10. ANODE
11. ANODE
12. ANODE
13. ANODE
14. ANODE
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42565B
SOIC−14 NB
PAGE 2 OF 2
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TSSOP−14 WB
CASE 948G
ISSUE C
14
DATE 17 FEB 2016
1
SCALE 2:1
NOTES:
14X K REF
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
M
S
S
V
0.10 (0.004)
T U
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
S
0.15 (0.006) T U
N
0.25 (0.010)
14
8
2X L/2
M
B
L
N
−U−
PIN 1
IDENT.
F
7
1
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
DETAIL E
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
S
K
0.15 (0.006) T U
A
−V−
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
K1
A
B
C
D
F
G
H
J
4.90
4.30
−−−
0.05
0.50
5.10 0.193 0.200
4.50 0.169 0.177
J J1
1.20
−−− 0.047
0.15 0.002 0.006
0.75 0.020 0.030
SECTION N−N
0.65 BSC
0.026 BSC
0.60 0.020 0.024
0.20 0.004 0.008
0.16 0.004 0.006
0.30 0.007 0.012
0.25 0.007 0.010
0.50
0.09
0.09
0.19
J1
K
−W−
C
K1 0.19
L
M
6.40 BSC
0.252 BSC
0.10 (0.004)
0
8
0
8
_
_
_
_
SEATING
PLANE
−T−
H
G
DETAIL E
D
GENERIC
MARKING DIAGRAM*
14
SOLDERING FOOTPRINT
XXXX
XXXX
ALYWG
G
7.06
1
1
A
L
= Assembly Location
= Wafer Lot
Y
W
G
= Year
= Work Week
= Pb−Free Package
0.65
PITCH
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
01.34X6
14X
1.26
DIMENSIONS: MILLIMETERS
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98ASH70246A
TSSOP−14 WB
PAGE 1 OF 1
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
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