MMBD4148SE [ONSEMI]

高导通超高速二极管;
MMBD4148SE
型号: MMBD4148SE
厂家: ONSEMI    ONSEMI
描述:

高导通超高速二极管

二极管
文件: 总7页 (文件大小:204K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DATA SHEET  
www.onsemi.com  
Small Signal Diode  
3
1
MMBD4148SE,  
MMBD4148CC,  
MMBD4148CA  
2
SOT23 (TO236)  
CASE 31808  
Features  
These are PbFree Devices  
MARKING DIAGRAM  
DxM G  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
A
G
Rating  
Symbol  
Value  
Unit  
1
Maximum Repetitive Reverse Voltage  
Average Rectified Forward Current  
V
100  
V
RRM  
Dx = Device Code  
I
200  
mA  
A
F(AV)  
x = 4, 5, 6  
M
= Assembly Operation Month  
NonRepetitive Peak Forward  
Surge Current  
I
FSM  
G
= PbFree Package  
Pulse Width = 1.0 s  
Pulse Width = 1.0 ms  
1.0  
2.0  
(Note: Microdot may be in either location)  
Operating Junction Temperature Range  
Storage Temperature Range  
T
55 to +150  
55 to +150  
°C  
°C  
J
T
STG  
CONNECTION DIAGRAMS  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
THERMAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
A
Characteristic  
Power Dissipation  
Thermal Resistance, JunctiontoAmbient  
Symbol  
Value  
Unit  
P
D
350  
mW  
R
q
JA  
357  
°C/W  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
A
Characteristic  
Symbol Min  
Typ  
Max  
Unit  
Breakdown Voltage  
V
R
V
I
R
I
R
= 5.0 mA  
75  
100  
= 100 mA  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 4  
of this data sheet.  
Forward Voltage  
V
F
V
I = 10 mA  
1.0  
F
Reverse Leakage Current  
I
R
V
R
V
R
V
R
= 20 V  
25  
50  
5.0  
nA  
mA  
mA  
= 20 V, T = 150°C  
A
= 75 V  
Total Capacitance  
= 0 V, f = 1.0 MHz  
C
pF  
T
V
R
4.0  
4.0  
Reverse Recovery Time  
t
rr  
ns  
I = 10 mA, V = 6.0 V,  
F
RR  
R
I
= 1.0 mA, R = 100 W  
L
Product parametric performance is indicated in the Electrical Characteristics for  
the listed test conditions, unless otherwise noted. Product performance may not  
be indicated by the Electrical Characteristics if operated under different conditions.  
©
Semiconductor Components Industries, LLC,2004  
1
Publication Order Number:  
February, 2022 Rev. 3  
MMBD4148SE/D  
MMBD4148SE, MMBD4148CC, MMBD4148CA  
TYPICAL PERFORMANCE CHARACTERISTICS  
150  
140  
Ta = 25°C  
Ta = 25°C  
300  
250  
200  
150  
100  
50  
130  
120  
110  
0
10  
20  
30  
70  
100  
1
2
3
5
10  
20 30  
50  
100  
50  
I , REVERSE CURRENT (mA)  
R
V , REVERSE VOLTAGE (V)  
R
Figure 1. Reverse Voltage vs. Reverse Current  
Figure 2. Reverse Current vs. Reverse Voltage  
BV 1.0 to 100 mA  
IR 10 to 100 V  
Ta = 25°C  
Ta = 25°C  
700  
650  
600  
550  
500  
450  
450  
400  
350  
300  
250  
1
2
3
5
10  
20 30  
50  
100  
0.1  
0.2 0.3 0.5  
1
2
3
5
10  
I , FORWARD CURRENT (mA)  
F
I , REVERSE CURRENT (mA)  
F
Figure 3. Forward Voltage vs. Forward Current  
Figure 4. Forward Voltage vs. Forward Current  
VF 1.0 to 100 mA  
VF 0.1 to 10 mA  
1.3  
1.2  
1.1  
1.0  
Ta = 25°C  
Ta = 25°C  
1.4  
1.2  
1.0  
0.8  
0.6  
6
8
12  
14  
100  
200 300 500  
0
2
4
10  
10  
20  
30  
50  
REVERSE VOLTAGE (V)  
I , FORWARD CURRENT (mA)  
F
Figure 5. Forward Voltage vs. Forward Current  
Figure 6. Total Capacitance vs. Reverse Voltage  
VF 10 to 800 mA  
www.onsemi.com  
2
MMBD4148SE, MMBD4148CC, MMBD4148CA  
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
400  
Ta = 25°C  
300  
I
AVERAGE RECTIFIED CURRENT (mA)  
F(AV)  
200  
100  
0
0
50  
100  
150  
10  
20  
30  
40  
50  
60  
REVERSE CURRENT (mA)  
T , AMBIENT TEMPERATURE (°C)  
A
Figure 7. Reverse Recovery Time vs. Reverse Current  
Figure 8. Average Rectified Current (IF(AV)  
vs. Ambient Temperature (TA)  
)
TRR IR 10 mA to 60 mA  
500  
400  
300  
SOT23 Pkg  
200  
100  
0
0
50  
100  
150  
200  
I , AVERAGE TEMPERATURE (°C)  
O
Figure 9. Power Derating Curve  
www.onsemi.com  
3
MMBD4148SE, MMBD4148CC, MMBD4148CA  
ORDERING INFORMATION  
Part Number  
Top Mark  
Package  
Pinout  
Pinout Style  
Shipping  
MMBD4148SE  
D4  
SOT23  
(PbFree)  
pin 1 = Anode, pin 2 = Cathode,  
pin 3 = Cathode/Anode  
Style 11  
3,000 / Tape & Reel  
3,000 / Tape & Reel  
3,000 / Tape & Reel  
MMBD4148CC  
MMBD4148CA  
D5  
D6  
pin 1 = Anode, pin 2 = Anode,  
pin 3 = Cathode  
Style 23  
Style 12  
pin 1 = Cathode, pin 2 = Cathode,  
pin 3 = Anode/Anode  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D  
www.onsemi.com  
4
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
SOT23 (TO236)  
CASE 318  
ISSUE AT  
DATE 01 MAR 2023  
SCALE 4:1  
GENERIC  
MARKING DIAGRAM*  
XXXMG  
G
1
XXX = Specific Device Code  
M
= Date Code  
G
= PbFree Package  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “G”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
STYLES ON PAGE 2  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98ASB42226B  
SOT23 (TO236)  
PAGE 1 OF 2  
onsemi and  
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves  
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular  
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation  
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.  
© Semiconductor Components Industries, LLC, 2019  
www.onsemi.com  
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
SOT23 (TO236)  
CASE 318  
ISSUE AT  
DATE 01 MAR 2023  
STYLE 1 THRU 5:  
CANCELLED  
STYLE 6:  
STYLE 7:  
PIN 1. EMITTER  
2. BASE  
STYLE 8:  
PIN 1. BASE  
PIN 1. ANODE  
2. EMITTER  
3. COLLECTOR  
2. NO CONNECTION  
3. CATHODE  
3. COLLECTOR  
STYLE 9:  
PIN 1. ANODE  
2. ANODE  
STYLE 10:  
STYLE 11:  
PIN 1. ANODE  
2. CATHODE  
STYLE 12:  
STYLE 13:  
PIN 1. SOURCE  
2. DRAIN  
STYLE 14:  
PIN 1. CATHODE  
2. GATE  
PIN 1. DRAIN  
2. SOURCE  
3. GATE  
PIN 1. CATHODE  
2. CATHODE  
3. ANODE  
3. CATHODE  
3. CATHODEANODE  
3. GATE  
3. ANODE  
STYLE 15:  
STYLE 16:  
STYLE 17:  
PIN 1. NO CONNECTION  
2. ANODE  
STYLE 18:  
STYLE 19:  
STYLE 20:  
PIN 1. CATHODE  
2. ANODE  
PIN 1. GATE  
2. CATHODE  
3. ANODE  
PIN 1. ANODE  
2. CATHODE  
3. CATHODE  
PIN 1. NO CONNECTION PIN 1. CATHODE  
2. CATHODE  
3. ANODE  
2. ANODE  
3. CATHODEANODE  
3. CATHODE  
3. GATE  
STYLE 21:  
STYLE 22:  
STYLE 23:  
PIN 1. ANODE  
2. ANODE  
STYLE 24:  
STYLE 25:  
STYLE 26:  
PIN 1. GATE  
2. SOURCE  
3. DRAIN  
PIN 1. RETURN  
2. OUTPUT  
3. INPUT  
PIN 1. GATE  
2. DRAIN  
PIN 1. ANODE  
2. CATHODE  
3. GATE  
PIN 1. CATHODE  
2. ANODE  
3. SOURCE  
3. NO CONNECTION  
3. CATHODE  
STYLE 27:  
STYLE 28:  
PIN 1. CATHODE  
2. CATHODE  
3. CATHODE  
PIN 1. ANODE  
2. ANODE  
3. ANODE  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98ASB42226B  
SOT23 (TO236)  
PAGE 2 OF 2  
onsemi and  
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves  
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular  
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation  
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.  
© Semiconductor Components Industries, LLC, 2019  
www.onsemi.com  
onsemi,  
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates  
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.  
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. onsemi reserves the right to make changes at any time to any  
products or information herein, without notice. The information herein is provided “asis” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the  
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use  
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products  
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information  
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may  
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license  
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems  
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should  
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ADDITIONAL INFORMATION  
TECHNICAL PUBLICATIONS:  
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