MMBFJ108 [ONSEMI]

N 沟道开关;
MMBFJ108
型号: MMBFJ108
厂家: ONSEMI    ONSEMI
描述:

N 沟道开关

开关 PC 光电二极管 晶体管
文件: 总9页 (文件大小:441K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
N-Channel JFET  
J109, MMBFJ108  
Features  
This Device is Designed for Digital Switching Applications where  
Very Low On Resistance is Mandatory  
Sourced from Process 58  
www.onsemi.com  
These are PbFree Devices  
MAXIMUM RATINGS (T = 25°C unless otherwise specified) (Notes 1, 2)  
A
Symbol  
Parameter  
DrainGate Voltage  
Value  
25  
Unit  
V
V
V
DG  
GS  
GF  
GateSource Voltage  
25  
V
1
I
Forward Gate Current  
10  
mA  
°C  
TO92 3 4.825x4.76  
T , T  
Operating and Storage Junction  
Temperature Range  
55 to 150  
J
STG  
CASE 135AN  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. These ratings are based on a maximum junction temperature of 150°C.  
2. These are steadystate limits. ON Semiconductor should be consulted on  
applications involving pulsed or lowdutycycle operations.  
1
THERMAL CHARACTERISTICS (T = 25°C unless otherwise specified)  
A
TO92 3 4.83x4.76  
LEADFORMED  
CASE 135AR  
Max  
J109  
(Note 3)  
MMBFJ108  
(Note 4)  
Symbol  
Parameter  
Unit  
mW  
P
D
Total Device Dissipation  
Derate Above 25°C  
625  
5.0  
350  
2.8  
3
mW/°C  
°C/W  
1
R
Thermal Resistance,  
JunctiontoCase  
125  
q
JC  
JA  
2
SOT23/SUPERSOTt23,  
R
Thermal Resistance,  
JunctiontoAmbient  
200  
357  
°C/W  
q
3 LEAD, 1.4x2.9  
CASE 527AG  
3. PCB size: FR4, 76 mm x 114 mm x 1.57 mm (3.0 inch x 4.5 inch x 0.062 inch)  
with minimum land pattern size.  
1. Drain, 2. Source, 3. Gate  
4. Device mounted on FR4 PCB 36 mm x 18 mm x 1.5 mm; mounting pad for  
2
the collector lead minimum 6 cm .  
MARKING DIAGRAM  
$Y&Z&3&K  
J109  
$Y&Z&3  
J109  
&Y  
I8 &G  
J109  
J109D26Z  
MMBFJ108  
J109, I8 = Specific Device Code  
$Y  
&Y  
&G  
&Z  
&3  
&K  
= ON Semiconductor Logo  
= Year Coding  
= Weekly Date Code  
= Assembly Plant Code  
= Date Code Format  
= Lot Run Traceability Code  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 5 of  
this data sheet.  
© Semiconductor Components Industries, LLC, 2002  
1
Publication Order Number:  
December, 2020 Rev. 4  
J109/D  
 
J109, MMBFJ108  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
J
Symbol  
Parameter  
Test Condition  
Min  
Max  
Unit  
OFF CHARACTERISTICS  
V
GateSource Breakdown Voltage  
I
= 10 mA, V = 0  
25  
V
(BR)GSS  
G
DS  
I
Gate Reverse Current  
V
V
V
= 15 V, V = 0  
3.0  
200  
10.0  
6.0  
nA  
GSS  
GS  
GS  
DS  
DS  
= 15 V, V = 0, T = 100°C  
DS  
A
V
(off)  
GateSource CutOff Voltage  
= 15 V, I = 10 nA  
MMBFJ108  
J109  
3.0  
2.0  
V
GS  
D
ON CHARACTERISTICS  
I
ZeroGate Voltage Drain Current (Note 5)  
V
V
= 15 V, V = 0  
MMBFJ108  
J109  
80  
40  
mA  
DSS  
DS  
GS  
r
(on)  
DrainSource On Resistance  
0.1 V, V = 0  
MMBFJ108  
J109  
8.0  
12  
W
DS  
DS  
GS  
SMALL SIGNAL CHARACTERISTICS  
C (on)  
dg  
C (off)  
sg  
DrainGate & SourceGate On Capacitance  
V
DS  
= 0, V = 0, f = 1.0 MHz  
85  
pF  
GS  
C (off)  
dg  
C (off)  
sg  
DrainGate Off Capacitance  
SourceGate Off Capacitance  
V
V
= 0, V = 10 V, f = 1.0 MHz  
15  
15  
pF  
pF  
DS  
GS  
= 0, V = 10 V, f = 1.0 MHz  
DS  
GS  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
5. Pulse test: pulse width 300 ms, duty cycle 2%.  
TYPICAL PERFORMANCE CHARACTERISTICS  
300  
V
= 10 mV  
GS  
Unit with Typical  
V
= 500 mV  
= 1.0 V  
GS  
V
(off) = 7.8 V  
GS  
V
V
V
V
T
A
= 25°C  
GS  
GS  
GS  
GS  
250  
200  
150  
100  
50  
= 1.5 V  
= 2.0 V  
= 2.5 V  
= 3.0 V  
V
GS  
V
= 3.5 V  
= 4.0 V  
= 4.5 V  
GS  
V
GS  
GS  
V
V
= 5.0 V  
GS  
V
= 5.5 V  
GS  
V
= 6.5 V  
GS  
V
V
= 6.0 V  
= 7.0 V  
GS  
GS  
0
0
1
2
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
V
DS  
, DRAIN SOURCE VOLTAGE (V)  
Figure 1. Common DrainSource, MMBFJ108  
www.onsemi.com  
2
 
J109, MMBFJ108  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
200  
180  
160  
140  
120  
100  
80  
V
= 0.01 V  
GS  
0.5 V  
1.0 V  
1.5 V  
2.0 V  
2.5 V  
3.5 V  
60  
40  
Unit with Typical  
VGS(off) = 4.8 V  
20  
T
A
= 25°C  
0
0
2
4
6
8
10  
12  
14  
16  
V
DS  
, DRAIN SOURCE VOLTAGE (V)  
Figure 2. Common DrainSource,MMBFJ108, J109  
250  
200  
150  
100  
50  
Unit with Typical  
VGS(off) = 2.9 V  
T
A
= 25°C  
V
= 0.1 V  
GS  
0.5 V  
1.0 V  
1.5 V  
2.0 V  
3
0
0
1
2
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
V
DS  
, DRAIN SOURCE VOLTAGE (V)  
Figure 3. Common DrainSource, J109  
www.onsemi.com  
3
J109, MMBFJ108  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
1000  
100  
10  
1
V
V
V
= 0 PULSED  
= 5 V  
V
I
V
= 100 mV  
= 100 mA  
GS  
GS  
DS  
D
@ V = 15 V, I = 10 nA  
@ V = 15 V, I = 10 nA  
GS(off)  
DS  
D
GS(off)  
DS  
D
100  
10  
1  
1  
10  
100  
25  
10  
V
, GATE CUTOFF VOLTAGE (V)  
V
, GATE CUTOFF VOLTAGE (V)  
GS(off)  
GS(off)  
Figure 4. Drain ON Resistance  
Figure 5. Drain Current vs.  
GateSource CutOff Voltage  
100  
50  
10  
8
V
= 10 V  
T = 25°C  
A
DG  
BW = 6.0 Hz @ f = 10 Hz, 100 Hz  
V
V
= 1.5 V  
= 12 V  
DD  
= 0.21 @ f 1.0 kHz  
GS  
6
I
D
= 30 mA  
10  
5
4
I
D
= 10 mA  
I
D
= 1.0 mA  
I
= 10 mA  
D
2
1
0
0.01  
0.03  
0.1  
0.5  
1
2
10  
0
2  
4  
6  
8  
10  
f, FREQUENCY (Hz)  
V
GS(off)  
, GATE CUTOFF VOLTAGE (V)  
Figure 6. Noise Voltage vs. Frequency  
Figure 7. Switching TurnOn Time vs.  
GateSource CutOff Voltage  
100  
50  
40  
30  
20  
10  
0
VGS = 0 V  
V
V
= 8.5 V  
= 5.5 V  
GS(off)  
GS(off)  
T
A
= 125°C  
25°C  
VGS(off) = 2.9 V  
V
= 3.5 V  
10  
GS(off)  
55°C  
VGS(off) = 4.0 V  
T
= 25°C  
= 1.5 V  
= 12 V  
A
V
V
DD  
GS  
1
1
10  
100  
0
5
10  
15  
20  
I , DRAIN CURRENT (mA)  
D
I , DRAIN CURRENT (mA)  
D
Figure 8. Switching TurnOn Time vs. Drain Current  
Figure 9. On Resistance vs. Drain Current  
www.onsemi.com  
4
J109, MMBFJ108  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
1000  
100  
10  
100  
T
= 25°C  
T
= 25°C  
A
A
f = 1.0 kHz  
V
V
f = 1.0 kHz  
VGS(off) = 4.0 V  
= 10 V  
GS  
GS(off)  
= 3.0 V @ V = 15 V, I = 10 nA  
DS  
D
10  
1
0,1  
1
0,1  
1
10  
0,1  
1
10  
I , DRAIN CURRENT (mA)  
D
I , DRAIN CURRENT (mA)  
D
Figure 10. Output Conductance vs. Drain Current  
Figure 11. Output Conductance vs. Drain Current  
700  
600  
TO92  
500  
SUPERSOT3  
400  
300  
200  
100  
0
0
20  
40  
60  
80  
100  
120  
140  
160  
T, AMBIENT TEMPERATURE (°C)  
Figure 12. Power Dissipation vs. Ambient Temperature  
ORDERING INFORMATION  
Part Number  
Top Mark  
Package  
Shipping  
J109  
J109  
TO92 3L  
(PbFree)  
10000 Units / Bulk  
2000 / Tape & Reel  
3000 / Tape & Reel  
J109D26Z  
J109  
I8  
TO92 3L  
(PbFree)  
MMBFJ108  
SSOT 3L  
(PbFree)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
SUPERSOT is trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.  
www.onsemi.com  
5
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
TO92 3 4.825x4.76  
CASE 135AN  
ISSUE O  
DATE 31 JUL 2016  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13880G  
TO92 3 4.825X4.76  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
© Semiconductor Components Industries, LLC, 2019  
www.onsemi.com  
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
TO92 3 4.83x4.76 LEADFORMED  
CASE 135AR  
ISSUE O  
DATE 30 SEP 2016  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13879G  
TO92 3 4.83X4.76 LEADFORMED  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
© Semiconductor Components Industries, LLC, 2019  
www.onsemi.com  
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
SOT23/SUPERSOTt23, 3 LEAD, 1.4x2.9  
CASE 527AG  
ISSUE A  
DATE 09 DEC 2019  
GENERIC  
MARKING DIAGRAM*  
*This information is generic. Please refer to  
XXX = Specific Device Code  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “G”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
M
= Month Code  
XXXMG  
G
= PbFree Package  
G
(Note: Microdot may be in either location)  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON34319E  
SOT23/SUPERSOT23, 3 LEAD, 1.4X2.9  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
© Semiconductor Components Industries, LLC, 2019  
www.onsemi.com  
onsemi,  
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates  
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.  
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. onsemi reserves the right to make changes at any time to any  
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information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use  
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