MMBZ20VAWT1G [ONSEMI]

齐纳保护,40 瓦峰值功率;
MMBZ20VAWT1G
型号: MMBZ20VAWT1G
厂家: ONSEMI    ONSEMI
描述:

齐纳保护,40 瓦峰值功率

光电二极管 电视 瞬态抑制器
文件: 总5页 (文件大小:107K)
中文:  中文翻译
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MMBZ27VAWT1G  
40 Watt Peak Power  
Zener Transient Voltage  
Suppressors  
SC70 Dual Common Anode Zeners  
for ESD Protection  
http://onsemi.com  
These dual monolithic silicon Zener diodes are designed for  
applications requiring transient overvoltage protection capability. They  
are intended for use in voltage and ESD sensitive equipment such as  
computers, printers, business machines, communication systems,  
medical equipment and other applications. Their dual junction common  
anode design protects two separate lines using only one package. These  
devices are ideal for situations where board space is at a premium.  
1
2
3
MARKING  
DIAGRAM  
Features  
AA MG  
SC70  
CASE 419  
STYLE 4  
G
SC70 Package Allows Either Two Separate Unidirectional  
Configurations or a Single Bidirectional Configuration  
Working Peak Reverse Voltage Range  
1
AA = Specific Device Code  
Standard Zener Breakdown Voltage Range 27 V  
M
= Date Code  
Peak Power 40 W @ 1.0 ms (Unidirectional),  
G
= PbFree Package  
per Figure 5 Waveform  
(Note: Microdot may be in either location)  
ESD Rating:  
Class 3B (>16 kV) per the Human Body Model  
Class C (>400 V) per the Machine Model  
ORDERING INFORMATION  
Low Leakage < 5.0 mA  
Device  
Package  
Shipping  
Flammability Rating UL 94 V0  
This is a PbFree Device  
MMBZ27VAWT1G  
SC70  
(PbFree)  
3000/Tape & Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
Mechanical Characteristics:  
CASE: Void-free, transfer-molded, thermosetting plastic case  
FINISH: Corrosion resistant finish, easily solderable  
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:  
260°C for 10 Seconds  
Package designed for optimal automated board assembly  
Small package size for high density applications  
Available in 8 mm Tape and Reel  
Use the Device Number to order the 7 inch/3,000 unit reel.  
Replace the “T1” with “T3” in the Device Number to order the  
13 inch/10,000 unit reel.  
© Semiconductor Components Industries, LLC, 2008  
1
Publication Order Number:  
May, 2008 Rev. 0  
MMBZ27VAW/D  
MMBZ27VAWT1G  
MAXIMUM RATINGS  
Rating  
Peak Power Dissipation @ 1.0 ms (Note 1)  
@ T 25°C  
Symbol  
Value  
Unit  
P
pk  
40  
W
L
Total Power Dissipation on FR5 Board (Note 2) @ T = 25°C  
°P °  
D
200  
1.6  
°mW°  
mW/°C  
A
Derate above 25°C  
Thermal Resistance JunctiontoAmbient  
Junction and Storage Temperature Range  
R
618  
°C/W  
°C  
q
JA  
T , T  
J
55 to +150  
stg  
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the  
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect  
device reliability.  
1. Nonrepetitive current pulse per Figure 5 and derate above T = 25°C per Figure 6.  
A
2. FR5 = 1.0 x 0.75 x 0.62 in.  
ELECTRICAL CHARACTERISTICS  
I
(T = 25°C unless otherwise noted)  
A
I
F
UNIDIRECTIONAL (Circuit tied to Pins 1 and 3 or 2 and 3)  
Symbol  
Parameter  
I
PP  
Maximum Reverse Peak Pulse Current  
V
Clamping Voltage @ I  
PP  
C
V
C
V
V
BR RWM  
V
I
V
F
V
Working Peak Reverse Voltage  
R
T
RWM  
I
I
R
Maximum Reverse Leakage Current @ V  
RWM  
V
Breakdown Voltage @ I  
Test Current  
BR  
T
I
T
I
PP  
QV  
Maximum Temperature Coefficient of V  
Forward Current  
BR  
BR  
I
F
UniDirectional TVS  
V
F
Forward Voltage @ I  
F
Z
Maximum Zener Impedance @ I  
Reverse Current  
ZT  
ZT  
I
ZK  
Z
ZK  
Maximum Zener Impedance @ I  
ZK  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
A
UNIDIRECTIONAL (Circuit tied to Pins 1 and 3 or Pins 2 and 3)  
(VF = 0.9 V Max @ IF = 10 mA)  
Breakdown Voltage  
V
@ I (Note 4)  
C
PP  
I
V
@
RWM  
nA  
R
V
(Note 3) (V)  
@ I  
V
I
PP  
V
RWM  
QV  
BR  
T
C
BR  
Device  
mV/5C  
24.3  
Volts  
Min  
25.65  
Nom  
Max  
mA  
V
A
Marking  
Device  
MMBZ27VAWT1G  
AA  
22  
50  
27  
28.35  
1.0  
40  
1.0  
3. V measured at pulse test current I at an ambient temperature of 25°C.  
BR  
T
4. Surge current waveform per Figure 5 and derate per Figure 6  
http://onsemi.com  
2
 
MMBZ27VAWT1G  
TYPICAL CHARACTERISTICS  
18  
15  
12  
9
1000  
100  
10  
1
6
3
0
0.1  
0.01  
40  
0
+50  
+100  
+150  
40  
+25  
+85  
+125  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
Figure 1. Typical Breakdown Voltage  
versus Temperature  
Figure 2. Typical Leakage Current  
versus Temperature  
(Upper curve for each voltage is bidirectional mode,  
lower curve is unidirectional mode)  
320  
300  
280  
240  
200  
160  
120  
80  
250  
200  
ALUMINA SUBSTRATE  
5.6 V  
150  
100  
50  
15 V  
FR5 BOARD  
40  
0
0
0
1
2
3
0
25  
50  
75  
100  
125  
150  
175  
BIAS (V)  
TEMPERATURE (°C)  
Figure 3. Typical Capacitance versus Bias Voltage  
(Upper curve for each voltage is unidirectional mode,  
lower curve is bidirectional mode)  
Figure 4. Steady State Power Derating Curve  
http://onsemi.com  
3
MMBZ27VAWT1G  
TYPICAL CHARACTERISTICS  
100  
PULSE WIDTH (t ) IS DEFINED  
P
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
AS THAT POINT WHERE THE  
PEAK CURRENT DECAYS TO  
t 10 ms  
r
50% OF I .  
PP  
100  
PEAK VALUE I  
PP  
I
PP  
HALF VALUE −  
2
50  
0
t
P
0
1
2
3
4
0
25  
50  
75  
100  
125  
150 175 200  
t, TIME (ms)  
T , AMBIENT TEMPERATURE (°C)  
A
Figure 5. Pulse Waveform  
MMBZ27VAWT1  
Figure 6. Pulse Derating Curve  
MMBZ27VAWT1  
100  
100  
10  
1
RECTANGULAR  
WAVEFORM, T = 25°C  
RECTANGULAR  
WAVEFORM, T = 25°C  
A
A
BIDIRECTIONAL  
BIDIRECTIONAL  
10  
UNIDIRECTIONAL  
UNIDIRECTIONAL  
1
0.1  
1
10  
100  
1000  
0.1  
1
10  
100  
1000  
PW, PULSE WIDTH (ms)  
PW, PULSE WIDTH (ms)  
Figure 7. Maximum Nonrepetitive Surge  
Figure 8. Maximum Nonrepetitive Surge  
Power, Ppk versus PW  
Power, Ppk(NOM) versus PW  
Power is defined as V  
x I (pk) where V  
is  
Power is defined as V (NOM) x I (pk) where  
Z Z  
RSM  
Z
RSM  
the clamping voltage at I (pk).  
V (NOM) is the nominal Zener voltage measured at  
Z
Z
the low test current used for voltage classification.  
http://onsemi.com  
4
MMBZ27VAWT1G  
PACKAGE DIMENSIONS  
SC70 (SOT323)  
CASE 41904  
ISSUE M  
D
NOTES:  
e1  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3
MILLIMETERS  
INCHES  
NOM  
0.035  
0.002  
0.028 REF  
0.014  
0.007  
0.083  
0.049  
0.051  
E
H
E
DIM  
A
A1  
A2  
b
c
D
MIN  
0.80  
0.00  
NOM  
0.90  
0.05  
MAX  
1.00  
0.10  
MIN  
0.032  
0.000  
MAX  
0.040  
0.004  
1
2
0.7 REF  
0.35  
0.18  
2.10  
1.24  
0.30  
0.10  
1.80  
1.15  
1.20  
0.40  
0.25  
2.20  
1.35  
1.40  
0.012  
0.004  
0.071  
0.045  
0.047  
0.016  
0.010  
0.087  
0.053  
0.055  
b
e
E
e
1.30  
0.65 BSC  
0.425 REF  
2.10  
0.026 BSC  
0.017 REF  
0.083  
e1  
L
c
H
2.00  
2.40  
0.079  
0.095  
E
A2  
A
STYLE 4:  
PIN 1. CATHODE  
2. CATHODE  
3. ANODE  
0.05 (0.002)  
L
A1  
SOLDERING FOOTPRINT*  
0.65  
0.025  
0.65  
0.025  
1.9  
0.075  
0.9  
0.035  
0.7  
0.028  
mm  
inches  
ǒ
Ǔ
SCALE 10:1  
*For additional information on our PbFree strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 8002829855 Toll Free  
USA/Canada  
Europe, Middle East and Africa Technical Support:  
Phone: 421 33 790 2910  
Japan Customer Focus Center  
Phone: 81357733850  
ON Semiconductor Website: www.onsemi.com  
Order Literature: http://www.onsemi.com/orderlit  
Literature Distribution Center for ON Semiconductor  
P.O. Box 5163, Denver, Colorado 80217 USA  
Phone: 3036752175 or 8003443860 Toll Free USA/Canada  
Fax: 3036752176 or 8003443867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
For additional information, please contact your local  
Sales Representative  
MMBZ27VAW/D  

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