MMQA15VT [ONSEMI]

Transient Voltage Suppressors for ESD Protection; 瞬态电压抑制器ESD保护
MMQA15VT
型号: MMQA15VT
厂家: ONSEMI    ONSEMI
描述:

Transient Voltage Suppressors for ESD Protection
瞬态电压抑制器ESD保护

文件: 总7页 (文件大小:126K)
中文:  中文翻译
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MMQA, SZMMQA Quad  
Common Anode Series  
SC-74 Quad Monolithic  
Common Anode  
Transient Voltage Suppressors for ESD  
Protection  
http://onsemi.com  
SC74 QUAD TRANSIENT  
VOLTAGE SUPPRESSOR  
24 WATTS PEAK POWER  
5.6 33 VOLTS  
This quad monolithic silicon voltage suppressor is designed for  
applications requiring transient overvoltage protection capability. It is  
intended for use in voltage and ESD sensitive equipment such as  
computers, printers, business machines, communication systems,  
medical equipment, and other applications. Its quad junction common  
anode design protects four separate lines using only one package.  
These devices are ideal for situations where board space is at a  
premium.  
SC74  
CASE 318F  
STYLE 1  
Features  
SC74 Package Allows Four Separate Unidirectional Configurations  
Peak Power Min. 24 W @ 1.0 ms (Unidirectional),  
per Figure 5 Waveform  
PIN ASSIGNMENT  
Peak Power Min. 150 W @ 20 ms (Unidirectional),  
per Figure 6 Waveform  
PIN 1. CATHODE  
2. ANODE  
1
2
3
6
5
4
Maximum Clamping Voltage @ Peak Pulse Current  
3. CATHODE  
4. CATHODE  
5. ANODE  
Low Leakage < 2.0 mA  
ESD Rating of Class 3B (exceeding 16 kV) per the Human Body  
6. CATHODE  
Model  
SZ Prefix for Automotive and Other Applications Requiring Unique  
Site and Control Change Requirements; AECQ101 Qualified and  
PPAP Capable  
MARKING DIAGRAM  
PbFree Packages are Available*  
xxxMG  
G
xxx = Specific Device Code  
M
= Date Cade  
G
= PbFree Package  
(Note: Microdot may be in either location)  
DEVICE MARKING & ORDERING  
INFORMATION  
See specific marking and ordering information in the device  
marking and ordering information table on page 6 of this data  
sheet.  
*For additional information on our PbFree strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
© Semiconductor Components Industries, LLC, 2012  
1
Publication Order Number:  
February, 2012 Rev. 10  
MMQA/D  
MMQA, SZMMQA Quad Common Anode Series  
THERMAL CHARACTERISTICS (T = 25°C Unless Otherwise Noted)  
A
Characteristic  
Symbol  
Value  
24  
Unit  
Peak Power Dissipation @ 1.0 ms (Note 1)  
P
pk  
W
@ T 25°C  
A
Peak Power Dissipation @ 20 ms (Note 2)  
P
pk  
W
150  
@ T 25°C  
A
Total Power Dissipation on FR-5 Board (Note 3)  
P
D
225  
1.8  
MW  
mW/°C  
@ T = 25°C  
A
Thermal Resistance from JunctiontoAmbient  
R
556  
°C/W  
q
JA  
Total Power Dissipation on Alumina Substrate (Note 4)  
P
D
@ T = 25°C  
300  
2.4  
MW  
mW/°C  
A
Derate above 25°C  
Thermal Resistance from JunctiontoAmbient  
Junction and Storage Temperature Range  
Lead Solder Temperature Maximum (10 Second Duration)  
R
417  
55 to +150  
260  
°C/W  
°C  
q
JA  
T , T  
J
stg  
T
°C  
L
1. Non-repetitive current pulse per Figure 5 and derate above T = 25°C per Figure 4.  
A
2. Non-repetitive current pulse per Figure 6 and derate above T = 25°C per Figure 4.  
A
3. FR-5 = 1.0 x 0.75 x 0.62 in.  
4. Alumina = 0.4 x 0.3 x 0.024 in., 99.5% alumina  
ELECTRICAL CHARACTERISTICS (T = 25°C Unless Otherwise Noted)  
A
UNIDIRECTIONAL  
(Circuit tied to pins 1, 2, and 5; Pins 2, 3, and 5; Pins 2, 4, and 5; or Pins 2, 5, and 6) (V = 0.9 V Max @ I = 10 mA)  
F
F
Max  
Max  
Reverse  
Voltage @  
Capacitance  
@ 0 Volt  
Bias, 1 MHz  
Reverse  
Leakage  
Current  
Breakdown Voltage  
Max  
Reverse  
Surge  
I
Maximum  
Temperature  
Coefficient  
RSM  
VZT  
(Note 5)  
Max Zener  
Impedance  
(Note 7)  
(Note 6)  
(Clamping  
Voltage)  
(V)  
@ I  
I
V
R
(pF)  
Current  
of V  
ZT  
R
Z
Device  
(Note 8)  
ZZT @ IZT  
IRSM  
(A)  
VRSM  
(V)  
(W) (mA)  
Min  
5.32  
5.89  
6.46  
11.4  
12.4  
14.3  
17.1  
19  
Nom  
5.6  
6.2  
6.8  
12  
Max (mA) (nA) (V)  
(mV/°C)  
1.26  
10.6  
10.9  
14  
Min  
Max  
MMQA5V6T  
MMQA6V2T  
MMQA6V8T  
MMQA12VT  
MMQA13VT  
MMQA15VT  
MMQA18VT  
MMQA20VT  
MMQA21VT  
MMQA22VT  
MMQA24VT  
MMQA27VT  
MMQA33VT  
5.88  
6.51  
7.14  
12.6  
13.7  
15.8  
18.9  
21  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
2000 3.0  
700 4.0  
500 4.3  
400  
300  
300  
80  
3.0  
8.0  
9.0  
2.66  
2.45  
9.8  
100  
250  
75  
75  
75  
75  
75  
75  
75  
75  
75  
75  
9.1  
9.8  
11  
1.39  
17.3  
18.6  
21.7  
26  
13  
80  
1.29  
15  
15  
80  
1.1  
16  
18  
14  
15  
16  
17  
18  
21  
25  
80  
0.923  
0.84  
19  
20  
80  
28.6  
30.3  
31.7  
34.6  
39  
20.1  
21  
20  
21  
22.1  
23.1  
25.2  
28.4  
34.7  
80  
0.792  
0.758  
0.694  
0.615  
0.504  
20.9  
22.8  
25.7  
31.4  
22  
80  
22  
24  
100  
125  
200  
25  
27  
28  
33  
48.6  
37  
5. V measured at pulse test current I at an ambient temperature of 25°C.  
Z
T
6. Surge current waveform per Figure 5 and derate per Figure 4.  
7. Z is measured by dividing the AC voltage drop across the device by the AC current supplied. The specified limits are I  
= 0.1 I  
,
ZT  
Z(AC)  
Z(DC)  
with AC frequency = 1 kHz.  
8. Include SZ-prefix devices where applicable.  
http://onsemi.com  
2
 
MMQA, SZMMQA Quad Common Anode Series  
TYPICAL CHARACTERISTICS  
300  
250  
200  
150  
100  
10,000  
BIASED AT 0 V  
BIASED AT 1 V  
BIASED AT 50%  
1,000  
OF V NOM  
Z
+150°C  
100  
10  
0
+25°C  
-40°C  
50  
0
5.6  
6.8  
20  
27  
33  
5.6  
6.8  
12  
20  
27  
33  
V , NOMINAL ZENER VOLTAGE (V)  
Z
V , NOMINAL ZENER VOLTAGE (V)  
Z
Figure 1. Typical Capacitance  
Figure 2. Typical Leakage Current  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
300  
250  
200  
ALUMINA SUBSTRATE  
150  
100  
50  
FR‐5 BOARD  
0
0
25  
50  
75  
100  
125  
150  
175  
200  
0
25  
50  
75  
100  
125  
150  
175  
T , AMBIENT TEMPERATURE (°C)  
A
T , AMBIENT TEMPERATURE (°C)  
A
Figure 3. Steady State Power Derating Curve  
Figure 4. Pulse Derating Curve  
http://onsemi.com  
3
MMQA, SZMMQA Quad Common Anode Series  
TYPICAL CHARACTERISTICS  
100  
PULSE WIDTH (t ) IS DEFINED  
P
AS THAT POINT WHERE THE  
t
r
PEAK VALUE I  
@ 8 ms  
RSM  
90  
80  
70  
60  
50  
40  
30  
20  
t
r
PEAK CURRENT DECAYS TO 50%  
PULSE WIDTH (t ) IS DEFINED  
P
AS THAT POINT WHERE THE  
OF I  
.
PEAK VALUEꢀ—ꢀI  
RSM  
RSM  
100  
50  
0
t 10 ms  
r
PEAK CURRENT DECAY = 8 ms  
HALF VALUE I /2 @ 20 ms  
RSM  
I
RSM  
HALF VALUEꢀ—  
2
t
P
t
P
10  
0
0
1
2
3
4
0
20  
40  
t, TIME (ms)  
60  
80  
t, TIME (ms)  
Figure 5. 10 × 1000 ms Pulse Waveform  
Figure 6. 8 × 20 ms Pulse Waveform  
200  
180  
160  
140  
120  
100  
80  
100  
RECTANGULAR  
WAVEFORM, TA = 25°C  
8 × 20 WAVEFORM AS PER FIGURE  
NO TAG  
10  
UNIDIRECTIONAL  
10 × 100 WAVEFORM AS PER FIGURE  
NO TAG  
60  
40  
20  
0
1.0  
0.1  
1.0  
10  
100  
1000  
5.6  
6.8  
12  
20  
NOMINAL V  
27  
33  
PW, PULSE WIDTH (ms)  
Z
Figure 7. Maximum NonRepetitive Surge  
Figure 8. Typical Maximum NonRepetitive  
Power, Ppk versus PW  
Surge Power, Ppk versus VZ  
Power is defined as V  
x I (pk) where V  
is the clamping voltage at I (pk).  
RSM Z  
RSM  
Z
http://onsemi.com  
4
MMQA, SZMMQA Quad Common Anode Series  
TYPICAL COMMON ANODE APPLICATIONS  
A quad junction common anode design in a SC-74  
package protects four separate lines using only one package.  
This adds flexibility and creativity to PCB design especially  
when board space is at a premium. A simplified example of  
MMQA/SZMMQA Series Device applications is illustrated  
below.  
A
B
KEYBOARD  
TERMINAL  
PRINTER  
ETC.  
FUNCTIONAL  
DECODER  
C
I/O  
D
GND  
MMQA/SZMMQA SERIES DEVICE  
Figure 9. Computer Interface Protection  
V
DD  
V
GG  
ADDRESS BUS  
RAM  
ROM  
DATA BUS  
CPU  
I/O  
CLOCK  
CONTROL BUS  
GND  
MMQA/SZMMQA  
SERIES DEVICE  
Figure 10. Microprocessor Protection  
http://onsemi.com  
5
MMQA, SZMMQA Quad Common Anode Series  
DEVICE MARKING AND ORDERING INFORMATION  
Device*  
MMQA5V6T1  
Device Marking  
5A6  
Package  
SC74  
SC74  
SC74  
SC74  
SC74  
SC74  
SC74  
SC74  
SC74  
SC74  
SC74  
SC74  
SC74  
SC74  
SC74  
SC74  
Shipping  
3,000/Tape & Reel  
3,000/Tape & Reel  
10,000/Tape & Reel  
3,000/Tape & Reel  
3,000/Tape & Reel  
3,000/Tape & Reel  
3,000/Tape & Reel  
3,000/Tape & Reel  
3,000/Tape & Reel  
10,000/Tape & Reel  
3,000/Tape & Reel  
3,000/Tape & Reel  
3,000/Tape & Reel  
3,000/Tape & Reel  
10,000/Tape & Reel  
3,000/Tape & Reel  
MMQA6V2T1  
MMQA6V2T3  
MMQA6V8T1  
MMQA12VT1  
MMQA13VT1  
MMQA15VT1  
MMQA18VT1  
MMQA20VT1  
MMQA20VT3  
MMQA21VT1  
MMQA22VT1  
MMQA24VT1  
MMQA27VT1  
MMQA27VT3  
MMQA33VT1  
6A2  
6A2  
6A8  
12A  
13A  
15A  
18A  
20A  
20A  
21A  
22A  
24A  
27A  
27A  
33A  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specification Brochure, BRD8011/D.  
*Include SZ-prefix devices where applicable.  
Mechanical Characteristics:  
CASE: Voidfree, Transfermolded, Thermosetting Plastic Case.  
FINISH: Corrosion resistant finish, easily solderable.  
Package designed for optimal automated board assembly.  
Small package size for high density applications.  
Available in 8 mm Tape and Reel.  
Use the Device Number to order the 7 inch/3,000 unit reel.  
Replace the “T1” with “T3” in the Device Number to order the 13 inch/10,000 unit reel.  
http://onsemi.com  
6
MMQA, SZMMQA Quad Common Anode Series  
PACKAGE DIMENSIONS  
SC74  
CASE 318F05  
ISSUE M  
D
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH  
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM  
THICKNESS OF BASE MATERIAL.  
4. 318F01, 02, 03, 04 OBSOLETE. NEW STANDARD  
318F05.  
6
5
2
4
E
H
E
1
3
MILLIMETERS  
INCHES  
NOM  
0.039  
0.002  
0.015  
0.007  
0.118  
0.059  
0.037  
0.016  
0.108  
DIM  
A
A1  
b
c
D
E
e
L
MIN  
0.90  
0.01  
0.25  
0.10  
2.90  
1.30  
0.85  
0.20  
2.50  
0°  
NOM  
1.00  
0.06  
0.37  
0.18  
3.00  
1.50  
0.95  
0.40  
2.75  
MAX  
MIN  
0.035  
0.001  
0.010  
0.004  
0.114  
0.051  
0.034  
0.008  
0.099  
0°  
MAX  
0.043  
0.004  
0.020  
0.010  
0.122  
0.067  
0.041  
0.024  
0.118  
10°  
1.10  
0.10  
0.50  
0.26  
3.10  
1.70  
1.05  
0.60  
3.00  
10°  
b
e
q
C
A
0.05 (0.002)  
H
E
q
L
A1  
STYLE 1:  
PIN 1. CATHODE  
2. ANODE  
3. CATHODE  
4. CATHODE  
5. ANODE  
SOLDERING FOOTPRINT*  
6. CATHODE  
2.4  
0.094  
0.95  
0.037  
1.9  
0.074  
0.95  
0.037  
0.7  
0.028  
1.0  
0.039  
mm  
inches  
ǒ
Ǔ
SCALE 10:1  
*For additional information on our PbFree strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 8002829855 Toll Free  
USA/Canada  
Europe, Middle East and Africa Technical Support:  
Phone: 421 33 790 2910  
Japan Customer Focus Center  
Phone: 81358171050  
ON Semiconductor Website: www.onsemi.com  
Order Literature: http://www.onsemi.com/orderlit  
Literature Distribution Center for ON Semiconductor  
P.O. Box 5163, Denver, Colorado 80217 USA  
Phone: 3036752175 or 8003443860 Toll Free USA/Canada  
Fax: 3036752176 or 8003443867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
For additional information, please contact your local  
Sales Representative  
MMQA/D  

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