MMSZ4703T3 [ONSEMI]
16V, 0.5W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, PLASTIC, CASE 425-04, 2 PIN;
| 型号： | MMSZ4703T3 |
| 厂家： | 
ONSEMI |
| 描述： | 16V, 0.5W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, PLASTIC, CASE 425-04, 2 PIN |
| 文件： | 总8页 (文件大小：76K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MMSZ4678T1 Series
Zener Voltage Regulators
500 mW SOD–123 Surface Mount
Three complete series of Zener diodes are offered in the convenient,
surface mount plastic SOD–123 package. These devices provide a
convenient alternative to the leadless 34–package style.
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Specification Features:
• 500 mW Rating on FR–4 or FR–5 Board
• Wide Zener Reverse Voltage Range – 1.8 V to 43 V
• Package Designed for Optimal Automated Board Assembly
• Small Package Size for High Density Applications
• ESD Rating of Class 3 (>16 KV) per Human Body Model
1
2
Cathode
Anode
Mechanical Characteristics:
2
CASE: Void-free, transfer-molded, thermosetting plastic case
FINISH: Corrosion resistant finish, easily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds
POLARITY: Cathode indicated by polarity band
FLAMMABILITY RATING: UL94 V–0
1
SOD–123
CASE 425
STYLE 1
MAXIMUM RATINGS
MARKING DIAGRAM
xx M
Rating
Symbol
Max
Unit
Total Power Dissipation on FR–5 Board,
P
D
(Note 1.) @ T = 75°C
500
6.7
mW
mW/°C
L
Derated above 75°C
xx = Specific Device Code
Thermal Resistance –
Junction to Ambient (Note 2.)
R
340
°C/W
°C/W
°C
q
JA
M
= Date Code
Thermal Resistance –
Junction to Lead (Note 2.)
R
q
JL
150
Junction and Storage
Temperature Range
T , T
J
–55 to
+150
ORDERING INFORMATION
stg
{
Device
Package
Shipping
3000/Tape & Reel
1. FR–5 = 3.5 X 1.5 inches, using the On minimum recommended footprint as
shown in Figure 11
2. Thermal Resistance measurement obtained via infrared Scan Method
MMSZ4xxxT1
MMSZ4xxxT3
SOD–123
SOD–123 10,000/Tape & Reel
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
this data sheet.
Devices listed in bold, italic are ON Semiconductor
Preferred devices. Preferred devices are recommended
choices for future use and best overall value.
†The “T1” suffix refers to an 8 mm, 7 inch reel.
The “T3” suffix refers to an 8 mm, 13 inch reel.
Semiconductor Components Industries, LLC, 2001
1
Publication Order Number:
May, 2001 – Rev. 1
MMSZ4678T1/D
MMSZ4678T1 Series
ELECTRICAL CHARACTERISTICS (T = 25°C unless
I
A
otherwise noted, V = 0.95 V Max. @ I = 10 mA)
F
F
I
F
Symbol
Parameter
V
Z
Reverse Zener Voltage @ I
ZT
I
ZT
Reverse Current
V
Z
V
R
I
Reverse Leakage Current @ V
Reverse Voltage
R
R
V
I
V
F
R
ZT
V
I
R
I
F
Forward Current
V
F
Forward Voltage @ I
F
Zener Voltage Regulator
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2
MMSZ4678T1 Series
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted, V = 0.9 V Max. @ I = 10 mA)
A
F
F
Zener Voltage (Notes 3.)
Leakage Current
@ V
V (Volts)
Z
@ I
I
R
ZT
R
Device
Min
Nom
Max
mA
mA
Volts
Marking
Device
MMSZ4678T1
MMSZ4679T1
MMSZ4680T1
MMSZ4681T1
MMSZ4682T1
CC
CD
CE
CF
CH
1.71
1.90
2.09
2.28
2.565
1.8
2.0
2.2
2.4
2.7
1.89
2.10
2.31
2.52
2.835
50
50
50
50
50
7.5
5
4
2
1
1
1
1
1
1
MMSZ4683T1
MMSZ4684T1
MMSZ4685T1
MMSZ4686T1
MMSZ4687T1
CJ
CK
CM
CN
CP
2.85
3.13
3.42
3.70
4.09
3.0
3.3
3.6
3.9
4.3
3.15
3.47
3.78
4.10
4.52
50
50
50
50
50
0.8
7.5
7.5
5
1
1.5
2
2
2
4
MMSZ4688T1
MMSZ4689T1
MMSZ4690T1
MMSZ4691T1
MMSZ4692T1
CT
CU
CV
CA
CX
4.47
4.85
5.32
5.89
6.46
4.7
5.1
5.6
6.2
6.8
4.94
5.36
5.88
6.51
7.14
50
50
50
50
50
10
10
10
10
10
3
3
4
5
5.1
MMSZ4693T1
MMSZ4694T1
MMSZ4695T1
MMSZ4696T1
MMSZ4697T1
CY
CZ
DC
DD
DE
7.13
7.79
8.27
8.65
9.50
7.5
8.2
8.7
9.1
10
7.88
8.61
9.14
9.56
10.50
50
50
50
50
50
10
1
1
1
1
5.7
6.2
6.6
6.9
7.6
MMSZ4698T1
MMSZ4699T1
MMSZ4700T1
MMSZ4701T1
MMSZ4702T1
DF
DH
DJ
DK
DM
10.45
11.40
12.35
13.30
14.25
11
12
13
14
15
11.55
12.60
13.65
14.70
15.75
50
50
50
50
50
0.05
0.05
0.05
0.05
0.05
8.4
9.1
9.8
10.6
11.4
MMSZ4703T1
MMSZ4704T1
MMSZ4705T1
MMSZ4706T1
MMSZ4707T1
DN
DP
DT
DU
DV
15.20
16.15
17.10
18.05
19.00
16
17
18
19
20
16.80
17.85
18.90
19.95
21.00
50
50
50
50
50
0.05
0.05
0.05
0.05
0.01
12.1
12.9
13.6
14.4
15.2
MMSZ4708T1
MMSZ4709T1
MMSZ4710T1
MMSZ4711T1
MMSZ4712T1
DA
DX
DY
EA
EC
20.90
22.80
23.75
25.65
26.60
22
24
25
27
28
23.10
25.20
26.25
28.35
29.40
50
50
50
50
50
0.01
0.01
0.01
0.01
0.01
16.7
18.2
19.0
20.4
21.2
MMSZ4713T1
MMSZ4714T1
MMSZ4715T1
MMSZ4716T1
MMSZ4717T1
ED
EE
EF
EH
EJ
28.50
31.35
34.20
37.05
40.85
30
33
36
39
43
31.50
34.65
37.80
40.95
45.15
50
50
50
50
50
0.01
0.01
0.01
0.01
0.01
22.8
25.0
27.3
29.6
32.6
3. Nominal Zener voltage is measured with the device junction in thermal equilibrium at T = 30°C ±1°C
L
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3
MMSZ4678T1 Series
TYPICAL CHARACTERISTICS
8
7
6
5
4
3
100
TYPICAL T VALUES
C
TYPICAL T VALUES
C
V @ I
Z
ZT
V @ I
Z
ZT
10
2
1
0
-1
-2
-3
1
2
3
4
5
6
7
8
9
10
11
12
10
100
V , NOMINAL ZENER VOLTAGE (V)
Z
V , NOMINAL ZENER VOLTAGE (V)
Z
Figure 1. Temperature Coefficients
Figure 2. Temperature Coefficients
(Temperature Range –55°C to +150°C)
(Temperature Range –55°C to +150°C)
1.2
1.0
0.8
0.6
1000
100
10
RECTANGULAR
WAVEFORM, T = 25°C
A
P versus T
D
L
P versus T
D
A
0.4
0.2
0
1
0.1
0
25
50
75
100
125
150
1
10
100
1000
T, TEMPERATURE (°C)
PW, PULSE WIDTH (ms)
Figure 3. Steady State Power Derating
Figure 4. Maximum Nonrepetitive Surge Power
1000
100
10
1000
100
10
T = 25°C
I = 0.1 I
Z(AC) Z(DC)
f = 1 kHz
75 V (MMSZ5267BT1)
91 V (MMSZ5270BT1)
J
I = 1 mA
Z
5 mA
20 mA
75°C 25°C
0.6 0.7
0°C
150°C
0.5
1
1
0.4
1
10
V , NOMINAL ZENER VOLTAGE
100
0.8
0.9
1.0
1.1
1.2
V , FORWARD VOLTAGE (V)
F
Z
Figure 5. Effect of Zener Voltage on
Zener Impedance
Figure 6. Typical Forward Voltage
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4
MMSZ4678T1 Series
TYPICAL CHARACTERISTICS
1000
100
1000
T = 25°C
A
100
10
0 V BIAS
1 V BIAS
1
+150°C
BIAS AT
50% OF V NOM
0.1
0.01
Z
10
1
+25°C
-55°C
0.001
0.0001
0.00001
1
10
100
0
10
20
30
40
50
60
70
80
90
V , NOMINAL ZENER VOLTAGE (V)
Z
V , NOMINAL ZENER VOLTAGE (V)
Z
Figure 7. Typical Capacitance
Figure 8. Typical Leakage Current
100
10
100
10
T = 25°C
A
T = 25°C
A
1
1
0.1
0.01
0.1
0.01
10
30
50
70
90
0
2
4
6
8
10
12
V , ZENER VOLTAGE (V)
Z
V , ZENER VOLTAGE (V)
Z
Figure 10. Zener Voltage versus Zener Current
(12 V to 91 V)
Figure 9. Zener Voltage versus Zener Current
(VZ Up to 12 V)
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5
MMSZ4678T1 Series
INFORMATION FOR USING THE SOD-123 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINTS FOR SURFACE MOUNT APPLICATIONS
Surface mount board layout is a critical portion of the
total design. The footprint for the semiconductor packages
0.91
0.036
must be the correct size to ensure proper solder connection
interface between the board and the package.
The minimum recommended footprint for the SOD-123
is shown at the right.
1.22
0.048
The SOD-123 package can be used on existing surface
mount boards which have been designed for the leadless 34
package style. The footprint compatibility makes
conversion from leadless 34 to SOD-123 straightforward.
2.36
0.093
4.19
mm
inches
0.165
Figure 11. Minimum Recommended Footprint
SOD-123 POWER DISSIPATION
The power dissipation of the SOD-123 is a function of
the pad size. This can vary from the minimum pad size for
soldering to a pad size given for maximum power
dissipation. Power dissipation for a surface mount device is
into the equation for an ambient temperature T of 25°C,
one can calculate the power dissipation of the device which
in this case is 0.37 watts.
A
150°C – 25°C
= 0.37 watts
PD
=
determined by T
, the maximum rated junction
J(max)
340°C/W
temperature of the die, R , the thermal resistance from
θJA
the device junction to ambient; and the operating
The 340°C/W for the SOD-123 package assumes using
recommended footprint shown on FR-4 glass epoxy printed
circuit board. Another alternative is to use a ceramic
substrate or an aluminum core board such as
Thermal Clad . By using an aluminum core board
material such as Thermal Clad, the power dissipation can
be doubled using the same footprint.
temperature, T . Using the values provided on the data
A
sheet for the SOD-123 package, P can be calculated as
D
follows:
TJ(max) – TA
PD
=
Rθ
JA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values
GENERAL SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within
a short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
• Always preheat the device.
• The delta temperature between the preheat and
soldering should be 100°C or less.*
• When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering
method, the difference shall be a maximum of 10°C.
• The soldering temperature and time shall not exceed
260°C for more than 10 seconds.
• When shifting from preheating to soldering, the
maximum temperature gradient shall be 5°C or less.
• After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and
result in latent failure due to mechanical stress.
• Mechanical stress or shock should not be applied
during cooling
* Soldering a device without preheating can cause
excessive thermal shock and stress which can result in
damage to the device.
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6
MMSZ4678T1 Series
PACKAGE DIMENSIONS
Zener Voltage Regulators – Surface Mounted
500 mW SOD–123
SOD–123
CASE 425–04
ISSUE C
A
C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
H
1
INCHES
DIM MIN MAX
MILLIMETERS
MIN
1.40
2.55
0.95
0.50
0.25
0.00
---
MAX
1.80
2.85
1.35
0.70
---
A
B
C
D
E
H
J
0.055
0.100
0.037
0.020
0.01
0.071
0.112
0.053
0.028
---
K
B
0.000
---
0.140
0.004
0.006
0.152
0.10
0.15
3.85
K
3.55
E
STYLE 1:
2
PIN 1. CATHODE
2. ANODE
J
D
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7
MMSZ4678T1 Series
Thermal Clad is a registered trademark of the Bergquist Company
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,
including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or
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attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
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CENTRAL/SOUTH AMERICA:
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Phone: 81–3–5740–2700
Email: r14525@onsemi.com
English Phone: (+1) 303–308–7142 (Mon–Fri 12:00pm to 5:00pm GMT)
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EUROPEAN TOLL–FREE ACCESS*: 00–800–4422–3781
For additional information, please contact your local
Sales Representative.
*Available from Germany, France, Italy, UK, Ireland
MMSZ4678T1/D
相关型号：
MMSZ4704-E3-08
Zener Diode, 17V V(Z), 5%, 0.5W, Silicon, Unidirectional, ROHS COMPLIANT, PLASTIC PACKAGE-2
VISHAY
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