NB100LVEP56_06 [ONSEMI]

2.5V / 3.3V ECL DUAL Differential 2:1 Multiplexer; 2.5V / 3.3V ECL双差分2 : 1多路复用器
NB100LVEP56_06
型号: NB100LVEP56_06
厂家: ONSEMI    ONSEMI
描述:

2.5V / 3.3V ECL DUAL Differential 2:1 Multiplexer
2.5V / 3.3V ECL双差分2 : 1多路复用器

复用器
文件: 总10页 (文件大小:150K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
NB100LVEP56  
2.5V / 3.3V ECL DUAL  
Differential 2:1 Multiplexer  
Description  
The NB100LVEP56 is a dual, fully differential 2:1 multiplexer. The  
differential data path makes the device ideal for multiplexing low  
skew clock or differential data signals. The device features both  
individual and common select inputs to address both data path and  
random logic applications. Common and individual selects can accept  
http://onsemi.com  
MARKING  
DIAGRAMS*  
both LVECL and LVCMOS input voltage levels. Multiple V pins  
BB  
are provided.  
The V pin, an internally generated voltage supply, is available to  
this device only. For singleended input operation, the unused  
BB  
N100  
VP56  
ALYWG  
G
differential input is connected to V as a switching reference voltage.  
BB  
V
may also rebias AC coupled inputs. When used, decouple V  
BB  
BB  
and V via a 0.01 mF capacitor and limit current sourcing or sinking  
CC  
TSSOP20  
DT SUFFIX  
CASE 948E  
to 0.5 mA. When not used, V should be left open.  
BB  
Features  
Maximum Input Clock Frequency > 2.5 GHz Typical  
Maximum Input Data Rate > 2.5 Gb/s Typical  
525 ps Typical Propagation Delays  
Low Profile QFN Package  
24  
1
N100  
VP56  
ALYWG  
G
24  
1
24 PIN QFN  
MN SUFFIX  
CASE 485L  
PECL Mode Operating Range:  
V
CC  
= 2.375 V to 3.8 V with V = 0 V  
EE  
NECL Mode Operating Range:  
= 0 V with V = 2.375 V to 3.8 V  
V
CC  
EE  
A
L
Y
W
G
= Assembly Location  
Separate, Common Select, and Individual Select  
= Wafer Lot  
= Year  
(Compatible with ECL and CMOS Input Voltage Levels)  
= Work Week  
= PbFree Package  
Q Output Will Default LOW with Inputs Open or at V  
EE  
Multiple V Outputs  
BB  
(Note: Microdot may be in either location)  
*For additional marking information, refer to  
Application Note AND8002/D.  
PbFree Packages are Available  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 8 of this data sheet.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
November, 2006 Rev. 9  
NB100LVEP56/D  
NB100LVEP56  
Table 1. PIN FUNCTION DESCRIPTION  
Pin No.  
Default  
State  
TSSOP  
QFN  
Name  
I/O  
Description  
14,20  
3,9,18,19,  
20  
V
Positive Supply Voltage. All VCC Pins must be Externally  
Connected to Power Supply to Guarantee Proper Operation.  
CC  
11  
3,8  
1
15,24  
6,12  
4
V
Negative Supply Voltage. All VEE Pins must be Externally  
Connected to Power Supply to Guarantee Proper Operation.  
EE  
V
,
ECL Reference Voltage Output  
BB0  
BB1  
V
D0a  
ECL Input  
ECL Input  
ECL Input  
ECL Input  
ECL Input  
ECL Input  
ECL Input  
ECL Input  
ECL Output  
ECL Output  
ECL Output  
ECL Output  
Low  
High  
Low  
High  
Low  
High  
Low  
High  
Noninverted Differential Data a Input to MUX 0. Internal 75 kW to  
V
.
EE  
2
5
D0a  
Inverted Differential Data a Input to MUX 0. Internal 75 kW to V  
EE  
and 37 kW to V  
.
CC  
4
7
D0b  
Noninverted Differential Data b Input to MUX 0. Internal 75 kW to  
V
.
EE  
5
8
D0b  
Inverted Differential Data b Input to MUX 0. Internal 75 kW to V  
EE  
and 37 kW to V  
.
CC  
6
10  
11  
13  
14  
2
D1a  
Noninverted Differential Data a Input to MUX 1. Internal 75 kW to  
V
.
EE  
7
D1a  
Inverted Differential Data a Input to MUX 1. Internal 75 kW to V  
EE  
and 37 kW to V  
.
CC  
9
D1b  
Noninverted Differential Data b Input to MUX 1. Internal 75 kW to  
V
.
EE  
10  
19  
18  
13  
12  
17  
16  
15  
N/A  
D1b  
Inverted Differential Data b Input to MUX 1. Internal 75 kW to V  
EE  
and 37 kW to V  
.
CC  
Q0  
Noninverted Differential Output MUX 0. Typically Terminated with  
50 W to V = V 2.0 V.  
TT  
CC  
1
Q0  
Inverted Differential Output MUX 0. Typically Terminated with  
50 W to V = V 2.0 V.  
TT  
CC  
17  
16  
23  
22  
21  
Q1  
Noninverted Differential Output MUX 1. Typically Terminated with  
50 W to V = V 2.0 V.  
TT  
CC  
Q1  
Inverted Differential Output MUX 1. Typically Terminated with  
50 W to V = V 2.0 V.  
TT  
CC  
SEL0  
COM_SEL  
SEL1  
EP  
ECL, CMOS  
Input  
Low  
Low  
Low  
Noninverted Differential Select Input to MUX 0. Internal 75 W to  
V
.
EE  
ECL, CMOS  
Input  
Noninverted Differential Common Select Input to Both MUX.  
Internal 75 W to V  
.
EE  
ECL, CMOS  
Input  
Noninverted Differential Select Input to MUX 1. Internal 75 W to  
V
.
EE  
Exposed Pad. (Note 1)  
1. The thermally conductive exposed pad on the package bottom (see case drawing) must be attached to a heat sinking conduit.  
http://onsemi.com  
2
 
NB100LVEP56  
D0a  
R
1
1
R
R
2
Q0  
Q0  
D0a  
R
1
D0b  
0
Table 2. TRUTH TABLE  
R
1
SEL0  
2
SEL0  
SEL1  
COM_SEL Q0, Q0 Q1, Q1  
R
R
R
1
1
1
D0b  
R
X
L
L
H
H
X
L
H
H
L
H
L
L
L
L
a
b
b
a
a
a
b
a
a
b
1
COM_SEL  
SEL1  
D1a  
R
1
1
R
R
2
D1a  
Q1  
Q1  
R
1
D1b  
0
R
1
V
V
CC  
2
EE  
D1b  
R
1
Exposed Pad  
(EP)  
COM  
SEL  
Figure 1. Logic Diagram  
V
SEL0  
SEL1 V  
V
CC CC  
EE  
24  
23  
22  
21  
20  
19  
Q0  
Q0  
V
CC  
1
18  
17  
20 19 18 17 16 15 14 13 12  
11  
Q1  
2
3
4
5
6
V
16 Q1  
CC  
NB100LVEP56  
NB100LVEP56  
15  
D0a  
V
EE  
14  
13  
D1b  
D1b  
D0a  
1
2
3
4
5
6
7
8
9
10  
V
BB0  
7
8
9
10  
11  
12  
Figure 2. TSSOP20 Lead Pinout (Top View)  
D0b D0b V  
D1a D1a V  
BB1  
CC  
Figure 3. QFN24 Lead Pinout (Top View)  
Table 3. ATTRIBUTES  
Characteristics  
Value  
Internal Input Pulldown Resistor  
Internal Input Pullup Resistor  
ESD Protection  
(R1)  
(R2)  
75 kW  
37 kW  
Human Body Model  
Machine Model  
Charged Device Model  
> 2 kV  
> 150 V  
> 2 kV  
Moisture Sensitivity (Note 1)  
Pb Pkg  
PbFree Pkg  
TSSOP20  
QFN24  
Level 1  
Level 1  
Level 1  
Level 1  
Flammability Rating  
Transistor Count  
Oxygen Index: 28 to 34  
UL 94 V0 @ 0.125 in  
354 Devices  
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test  
1. For additional information, see Application Note AND8003/D.  
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3
 
NB100LVEP56  
Table 4. MAXIMUM RATINGS  
Symbol  
Parameter  
Condition 1  
= 0 V  
Condition 2  
Rating  
Unit  
V
V
V
V
Positive Mode Power Supply  
V
V
6
CC  
EE  
I
EE  
CC  
Negative Mode Power Supply  
= 0 V  
6  
V
Positive Mode Input Voltage  
Negative Mode Input Voltage  
V
V
= 0 V  
= 0 V  
V v V  
6
6  
V
V
EE  
CC  
I
CC  
EE  
V w V  
I
I
Output Current  
Continuous  
Surge  
50  
100  
mA  
mA  
out  
I
V
Sink/Source  
BB  
"0.5  
mA  
°C  
BB  
T
Operating Temperature Range  
Storage Temperature Range  
40 to +85  
65 to +150  
A
T
°C  
stg  
q
Thermal Resistance (JunctiontoAmbient)  
JEDEC 513 (1S Single Layer Test Board)  
0 lfpm  
500 lfpm  
TSSOP20  
TSSOP20  
140  
50  
°C/W  
°C/W  
JA  
q
Thermal Resistance (JunctiontoAmbient)  
JEDEC 516 (2S2PMulti Layer Test Board)  
with Filled Thermal Vias  
0 lfpm  
500 lfpm  
QFN24  
QFN24  
37  
32  
°C/W  
°C/W  
JA  
q
Thermal Resistance (JunctiontoCase)  
Standard Board  
TSSOP20  
QFN24  
23 to 41  
11  
°C/W  
°C  
JC  
T
sol  
Wave Solder  
Pb  
PbFree  
265  
265  
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the  
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect  
device reliability.  
Table 5. DC CHARACTERISTICS, PECL V = 2.5 V, V = 0 V (Note 2)  
CC  
EE  
40°C  
Typ  
45  
25°C  
Typ  
45  
85°C  
Typ  
48  
Min  
Max  
Min  
Max  
Min  
Max  
Symbol  
Characteristic  
Negative Power Supply Current  
Output HIGH Voltage (Note 3)  
Unit  
mA  
mV  
I
35  
55  
35  
55  
35  
58  
EE  
V
V
V
1355 1480 1605 1355 1480 1605 1355 1480 1605  
OH  
OL  
IH  
Output LOW Voltage (Note 3)  
555  
775  
900  
555  
775  
900  
555  
775  
900  
mV  
mV  
Input HIGH Voltage (SEL0, SEL1, COM_SEL) 1335  
V
1335  
V
1275  
V
CC  
1620  
CC  
CC  
1335  
1620 1335  
1620 1275  
Input HIGH Voltage (D Inputs) (Note 4)  
V
V
Input LOW Voltage (SEL0, SEL1, COM_SEL)  
Input LOW Voltage (D Inputs) (Note 4)  
V
875  
875  
V
875  
875  
V
EE  
875  
875  
mV  
V
IL  
EE  
EE  
555  
555  
555  
Input HIGH Voltage Common Mode Range  
(Differential Configuration) (Note 5)  
1.2  
2.5  
1.2  
2.5  
1.2  
2.5  
IHCMR  
I
I
Input HIGH Current (@V  
)
IH  
150  
150  
150  
mA  
mA  
IH  
IL  
Input LOW Current (@V )  
D
D
SEL  
0.5  
150  
150  
0.5  
150  
150  
0.5  
150  
150  
IL  
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit  
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared  
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit  
values are applied individually under normal operating conditions and not valid simultaneously.  
2. Input and output parameters vary 1:1 with V . V can vary 0.125 V to +1.3 V.  
CC  
EE  
3. All loading with 50 W to V 2.0 V.  
CC  
4. Do not use V at V < 3.0 V.  
BB  
CC  
5. V  
min varies 1:1 with V , V  
max varies 1:1 with V . The V  
range is referenced to the most positive side of the differential  
IHCMR  
EE IHCMR  
CC  
IHCMR  
input signal.  
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4
 
NB100LVEP56  
Table 6. DC CHARACTERISTICS, PECL V = 3.3 V, V = 0 V (Note 6)  
CC  
EE  
40°C  
Typ  
45  
25°C  
Typ  
45  
85°C  
Typ  
Min  
Max  
Min  
Max  
Min  
Max  
58  
Symbol  
Characteristic  
Negative Power Supply Current  
Output HIGH Voltage (Note 7)  
Output LOW Voltage (Note 7)  
Unit  
mA  
mV  
mV  
mV  
I
35  
55  
35  
55  
35  
48  
EE  
V
V
V
2155 2280 2405 2155 2280 2405 2155  
1355 1575 1700 1355 1575 1700 1355  
2280  
1575  
2405  
1700  
OH  
OL  
IH  
Input HIGH Voltage (SEL0, SEL1, COM_SEL)  
Input HIGH Voltage (D Inputs)  
2135  
2135  
V
2135  
V
2135  
V
CC  
2420  
CC  
CC  
2420 2135  
2420 2135  
V
Input LOW Voltage (SEL0, SEL1, COM_SEL)  
Input LOW Voltage (D Inputs)  
V
1675  
V
1675  
V
1675  
1675  
mV  
IL  
EE  
EE  
EE  
1355  
1675 1355  
1675 1355  
V
V
Output Reference Voltage (Note 8)  
1775 1875 1975 1775 1875 1975 1775  
1875  
1975  
3.3  
mV  
V
BB  
Input HIGH Voltage Common Mode Range  
(Differential Configuration) (Note 9)  
1.2  
3.3  
1.2  
3.3  
1.2  
IHCMR  
I
I
Input HIGH Current (@V  
)
IH  
150  
150  
150  
mA  
mA  
IH  
IL  
Input LOW Current (@V )  
D
D
SEL  
0.5  
150  
150  
0.5  
150  
150  
0.5  
150  
150  
IL  
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit  
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared  
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit  
values are applied individually under normal operating conditions and not valid simultaneously.  
6. Input and output parameters vary 1:1 with V . V can vary +0.5 V to 0.3 V.  
CC  
EE  
7. All loading with 50 W to V 2.0 V.  
CC  
8. SingleEnded input operation is limited to V w 3.0 V in PECL mode.  
CC  
9. V  
min varies 1:1 with V , V  
max varies 1:1 with V . The V  
range is referenced to the most positive side of the differential  
IHCMR  
EE IHCMR  
CC  
IHCMR  
input signal.  
Table 7. DC CHARACTERISTICS, NECL V = 0 V, V = 3.8 V to 2.375 V (Note 10)  
CC  
EE  
40°C  
25°C  
85°C  
Min  
Typ  
Max  
Min  
Typ  
Max  
Min  
Typ  
Max  
Symbol  
Characteristic  
Unit  
mA  
mV  
I
Negative Power Supply Current  
Output HIGH Voltage (Note 11)  
35  
45  
55  
35  
45  
55  
35  
48  
58  
EE  
V
V
V
1145 1020 895 1145 1020 895 1145 1020 895  
OH  
OL  
IH  
Output LOW Voltage (Note 11)  
1945 1725 1600 1945 1725 1600 1945 1725 1600 mV  
Input HIGH Voltage  
(SEL0, SEL1, COM_SEL)  
Input HIGH Voltage (D Inputs)  
mV  
1165  
1165  
V
1165  
V
1165  
V
CC  
880  
CC  
CC  
880 1165  
880 1165  
V
Input LOW Voltage  
(SEL0, SEL1, COM_SEL)  
Input LOW Voltage (D Inputs)  
mV  
IL  
V
1600  
V
1600  
V
1600  
1600  
EE  
EE  
EE  
1945  
1600 1945  
1600 1945  
V
V
Output Reference Voltage (Note 12)  
1525 1425 1325 1525 1425 1325 1525 1425 1325 mV  
BB  
Input HIGH Voltage Common Mode  
Range (Differential Configuration)  
(Note 13)  
V
+1.2  
EE  
0.0  
V
+1.2  
EE  
0.0  
V
+1.2  
EE  
0.0  
V
IHCMR  
I
I
Input HIGH Current (@V  
)
IH  
150  
150  
150  
mA  
mA  
IH  
IL  
Input LOW Current (@V )  
D
D
0.5  
150  
0.5  
150  
150  
0.5  
150  
150  
IL  
SEL 150  
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit  
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared  
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit  
values are applied individually under normal operating conditions and not valid simultaneously.  
10.Input and output parameters vary 1:1 with V  
.
CC  
11. All loading with 50 W to V 2.0 V.  
CC  
12.SingleEnded input operation is limited to V from 3.0 V to 5.5 V in NECL mode.  
EE  
13.V  
min varies 1:1 with V , V  
max varies 1:1 with V . The V  
range is referenced to the most positive side of the differential  
IHCMR  
EE IHCMR  
CC  
IHCMR  
input signal.  
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5
 
NB100LVEP56  
Table 8. AC CHARACTERISTICS V = 0 V; V = 2.375 V to 3.8 V or V = 2.375 V to 3.8 V; V = 0 V (Note 14)  
CC  
EE  
CC  
EE  
40°C  
25°C  
85°C  
Min  
v 1 GHz 525  
in  
Typ  
Max  
Min  
Typ  
Max  
Min  
Typ  
Max  
Symbol  
Characteristic  
Unit  
V
Output Voltage Amplitude  
(See Figure 4)  
f
700  
600  
500  
550  
500  
350  
700  
600  
450  
500  
400  
200  
700  
500  
300  
mV  
OUTPP  
f
= 2 GHz 500  
in  
f
= 2.5 GHz 400  
in  
t
t
,
Propagation Delay to Output Differential  
ps  
ps  
ps  
PLH  
PHL  
D to Q, Q 375  
500  
775  
750  
625  
975  
950  
400  
625  
600  
525  
650  
450  
575  
900  
900  
700  
1100  
1100  
SEL to Q, Q 575  
COM_SEL to Q, Q 550  
825 1025 700  
800 1000 700  
t
t
Pulse Skew (Note 15)  
10  
5
15  
50  
50  
30  
50  
200  
10  
5
15  
50  
10  
5
15  
50  
50  
30  
50  
200  
Skew  
Within Device Input Skew (Note 16)  
Within Device Output Skew (Note 17)  
DevicetoDevice Skew (Note 18)  
RMS Random Clock Jitter (Note 19)  
JITTER  
@ v1.0 GHz  
0.269  
0.306  
0.250  
0.339  
0.4  
0.4  
0.4  
0.8  
0.307  
0.303  
0.305  
0.895  
0.4  
0.4  
0.5  
2.0  
0.371  
0.391  
0.722  
2.443  
0.5  
0.6  
1.2  
7.7  
@ v1.5 GHz  
@ v2.0 GHz  
@ v2.5 GHz  
PeaktoPeak Data Dependent Jitter (Note 20)  
@ 0.5 GHz  
@ 1.25 GHz  
@ 2.488 GHz  
4.1  
32.2  
30.8  
16  
80  
66  
4.6  
22.6  
27.2  
15  
63  
56  
4.4  
22  
24.4  
16  
53  
54  
V
Input Voltage Swing (Differential Configuration)  
(Note 21)  
150  
60  
800 1200 150  
800 1200 150  
800 1200 mV  
INPP  
t
t
Output Rise/Fall Times @ 50 MHz  
Q, Q  
ps  
r
f
(20% 80%)  
110  
150  
60  
120  
170  
90  
140  
230  
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit  
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared  
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit  
values are applied individually under normal operating conditions and not valid simultaneously.  
14.Measured using a 750 mV source, 50% duty cycle clock source. All loading with 50 W to V 2.0 V. Input edge rates 150 ps (20% 80%).  
CC  
15.Pulse Skew |t  
t  
PHL  
|
PLH  
16.Worst case difference between D0a and D0b (or between D1a or D1b), when both output come from same input.  
17.Worst case difference between Q0 and Q1 outputs.  
18.Skew is measured between outputs under identical transitions.  
19.Additive RMS jitter with 50% Duty Cycle Clock Signal.  
31  
20.Additive PeaktoPeak jitter with input NRZ data at PRBS 2 1.  
21.Input voltage swing is a singleended measurement operating in differential mode.  
850  
Q AMP (mV)  
750  
650  
550  
450  
350  
250  
0.5  
1.0  
1.5  
2.0  
2.5  
INPUT FREQUENCY (GHz)  
Figure 4. Output Voltage Amplitude (VOUTPP) vs.  
Input Frequency (fin) at VCC = 2.5 V, 255C  
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NB100LVEP56  
D
V
V
= V (D) V (D)  
IH IL  
INPP  
D
Q
= V (Q) V (Q)  
OUTPP  
OH  
OL  
Q
t
PHL  
t
PLH  
Figure 5. AC Reference Measurement  
Z = 50 W  
Q
Q
D
o
Receiver  
Device  
Driver  
Device  
Z = 50 W  
o
D
50 W  
50 W  
V
TT  
V
= V 2.0 V  
TT  
CC  
Figure 6. Typical Termination for Output Driver and Device Evaluation  
(See Application Note AND8020/D Termination of ECL Logic Devices.)  
http://onsemi.com  
7
NB100LVEP56  
ORDERING INFORMATION  
Device  
Package  
TSSOP20*  
TSSOP20*  
TSSOP20*  
TSSOP20*  
QFN24  
Shipping†  
75 Units / Rail  
75 Units / Rail  
2500 Tape & Reel  
2500 Tape & Reel  
92 Units / Rail  
92 Units / Rail  
NB100LVEP56DT  
NB100LVEP56DTG  
NB100LVEP56DTR2  
NB100LVEP56DTR2G  
NB100LVEP56MN  
NB100LVEP56MNG  
QFN24  
(PbFree)  
NB100LVEP56MNR2  
NB100LVEP56MNR2G  
QFN24  
3000 Tape & Reel  
3000 Tape & Reel  
QFN24  
(PbFree)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specification Brochure, BRD8011/D.  
*This package is inherently PbFree.  
Resource Reference of Application Notes  
AN1405/D  
AN1406/D  
AN1503/D  
AN1504/D  
AN1568/D  
AN1672/D  
AND8001/D  
AND8002/D  
AND8020/D  
AND8066/D  
AND8090/D  
ECL Clock Distribution Techniques  
Designing with PECL (ECL at +5.0 V)  
ECLinPSt I/O SPiCE Modeling Kit  
Metastability and the ECLinPS Family  
Interfacing Between LVDS and ECL  
The ECL Translator Guide  
Odd Number Counters Design  
Marking and Date Codes  
Termination of ECL Logic Devices  
Interfacing with ECLinPS  
AC Characteristics of ECL Devices  
http://onsemi.com  
8
NB100LVEP56  
PACKAGE DIMENSIONS  
TSSOP20  
CASE 948E02  
ISSUE C  
NOTES:  
20X K REF  
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
K
K1  
M
S
S
V
0.10 (0.004)  
T U  
S
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION A DOES NOT INCLUDE MOLD  
FLASH, PROTRUSIONS OR GATE BURRS.  
MOLD FLASH OR GATE BURRS SHALL NOT  
EXCEED 0.15 (0.006) PER SIDE.  
0.15 (0.006) T U  
J J1  
20  
11  
2X L/2  
4. DIMENSION B DOES NOT INCLUDE  
INTERLEAD FLASH OR PROTRUSION.  
INTERLEAD FLASH OR PROTRUSION  
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.  
5. DIMENSION K DOES NOT INCLUDE  
DAMBAR PROTRUSION. ALLOWABLE  
DAMBAR PROTRUSION SHALL BE 0.08  
(0.003) TOTAL IN EXCESS OF THE K  
DIMENSION AT MAXIMUM MATERIAL  
CONDITION.  
B
SECTION NN  
L
U−  
PIN 1  
IDENT  
0.25 (0.010)  
N
1
10  
6. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
7. DIMENSION A AND B ARE TO BE  
DETERMINED AT DATUM PLANE W.  
M
S
0.15 (0.006) T U  
A
V−  
N
MILLIMETERS  
INCHES  
DIM MIN  
MAX  
6.60  
4.50  
1.20  
0.15  
0.75  
MIN  
MAX  
0.260  
0.177  
F
A
B
6.40  
4.30  
−−−  
0.252  
0.169  
DETAIL E  
C
−−− 0.047  
0.006  
0.030  
D
0.05  
0.50  
0.002  
0.020  
F
G
H
0.65 BSC  
0.026 BSC  
W−  
0.27  
0.09  
0.09  
0.19  
0.19  
0.37  
0.20  
0.16  
0.30  
0.25  
0.011  
0.004  
0.004  
0.007  
0.007  
0.015  
0.008  
0.006  
0.012  
0.010  
C
J
J1  
K
G
D
H
K1  
L
DETAIL E  
6.40 BSC  
0.252 BSC  
0
0.100 (0.004)  
TSEATING  
M
0
8
8
_
_
_
_
PLANE  
SOLDERING FOOTPRINT*  
7.06  
1
0.65  
PITCH  
01.36X6  
16X  
1.26  
DIMENSIONS: MILLIMETERS  
*For additional information on our PbFree strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
http://onsemi.com  
9
NB100LVEP56  
PACKAGE DIMENSIONS  
QFN 24  
MN SUFFIX  
24 PIN QFN, 4x4  
CASE 485L01  
ISSUE O  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ASME  
Y14.5M, 1994.  
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. DIMENSION b APPLIES TO PLATED TERMINAL  
AND IS MEASURED BETWEEN 0.25 AND 0.30 MM  
FROM TERMINAL.  
D
A
B
E
PIN 1  
IDENTIFICATION  
4. COPLANARITY APPLIES TO THE EXPOSED PAD  
AS WELL AS THE TERMINALS.  
MILLIMETERS  
DIM MIN  
MAX  
1.00  
0.05  
0.80  
2X  
A
A1  
A2  
A3  
b
0.80  
0.00  
0.60  
0.15  
C
0.20 REF  
2X  
0.15  
C
0.23  
0.28  
D
4.00 BSC  
A2  
D2  
E
2.70  
2.90  
0.10  
C
4.00 BSC  
E2  
e
2.70  
2.90  
A
0.50 BSC  
0.08  
C
L
0.35  
0.45  
A3  
SEATING  
PLANE  
REF  
A1  
C
D2  
e
L
7
12  
6
1
13  
E2  
24X  
b
18  
24  
19  
e
0.10 C A B  
0.05 C  
ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC).  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 8002829855 Toll Free  
USA/Canada  
Europe, Middle East and Africa Technical Support:  
Phone: 421 33 790 2910  
Japan Customer Focus Center  
Phone: 81357733850  
ON Semiconductor Website: www.onsemi.com  
Order Literature: http://www.onsemi.com/orderlit  
Literature Distribution Center for ON Semiconductor  
P.O. Box 5163, Denver, Colorado 80217 USA  
Phone: 3036752175 or 8003443860 Toll Free USA/Canada  
Fax: 3036752176 or 8003443867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
For additional information, please contact your local  
Sales Representative  
NB100LVEP56/D  

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