NC7NZ17L8X-L22185 [ONSEMI]
带施密特触发器输入的TinyLogic UHS三通道缓冲器;
| 型号： | NC7NZ17L8X-L22185 |
| 厂家： | 
ONSEMI |
| 描述： | 带施密特触发器输入的TinyLogic UHS三通道缓冲器 触发器 |
| 文件： | 总9页 (文件大小：423K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
www.onsemi.com
MARKING
DIAGRAMS
TinyLogic UHS Triple Buffer
with Schmitt Trigger Inputs
UQFN8
1.6X1.6, 0.5P
CASE 523AY
U4KK
XYZ
NC7NZ17
Description
The NC7NZ17 is a triple buffer with Schmitt trigger inputs from
onsemi’s Ultra High Speed Series of TinyLogic in the US8 package.
The device is fabricated with advanced CMOS technology to achieve
ultra high speed with high output drive while maintaining low static
NZ17
ALYW
US8
CASE 846AN
power dissipation over a very broad V operating range. The device
CC
is specified to operate over the 1.65 V to 5.5 V V range. The inputs
CC
and outputs are high impedance when V is 0 V. Inputs tolerate
CC
voltages up to 5.5 V independent of V operating voltage. Schmitt
CC
trigger inputs typically achieve 1 V hysteresis between the positive
U4, NZ17 = Specific Device Code
KK
XY
Z
= 2−Digit Lot Run Traceability Code
= 2−Digit Date Code Format
= Assembly Plant Code
= Assembly Site
going and negative going input threshold voltage at 5 V V
.
CC
Features
A
• Space Saving US8 Surface Mount Package
• MicroPak™ Pb−Free Leadless Package
• Ultra High Speed: t 3.6 ns Typ into 50 pF at 5 V V
L
= Wafer Lot Number
YW
= Assembly Start Week
PD
CC
• High Output Drive: 24 mA at 3 V V
CC
ORDERING INFORMATION
See detailed ordering, marking and shipping information on
page 6 of this data sheet.
• Broad V Operating Range: 1.65 V to 5.5 V
CC
• Power Down High Impedance Inputs / Outputs
• Overvoltage Tolerant Inputs Facilitate 5 V to 3 V Translation
• Proprietary Noise / EMI Reduction Circuitry Implemented
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
IEEE / IEC
(1)
(3)
(7)
(5)
1A
2A
1Y
2Y
(6)
(2)
3A
3Y
Figure 1. Logic Symbol
© Semiconductor Components Industries, LLC, 2005
1
Publication Order Number:
June, 2022 − Rev. 3
NC7NZ17/D
NC7NZ17
Connection Diagrams
V
1Y
7
3A
6
2Y
5
CC
8
1A
7
3Y
6
2A
5
V
CC
8
4 GND
1
2
3
4
1
2
3
1A
3Y
2A
GND
1Y
3A
2Y
Figure 2. Connection Diagram (Top View)
Figure 4. Pad Assignments for MicroPak
(Top Thru View)
AAA
(Top View)
Pin One
AAA represents Product Code Top Mark − see ordering code
NOTE: Orientation of Top Mark determines Pin One location.
Read the Top Product Code Mark left to right, Pin One
is the lower left pin (see diagram).
Figure 3. Pin One Orientation Diagram
PIN DESCRIPTIONS
FUNCTION TABLE (Y = A)
Name
A , A , A
Description
Data Inputs
Output
Input
Output
A
L
Y
L
1
2
3
3
Y , Y , Y
1
2
H
H
H = HIGH Logic Level
L = LOW Logic Level
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2
NC7NZ17
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Min
−0.5
−0.5
−0.5
−
Max
6.5
Unit
V
V
CC
Supply Voltage
V
IN
DC Input Voltage
6.5
V
V
DC Output Voltage
DC Input Diode Current
DC Output Diode Current
DC Output Current
6.5
V
OUT
I
V
V
< 0 V
−50
−50
50
mA
mA
mA
mA
°C
IK
IN
I
< 0 V
−
OK
OUT
I
−
OUT
I
/ I
DC V / GND Current
−
100
+150
+150
+260
CC GND
CC
T
STG
Storage Temperature
−65
−
T
Junction Temperature under Bias
°C
J
L
T
Junction Lead Temperature (Soldering, 10 Seconds)
Power Dissipation in Still Air
−
°C
P
D
US8
MicroPak−8
−
−
500
539
mW
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
1.65
1.5
0
Max
5.5
5.5
5.5
Unit
V
CC
Supply Voltage Operating
V
Supply Voltage Data Retention
Input Voltage
V
IN
V
V
V
OUT
Output Voltage
0
V
CC
T
Operating Temperature
Thermal Resistance
−40
+85
°C
A
q
US8
MicroPak−8
−
−
250
232
°C/W
JA
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
1. Unused inputs must be held HIGH or LOW. They may not float.
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3
NC7NZ17
DC ELECTICAL CHARACTERISTICS
T
A
= +25°C
Typ
1.07
1.38
1.74
2.43
2.88
0.56
0.75
0.98
1.42
1.68
0.51
0.62
0.76
1.01
1.20
1.65
2.3
T = −40 to +85°C
A
Min
−
Max
1.5
1.8
2.2
3.1
3.6
−
Min
Max
1.5
1.8
2.2
3.1
3.6
−
Symbol
Parameter
V
CC
(V)
Conditions
Unit
V
P
V
N
V
H
Positive Threshold
Voltage
1.65
2.3
3.0
4.5
5.5
1.65
2.3
3.0
4.5
5.5
1.65
2.3
3.0
4.5
5.5
1.65
2.3
3.0
4.5
1.65
2.3
3.0
3.0
4.5
1.65
2.3
3.0
4.5
−
−
−
−
−
V
−
−
−
−
Negative Threshold
Voltage
0.25
0.40
0.6
1.0
1.2
0.15
0.25
0.4
0.6
0.7
1.55
2.2
2.9
4.4
1.29
1.9
2.4
2.3
3.8
−
0.25
0.40
0.6
1.0
1.2
0.15
0.25
0.4
0.6
0.7
1.55
2.2
2.9
4.4
1.29
1.9
2.4
2.3
3.8
−
V
V
V
−
−
−
−
−
−
−
−
Hysteresis Voltage
1.0
1.1
1.2
1.5
1.7
−
1.0
1.1
1.2
1.5
1.7
−
V
OH
HIGH Level Output
Voltage
V
= V
I
= −100 mA
IN
IH
OH
−
−
3.0
−
−
4.5
−
−
I
I
I
I
I
I
= −4 mA
= −8 mA
= −16 mA
= −24 mA
= −32 mA
= 100 mA
1.52
2.14
2.75
2.62
4.13
0.0
−
−
OH
OH
OH
OH
OH
OL
−
−
−
−
−
−
−
−
V
OL
LOW Level Output
Voltage
V
IN
= V
IL
0.1
0.1
0.1
0.1
0.1
0.1
0.1
V
−
0.0
−
−
0.0
−
−
0.0
−
0.1
0.24
0.3
1.65
2.3
3.0
3.0
4.5
I
I
I
I
I
= 4 mA
−
−
−
−
−
−
−
0.08
0.10
0.16
0.24
0.25
−
0.24
0.3
0.4
0.55
0.55
0.1
1
−
−
−
−
−
−
−
OL
OL
OL
OL
OL
= 8 mA
= 16 mA
= 24 mA
= 32 mA
= 5.5 V, GND
0.4
0.55
0.55
1.0
I
Input Leakage Current 1.65 to 5.5
V
V
mA
mA
IN
IN
IN
I
Power Off Leakage
Current
0.0
or V
= 5.5 V
−
10
OFF
OUT
I
Quiescent Supply
Current
1.65 to 5.5
V
IN
= 5.5 V, GND
−
−
1.0
−
10
mA
CC
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4
NC7NZ17
AC ELECTRICAL CHARACTERISTICS
T
A
= +25°C
T = −40 to +85°C
A
Min
Typ
Max
11.9
8.2
5.6
4.7
6.6
5.6
−
Min
−
Max
13.1
9.0
6.2
5.2
7.3
6.2
−
Symbol
, t
Parameter
V
(V)
Conditions
Unit
CC
t
Propagation Delay
(Figure 5, 7)
ns
1.8 0.15 C = 15 pF,
−
−
−
−
−
−
−
−
−
6.9
4.8
3.7
3.0
4.3
3.6
2.5
9
PLH PHL
L
R = 1 MW,
L
2.5 0.2
3.3 0.3
5.0 0.5
3.3 0.3
5.0 0.5
0
−
−
−
C = 50 pF,
−
L
R = 500 W,
L
−
C
C
Input Capacitance
−
pF
pF
IN
Power Dissipation Capacitance
(Figure 6)
−
−
3.3
(Note 2)
−
PD
−
−
5.0
11
−
2. C is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (I
) at
CCD
PD
CCD
no output loading and operating at 50% duty cycle. (See Figure 6). C is related to I
dynamic operating current by the expression: I
PD
CCD
= (C ) (V ) (f ) + (I static).
PD
CC
IN
CC
AC ELECTRICAL CHARACTERISTICS
T
A
= +25°C
Typical
0.8
Symbol
Parameter
Conditions
C = 50 pF, V = 5.0 V, V = 0 V
V
(V)
Unit
V
CC
V
OLP
Quiet Output Dynamic Peak V
5.0
5.0
OL
L
IH
IL
V
OLV
Quiet Output Dynamic Valley V
C = 50 pF, V = 5.0 V, V = 0 V
−0.8
V
OL
L
IH
IL
AC Loading and Waveforms
t = 3 ns
r
t = 3 ns
f
V
CC
90%
50%
90%
50%
V
CC
INPUT
10%
10%
t
W
GND
INPUT
OUTPUT
t
t
PHL
PLH
C
R
L
V
L
OH
50%
50%
OUTPUT
C includes load and stray capacitance
L
Input PRR = 1.0 MHz, t = 500 ns.
V
OL
W
Figure 5. AC Test Circuit
Figure 7. AC Waveforms
V
CC
A
INPUT
Input = AC Waveform; t = t = 1.8 ns;
r
f
PRR = variable; Duty Cycle = 50%.
Figure 6. ICCD Test Circuit
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5
NC7NZ17
ORDERING INFORMATION
Part Number
†
Top Mark
Package
Shipping
NC7NZ17K8X
NZ17
8−Lead US8, JEDEC MO−187, Variation CA
3000 / Tape & Reel
5000 / Tape & Reel
5000 / Tape & Reel
3.1 mm Wide
NC7NZ17L8X
U4
U4
8−Lead MicroPak, 1.6 mm Wide
(Pb−Free)
NC7NZ17L8X−L22185
8−Lead MicroPak, 1.6 mm Wide
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
3. Pb−Free package per JEDEC J−STD−020B.
MicroPak is trademark of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other
countries.
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6
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UQFN8 1.6X1.6, 0.5P
CASE 523AY
ISSUE O
DATE 31 AUG 2016
0.40
(6X)
1.60
A
0.05
C
1.60
B
0.45
(2X)
2X
1.60
1.61
0.05
C
PIN#1 IDENT
0.50
TOP VIEW
0.25
(8X)
RECOMMENDED
LAND PATTERN
0.50 0.05
0.05
0.05
C
C
NOTES:
SEATING
PLANE
A. PACKAGE CONFORMS TO JEDEC MO−255
C
VARIATION UAAD.
0.025 0.025
B. DIMENSIONS ARE IN MILLIMETERS.
SIDE VIEW
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 2009.
1.60 0.05
D. LAND PATTERN RECOMMENDATION IS
EXISTING INDUSTRY LAND PATTERN.
(0.10)
(0.20)3X
(0.09)
DETAIL A
1
2
3
(0.20)
4
8
1.60 0.05
0.30 0.05
0.30 0.05 (7X)
0.50
(0.15)
7
6
5
0.20 0.05 (8X)
0.30 0.05
0.10
0.05
C
C
A
B
1.00 0.05
DETAIL A
SCALE : 2X
BOTTOM VIEW
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON13591G
UQFN8 1.6X1.6, 0.5P
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
US8
CASE 846AN
ISSUE O
DATE 31 DEC 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON13778G
US8
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should
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ADDITIONAL INFORMATION
TECHNICAL PUBLICATIONS:
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For additional information, please contact your local Sales Representative at
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