NC7ST04M5X-L22090 [ONSEMI]
TinyLogic HST 逆变器;
| 型号： | NC7ST04M5X-L22090 |
| 厂家： | 
ONSEMI |
| 描述： | TinyLogic HST 逆变器 |
| 文件： | 总7页 (文件大小：296K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
www.onsemi.com
MARKING
DIAGRAMS
TinyLogic HST Inverter
NC7ST04
8S04MG
SC−74A
CASE 318BQ
G
5
Description
The NC7ST04 is a single high performance CMOS Inverter, with
TTL−compatible inputs. Advanced Silicon Gate CMOS fabrication
assures high speed and low power circuit operation. ESD protection
1
diodes inherently guard both input and output with respect to the V
and GND rails. High gain circuitry offers high noise immunity and
SOT23−5
CASE 527AH
CC
8S04M
reduced sensitivity to input edge rate. The TTL−compatible input
facilitates TTL to NMOS/CMOS interfacing. Device performance is
1
similar to MM74HCT but with
HC/HCT.
/ the output current drive of
2
T04MG
SC−88A
CASE 419A−02
G
Features
• Space Saving SOT23−5, SC−74A and SC−88A 5−Lead Packages
• High Speed; t < 7 ns typ, V = 5 V, C = 15 pF
PD
CC
L
8S04, T04 = Specific Device Code
= Date Code*
M
• Low Quiescent Power; I < 1 mA typ, V = 5.5 V
CC
CC
*Date Code orientation and/or position may
vary depending upon manufacturing location.
• Balanced Output Drive; 2 mA I , −2 mA I
OL
OH
• TTL−compatible Inputs
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
PIN ASSIGNMENT
IEEC / IEC
Pin Name
Description
A
Input
1
A
Y
Y
Output
Figure 1. Logic Symbol
NC
No Connect
1
2
3
5
4
NC
V
Y
FUNCTION TABLE (Y = A)
CC
Input
A
Output
Y
A
GND
L
H
L
H
(Top View)
H = HIGH Logic Level
L = LOW Logic Level
Figure 2. Connection Diagram
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 3 of this data sheet.
© Semiconductor Components Industries, LLC, 2004
1
Publication Order Number:
June, 2022 − Rev. 4
NC7ST04/D
NC7ST04
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Min
−0.5
−
Max
6.5
Unit
V
V
CC
IK
Supply Voltage
I
DC Input Diode Current
V
V
< 0 V
−20
+20
mA
IN
> V
−
IN
CC
V
DC Input Voltage
−0.5
−
V
V
+ 0.5 V
−20
V
IN
CC
I
DC Output Diode Current
V
V
< 0 V
mA
OK
OUT
> V
−
+20
OUT
CC
V
OUT
DC Output Voltage
−0.5
−
+ 0.5 V
12.5
V
mA
mA
°C
CC
I
DC Output Source or Sink Current
OUT
I
or I
DC V or Ground Current per Supply Pin
−
25
CC
GND
CC
T
STG
Storage Temperature Range
Junction Temperature
−65
−
+150
150
T
°C
J
DC V or Ground Current per (Soldering, 10 Seconds)
−
+260
390
°C
CC
P
D
Power Dissipation in Still Air
SC−74A / SOT23−5
SC−88A
−
mW
−
332
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Supply Voltage
Conditions
Min
4.5
0
Max
Unit
V
V
CC
5.5
V
IN
Input Voltage
V
CC
V
CC
V
V
OUT
Output Voltage
0
V
T
Operating Temperature
Input Rise and Fall Times
Thermal Resistance
−40
0
+85
10
°C
A
t , t
r
V = 5.0 V
CC
ns/V
°C/W
f
q
SC−74A / SOT23−5
SC−88A
−
320
377
JA
−
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
1. Unused inputs must be held HIGH or LOW. They may not float.
DC ELECTICAL CHARACTERISTICS
T
A
= +25°C
T = −40 to +85°C
A
Symbol
Parameter
V
(V)
Conditions
Min
2.0
−
Typ
−
Max
−
Min
2.0
Max
−
Unit
V
CC
V
IH
HIGH Level Input Voltage
LOW Level Input Voltage
4.5 − 5.5
4.5 − 5.5
4.5
V
IL
−
0.8
−
−
4.4
4.13
−
0.8
−
V
V
OH
HIGH Level Output
Voltage
I
= −20 mA,
4.4
4.18
−
4.5
4.35
0
V
OH
IN
V
= V or V ,
IH
IL
4.5
−
−
I
= −2 mA
OH
V
LOW Level Output
Voltage
4.5
I
= 20 mA,
0.1
0.26
0.1
1.0
2.0
0.1
0.33
1.0
10.0
2.9
V
OL
IN
OL
V
= V or V ,
IN
IH
IL
4.5
−
0.10
−
−
I
OL
= 2 mA
I
Input Leakage Current
5.5
0 ≤ V ≤ 5.5 V
−
−
mA
mA
IN
I
Quiescent Supply Current
5.5
V
= V or GND
−
−
−
CC
IN
CC
I
I
per Input
5.5
Input V = 0.5 V or 2.4 V
−
−
−
mA
CCT
CC
IN
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2
NC7ST04
AC ELECTRICAL CHARACTERISTICS
T
A
= 25°C
Typ
T = −40 to 85°C
A
Symbol
, t
Parameter
V
(V)
Conditions
Min
−
Max
12
17
16
27
14
26
10
25
21
10
−
Min
Max
−
Unit
CC
t
Propagation Delay
(Figure 3, 5)
5.0
C = 15 pF
L
3.5
−
−
−
−
−
−
−
−
−
−
−
ns
PLH PHL
−
6.0
6.2
11.4
4.3
11.1
4
−
4.5
5.5
C = 50 pF
L
−
20
31
18
30
−
−
−
−
t
, t
Output Transition Time
(Figure 3, 5)
5.0
4.5
5.5
C = 15 pF
−
ns
TLH THL
L
C = 50 pF
L
−
11
31
26
−
−
10
2
C
Input Capacitance
Open
5.00
−
pF
pF
IN
C
Power Dissipation Capacitance
(Figure 4)
(Note 2)
−
6
−
PD
2. C is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (I
) at
PD
CCD
no output lading and operating at 50% duty cycle. C is related to I
dynamic operating current by the expression:
PD
CCD
I
= (C ) (V ) (f ) + (I
).
CCD
PD
CC
IN
CCstatic
AC Loading and Waveforms
V
CC
INPUT
OUTPUT
C
L
C includes load and stray capacitance;
L
t = 6 ns
r
t = 6 ns
f
inputs PRR = 1.0 MHz, t = 500 ns.
3.0 V
W
90%
90%
Figure 3. AC Test Circuit
V
CC
1.3 V
1.3 V
INPUT
10%
10%
t
W
GND
A
t
t
PHL
PLH
V
V
OH
90%
90%
INPUT
OUTPUT
1.3 V
10%
1.3 V
10%
OL
t
t
THL
TLH
Input = AC Waveform; PRR = Variable; Duty Cycle = 50%.
Figure 4. ICCD Test Circuit
Figure 5. AC Waveforms
DEVICE ORDERING INFORMATION
†
Device
NC7ST04M5X
Top Mark
8S04
8S04
T04
Packages
SC−74A
SOT23−5
SC−88A
SC−88A
Shipping
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
NC7ST04M5X−L22090
NC7ST04P5X
NC7ST04P5X−L22057
T04
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
www.onsemi.com
3
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−74A
CASE 318BQ
ISSUE B
5
1
DATE 18 JAN 2018
SCALE 2:1
5X b
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
0.20 C A B
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE.
M
5
4
E1
E
1
2
3
0.05
A1
L
B
e
DETAIL A
A
D
MILLIMETERS
DIM
A
A1
b
c
D
E
E1
e
MIN
0.90
0.01
0.25
0.10
2.85
2.50
1.35
MAX
1.10
0.10
0.50
0.26
3.15
3.00
1.65
TOP VIEW
SIDE VIEW
A
DETAIL A
c
0.95 BSC
SEATING
PLANE
END VIEW
C
L
M
0.20
0
0.60
10
_
_
RECOMMENDED
GENERIC
SOLDERING FOOTPRINT*
MARKING DIAGRAM*
0.95
PITCH
XXX MG
G
XXX
M
= Specific Device Code
= Date Code
2.40
G
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present. Some products
may not follow the Generic Marking.
5X
1.00
5X
0.70
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON66279G
SC−74A
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2018
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE M
SCALE 2:1
DATE 11 APR 2023
GENERIC MARKING
DIAGRAM*
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
XXXMG
G
XXX = Specific Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
STYLE 1:
STYLE 2:
STYLE 3:
PIN 1. ANODE 1
2. N/C
STYLE 4:
STYLE 5:
PIN 1. BASE
PIN 1. ANODE
2. EMITTER
3. BASE
PIN 1. SOURCE 1
2. DRAIN 1/2
3. SOURCE 1
4. GATE 1
PIN 1. CATHODE
2. COMMON ANODE
3. CATHODE 2
2. EMITTER
3. BASE
4. COLLECTOR
5. COLLECTOR
3. ANODE 2
4. CATHODE 2
5. CATHODE 1
4. COLLECTOR
5. CATHODE
4. CATHODE 3
5. CATHODE 4
5. GATE 2
STYLE 9:
STYLE 6:
PIN 1. EMITTER 2
2. BASE 2
STYLE 7:
STYLE 8:
Note: Please refer to datasheet for
style callout. If style type is not called
out in the datasheet refer to the device
datasheet pinout or pin assignment.
PIN 1. ANODE
2. CATHODE
3. ANODE
4. ANODE
5. ANODE
PIN 1. BASE
2. EMITTER
3. BASE
PIN 1. CATHODE
2. COLLECTOR
3. N/C
3. EMITTER 1
4. COLLECTOR
5. COLLECTOR 2/BASE 1
4. COLLECTOR
5. COLLECTOR
4. BASE
5. EMITTER
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42984B
SC−88A (SC−70−5/SOT−353)
PAGE 1 OF 1
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2018
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOT−23, 5 Lead
CASE 527AH
ISSUE A
DATE 09 JUN 2021
q
q
q
q
q
q1
q2
GENERIC
MARKING DIAGRAM*
XXXM
XXX = Specific Device Code
M
= Date Code
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON34320E
SOT−23, 5 LEAD
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
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and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
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vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
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