NC7SV08P5X-L22735 [ONSEMI]
TinyLogic ULP-A 2 输入 AND 门极;
| 型号： | NC7SV08P5X-L22735 |
| 厂家： | 
ONSEMI |
| 描述： | TinyLogic ULP-A 2 输入 AND 门极 |
| 文件： | 总10页 (文件大小：348K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
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MARKING
DIAGRAMS
TinyLogic ULP-A 2-Input
AND Gate
SIP6 1.45X1.0
MicroPak
CASE 127EB
CCKK
XYZ
NC7SV08
The NC7SV08 is a single 2−Input AND Gate in tiny footprint
Pin 1
UDFN6
MicroPak2
CASE 517DP
=
packages. The device is designed to operate for V
0.9 V to 3.6 V.
CC
CCKK
XYZ
Features
Pin 1
= Specific Device Code
= 2−Digit Lot Run Traceability Code
= 2−Digit Date Code
• Designed for 0.9 V to 3.6 V V Operation
CC
CC
KK
XY
Z
• 1.6 ns t at 3.3 V (Typ)
PD
• Inputs/Outputs Over−Voltage Tolerant up to 3.6 V
= Assembly Plant Code
• I
Supports Partial Power Down Protection
• Source/Sink 24 mA at 3.3 V
OFF
• Available in SC−88A and MicroPak™ Packages
SC−88A
XXXMG
CASE 419AC
G
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
XXX = Specific Devic Code
M
G
= Date Code
= Pb−Free Package
A
B
1
2
3
6
5
4
V
CC
A
B
1
2
3
5
4
V
CC
NC
Y
ORDERING INFORMATION
See detailed ordering, marking and shipping information on
page 6 of this data sheet.
Y
GND
GND
SC−88A
MicroPak
Figure 1. Pinout Diagrams (Top Views)
A
&
Y
B
Figure 2. Logic Symbol
PIN ASSIGNMENT
FUNCTION TABLE
Pin
1
SC−88A
MicroPak
Output
Y = AB
Input
A
B
A
B
A
L
B
L
Y
L
2
3
GND
Y
GND
Y
L
H
L
L
4
H
H
L
5
V
CC
N.C.
H
H
6
−
V
CC
N.C. = No Connect
© Semiconductor Components Industries, LLC, 2002
1
Publication Order Number:
June, 2022 − Rev. 3
NC7SV08/D
NC7SV08
MAXIMUM RATINGS
Symbol
Characteristics
Value
Unit
V
V
CC
DC Supply Voltage
DC Input Voltage
DC Output Voltage
−0.5 to +4.3
−0.5 to +4.3
V
IN
V
V
OUT
Active−Mode (High or Low State)
Tri−State Mode (Note 1)
−0.5 to V + 0.5
V
CC
−0.5 to +4.3
−0.5 to +4.3
Power−Down Mode (V = 0 V)
CC
I
DC Input Diode Current
V
< GND
< GND
−50
−50
mA
mA
mA
mA
°C
IK
IN
I
DC Output Diode Current
V
OUT
OK
I
DC Output Source/Sink Current
DC Supply Current per Supply Pin or Ground Pin
Storage Temperature Range
50
OUT
I
or I
GND
STG
50
CC
T
−65 to +150
260
T
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature Under Bias
Thermal Resistance (Note 2)
°C
L
T
+150
°C
J
q
SC−88A
MicroPak
377
154
°C/W
JA
P
D
Power Dissipation in Still Air
SC−88A
MicroPak
332
812
mW
MSL
Moisture Sensitivity
Level 1
−
−
V
F
R
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
V
ESD
ESD Withstand Voltage (Note 3)
Human Body Model
Charged Device Model
4000
2000
I
Latchup Performance (Note 4)
100
mA
Latchup
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Applicable to devices with outputs that may be tri−stated.
2. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow per JESD51−7.
3. HBM tested to EIA / JESD22−A114−A. CDM tested to JESD22−C101−A. JEDEC recommends that ESD qualification to EIA/JESD22−A115A
(Machine Model) be discontinued.
4. Tested to EIA/JESD78 Class II.
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2
NC7SV08
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
0.9
0
Max
3.6
Unit
V
V
CC
Positive DC Supply Voltage
DC Input Voltage
V
IN
3.6
V
V
OUT
DC Output Voltage
Active−Mode (High or Low State)
Tri−State Mode (Note 1)
0
0
0
V
CC
3.6
3.6
Power−Down Mode (V = 0 V)
CC
T
Operating Temperature Range
−40
+85
10
°C
A
t , t
r
Input Transition Rise and Fall Time
V = 3.3 V 0.3 V
CC
0
ns/V
f
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
T
A
= 255C
Typ
T
= −405C to +855C
A
Min
Max
Min
Max
Symbol
Parameter
Condition
V
CC
(V)
Unit
0.9
−
0.5
−
−
−
−
V
High−Level Input
V
IH
Voltage
1.1 to 1.3
1.4 to 1.6
0.65 x V
−
0.65 x V
−
CC
CC
CC
CC
0.65 x V
−
−
0.65 x V
−
CC
CC
1.65 to 1.95 0.65 x V
−
−
−
0.65 x V
−
−
2.3 to <2.7
2.7 to 3.6
0.9
1.6
2.0
−
−
1.6
2.0
−
−
−
−
0.5
−
−
−
V
Low−Level Input
Voltage
V
IL
1.1 to 1.3
1.4 to 1.6
1.65 to 1.95
2.3 to <2.7
2.7 to 3.6
−
0.35 x V
0.35 x V
0.35 x V
0.7
−
0.35 x V
0.35 x V
0.35 x V
0.7
CC
CC
CC
CC
CC
CC
−
−
−
−
−
−
−
−
−
−
−
0.8
−
0.8
V
I
= V or V
IL
V
OH
High−Level Output
Voltage
V
IN
IH
0.9
−
V
CC
0.1
–
−
−
−
= −100 mA
OH
1.1 to 1.3
1.4 to 1.6
1.65 to 1.95
2.3 to <2.7
2.7 to 3.6
1.1 o 1.3
V
V
V
V
V
– 0.1
– 0.1
– 0.2
– 0.2
– 0.2
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
V
V
V
V
V
– 0.1
– 0.1
– 0.2
– 0.2
– 0.2
−
−
−
−
−
−
−
−
−
−
−
−
−
−
CC
CC
CC
CC
CC
CC
CC
CC
CC
CC
I
I
I
= −2 mA
= −4 mA
= −6 mA
0.75 x V
0.75 x V
1.25
2.0
0.75 x V
0.75 x V
1.25
2.0
OH
OH
OH
CC
CC
CC
CC
1.4 to 1.6
1.65 to 1.95
2.3 to <2.7
2.3 to <2.7
2.7 to 3.6
2.3 to <2.7
2.7 to 3.6
2.7 to 3.6
1.8
1.8
I
I
I
= −12 mA
= −18 mA
= −24 mA
OH
OH
OH
2.2
2.2
1.7
1.7
2.4
2.4
2.2
2.2
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3
NC7SV08
DC ELECTRICAL CHARACTERISTICS (continued)
T
A
= 255C
Typ
T
= −405C to +855C
A
Min
Max
Min
Max
Symbol
Parameter
Condition
V
CC
(V)
Unit
V
= V or V
V
Low−Level
V
IN
IH
IL
OL
Output Voltage
0.9
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
0.1
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
0.1
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
0.1
I
OL
= 100 mA
1.1 to 1.3
1.4 to 1.6
1.65 to 1.95
2.3 to < 2.7
2.7 to 3.6
1.1 o 1.3
0.1
0.1
0.2
0.2
0.2
0.2
0.2
0.2
I
OL
I
OL
I
OL
I
OL
= 2 mA
= 4 mA
= 6 mA
= 12 mA
0.25 x V
0.25 x V
0.3
0.25 x V
0.25 x V
0.3
CC
CC
1.4 to 1.6
1.65 to 1.95
2.3 to <2.7
2.7 to 3.6
2.3 to <2.7
2.7 to 3.6
2.7 to 3.6
0.9 to 3.6
CC
CC
0.4
0.4
0.4
0.4
0.6
0.6
I
I
= 18 mA
= 24 mA
OL
0.4
0.4
0.55
0.1
0.55
0.5
OL
I
IN
Input Leakage
Current
V
IN
= 0 V to 3.6 V
mA
mA
mA
I
Power Off Leakage
Current
V
V
= 0 V to 3.6 V or
= 0 V to 3.6 V
0
−
−
−
−
0.5
0.9
−
−
0.5
0.9
OFF
IN
OUT
I
Quiescent Supply
Current
V
IN
= V or GND
0.9 to 3.6
CC
CC
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
AC ELECTRICAL CHARACTERISTICS
T
A
= 25°C
Typ
15.9
6.8
T
= −405C to +855C
A
Min
−
Max
−
Min
Max
Symbol
Parameter
Condition
V
(V)
Unit
CC
t
,
Propagation Delay,
(A or B) to Y (Figures 3
and 4)
0.9
−
−
−
−
−
−
−
ns
R = 1 MW, C = 15 pF
PLH
L
L
t
PHL
R = 2 kW, C = 15 pF
1.1 to 1.3
1.4 to 1.6
1.65 to 1.95
2.3 to 2.7
2.7 to 3.6
−
11.6
6.0
4.5
2.6
2.3
14.6
7.2
5.3
3.7
3.0
L
L
−
3.6
R = 500 W, C = 30 pF
−
2.6
L
L
−
1.9
−
1.6
CAPACITIVE CHARACTERISTICS
Symbol
Parameter
Input Capacitance
Power Dissipation Capacitance (Note 5)
Test Condition
Typical (T = 25°C)
Unit
pF
A
C
V
CC
= 0 V
2.0
8.0
IN
C
f = 10 MHz, V = 0.9 to 3.6 V, V = 0 V or V
CC
pF
PD
CC
IN
5. C is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
PD
Average operating current can be obtained by the equation I
) = C ꢀ V ꢀ f + I . C is used to determine the no−load dynamic
CC(OPR
PD CC in CC PD
2
power consumption: P = C ꢀ V
ꢀ f + I ꢀ V
.
D
PD
CC
in
CC
CC
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4
NC7SV08
OPEN
Test
/ t
Switch Position
2 x V
DUT
GND
CC
t
Open
PLH PHL
t
/ t
2 x V
CC
PLZ PZL
R
1
L
t
/ t
GND
PHZ PZH
INPUT
OUTPUT
R
R
C *
L
T
C includes probe and jig capacitance
L
R is Z
of pulse generator (typically 50 W)
T
OUT
f = 1 MHz
Figure 3. Test Circuit
V
CC
t = 3 ns
r
t = 3 ns
f
V
CC
90%
90%
INPUT
V
mi
V
mi
V
mi
V
mi
INPUT
GND
~V
10%
10%
GND
t
t
PLZ
PZL
t
t
PLH
PHL
CC
V
OH
V
V
OUTPUT
OUTPUT
mo
V
V
V
V
OUTPUT
OUTPUT
mo
mo
V
+ V
OL
OL
Y
V
V
V
OL
t
t
PHZ
PZH
t
t
PLH
PHL
V
OH
OH
V
− V
OH
Y
mo
mo
mo
V
OL
~0 V
V
, V
V
, V
V
, V
/ 2
/ 2
/ 2
/ 2
/ 2
V , V
CC
mi
mo
CC
CC
CC
CC
CC
Y
0.9
V
CC
V
CC
V
CC
V
CC
V
CC
/ 2
/ 2
/ 2
/ 2
/ 2
V
V
V
V
V
0.1
0.1
1.1 to 1.3
1.4 to 1.6
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
0.1
0.15
0.15
0.3
1.5
1.5
Figure 4. Switching Waveforms
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5
NC7SV08
ORDERING INFORMATION
Pin 1 Orientation
(See below)
†
Device
NC7SV08P5X
Package
SC−88A
Marking
V08
V08
G3
Shipping
Q4
Q4
Q4
Q4
Q4
3000 / Tape & Reel
3000 / Tape & Reel
5000 / Tape & Reel
5000 / Tape & Reel
5000 / Tape & Reel
NC7SV08P5X−L22735
NC7SV08L6X
SC−88A
MicroPak
MicroPak
MicroPak2
NC7SV08L6X−L22780
NC7SV08FHX
G3
G3
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Pin 1 Orientation in Tape and Reel
MicroPak is trademark of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other
countries.
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6
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SIP6 1.45X1.0
CASE 127EB
ISSUE O
DATE 31 AUG 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON13590G
SIP6 1.45X1.0
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−88A (SC−70 5 Lead), 1.25x2
CASE 419AC−01
ISSUE A
DATE 29 JUN 2010
SYMBOL
MIN
NOM
MAX
D
0.80
A
1.10
e
e
A1
A2
0.00
0.80
0.10
1.00
b
c
0.15
0.10
1.80
1.80
1.15
0.30
0.18
2.20
2.40
1.35
D
2.00
2.10
E1
E
E
E1
e
1.25
0.65 BSC
0.36
L
0.26
0.46
L1
L2
0.42 REF
0.15 BSC
TOP VIEW
0º
4º
8º
θ
10º
θ1
q1
A2
A1
A
q
L
b
L1
q1
c
L2
SIDE VIEW
END VIEW
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MO-203.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON34260E
SC−88A (SC−70 5 LEAD), 1.25X2
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UDFN6 1.0X1.0, 0.35P
CASE 517DP
ISSUE O
DATE 31 AUG 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON13593G
UDFN6 1.0X1.0, 0.35P
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
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