NC7SV58FHX [ONSEMI]
TinyLogic ULP-A 通用可配置 2 输入逻辑门极;
| 型号： | NC7SV58FHX |
| 厂家： | 
ONSEMI |
| 描述： | TinyLogic ULP-A 通用可配置 2 输入逻辑门极 栅 光电二极管 逻辑集成电路 触发器 |
| 文件： | 总13页 (文件大小：389K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
www.onsemi.com
TinyLogic ULP-A Universal
Configurable Logic Gates
MARKING
DIAGRAM
CCKK
XYZ
SIP6 1.45X1.0
MicroPak
CASE 127EB
NC7SV57, NC7SV58
The NC7SV57 and NC7SV58 are universal configurable logic gates
Pin 1
in tiny footprint packages. The devices are designed to operate
=
for V
0.9 V to 3.6 V.
CC
UDFN6 1.0X1.0, 0.35P
CCKK
XYZ
TM
MicroPak2
Features
CASE 517DP
• Designed for 0.9 V to 3.6 V V Operation
CC
Pin 1
• 2.4 ns t at 3.3 V (Typ)
PD
CC
KK
XY
Z
= Specific Device Code
= 2−Digit Lot Run Traceability Code
= 2−Digit Date Code
• Inputs/Outputs Over−Voltage Tolerant up to 3.6 V
• I
Supports Partial Power Down Protection
OFF
= Assembly Plant Code
• Source/Sink 24 mA at 3.3 V
TM
• Available in SC−88 and MicroPak Packages
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
XXXMG
SC−88
G
CASE 419AD
Compliant
1
2
3
6
5
4
I2
V
XXX = Specific Device Code
I1
GND
I0
I1
GND
I0
1
2
3
6
5
4
I2
V
M
= Date Code
G
= Pb−Free Package
CC
CC
ORDERING INFORMATION
See detailed ordering, marking and shipping information on
page 9 of this data sheet.
Y
Y
SC−88
MicroPak
Figure 1. Pinout Diagrams (Top Views)
PIN ASSIGNMENT
Pin
1
SC−88
MicroPak
I1
GND
I0
I1
GND
I0
2
3
4
Y
Y
5
V
CC
V
CC
6
I2
I2
© Semiconductor Components Industries, LLC, 2002
1
Publication Order Number:
June, 2022 − Rev. 4
NC7SV58/D
NC7SV57, NC7SV58
FUNCTION TABLE
Inputs
NC7SV57
NC7SV58
I2
L
I1
L
I0
Y = (I0) w (I2) + (I1) w (I2)
Y = (I0) w (I2) + (I1) w (I2)
L
H
L
H
L
H
L
L
L
L
L
H
H
L
H
L
L
H
L
H
H
H
L
H
H
H
H
L
L
H
L
L
H
H
H
H
H
L
FUNCTION SELECTION TABLE
2−Input Logic Function
2−Input AND
Device Selection
NC7SV57
NC7SV58
NC7SV57
NC7SV58
NC7SV57
NC7SV58
NC7SV58
NC7SV57
NC7SV58
NC7SV57
NC7SV58
NC7SV57
NC7SV58
NC7SV57
Connection Configuration
Figure 2
2−Input AND with inverted input
2−Input AND with both inputs inverted
2−Input NAND
Figure 8, 9
Figure 5
Figure 7
2−Input NAND with inverted input
2−Input NAND with both inputs inverted
2−Input OR
Figure 3, 4
Figure 10
Figure 10
Figure 3, 4
Figure 7
2−Input OR with inverted input
2−Input OR with both inputs inverted
2−Input NOR
Figure 5
2−Input NOR with inverted input
2−Input NOR with both inputs inverted
2−Input XOR
Figure 8, 9
Figure 2
Figure 11
2−Input XNOR
Figure 6
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2
NC7SV57, NC7SV58
Logic Configurations NC7SV57
Figure 2. 2−Input AND Gate
Figure 3. 2−Input NAND with Inverted A Input
Figure 5. 2−Input NOR Gate
Figure 4. 2−Input NAND with Inverted B Input
Figure 6. 2−Input XNOR Gate
NOTE: Figure 2 through Figure 6 show the logical functions that can be implemented using the NC7SV57. The diagrams show the
DeMorgan’s equivalent logic duals for a given 2−input function. Next to the logical implementation is the board level physical
implementation of how the pins of the function should be connected.
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3
NC7SV57, NC7SV58
Logic Configurations NC7SV58
Figure 8. 2−Input AND with Inverted A Input
Figure 7. 2−Input NAND Gate
Figure 10. 2−Input OR Gate
Figure 9. 2−Input AND with Inverted B Input
Figure 11. 2−Input XOR Gate
NOTE: Figure 7 through Figure 11 show the logical functions that can be implemented using the NC7SV58. The diagrams show the
DeMorgan’s equivalent logic duals for a given 2−input function. Next to the logical implementation is the board level physical
implementation of how the pins of the function should be connected.
www.onsemi.com
4
NC7SV57, NC7SV58
MAXIMUM RATINGS
Symbol
Characteristics
Value
Unit
V
V
CC
DC Supply Voltage
DC Input Voltage
DC Output Voltage
−0.5 to +4.3
−0.5 to +4.3
V
IN
V
V
OUT
Active−Mode (High or Low State)
Tri−State Mode (Note 1)
−0.5 to V + 0.5
V
CC
−0.5 to +4.3
−0.5 to +4.3
Power−Down Mode (V = 0 V)
CC
I
DC Input Diode Current
V
< GND
< GND
−50
−50
mA
mA
mA
mA
°C
IK
IN
I
DC Output Diode Current
V
OUT
OK
I
DC Output Source/Sink Current
DC Supply Current per Supply Pin or Ground Pin
Storage Temperature Range
50
OUT
I
or I
GND
STG
50
CC
T
−65 to +150
260
T
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature Under Bias
Thermal Resistance (Note 2)
°C
L
T
+150
°C
J
q
SC−88
MicroPak
377
154
°C/W
JA
P
D
Power Dissipation in Still Air
SC−88
MicroPak
332
812
mW
MSL
Moisture Sensitivity
Level 1
F
R
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
V
ESD
ESD Withstand Voltage (Note 3)
Human Body Model
Charged Device Model
2000
1000
V
I
Latchup Performance (Note 4)
100
mA
Latchup
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Applicable to devices with outputs that may be tri−stated.
2. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow per JESD51−7.
3. HBM tested to EIA / JESD22−A114−A. CDM tested to JESD22−C101−A. JEDEC recommends that ESD qualification to EIA/JESD22−A115A
(Machine Model) be discontinued.
4. Tested to EIA/JESD78 Class II.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
0.9
0
Max
3.6
Unit
V
V
CC
Positive DC Supply Voltage
DC Input Voltage
V
IN
3.6
V
V
OUT
DC Output Voltage
Active−Mode (High or Low State)
Tri−State Mode (Note 5)
0
0
0
V
3.6
3.6
V
CC
Power−Down Mode (V = 0 V)
CC
T
A
Operating Temperature Range
−40
+85
°C
t , t
Input Transition Rise and Fall Time
0
No Limit
ns/V
r
f
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
5. Applicable to devices with outputs that may be tri−stated.
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5
NC7SV57, NC7SV58
DC ELECTRICAL CHARACTERISTICS
T
A
= 255C
Typ
T
= −405C to +855C
A
Min
Max
Min
Max
Symbol
Parameter
Condition
V
CC
(V)
Unit
0.9
−
−
0.62
−
−
1.0
1.25
1.5
1.8
2.2
−
−
−
−
1.0
1.25
1.5
1.8
2.2
−
V
V
V
Positive
V
P
N
H
Threshold Voltage
1.1
1.4
1.65
2.3
2.7
0.9
1.1
1.4
1.65
2.3
2.7
0.9
1.1
1.4
1.65
2.3
2.7
−
−
−
−
−
−
−
−
−
−
−
−
−
0.34
−
−
Negative
Threshold Voltage
V
V
V
0.15
0.2
0.25
0.4
0.6
−
−
0.15
0.2
0.25
0.4
0.6
−
−
−
−
−
−
−
−
−
−
−
−
−
−
0.29
−
−
−
Hysteresis
Voltage
0.08
0.09
0.15
0.25
0.6
0.6
0.8
1.0
1.1
1.2
0.08
0.09
0.15
0.25
0.6
0.6
0.8
1.0
1.1
1.2
−
−
−
−
V
I
= V or V
V
OH
High−Level
Output Voltage
IN
IH
IL
0.9
−
V
– 0.1
−
−
−
−
−
−
−
−
−
= −100 mA
CC
OH
1.1 to 1.3
1.4 to 1.6
V
CC
V
CC
V
CC
– 0.1
−
−
−
V
– 0.1
CC
CC
CC
– 0.1
– 0.2
V
V
– 0.1
– 0.2
1.65 to
1.95
2.3 to <2.7
2.7 to 3.6
1.1 o 1.3
V
V
– 0.2
– 0.2
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
V
V
– 0.2
– 0.2
−
−
−
−
−
−
−
−
−
−
−
CC
CC
CC
CC
I
I
I
= −2 mA
= −4 mA
= −6 mA
0.75 x V
0.75 x V
0.75 x V
1.25
2.0
OH
OH
OH
CC
CC
CC
CC
1.4 to 1.6 0.75 x V
1.65 to 1.95
2.3 to <2.7
2.3 to <2.7
2.7 to 3.6
2.3 to <2.7
2.7 to 3.6
2.7 to 3.6
1.25
2.0
1.8
2.2
1.7
2.4
2.2
1.8
I
I
I
= −12 mA
= −18 mA
= −24 mA
OH
OH
OH
2.2
1.7
2.4
2.2
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6
NC7SV57, NC7SV58
DC ELECTRICAL CHARACTERISTICS (continued)
T
A
= 255C
Typ
T
= −405C to +855C
A
Min
Max
Min
Max
Symbol
Parameter
Condition
V
CC
(V)
Unit
V
= V or V
V
OL
Low−Level
Output Voltage
V
IN
IH
IL
0.9
−
−
−
−
0.1
−
−
−
−
−
−
−
I
OL
= 100 mA
1.1 to 1.3
1.4 to 1.6
0.1
0.1
0.2
0.1
0.1
0.2
−
1.65 to
1.95
−
2.3 to < 2.7
2.7 to 3.6
1.1 o 1.3
−
−
−
−
−
−
−
−
−
−
0.2
0.2
−
−
−
−
−
0.2
0.2
I
OL
I
OL
I
OL
= 2 mA
= 4 mA
= 6 mA
0.25 x V
0.25 x V
0.3
0.25 x V
0.25 x V
0.3
CC
CC
1.4 to 1.6
CC
CC
1.65 to
1.95
2.3 to <2.7
2.7 to 3.6
2.3 to <2.7
2.7 to 3.6
2.7 to 3.6
0.9 to 3.6
−
−
−
−
−
−
−
−
−
−
−
−
0.4
0.4
0.6
0.4
0.55
0.1
−
−
−
−
−
−
0.4
0.4
0.6
0.4
0.55
0.5
I
I
I
= 12 mA
= 18 mA
= 24 mA
OL
OL
OL
I
Input Leakage
Current
V
= 0 V to 3.6 V
mA
mA
mA
IN
IN
I
Power Off
Leakage Current
V
V
= 0 V to 3.6 V or
0
−
−
−
−
0.5
0.9
−
−
0.5
0.9
OFF
IN
= 0 V to 3.6 V
OUT
I
Quiescent Supply
Current
V
= V or GND
0.9 to 3.6
CC
IN
CC
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
AC ELECTRICAL CHARACTERISTICS
T
A
= 25°C
Typ
22.2
7.1
T
= −405C to +855C
A
Min
−
Max
−
Min
Max
Symbol
Parameter
Condition
V
(V)
Unit
CC
t
,
Propagation Delay,
(I0 or I1 or I2) to Y
(Figures 12 and 13)
0.9
−
−
−
−
−
−
−
ns
R = 1 MW, C = 15 pF
PLH
L
L
t
PHL
R = 2 kW, C = 15 pF
1.10 to 1.30
1.40 to 1.60
1.65 to 1.95
2.3 to 2.7
−
16.5
10.0
9.1
6.2
5.4
31.0
12.0
10.0
6.7
L
L
−
4.4
R = 500 W, C = 30 pF
−
3.7
L
L
−
2.9
3.0 to 3.6
−
2.4
6.1
CAPACITIVE CHARACTERISTICS
Symbol
Parameter
Input Capacitance
Output Capacitance
Power Dissipation Capacitance (Note 6)
Test Condition
Typical (T = 25°C)
Unit
pF
A
C
V
V
= 0 V
= 0 V
8.0
12
10
IN
CC
C
pF
OUT
CC
C
f = 10 MHz, V = 0.9 to 3.6 V, V = 0 V or V
CC
pF
PD
CC
IN
6. C is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
PD
Average operating current can be obtained by the equation I
) = C ꢀ V ꢀ f + I . C is used to determine the no−load dynamic
CC(OPR
PD CC in CC PD
2
power consumption: P = C ꢀ V
ꢀ f + I ꢀ V
.
D
PD
CC
in
CC
CC
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7
NC7SV57, NC7SV58
OPEN
Test
/ t
Switch Position
2 x V
DUT
GND
CC
t
Open
PLH PHL
t
/ t
2 x V
CC
PLZ PZL
R
1
L
t
/ t
GND
PHZ PZH
INPUT
OUTPUT
R
R
C *
L
T
C includes probe and jig capacitance
L
R is Z
of pulse generator (typically 50 W)
T
OUT
f = 1 MHz
Figure 12. Test Circuit
V
CC
t = 3 ns
r
t = 3 ns
f
V
CC
90%
90%
INPUT
V
mi
V
mi
V
mi
V
mi
INPUT
GND
~V
10%
10%
GND
t
t
PLZ
PZL
t
t
PLH
PHL
CC
V
OH
V
V
OUTPUT
OUTPUT
mo
V
V
V
V
OUTPUT
OUTPUT
mo
mo
V
+ V
OL
OL
Y
V
V
V
OL
t
t
PHZ
PZH
t
t
PLH
PHL
V
OH
OH
V
− V
OH
Y
mo
mo
mo
V
OL
~0 V
V
, V
V
, V
V
, V
/ 2
/ 2
/ 2
/ 2
/ 2
V , V
CC
mi
mo
CC
CC
CC
CC
CC
Y
0.9
V
CC
V
CC
V
CC
V
CC
V
CC
/ 2
/ 2
/ 2
/ 2
/ 2
V
V
V
V
V
0.1
0.1
1.1 to 1.3
1.4 to 1.6
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
0.1
0.15
0.15
0.3
1.5
1.5
Figure 13. Switching Waveforms
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8
NC7SV57, NC7SV58
ORDERING INFORMATION
Pin 1 Orientation
(See below)
†
Device
NC7SV57P6X
NC7SV57L6X
Package
SC−88
Marking
V57
H3
Shipping
Q4
Q4
Q4
Q4
Q4
Q4
Q4
3000 / Tape & Reel
5000 / Tape & Reel
5000 / Tape & Reel
5000 / Tape & Reel
3000 / Tape & Reel
5000 / Tape & Reel
5000 / Tape & Reel
MicroPak
MicroPak2
MicroPak2
SC−88
NC7SV57FHX
NC7SV57FHX−L22780
NC7SV58P6X
NC7SV58L6X
H3
H3
V58
H4
MicroPak
MicroPak2
NC7SV58FHX
H4
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Pin 1 Orientation in Tape and Reel
MicroPak and MicroPak2 are trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United
States and/or other countries.
www.onsemi.com
9
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SIP6 1.45X1.0
CASE 127EB
ISSUE O
DATE 31 AUG 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON13590G
SIP6 1.45X1.0
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−88 (SC−70 6 Lead), 1.25x2
CASE 419AD
ISSUE A
DATE 07 JUL 2010
1
SYMBOL
MIN
NOM
MAX
D
0.80
A
1.10
e
e
A1
A2
0.00
0.80
0.10
1.00
b
c
0.15
0.10
1.80
1.80
1.15
0.30
0.18
2.20
2.40
1.35
D
2.00
2.10
E1
E
E
E1
e
1.25
0.65 BSC
0.36
L
0.26
0.46
L1
L2
0.42 REF
0.15 BSC
TOP VIEW
0º
4º
8º
θ
10º
θ1
q1
A2
A1
A
q
L
b
L1
q1
c
L2
SIDE VIEW
END VIEW
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MO-203.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON34266E
SC−88 (SC−70 6 LEAD), 1.25X2
PAGE 1 OF 1
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UDFN6 1.0X1.0, 0.35P
CASE 517DP
ISSUE O
DATE 31 AUG 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON13593G
UDFN6 1.0X1.0, 0.35P
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
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