NC7SZ00M5X [ONSEMI]

TinyLogic UHS Two-Input NAND Gate;
NC7SZ00M5X
型号: NC7SZ00M5X
厂家: ONSEMI    ONSEMI
描述:

TinyLogic UHS Two-Input NAND Gate

栅 光电二极管 逻辑集成电路 触发器
文件: 总11页 (文件大小:411K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
TinyLogic UHS Two-Input  
NAND Gate  
NC7SZ00  
Description  
The NC7SZ00 is a single twoinput NAND gate from  
ON Semiconductor’s UltraHigh Speed (UHS) series of TinyLogic.  
The device is fabricated with advanced CMOS technology to achieve  
ultrahigh speed with high output drive while maintaining low static  
www.onsemi.com  
MARKING  
DIAGRAMS  
power dissipation over a broad V operating range. The device is  
CC  
specified to operate over the 1.65 V to 5.5 V V operating range. The  
CC  
inputs and output are high impedance when V is 0 V. Inputs tolerate  
CC  
YYKK  
XYZ  
SIP6  
CASE 127EB  
voltages up to 5.5 V, independent of V operating voltage.  
CC  
Features  
Pin 1  
UltraHigh Speed: t = 2.4 ns (Typical) into 50 pF at 5 V V  
PD  
CC  
High Output Drive: 24 mA at 3 V V  
CC  
UDFN6  
YYKK  
XYZ  
Broad V Operating Range: 1.65 V to 5.5 V  
CC  
CASE 517DP  
Matches Performance of LCX Operated at 3.3 V V  
CC  
Pin 1  
Power Down HighImpedance Inputs / Outputs  
OverVoltage Tolerance Inputs Facilitate 5 V to 3 V Translation  
Proprietary Noise / EMI Reduction Circuitry  
UltraSmall MicroPakPackages  
7Z00MG  
SC74A  
CASE 318BQ  
G
SpaceSaving SC74A and SC88A Packages  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
Compliant  
Z00M G  
SC88A  
CASE 419A02  
G
IEEE / IEC  
A
B
&
Y
Figure 1. Logic Symbol  
YY, 7Z00, Z00 = Specific Device Code  
KK  
XY  
Z
M
G
= 2Digit Lot Run Traceability Code  
= 2Digit Date Code Format  
= Assembly Plant Code  
= Data Code  
= PbFree Package  
(Note: Microdot may be in either location)  
ORDERING INFORMATION  
See detailed ordering, marking and shipping information in the  
package dimensions section on page 6 of this data sheet.  
© Semiconductor Components Industries, LLC, 1996  
1
Publication Order Number:  
May, 2021 Rev. 6  
NC7SZ00/D  
NC7SZ00  
Pin Configurations  
A 1  
B 2  
6 V  
CC  
A
B
1
2
3
5
4
V
Y
CC  
5 NC  
4 Y  
GND  
GND 3  
Figure 2. SC88A and SC74A (Top View)  
PIN DEFINITIONS  
Figure 3. MicroPak (Top Through View)  
FUNCTION TABLE  
Pin # SC88A /  
Inputs  
Output  
SC74A  
Pin # MicroPak  
Name  
A
Description  
Input  
A
L
B
L
Y
H
H
H
L
1
2
3
4
5
1
2
3
4
6
5
B
Input  
L
H
L
GND  
Y
Ground  
Output  
H
H
H
V
CC  
Supply Voltage  
No Connect  
H = HIGH Logic Level  
L = LOW Logic Level  
NC  
www.onsemi.com  
2
NC7SZ00  
ABSOLUTE MAXIMUM RATINGS  
Symbol  
Parameter  
Min  
0.5  
0.5  
0.5  
Max  
6.5  
Unit  
V
V
CC  
Supply Voltage  
V
IN  
DC Input Voltage  
6.5  
V
V
DC Output Voltage  
DC Input Diode Current  
DC Output Diode Current  
DC Output Current  
6.5  
V
OUT  
I
V
V
< 0 V  
50  
50  
50  
mA  
mA  
mA  
mA  
°C  
IK  
IN  
I
< 0 V  
OK  
OUT  
I
OUT  
I
or I  
DC V or Ground Current  
50  
CC  
GND  
CC  
T
STG  
Storage Temperature Range  
65  
+150  
+150  
+260  
390  
332  
812  
812  
2000  
1000  
T
J
Junction Temperature Under Bias  
°C  
T
L
Junction Lead Temperature (Soldering, 10 Seconds)  
°C  
P
D
Power Dissipation in Still Air  
SC74A  
mW  
SC88A  
MicroPak6  
MicroPak26  
ESD  
Human Body Model, JEDEC: JESD22A114  
Charge Device Model, JEDEC: JESD22C101  
V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
RECOMMENDED OPERATING CONDITIONS  
Symbol  
Parameter  
Supply Voltage Operating  
Supply Voltage Data Retention  
Input Voltage  
Conditions  
Min  
1.65  
1.5  
0
Max  
5.5  
5.5  
5.5  
Unit  
V
CC  
V
V
IN  
V
V
V
OUT  
Output Voltage  
0
V
CC  
T
Operating Temperature  
Input Rise and Fall Times  
40  
0
+85  
20  
°C  
A
t , t  
r
V
CC  
V
CC  
V
CC  
= 1.8 V, 2.5 V 0.2 V  
= 3.3 V 0.3 V  
ns/V  
f
0
10  
= 5.0 V 0.5 V  
0
5
q
Thermal Resistance  
SC74A  
320  
377  
154  
154  
°C/W  
JA  
SC88A  
MicroPak6  
MicroPak26  
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond  
the Recommended Operating Ranges limits may affect device reliability.  
1. Unused inputs must be held HIGH or LOW. They may not float.  
www.onsemi.com  
3
NC7SZ00  
DC ELECTICAL CHARACTERISTICS  
T
A
= +25°C  
T = 40 to +85°C  
A
Min  
0.65 V  
0.70 V  
Typ  
Max  
Min  
Max  
Symbol  
Parameter  
V
(V)  
Conditions  
Unit  
CC  
V
IH  
HIGH Level Input Voltage  
1.65 to 1.95  
2.30 to 5.50  
1.65 to 1.95  
2.30 to 5.50  
1.65  
0.65 V  
V
CC  
CC  
CC  
CC  
0.70 V  
V
IL  
LOW Level Input Voltage  
HIGH Level Output Voltage  
0.35 V  
0.35 V  
CC  
V
V
CC  
0.30 V  
0.30 V  
CC  
CC  
V
OH  
V
OH  
= V or V ,  
1.55  
1.70  
2.20  
2.90  
4.40  
1.29  
1.90  
2.40  
2.30  
3.80  
1.65  
1.80  
2.30  
3.00  
4.50  
1.52  
2.15  
2.80  
2.68  
4.20  
0.00  
0.00  
0.00  
0.00  
0.00  
0.80  
0.10  
0.15  
0.22  
0.22  
1.55  
1.70  
2.20  
2.90  
4.40  
1.29  
1.90  
2.40  
2.30  
3.80  
IN  
IH  
IL  
I
= 100 mA  
1.80  
2.30  
3.00  
4.50  
1.65  
I
I
I
I
I
= 4 mA  
= 8 mA  
= 16 mA  
= 24 mA  
= 32 mA  
OH  
OH  
OH  
OH  
OH  
2.30  
3.00  
3.00  
4.50  
V
OL  
LOW Level Output Voltage  
1.65  
V
OL  
= V or V ,  
0.10  
0.10  
0.10  
0.10  
0.10  
0.24  
0.30  
0.40  
0.55  
0.55  
1
0.08  
0.10  
0.10  
0.10  
0.10  
0.24  
0.30  
0.40  
0.55  
0.55  
10  
V
IN  
IH  
IL  
I
= 100 mA  
2.30  
3.00  
3.00  
4.50  
1.65  
I
OL  
I
OL  
I
OL  
I
OL  
I
OL  
= 4 mA  
2.30  
= 8 mA  
3.00  
= 16 mA  
= 24 mA  
= 32 mA  
3.00  
4.50  
I
IN  
Input Leakage Current  
1.65 to 5.5  
0
V
IN  
V
IN  
V
IN  
= 5.5 V, GND  
mA  
mA  
mA  
I
Power Off Leakage Current  
Quiescent Supply Current  
or V  
= 5.5 V  
1
10  
OFF  
OUT  
I
1.65 to 5.5  
= 5.5 V, GND  
2
20  
CC  
www.onsemi.com  
4
NC7SZ00  
AC ELECTRICAL CHARACTERISTICS  
T
A
= +25°C  
Typ  
5.4  
T = 40 to +85°C  
A
Min  
Max  
11.4  
9.5  
6.5  
4.5  
3.9  
5.0  
4.3  
Min  
Max  
12.0  
10.0  
7.0  
4.7  
4.1  
5.2  
4.5  
Symbol  
, t  
Parameter  
V
(V)  
Conditions  
Unit  
CC  
t
Propagation Delay  
(Figure 4, 5)  
1.65  
1.80  
C = 15 pF,  
ns  
PHL PLH  
L
R = 1 MW  
L
4.5  
2.50 0.20  
3.30 0.30  
5.00 0.50  
3.30 0.30  
5.00 0.50  
0.00  
3.0  
2.4  
2.0  
C = 50 pF,  
L
2.9  
L
R = 500 W  
2.4  
C
Input Capacitance  
4
pF  
pF  
IN  
C
Power Dissipation Capacitance  
(Note 2) (Figure 6)  
3.30  
24  
30  
PD  
5.00  
2. C is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (I  
) at  
PD  
CCD  
no output loading and operating at 50% duty cycle. C is related to I  
dynamic operating current by the expression:  
PD  
CCD  
I
= (C ) (V ) (f ) + (I static).  
CCD  
PD  
CC  
IN  
CC  
t = 3 ns  
t = 3 ns  
f
r
V
CC  
90%  
50%  
90%  
50%  
INPUT  
V
CC  
10%  
10%  
GND  
t
W
t
t
PLH  
PHL  
OUTPUT  
V
OH  
OL  
INPUT  
C
R
L
L
50%  
50%  
OUTPUT  
V
Figure 4. AC Test Circuit  
Figure 5. AC Waveforms  
V
CC  
A
INPUT  
NOTE:  
3. Input = AC Waveform; t = t = 1.8 ns;  
r
f
PRR = 10 MHz; Duty Cycle = 50%.  
Figure 6. ICCD Test Circuit  
www.onsemi.com  
5
 
NC7SZ00  
ORDERING INFORMATION  
Part Number  
Top Mark  
7Z00  
Z00  
Package  
SC74A  
Shipping  
NC7SZ00M5X  
3000 / Tape & Reel  
3000 / Tape & Reel  
5000 / Tape & Reel  
5000 / Tape & Reel  
NC7SZ00P5X  
SC88A  
NC7SZ00L6X  
YY  
SIP6, MicroPak  
NC7SZ00FHX  
YY  
UDFN6, MicroPak2  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
MicroPak and MicroPak2 are trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other  
countries.  
www.onsemi.com  
6
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
SIP6 1.45X1.0  
CASE 127EB  
ISSUE O  
DATE 31 AUG 2016  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13590G  
SIP6 1.45X1.0  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
© Semiconductor Components Industries, LLC, 2019  
www.onsemi.com  
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
SC74A  
CASE 318BQ  
ISSUE B  
5
1
DATE 18 JAN 2018  
SCALE 2:1  
5X b  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ASME  
Y14.5M, 1994.  
0.20 C A B  
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH  
THICKNESS. MINIMUM LEAD THICKNESS IS THE  
MINIMUM THICKNESS OF BASE MATERIAL.  
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD  
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD  
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT  
EXCEED 0.15 PER SIDE.  
M
5
4
E1  
E
1
2
3
0.05  
A1  
L
B
e
DETAIL A  
A
D
MILLIMETERS  
DIM  
A
A1  
b
c
D
E
E1  
e
MIN  
0.90  
0.01  
0.25  
0.10  
2.85  
2.50  
1.35  
MAX  
1.10  
0.10  
0.50  
0.26  
3.15  
3.00  
1.65  
TOP VIEW  
SIDE VIEW  
A
DETAIL A  
c
0.95 BSC  
SEATING  
PLANE  
END VIEW  
C
L
M
0.20  
0
0.60  
10  
_
_
RECOMMENDED  
GENERIC  
SOLDERING FOOTPRINT*  
MARKING DIAGRAM*  
0.95  
PITCH  
XXX MG  
G
XXX  
M
= Specific Device Code  
= Date Code  
2.40  
G
= PbFree Package  
(Note: Microdot may be in either location)  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “ G”,  
may or may not be present. Some products  
may not follow the Generic Marking.  
5X  
1.00  
5X  
0.70  
DIMENSIONS: MILLIMETERS  
*For additional information on our PbFree strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON66279G  
SC74A  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
© Semiconductor Components Industries, LLC, 2018  
www.onsemi.com  
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
SC88A (SC705/SOT353)  
CASE 419A02  
ISSUE L  
SCALE 2:1  
DATE 17 JAN 2013  
A
NOTES:  
1. DIMENSIONING AND TOLERANCING  
PER ANSI Y14.5M, 1982.  
G
2. CONTROLLING DIMENSION: INCH.  
3. 419A01 OBSOLETE. NEW STANDARD  
419A02.  
4. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD FLASH, PROTRUSIONS, OR GATE  
BURRS.  
5
4
3
B−  
S
INCHES  
DIM MIN MAX  
MILLIMETERS  
MIN  
1.80  
1.15  
0.80  
0.10  
MAX  
2.20  
1.35  
1.10  
0.30  
1
2
A
B
C
D
G
H
J
0.071  
0.045  
0.031  
0.004  
0.087  
0.053  
0.043  
0.012  
0.026 BSC  
0.65 BSC  
M
M
B
D 5 PL  
0.2 (0.008)  
---  
0.004  
0.004  
0.004  
0.010  
0.012  
---  
0.10  
0.10  
0.10  
0.25  
0.30  
N
K
N
S
0.008 REF  
0.20 REF  
0.079  
0.087  
2.00  
2.20  
J
C
GENERIC MARKING  
DIAGRAM*  
K
H
XXXMG  
SOLDER FOOTPRINT  
0.50  
G
0.0197  
XXX = Specific Device Code  
M
= Date Code  
G
= PbFree Package  
(Note: Microdot may be in either location)  
0.65  
0.025  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “G”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
0.65  
0.025  
0.40  
0.0157  
1.9  
0.0748  
mm  
inches  
ǒ
Ǔ
SCALE 20:1  
STYLE 3:  
STYLE 1:  
PIN 1. BASE  
STYLE 2:  
STYLE 4:  
STYLE 5:  
PIN 1. ANODE  
2. EMITTER  
3. BASE  
PIN 1. ANODE 1  
2. N/C  
PIN 1. SOURCE 1  
2. DRAIN 1/2  
3. SOURCE 1  
4. GATE 1  
PIN 1. CATHODE  
2. COMMON ANODE  
3. CATHODE 2  
2. EMITTER  
3. BASE  
4. COLLECTOR  
5. COLLECTOR  
3. ANODE 2  
4. CATHODE 2  
5. CATHODE 1  
4. COLLECTOR  
5. CATHODE  
4. CATHODE 3  
5. CATHODE 4  
5. GATE 2  
STYLE 9:  
STYLE 6:  
PIN 1. EMITTER 2  
2. BASE 2  
STYLE 7:  
STYLE 8:  
Note: Please refer to datasheet for  
style callout. If style type is not called  
out in the datasheet refer to the device  
datasheet pinout or pin assignment.  
PIN 1. ANODE  
2. CATHODE  
3. ANODE  
4. ANODE  
5. ANODE  
PIN 1. BASE  
2. EMITTER  
3. BASE  
PIN 1. CATHODE  
2. COLLECTOR  
3. N/C  
3. EMITTER 1  
4. COLLECTOR  
5. COLLECTOR 2/BASE 1  
4. COLLECTOR  
5. COLLECTOR  
4. BASE  
5. EMITTER  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98ASB42984B  
SC88A (SC705/SOT353)  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
© Semiconductor Components Industries, LLC, 2018  
www.onsemi.com  
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
UDFN6 1.0X1.0, 0.35P  
CASE 517DP  
ISSUE O  
DATE 31 AUG 2016  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13593G  
UDFN6 1.0X1.0, 0.35P  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
© Semiconductor Components Industries, LLC, 2019  
www.onsemi.com  
onsemi,  
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates  
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