概述
规格参数
数据手册NC7SZ373P6X 概述
TinyLogic UHS D 型锁存，带 3 态输出 锁存器 总线驱动器/收发器
NC7SZ373P6X 规格参数
| 是否无铅： | 不含铅 | 生命周期： | Active |
| 包装说明： | TSSOP, TSSOP6,.08 | Reach Compliance Code： | compliant |
| ECCN代码： | EAR99 | HTS代码： | 8542.39.00.01 |
| Factory Lead Time： | 1 week | 风险等级： | 1.08 |
| 系列： | LVC/LCX/Z | JESD-30 代码： | R-PDSO-G6 |
| JESD-609代码： | e4 | 长度： | 2 mm |
| 负载电容（CL）： | 50 pF | 逻辑集成电路类型： | BUS DRIVER |
| 最大I（ol）： | 0.024 A | 湿度敏感等级： | 1 |
| 位数： | 1 | 功能数量： | 1 |
| 端口数量： | 2 | 端子数量： | 6 |
| 最高工作温度： | 85 °C | 最低工作温度： | -40 °C |
| 输出特性： | 3-STATE | 输出极性： | TRUE |
| 封装主体材料： | PLASTIC/EPOXY | 封装代码： | TSSOP |
| 封装等效代码： | TSSOP6,.08 | 封装形状： | RECTANGULAR |
| 封装形式： | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 包装方法： | TAPE AND REEL |
| 峰值回流温度（摄氏度）： | NOT SPECIFIED | 电源： | 3.3 V |
| 传播延迟（tpd）： | 15 ns | 认证状态： | Not Qualified |
| 座面最大高度： | 1.1 mm | 子类别： | FF/Latches |
| 最大供电电压 (Vsup)： | 5.5 V | 最小供电电压 (Vsup)： | 1.65 V |
| 标称供电电压 (Vsup)： | 1.8 V | 表面贴装： | YES |
| 技术： | CMOS | 温度等级： | INDUSTRIAL |
| 端子面层： | Nickel/Palladium/Gold (Ni/Pd/Au) | 端子形式： | GULL WING |
| 端子节距： | 0.65 mm | 端子位置： | DUAL |
| 处于峰值回流温度下的最长时间： | NOT SPECIFIED | 宽度： | 1.25 mm |
| Base Number Matches： | 1 |
NC7SZ373P6X 数据手册
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PDF下载DATA SHEET
www.onsemi.com
MARKING
DIAGRAMS
TinyLogic UHS D-Type
Latch with 3-STATE Output
D4KK
XYZ
SIP6 1.45x1.0
CASE 127EB
NC7SZ373
Description
Pin 1
The NC7SZ373 is a single positive edge−triggered D−type CMOS
Lach with 3−STATE output from onsemi’s Ultra High Speed Series of
TinyLogic in the space saving SC70 6−lead package. The device is
fabricated with advanced CMOS technology to achieve ultra high
speed with high output drive while maintaining low static power
6
1
SC−88
CASE 419B−02
Z73MG
G
dissipation over a very broad V operating range. The device is
CC
specified to operate over the 1.65 V to 5.5 V V range. The inputs
CC
D4, Z73
= Specific Device Code
and output are high impedance when V
is 0 V. Inputs tolerate
CC
KK
XY
Z
M
G
= 2−Digit Lot Run Traceability Code
= 2−Digit Date Code Format
= Assembly Plant Code
= Date Code*
voltages up to 5.5 V independent of V operating voltage. The latch
CC
appears transparent to the data when Latch Enable (LE) is HIGH.
When LE is LOW, the data that meets the setup time is latched. The
= Pb−Free Package
output tolerates voltages above V in the 3−STATE condition.
CC
(Note: Microdot may be in either location)
Features
*Date Code orientation and/or position may
vary depending upon manufacturing location.
• Space Saving SC−88 6−Lead Package
• Ultra Small MicroPak™ Leadless Package
• Ultra High Speed: t = 2.6 ns Typ into 50 pF at 5 V V
• High Output Drive: 24 mA at 3 V V
• Broad V Operating Range: 1.65 V to 5.5 V
PD
CC
CC
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 7 of this data sheet.
CC
• Matches the Performance of LCX when Operated at 3.3 V V
• Power Down High Impedance Inputs / Output
CC
• Overvoltage Tolerant Inputs Facilitate 5 V to 3 V Translation
• Patented Noise / EMI Reduction Circuitry Implemented
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
IEEC / IEC
OE
LE
D
Q
Figure 1. Logic Symbol
© Semiconductor Components Industries, LLC, 2004
1
Publication Order Number:
March, 2022 − Rev. 3
NC7SZ373/D
NC7SZ373
Connection Diagrams
LE
GND
D
1
2
3
LE
6
5
4
OE
LE 1
GND 2
D 3
6 OE
5 V
V
CC
D
Q
CC
Q
4 Q
Figure 2. SC−88 (Top View)
Figure 4. MicroPak (Top Through View)
(Top View)
AAA
Pin One
AAA = Product Code Top Mark − see ordering code
NOTE: Orientation of Top Mark determines Pin One location.
Read the top product code mark left to right, Pin One
is the lower left pin (see diagram).
Figure 3. Pin 1 Orientation
PIN DESCRIPTIONS
FUNCTION TABLE
Pin Name
Description
Data Input
Inputs
Output
D
CP
OE
Q
LE
H
H
L
D
L
OE
Q
L
Latch Enable Input
Output Enable Input
Latch Output
L
H
X
X
L
H
L
Q
n−1
X
H
Z
H = HIGH Logic Level
L = LOW Logic Level
X = Immaterial
Z = HIGH Impedance
Q
= Previous state prior to HIGH−to−LOW transition of latch
n−1
enable
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2
NC7SZ373
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Min
−0.5
−0.5
−0.5
−
Max
+6.5
+6.5
+6.5
−50
−50
50
Unit
V
V
CC
Supply Voltage
V
IN
DC Input Voltage
V
V
DC Output Voltage
DC Input Diode Current
DC Output Diode Current
V
OUT
I
V
V
< 0 V
mA
mA
mA
mA
°C
IK
IN
I
< 0 V
−
OK
OUT
I
DC Output Source / Sink Current
−
OUT
I
/ I
DC V / GND Current
−
50
CC GND
CC
T
STG
Storage Temperature Range
−65
−
+150
150
260
332
812
T
Junction Temperature under Bias
°C
J
L
T
Junction Lead Temperature (Soldering, 10 Seconds)
−
°C
P
D
Power Dissipation in Still Air
SC−88
−
mW
MicroPak
−
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Supply Voltage Operating
Supply Voltage Data Retention
Input Voltage
Conditions
Min
1.65
1.5
0
Max
5.5
5.5
5.5
Unit
V
CC
V
V
IN
V
V
V
OUT
Output Voltage
Active State
3−STATE
0
V
CC
0
5.5
20
V
t , t
Input Rise and Fall Time
V
CC
V
CC
V
CC
= 1.8 V, 2.5 V 0.2 V
= 3.3 V 0.3 V
0
ns/V
r
f
0
10
= 5.5 V 0.5 V
0
5
T
Operating Temperature
Thermal Resistance
−40
−
+85
377
154
°C
A
q
SC−88
°C/W
JA
MicroPak
−
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
1. Unused inputs must be held HIGH or LOW. They may not float.
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3
NC7SZ373
DC ELECTICAL CHARACTERISTICS
T
A
= +25°C
T = −40 to +85°C
A
Min
0.65 V
Typ
−
Max
−
Min
Max
−
Symbol
Parameter
V
(V)
Conditions
Unit
CC
V
IH
HIGH Level Control
Input Voltage
1.65 to 1.95
2.3 to 5.5
1.65 to 1.95
2.3 to 5.5
1.65
1.8
0.65 V
V
CC
CC
CC
0.7 V
−
−
0.7 V
−
CC
V
IL
LOW Level Control
Input Voltage
−
−
−
0.35 V
−
−
0.35 V
V
V
CC
CC
−
0.3 V
0.3 V
CC
CC
V
OH
HIGH Level Control
Output Voltage
V
= V
I
= −100 mA
1.55
1.7
2.2
2.9
4.4
1.24
1.9
2.4
2.3
3.8
−
1.65
1.8
−
−
−
−
−
−
−
−
−
−
1.55
1.7
2.2
2.9
4.4
1.29
1.9
2.4
2.3
3.8
−
−
−
−
−
−
−
−
−
−
−
IN
IH
OH
or V
IL
2.3
2.3
3.0
3.0
4.5
4.5
1.65
2.3
I
I
I
I
I
I
= −4 mA
= −8 mA
= −16 mA
= −24 mA
= −32 mA
= 100 mA
1.52
2.15
2.8
OH
OH
OH
OH
OH
OL
3.0
3.0
2.68
4.2
4.5
V
OL
LOW Level Control
Output Voltage
1.65
1.8
V
IN
= V
IH
0.0
0.08
0.1
0.0
0.1
V
or V
IL
−
0.0
−
2.3
−
0.0
0.1
−
0.1
3.0
−
0.0
0.1
−
0.1
4.5
−
0.0
0.1
−
0.1
1.65
2.3
I
I
I
I
I
= 4 mA
−
0.08
0.10
0.15
0.22
0.22
−
0.24
0.3
−
0.24
0.3
OL
OL
OL
OL
OL
= 8 mA
−
−
3.0
= 16 mA
= 24 mA
= 32 mA
−
0.4
−
0.4
3.0
−
0.55
0.55
0.1
−
0.55
0.55
1.0
4.5
−
−
I
Input Leakage
Current
1.65 to 5.5 0 ≤ V ≤ 5.5 V
−
−
mA
mA
mA
mA
IN
IN
I
3−STATE Output
Leakage
1.65 to 5.5
0.0
V
= V or V
IH
OUT
−
−
−
−
−
−
0.5
1.0
1.0
−
−
−
5.0
10
OZ
IN
IL
0 ≤ V
≤ 5.5 V
I
Power Off Leakage
Current
V
or V
= 5.5 V
OFF
IN
IN
OUT
I
Quiescent Supply
Current
1.65 to 5.5
V
= 5.5 V, GND
10
CC
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4
NC7SZ373
AC ELECTRICAL CHARACTERISTICS
T
A
= +25°C
Typ
9.0
T = −40 to +85°C
A
Min
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
Max
15.0
10.0
6.5
4.6
3.4
5.5
4.3
1.45
9.6
6.1
4.4
3.2
5.3
4.2
13.5
9.0
6.0
5.0
3.7
12.0
8.0
6.0
4.5
3.7
−
Min
Max
16.0
10.5
6.8
5.0
3.7
6.2
4.8
15.0
10.0
6.6
4.8
3.5
6.2
4.6
14.6
9.5
6.6
5.3
3.9
13.0
8.5
6.3
4.7
3.9
−
Unit
Symbol
Parameter
V
(V)
Conditions
CC
t
t
Propagation Delay
D to Q
1.65
1.8
C = 15 pF, R = 1 MW,
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
ns
PLH
PHL
L
1
D
S = Open
(Figures 5, 7)
6.1
2.5 0.2
3.3 0.3
5.0 0.5
3.3 0.3
5.0 0.5
1.65
3.6
2.7
2.0
C = 50 pF, R = 500 W
3.3
L
1
D
S = Open
(Figures 5, 7)
2.6
9.0
6.0
3.5
2.6
2.0
3.3
2.6
9.0
6.0
3.7
2.8
2.2
7.7
5.1
3.5
2.8
2.3
−
t
t
Propagation Delay
LE to Q
C = 15 pF, R = 1 MW,
ns
PLH
PHL
L
1
D
S = Open
(Figures 5, 7)
1.8
2.5 0.2
3.3 0.3
5.0 0.5
3.3 0.3
5.0 0.5
1.65
C = 50 pF, R = 500 W,
L
1
D
S = Open
(Figures 5, 8)
t
Output Enable Time
Output Disable Time
C = 50 pF, V = 2 x V
CC
,
,
ns
ns
PZL
PZH
L
I
t
R , R = 500 W,
U D
1.8
S = GND for t
1
1
PZH
PZL
S = V for t
I
2.5 0.2
3.3 0.3
5.0 0.5
1.65
(Figures 5, 8)
t
C = 50 pF, V = 2 x V
L I CC
PLZ
PHZ
t
R , R = 500 W,
U D
1.8
S = GND for t
1
1
PHZ
PLZ
S = V for t
I
2.5 0.2
3.3 0.3
5.0 0.5
2.5 0.2
3.3 0.3
5.0 0.5
2.5 0.2
3.3 0.3
5.0 0.5
2.5 0.2
3.3 0.3
5.0 0.5
(Figures 5, 8)
t
S
Setup Time, D to LE
Hold Time, D to LE
Pulse Width, LE
C = 50 pF, R = 500 W,
2.0
1.5
1.5
1.5
1.5
1.5
3.0
3.0
3.0
ns
ns
ns
L
1
D
S = Open
(Figures 5, 9)
−
−
−
−
−
−
t
H
C = 50 pF, R = 500 W,
−
−
−
−
−
−
−
−
−
L
1
D
S = Open
(Figures 5, 9)
−
−
−
−
−
−
t
W
C = 50 pF, R = 500 W,
−
−
−
L
1
D
S = Open
(Figures 5, 9)
−
−
−
−
−
−
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5
NC7SZ373
CAPACITANCE (T = +25°C, f = 1 MHz)
A
Symbol
Parameter
Input Capacitance
Condition
Typ
3
Max
−
Units
pF
C
V
V
= Open, V = 0 V or V
IN
CC
IN
CC
CC
C
Output Capacitance
= 3.3 V, V = 0 V or V
4
−
pF
OUT
CC
IN
C
Power Dissipation Capacitance
(Note 2)
V
CC
V
CC
= 3.3 V
= 5.0 V
14
17
−
−
pF
PD
2. C is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (I
) at
PD
CCD
no output loading and operating at 50% duty cycle. (See Figure 6)
C
is related to I
dynamic operating current by the expression: I
= (C ) (V ) (f ) + (I static).
CCD PD CC IN CC
PD
CCD
AC Loading and Waveforms
V
CC
A
V
IN
OPEN
GND
V
CC
OE
LE Input
D Input
RU
RD
OE
D
Q
OUTPUT
LE
C
Q Output
L
C includes load and stray capacitance
L
D Input = AC Waveform; t = t = 1.8 ns;
r f
Input PRR = 1.0 MHz, t = 500 ns.
D Input PRR = 10 MHz; Duty Cycle = 50%.
W
Figure 5. AC Test Circuit
Figure 6. ICCD Test Circuit
Figure 7. AC Waveforms
Figure 8. AC Waveforms
Figure 9. AC Waveforms
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6
NC7SZ373
ORDERING INFORMATION
†
Device
NC7SZ373P6X
Top Mark
Packages
Shipping
Z73
Z73
D4
6−Lead SC70, EIAJ SC88, 1.25 mm Wide
6−Lead SC70, EIAJ SC88, 1.25 mm Wide
6−Lead MicroPak, 1.00 mm Wide
3000 / Tape & Reel
3000 / Tape & Reel
5000 / Tape & Reel
NC7SZ373P6X−L22347
NC7SZ373L6X
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MicroPak is trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
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7
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SIP6 1.45X1.0
CASE 127EB
ISSUE O
DATE 31 AUG 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON13590G
SIP6 1.45X1.0
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−88 (SC−70 6 Lead), 1.25x2
CASE 419AD
ISSUE A
DATE 07 JUL 2010
1
SYMBOL
MIN
NOM
MAX
D
0.80
A
1.10
e
e
A1
A2
0.00
0.80
0.10
1.00
b
c
0.15
0.10
1.80
1.80
1.15
0.30
0.18
2.20
2.40
1.35
D
2.00
2.10
E1
E
E
E1
e
1.25
0.65 BSC
0.36
L
0.26
0.46
L1
L2
0.42 REF
0.15 BSC
TOP VIEW
0º
4º
8º
θ
10º
θ1
q1
A2
A1
A
q
L
b
L1
q1
c
L2
SIDE VIEW
END VIEW
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MO-203.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON34266E
SC−88 (SC−70 6 LEAD), 1.25X2
PAGE 1 OF 1
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−88/SC70−6/SOT−363
CASE 419B−02
ISSUE Y
1
DATE 11 DEC 2012
SCALE 2:1
2X
aaa H
D
NOTES:
D
H
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
A
3. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRU-
SIONS, OR GATE BURRS SHALL NOT EXCEED 0.20 PER END.
4. DIMENSIONS D AND E1 AT THE OUTERMOST EXTREMES OF
THE PLASTIC BODY AND DATUM H.
5. DATUMS A AND B ARE DETERMINED AT DATUM H.
6. DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.08 AND 0.15 FROM THE TIP.
7. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION.
ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 TOTAL IN
EXCESS OF DIMENSION b AT MAXIMUM MATERIAL CONDI-
TION. THE DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OF THE FOOT.
D
GAGE
PLANE
6
1
5
2
4
3
L
L2
E1
E
DETAIL A
aaa
C
2X
2X 3 TIPS
bbb H
D
e
MILLIMETERS
DIM MIN NOM MAX
−−−
INCHES
MIN
−−−
NOM MAX
−−− 0.043
−−− 0.004
6X b
B
TOP VIEW
A
−−−
−−−
1.10
A1 0.00
A2 0.70
0.10 0.000
M
ddd
C A-B D
0.90
0.20
0.15
2.00
2.10
1.25
0.65 BSC
0.36
1.00 0.027 0.035 0.039
0.25 0.006 0.008 0.010
0.22 0.003 0.006 0.009
2.20 0.070 0.078 0.086
2.20 0.078 0.082 0.086
1.35 0.045 0.049 0.053
0.026 BSC
b
C
D
E
0.15
0.08
1.80
2.00
A2
DETAIL A
A
E1 1.15
e
L
0.26
0.46 0.010 0.014 0.018
0.006 BSC
L2
0.15 BSC
0.15
aaa
bbb
ccc
ddd
0.006
0.012
0.004
0.004
0.30
0.10
0.10
6X
ccc C
A1
SEATING
PLANE
c
C
SIDE VIEW
END VIEW
GENERIC
MARKING DIAGRAM*
RECOMMENDED
SOLDERING FOOTPRINT*
6
6X
0.30
XXXMG
6X
0.66
G
1
2.50
XXX = Specific Device Code
M
= Date Code*
G
= Pb−Free Package
0.65
(Note: Microdot may be in either location)
PITCH
*Date Code orientation and/or position may
vary depending upon manufacturing location.
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
STYLES ON PAGE 2
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42985B
SC−88/SC70−6/SOT−363
PAGE 1 OF 2
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
SC−88/SC70−6/SOT−363
CASE 419B−02
ISSUE Y
DATE 11 DEC 2012
STYLE 1:
PIN 1. EMITTER 2
2. BASE 2
STYLE 2:
CANCELLED
STYLE 3:
CANCELLED
STYLE 4:
STYLE 5:
STYLE 6:
PIN 1. ANODE 2
2. N/C
PIN 1. CATHODE
2. CATHODE
3. COLLECTOR
4. EMITTER
5. BASE
PIN 1. ANODE
2. ANODE
3. COLLECTOR 1
4. EMITTER 1
5. BASE 1
3. COLLECTOR
3. CATHODE 1
4. ANODE 1
5. N/C
4. EMITTER
5. BASE
6. COLLECTOR 2
6. ANODE
6. CATHODE
6. CATHODE 2
STYLE 7:
STYLE 8:
CANCELLED
STYLE 9:
STYLE 10:
STYLE 11:
STYLE 12:
PIN 1. SOURCE 2
2. DRAIN 2
3. GATE 1
PIN 1. EMITTER 2
2. EMITTER 1
3. COLLECTOR 1
4. BASE 1
PIN 1. SOURCE 2
2. SOURCE 1
3. GATE 1
PIN 1. CATHODE 2
2. CATHODE 2
3. ANODE 1
PIN 1. ANODE 2
2. ANODE 2
3. CATHODE 1
4. ANODE 1
5. ANODE 1
6. CATHODE 2
4. SOURCE 1
5. DRAIN 1
6. GATE 2
4. DRAIN 1
5. DRAIN 2
6. GATE 2
4. CATHODE 1
5. CATHODE 1
6. ANODE 2
5. BASE 2
6. COLLECTOR 2
STYLE 13:
PIN 1. ANODE
2. N/C
STYLE 14:
PIN 1. VREF
2. GND
STYLE 15:
STYLE 16:
STYLE 17:
STYLE 18:
PIN 1. VIN1
2. VCC
PIN 1. ANODE 1
2. ANODE 2
PIN 1. BASE 1
2. EMITTER 2
3. COLLECTOR 2
4. BASE 2
PIN 1. BASE 1
2. EMITTER 1
3. COLLECTOR 2
4. BASE 2
3. COLLECTOR
4. EMITTER
5. BASE
3. GND
3. ANODE 3
3. VOUT2
4. VIN2
5. GND
6. VOUT1
4. IOUT
5. VEN
6. VCC
4. CATHODE 3
5. CATHODE 2
6. CATHODE 1
5. EMITTER 1
6. COLLECTOR 1
5. EMITTER 2
6. COLLECTOR 1
6. CATHODE
STYLE 19:
PIN 1. I OUT
2. GND
STYLE 20:
STYLE 21:
PIN 1. ANODE 1
2. N/C
STYLE 22:
PIN 1. D1 (i)
2. GND
STYLE 23:
PIN 1. Vn
2. CH1
3. Vp
STYLE 24:
PIN 1. CATHODE
2. ANODE
PIN 1. COLLECTOR
2. COLLECTOR
3. BASE
3. GND
3. ANODE 2
4. CATHODE 2
5. N/C
3. D2 (i)
3. CATHODE
4. CATHODE
5. CATHODE
6. CATHODE
4. V CC
4. EMITTER
5. COLLECTOR
6. COLLECTOR
4. D2 (c)
5. VBUS
6. D1 (c)
4. N/C
5. V EN
5. CH2
6. N/C
6. V REF
6. CATHODE 1
STYLE 30:
STYLE 25:
STYLE 26:
PIN 1. SOURCE 1
2. GATE 1
STYLE 27:
PIN 1. BASE 2
2. BASE 1
STYLE 28:
PIN 1. DRAIN
2. DRAIN
3. GATE
STYLE 29:
PIN 1. ANODE
2. ANODE
PIN 1. SOURCE 1
2. DRAIN 2
3. DRAIN 2
4. SOURCE 2
5. GATE 1
PIN 1. BASE 1
2. CATHODE
3. COLLECTOR 2
4. BASE 2
3. DRAIN 2
4. SOURCE 2
5. GATE 2
3. COLLECTOR 1
4. EMITTER 1
5. EMITTER 2
6. COLLECTOR 2
3. COLLECTOR
4. EMITTER
5. BASE/ANODE
6. CATHODE
4. SOURCE
5. DRAIN
6. DRAIN
5. EMITTER
6. COLLECTOR 1
6. DRAIN 1
6. DRAIN 1
Note: Please refer to datasheet for
style callout. If style type is not called
out in the datasheet refer to the device
datasheet pinout or pin assignment.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42985B
SC−88/SC70−6/SOT−363
PAGE 2 OF 2
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should
Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
ADDITIONAL INFORMATION
TECHNICAL PUBLICATIONS:
Technical Library: www.onsemi.com/design/resources/technical−documentation
onsemi Website: www.onsemi.com
ONLINE SUPPORT: www.onsemi.com/support
For additional information, please contact your local Sales Representative at
www.onsemi.com/support/sales
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