NC7SZ386P6X-L22347 [ONSEMI]

TinyLogic UHS 3 输入互斥 OR 门极;
NC7SZ386P6X-L22347
型号: NC7SZ386P6X-L22347
厂家: ONSEMI    ONSEMI
描述:

TinyLogic UHS 3 输入互斥 OR 门极

文件: 总9页 (文件大小:284K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DATA SHEET  
www.onsemi.com  
TinyLogic UHS Three-Input  
Exclusive-ORGate  
MARKING  
DIAGRAMS  
NC7SZ386  
F4KK  
XYZ  
SIP6 1.45x1.0  
CASE 127EB  
Description  
Pin 1  
The NC7SZ386 is a single threeinput ExclusiveOR Gate from  
onsemi’s UltraHigh Speed Series of TinyLogic. The device is  
fabricated with advanced CMOS technology to achieve ultrahigh  
speed with high output drive while maintaining low static power  
6
1
SC88  
386MG  
dissipation over a broad V operating range. The device is specified  
CC  
CASE 419B02  
G
to operate over the 1.65 V to 5.5 V V operating range. The inputs  
CC  
and output are high impedance when V  
is 0 V. Inputs tolerate  
CC  
voltages up to 5.5 V independent of V operating voltage.  
CC  
F4, 386  
= Specific Device Code  
Features  
KK  
XY  
Z
M
G
= 2Digit Lot Run Traceability Code  
= 2Digit Date Code Format  
= Assembly Plant Code  
= Date Code*  
UltraHigh Speed: t = 4.8 ns (Typical) into 50 pF at 5 V V  
PD  
CC  
High Output Drive: 24 mA at 3 V V  
CC  
Broad V Operating Range: 1.65 V to 5.5 V  
= PbFree Package  
CC  
Power Down High Impedance Inputs / Outputs  
(Note: Microdot may be in either location)  
OverVoltage Tolerance Inputs Facilitate 5 V to 3 V Translation  
Proprietary Noise / EMI Reduction Circuitry  
UltraSmall MicroPakPackages  
*Date Code orientation and/or position may  
vary depending upon manufacturing location.  
SpaceSaving SC70 Package  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
Compliant  
ORDERING INFORMATION  
See detailed ordering, marking and shipping information in the  
package dimensions section on page 5 of this data sheet.  
IEEC / IEC  
A
B
= 1  
Y
C
Figure 1. Logic Symbol  
© Semiconductor Components Industries, LLC, 2001  
1
Publication Order Number:  
March, 2022 Rev. 2  
NC7SZ386/D  
NC7SZ386  
Pin Configurations  
A 1  
GND 2  
B 3  
6 C  
5 V  
4 Y  
A
GND  
B
1
2
3
6
5
4
C
CC  
V
Y
CC  
Figure 2. SC88 (Top View)  
Figure 4. MicroPak (Top Through View)  
(Top View)  
AAA  
Pin One  
AAA represents Product Code Top Mark see ordering code.  
NOTE: Orientation of Top Mark determines Pin One location.  
Read the Top Product Code Mark left to right, Pin One  
is the lower left pin (see diagram).  
Figure 3. Pin 1 Orientation  
PIN DEFINITIONS  
FUNCTION TABLE  
Pin # SC88 Pin # MicroPak  
Name  
A
Description  
Input  
Inputs  
Output  
1
2
3
4
5
6
1
2
3
4
5
6
A
L
B
L
C
L
Y
L
GND  
B
Ground  
Input  
L
L
H
L
H
H
L
Y
Output  
L
H
H
L
V
CC  
Supply Voltage  
Input  
L
H
L
C
H
H
H
H
H
L
L
H
L
H
H
L
H
H
H = HIGH Logic Level  
L = LOW Logic Level  
www.onsemi.com  
2
NC7SZ386  
ABSOLUTE MAXIMUM RATINGS  
Symbol  
Parameter  
Min  
0.5  
0.5  
0.5  
Max  
6.5  
Unit  
V
V
CC  
Supply Voltage  
V
IN  
DC Input Voltage  
6.5  
V
V
DC Output Voltage  
DC Input Diode Current  
DC Output Diode Current  
DC Output Current  
6.5  
V
OUT  
I
V
< 0 V  
50  
50  
50  
mA  
mA  
mA  
mA  
°C  
IK  
IN  
I
V
< 0 V  
OK  
OUT  
I
OUT  
I
or I  
DC V or Ground Current  
50  
CC  
GND  
CC  
T
STG  
Storage Temperature Range  
65  
+150  
+150  
+260  
332  
812  
4000  
2000  
T
J
Junction Temperature Under Bias  
°C  
T
L
Junction Lead Temperature (Soldering, 10 Seconds)  
°C  
P
D
Power Dissipation in Still Air  
SC88  
mW  
MicroPak6  
ESD  
Human Body Model, JESD22A114  
V
Charge Device Model, JESD22C101  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
RECOMMENDED OPERATING CONDITIONS  
Symbol  
Parameter  
Supply Voltage Operating  
Supply Voltage Data Retention  
Input Voltage  
Conditions  
Min  
1.65  
1.50  
0
Max  
5.50  
5.50  
5.5  
Unit  
V
CC  
V
V
IN  
V
V
V
OUT  
Output Voltage  
0
V
CC  
T
Operating Temperature  
Input Rise and Fall Times  
40  
0
+85  
20  
°C  
A
t , t  
r
V
CC  
V
CC  
V
CC  
at 1.8 V, 2.5 V 0.2 V  
at 3.3 V 0.3 V  
ns/V  
f
0
10  
at 5.0 V 0.5 V  
0
5
q
Thermal Resistance  
SC88  
377  
154  
°C/W  
JA  
MicroPak6  
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond  
the Recommended Operating Ranges limits may affect device reliability.  
1. Unused inputs must be held HIGH or LOW. They may not float.  
www.onsemi.com  
3
NC7SZ386  
DC ELECTRICAL CHARACTERISTICS  
T
A
= 25°C  
Typ  
T = 40 to +85°C  
A
Min  
Max  
Min  
Max  
Symbol  
Parameter  
V
CC  
(V)  
Conditions  
Unit  
V
HIGH Level Input Voltage  
1.65 to 1.95  
2.30 to 5.50  
1.65 to 1.95  
2.30 to 5.50  
1.65  
0.65 V  
0.65 V  
V
IH  
CC  
CC  
CC  
CC  
0.70 V  
0.70 V  
V
LOW Level Input Voltage  
HIGH Level Output Voltage  
0.35 V  
0.35 V  
V
V
IL  
CC  
CC  
0.30 V  
0.30 V  
CC  
CC  
V
OH  
V
OH  
= V or V ,  
1.55  
2.20  
2.90  
4.40  
1.29  
1.90  
2.50  
2.40  
3.90  
1.65  
2.30  
3.00  
4.50  
1.52  
2.15  
2.80  
2.68  
4.20  
0.00  
0.00  
0.00  
0.00  
0.80  
0.10  
0.15  
0.22  
0.22  
1.55  
2.20  
2.90  
4.40  
1.29  
1.90  
2.40  
2.30  
3.80  
IN  
IH  
IL  
I
= 100 mA  
2.30  
3.00  
4.50  
1.65  
I
I
I
I
I
= 4 mA  
= 8 mA  
= 16 mA  
= 24 mA  
= 32 mA  
OH  
OH  
OH  
OH  
OH  
2.30  
3.00  
3.00  
4.50  
V
OL  
LOW Level Output Voltage  
1.65  
V
OL  
= V or V ,  
0.10  
0.10  
0.10  
0.10  
0.24  
0.30  
0.40  
0.55  
0.55  
1
0.10  
0.10  
0.10  
0.10  
0.24  
0.30  
0.40  
0.55  
0.55  
10  
V
IN  
IH  
IL  
I
= 100 mA  
2.30  
3.00  
4.50  
1.65  
I
OL  
I
OL  
I
OL  
I
OL  
I
OL  
= 4 mA  
2.30  
= 8 mA  
3.00  
= 16 mA  
= 24 mA  
= 32 mA  
3.00  
4.50  
I
IN  
Input Leakage Current  
1.65 to 5.5  
0
V
IN  
V
IN  
V
IN  
= 5.5 V, GND  
mA  
mA  
mA  
I
Power Off Leakage Current  
Quiescent Supply Current  
or V  
= 5.5 V  
1
10  
OFF  
OUT  
I
1.65 to 5.50  
= 5.5 V, GND  
2
20  
CC  
AC ELECTRICAL CHARACTERISTICS  
T
A
= 25°C  
Typ  
14.0  
8.0  
T = 40 to +85°C  
A
Symbol  
, t  
Parameter  
V
(V)  
Conditions  
Min  
Max  
Min  
Max  
23.0  
13.0  
9.5  
6.1  
9.8  
6.9  
Unit  
CC  
t
Propagation Delay  
(Figure 5, 6)  
1.80 0.15  
2.50 0.20  
3.30 0.30  
5.00 0.50  
3.30 0.30  
5.00 0.50  
0.00  
C = 15 pF,  
22.5  
12.5  
9.2  
5.7  
9.5  
6.5  
ns  
PLH PHL  
L
R = 1 MW  
L
6.0  
4.3  
C = 50 pF,  
6.1  
L
R = 500 W  
L
4.8  
C
Input Capacitance  
4
pF  
pF  
IN  
C
Power Dissipation Capacitance  
(Note 2) (Figure 7)  
3.30  
25  
31  
PD  
5.00  
2. C is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (I  
) at  
PD  
CCD  
no output loading and operating at 50% duty cycle.(See Figure 7) C is related to I  
dynamic operating current by the expression:  
PD  
CCD  
I
= (C ) (V ) (f ) + (I static).  
CCD  
PD CC IN CC  
www.onsemi.com  
4
 
NC7SZ386  
AC Loading and Waveforms  
V
CC  
t = 3 ns  
r
t = 3 ns  
f
V
CC  
90%  
50%  
90%  
50%  
INPUT  
OUTPUT  
INPUT  
R
10%  
10%  
C
L
L
t
W
GND  
t
t
PHL  
PLH  
V
OH  
NOTES:  
3. C includes load and stray capacitance  
L
50%  
50%  
OUTPUT  
4. Input PRR = 1.0 MHz, t = 500 ns.  
W
V
OL  
Figure 5. AC Test Circuit  
Figure 6. AC Waveforms  
V
CC  
A
INPUT  
NOTE:  
5. Input = AC Waveform; t = t = 1.8 ns; PRR = 10 MHz;  
r
f
Duty Cycle = 50%.  
Figure 7. ICCD Test Circuit  
DEVICE ORDERING INFORMATION  
Device  
NC7SZ386P6X  
Top Mark  
386  
Packages  
Shipping  
6Lead SC70, EIAJ SC88, 1.25 mm Wide  
6Lead SC70, EIAJ SC88, 1.25 mm Wide  
6Lead MicroPak, 1.00 mm Wide  
3000 / Tape & Reel  
3000 / Tape & Reel  
5000 / Tape & Reel  
NC7SZ386P6XL22347  
386  
NC7SZ386L6X  
F4  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
MicroPak is a trademark of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other  
countries.  
www.onsemi.com  
5
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
SIP6 1.45X1.0  
CASE 127EB  
ISSUE O  
DATE 31 AUG 2016  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13590G  
SIP6 1.45X1.0  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
© Semiconductor Components Industries, LLC, 2019  
www.onsemi.com  
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
SC88/SC706/SOT363  
CASE 419B02  
ISSUE Y  
1
DATE 11 DEC 2012  
SCALE 2:1  
2X  
aaa H  
D
NOTES:  
D
H
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.  
2. CONTROLLING DIMENSION: MILLIMETERS.  
A
3. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,  
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRU-  
SIONS, OR GATE BURRS SHALL NOT EXCEED 0.20 PER END.  
4. DIMENSIONS D AND E1 AT THE OUTERMOST EXTREMES OF  
THE PLASTIC BODY AND DATUM H.  
5. DATUMS A AND B ARE DETERMINED AT DATUM H.  
6. DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE  
LEAD BETWEEN 0.08 AND 0.15 FROM THE TIP.  
7. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION.  
ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 TOTAL IN  
EXCESS OF DIMENSION b AT MAXIMUM MATERIAL CONDI-  
TION. THE DAMBAR CANNOT BE LOCATED ON THE LOWER  
RADIUS OF THE FOOT.  
D
GAGE  
PLANE  
6
1
5
2
4
3
L
L2  
E1  
E
DETAIL A  
aaa  
C
2X  
2X 3 TIPS  
bbb H  
D
e
MILLIMETERS  
DIM MIN NOM MAX  
−−−  
INCHES  
MIN  
−−−  
NOM MAX  
−−− 0.043  
−−− 0.004  
6X b  
B
TOP VIEW  
A
−−−  
−−−  
1.10  
A1 0.00  
A2 0.70  
0.10 0.000  
M
ddd  
C A-B D  
0.90  
0.20  
0.15  
2.00  
2.10  
1.25  
0.65 BSC  
0.36  
1.00 0.027 0.035 0.039  
0.25 0.006 0.008 0.010  
0.22 0.003 0.006 0.009  
2.20 0.070 0.078 0.086  
2.20 0.078 0.082 0.086  
1.35 0.045 0.049 0.053  
0.026 BSC  
b
C
D
E
0.15  
0.08  
1.80  
2.00  
A2  
DETAIL A  
A
E1 1.15  
e
L
0.26  
0.46 0.010 0.014 0.018  
0.006 BSC  
L2  
0.15 BSC  
0.15  
aaa  
bbb  
ccc  
ddd  
0.006  
0.012  
0.004  
0.004  
0.30  
0.10  
0.10  
6X  
ccc C  
A1  
SEATING  
PLANE  
c
C
SIDE VIEW  
END VIEW  
GENERIC  
MARKING DIAGRAM*  
RECOMMENDED  
SOLDERING FOOTPRINT*  
6
6X  
0.30  
XXXMG  
6X  
0.66  
G
1
2.50  
XXX = Specific Device Code  
M
= Date Code*  
G
= PbFree Package  
0.65  
(Note: Microdot may be in either location)  
PITCH  
*Date Code orientation and/or position may  
vary depending upon manufacturing location.  
DIMENSIONS: MILLIMETERS  
*For additional information on our PbFree strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “G”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
STYLES ON PAGE 2  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98ASB42985B  
SC88/SC706/SOT363  
PAGE 1 OF 2  
onsemi and  
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves  
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular  
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation  
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.  
© Semiconductor Components Industries, LLC, 2019  
www.onsemi.com  
SC88/SC706/SOT363  
CASE 419B02  
ISSUE Y  
DATE 11 DEC 2012  
STYLE 1:  
PIN 1. EMITTER 2  
2. BASE 2  
STYLE 2:  
CANCELLED  
STYLE 3:  
CANCELLED  
STYLE 4:  
STYLE 5:  
STYLE 6:  
PIN 1. ANODE 2  
2. N/C  
PIN 1. CATHODE  
2. CATHODE  
3. COLLECTOR  
4. EMITTER  
5. BASE  
PIN 1. ANODE  
2. ANODE  
3. COLLECTOR 1  
4. EMITTER 1  
5. BASE 1  
3. COLLECTOR  
3. CATHODE 1  
4. ANODE 1  
5. N/C  
4. EMITTER  
5. BASE  
6. COLLECTOR 2  
6. ANODE  
6. CATHODE  
6. CATHODE 2  
STYLE 7:  
STYLE 8:  
CANCELLED  
STYLE 9:  
STYLE 10:  
STYLE 11:  
STYLE 12:  
PIN 1. SOURCE 2  
2. DRAIN 2  
3. GATE 1  
PIN 1. EMITTER 2  
2. EMITTER 1  
3. COLLECTOR 1  
4. BASE 1  
PIN 1. SOURCE 2  
2. SOURCE 1  
3. GATE 1  
PIN 1. CATHODE 2  
2. CATHODE 2  
3. ANODE 1  
PIN 1. ANODE 2  
2. ANODE 2  
3. CATHODE 1  
4. ANODE 1  
5. ANODE 1  
6. CATHODE 2  
4. SOURCE 1  
5. DRAIN 1  
6. GATE 2  
4. DRAIN 1  
5. DRAIN 2  
6. GATE 2  
4. CATHODE 1  
5. CATHODE 1  
6. ANODE 2  
5. BASE 2  
6. COLLECTOR 2  
STYLE 13:  
PIN 1. ANODE  
2. N/C  
STYLE 14:  
PIN 1. VREF  
2. GND  
STYLE 15:  
STYLE 16:  
STYLE 17:  
STYLE 18:  
PIN 1. VIN1  
2. VCC  
PIN 1. ANODE 1  
2. ANODE 2  
PIN 1. BASE 1  
2. EMITTER 2  
3. COLLECTOR 2  
4. BASE 2  
PIN 1. BASE 1  
2. EMITTER 1  
3. COLLECTOR 2  
4. BASE 2  
3. COLLECTOR  
4. EMITTER  
5. BASE  
3. GND  
3. ANODE 3  
3. VOUT2  
4. VIN2  
5. GND  
6. VOUT1  
4. IOUT  
5. VEN  
6. VCC  
4. CATHODE 3  
5. CATHODE 2  
6. CATHODE 1  
5. EMITTER 1  
6. COLLECTOR 1  
5. EMITTER 2  
6. COLLECTOR 1  
6. CATHODE  
STYLE 19:  
PIN 1. I OUT  
2. GND  
STYLE 20:  
STYLE 21:  
PIN 1. ANODE 1  
2. N/C  
STYLE 22:  
PIN 1. D1 (i)  
2. GND  
STYLE 23:  
PIN 1. Vn  
2. CH1  
3. Vp  
STYLE 24:  
PIN 1. CATHODE  
2. ANODE  
PIN 1. COLLECTOR  
2. COLLECTOR  
3. BASE  
3. GND  
3. ANODE 2  
4. CATHODE 2  
5. N/C  
3. D2 (i)  
3. CATHODE  
4. CATHODE  
5. CATHODE  
6. CATHODE  
4. V CC  
4. EMITTER  
5. COLLECTOR  
6. COLLECTOR  
4. D2 (c)  
5. VBUS  
6. D1 (c)  
4. N/C  
5. V EN  
5. CH2  
6. N/C  
6. V REF  
6. CATHODE 1  
STYLE 30:  
STYLE 25:  
STYLE 26:  
PIN 1. SOURCE 1  
2. GATE 1  
STYLE 27:  
PIN 1. BASE 2  
2. BASE 1  
STYLE 28:  
PIN 1. DRAIN  
2. DRAIN  
3. GATE  
STYLE 29:  
PIN 1. ANODE  
2. ANODE  
PIN 1. SOURCE 1  
2. DRAIN 2  
3. DRAIN 2  
4. SOURCE 2  
5. GATE 1  
PIN 1. BASE 1  
2. CATHODE  
3. COLLECTOR 2  
4. BASE 2  
3. DRAIN 2  
4. SOURCE 2  
5. GATE 2  
3. COLLECTOR 1  
4. EMITTER 1  
5. EMITTER 2  
6. COLLECTOR 2  
3. COLLECTOR  
4. EMITTER  
5. BASE/ANODE  
6. CATHODE  
4. SOURCE  
5. DRAIN  
6. DRAIN  
5. EMITTER  
6. COLLECTOR 1  
6. DRAIN 1  
6. DRAIN 1  
Note: Please refer to datasheet for  
style callout. If style type is not called  
out in the datasheet refer to the device  
datasheet pinout or pin assignment.  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98ASB42985B  
SC88/SC706/SOT363  
PAGE 2 OF 2  
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