NC7WP08L8X [ONSEMI]
TinyLogic ULP 双 2 输入 AND 门极;
| 型号： | NC7WP08L8X |
| 厂家： | 
ONSEMI |
| 描述： | TinyLogic ULP 双 2 输入 AND 门极 栅 逻辑集成电路 触发器 |
| 文件： | 总9页 (文件大小：514K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
www.onsemi.com
TinyLogic ULP-A Dual
2-Input AND Gate
MARKING
DIAGRAMS
NC7WP08
The NC7WP08 is a dual 2−input AND gate in tiny footprint
CCKK
XYZ
=
packages. The device is designed to operate for V
0.9 V to 3.6 V.
CC
Features
• Designed for 0.9 V to 3.6 V V Operation
CC
• 2.2 ns t at 3.3 V (Typ)
PD
XXXX
ALYW
• Inputs/Outputs Over−Voltage Tolerant up to 3.6 V
• I
Supports Partial Power Down Protection
• Source/Sink 2.6 mA at 3.3 V
OFF
• Available in US8 and MicroPak™ Packages
CC, XXXX = Specific Device Code
KK
XY
Z
= 2−Digit Lot Run Traceability Code
= 2−Digit Date Code Format
= Assembly Plant Code
= Assembly Site
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
A
A1 B1 Y2
L
= Wafer Lot Number
A
1
1
8
V
CC
5
7
6
YW
= Assembly Start Week
B
1
Y
2
2
3
7
6
Y
1
B
2
V
CC
8
GND
4
ORDERING INFORMATION
See detailed ordering, marking and shipping information on
page 6 of this data sheet.
GND
4
5
A
2
1
2
3
A2
Y1 B2
UQFN8
US8
Figure 1. Pinout Diagrams (Top Views)
A1
B1
&
&
Y1
Y2
A2
B2
Figure 2. Logic Symbol
PIN ASSIGNMENT
FUNCTION TABLE
Pin
1
US8
UQFN8
Inputs
Output
A1
B1
Y1
B2
A
L
B
L
Y
L
2
3
Y2
A2
L
H
L
L
4
GND
A2
GND
Y2
H
H
L
5
H
H
NOTE: H = HIGH Logic Level
L = LOW Logic Level
6
B2
B1
7
Y1
A1
8
V
CC
V
CC
Publication Order Number:
© Semiconductor Components Industries, LLC, 2005
1
NC7WP08/D
October, 2021 − Rev. 1
NC7WP08
MAXIMUM RATINGS
Symbol
Characteristics
Value
Unit
V
V
CC
DC Supply Voltage
DC Input Voltage
DC Output Voltage
−0.5 to +4.3
−0.5 to +4.3
V
IN
V
V
OUT
Active−Mode (High or Low State)
Tri−State Mode (Note 1)
−0.5 to V + 0.5
V
CC
−0.5 to +4.3
−0.5 to +4.3
Power−Down Mode (V = 0 V)
CC
I
DC Input Diode Current
V
< GND
< GND
−50
−50
mA
mA
mA
mA
°C
IK
IN
I
DC Output Diode Current
V
OUT
OK
I
DC Output Source/Sink Current
DC Supply Current per Supply Pin or Ground Pin
Storage Temperature Range
50
OUT
I
or I
GND
STG
50
CC
T
−65 to +150
260
T
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature Under Bias
Thermal Resistance (Note 2)
°C
L
T
+150
°C
J
q
US8
MicroPak
250
210
°C/W
JA
P
D
Power Dissipation in Still Air
US8
MicroPak
500
595
mW
MSL
Moisture Sensitivity
Level 1
−
−
V
F
R
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
V
ESD
ESD Withstand Voltage (Note 3)
Human Body Model
Charged Device Model
2000
1000
I
Latchup Performance (Note 4)
100
mA
Latchup
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Applicable to devices with outputs that may be tri−stated.
2. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow per JESD51−7.
3. HBM tested to EIA / JESD22−A114−A. CDM tested to JESD22−C101−A. JEDEC recommends that ESD qualification to EIA/JESD22−A115A
(Machine Model) be discontinued.
4. Tested to EIA/JESD78 Class II.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
0.9
0
Max
3.6
Unit
V
V
CC
Positive DC Supply Voltage
DC Input Voltage
V
IN
3.6
V
V
OUT
DC Output Voltage
Active−Mode (High or Low State)
Tri−State Mode (Note 1)
0
0
0
V
CC
3.6
3.6
Power−Down Mode (V = 0 V)
CC
T
Operating Temperature Range
−40
+85
10
°C
A
t , t
r
Input Transition Rise and Fall Time
V = 3.3 V 0.3 V
CC
0
ns/V
f
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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2
NC7WP08
DC ELECTRICAL CHARACTERISTICS
T
A
= 255C
Typ
T
= −405C to +855C
A
Min
Max
Min
Max
Symbol
Parameter
Condition
V
CC
(V)
Unit
0.9
0.5
−
−
−
V
High−Level Input
V
−
−
IH
Voltage
1.1 to 1.3
1.4 to 1.6
0.65 x V
−
0.65 x V
−
CC
CC
CC
CC
0.65 x V
−
−
0.65 x V
−
CC
CC
1.65 to 1.95 0.65 x V
−
−
−
0.65 x V
−
−
2.3 to 2.7
3.0 to 3.6
0.9
1.6
2.1
−
−
1.6
2.1
−
−
−
−
0.5
−
−
−
V
Low−Level Input
Voltage
V
V
IL
1.1 to 1.3
1.4 to 1.6
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
−
0.35 x V
0.35 x V
0.35 x V
0.7
−
0.35 x V
0.35 x V
0.35 x V
0.7
CC
CC
CC
CC
CC
CC
−
−
−
−
−
−
−
−
−
−
−
0.9
−
0.9
V
I
= V or V
V
OH
High−Level Output
Voltage
IN
IH
IL
0.9
−
V
CC
0.1
−
−
−
−
= −20 mA
OH
1.1 to 1.3
1.4 to 1.6
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
1.1 to 1.3
1.4 to 1.6
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
V
V
V
V
V
− 0.1
− 0.1
− 0.1
− 0.1
− 0.1
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
V
V
V
V
V
− 0.1
− 0.1
− 0.1
− 0.1
− 0.1
−
−
−
−
−
−
−
−
−
−
CC
CC
CC
CC
CC
CC
CC
CC
CC
CC
I
I
I
I
I
= −0.5 mA
= −1 mA
0.75 x V
1.07
0.70 x V
0.99
OH
OH
OH
OH
OH
CC
CC
= −1.5 mA
= −2.1 mA
= −2.6 mA
= V or V
1.24
1.22
1.95
1.87
2.61
2.55
V
V
Low−Level Output
V
IN
IH
IL
OL
Voltage
0.9
−
−
−
−
−
−
−
−
−
−
−
−
0.1
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
I
= 20 mA
OL
1.1 to 1.3
1.4 to 1.6
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
1.1 to 1.3
1.4 to 1.6
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
0.9 to 3.6
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
−
−
−
−
I
OL
I
OL
I
OL
I
OL
I
OL
= 0.5 mA
= 1 mA
−
0.3 x V
0.31
0.31
0.31
0.31
0.1
0.3 x V
0.37
0.35
0.33
0.33
0.5
CC
CC
−
= 1.5 mA
= 2.1 mA
= 2.6 mA
= 0 V to 3.6 V
−
−
−
I
IN
Input Leakage
Current
V
−
mA
mA
mA
IN
I
Power Off Leakage
Current
V
V
= 0 V to 3.6 V or
0
−
−
−
−
0.5
0.9
−
−
0.5
0.9
OFF
IN
= 0 V to 3.6 V
OUT
I
Quiescent Supply
Current
V
= V or GND
0.9 to 3.6
CC
IN
CC
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
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3
NC7WP08
AC ELECTRICAL CHARACTERISTICS
T
A
= 25°C
Typ
40.4
11.7
6.1
T
= −405C to +855C
A
Min
−
Max
−
Min
Max
Symbol
, t
Parameter
Condition
R = 1 MW, C = 10 pF
V
(V)
Unit
CC
t
t
t
Propagation Delay,
(A or B) to Y
(Figures 3 and 4)
0.9
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
ns
PLH PHL
L
L
1.10 to 1.30
1.40 to 1.60
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
0.9
−
24.3
14.8
12.0
9.4
34.3
15.0
12.2
9.9
−
−
4.0
−
3.0
−
2.2
8.3
9.0
, t
Propagation Delay,
(A or B) to Y
(Figures 3 and 4)
R = 1 MW, C = 15 pF
−
42.2
12.2
6.4
−
−
ns
ns
PLH PHL
L
L
1.10 to 1.30
1.40 to 1.60
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
0.9
−
25.7
15.5
12.6
9.9
37.3
16.5
13.6
10.8
9.5
−
−
4.3
−
3.2
−
2.4
8.7
, t
Propagation Delay,
(A or B) to Y
(Figures 3 and 4)
R = 1 MW, C = 30 pF
−
48.5
13.5
7.5
−
−
PLH PHL
L
L
1.10 to 1.30
1.40 to 1.60
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
−
29.7
17.8
14.4
11.3
9.2
46.3
18.2
15.9
12.8
10.7
−
−
5.2
−
3.8
−
2.9
CAPACITIVE CHARACTERISTICS
Symbol
Parameter
Input Capacitance
Output Capacitance
Power Dissipation Capacitance (Note 5)
Test Condition
Typical (T = 25°C)
Unit
pF
A
C
V
V
= 0 V
= 0 V
2.0
4.0
6.0
IN
CC
C
pF
OUT
CC
C
f = 10 MHz, V = 0.9 to 3.6 V, V = 0 V or V
CC
pF
PD
CC
IN
5. C is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
PD
Average operating current can be obtained by the equation I
) = C ꢀ V ꢀ f + I . C is used to determine the no−load dynamic
CC(OPR
PD CC in CC PD
2
power consumption: P = C ꢀ V
ꢀ f + I ꢀ V
.
D
PD
CC
in
CC
CC
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4
NC7WP08
OPEN
Test
/ t
Switch Position
2 x V
DUT
GND
CC
t
Open
PLH PHL
t
/ t
2 x V
CC
PLZ PZL
R
1
L
t
/ t
GND
PHZ PZH
INPUT
OUTPUT
R
R
C *
L
T
C includes probe and jig capacitance
L
R is Z
of pulse generator (typically 50 W)
T
OUT
f = 1 MHz
Figure 3. Test Circuit
V
CC
t = 3 ns
r
t = 3 ns
f
V
CC
90%
90%
INPUT
V
mi
V
mi
V
mi
V
mi
INPUT
GND
~V
10%
10%
GND
t
t
PLZ
PZL
t
t
PLH
PHL
CC
V
OH
V
V
OUTPUT
OUTPUT
mo
V
V
V
V
OUTPUT
OUTPUT
mo
mo
V
+ V
OL
OL
Y
V
V
V
OL
t
t
PHZ
PZH
t
t
PLH
PHL
V
OH
OH
V
− V
OH
Y
mo
mo
mo
V
OL
~0 V
V
, V
V
, V
V
, V
/ 2
/ 2
/ 2
/ 2
/ 2
V , V
CC
mi
mo
CC
CC
CC
CC
CC
Y
0.9
V
CC
V
CC
V
CC
V
CC
V
CC
/ 2
/ 2
/ 2
/ 2
/ 2
V
V
V
V
V
0.1
0.1
1.1 to 1.3
1.4 to 1.6
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
0.1
0.15
0.15
0.3
1.5
1.5
Figure 4. Switching Waveforms
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5
NC7WP08
ORDERING INFORMATION
Pin 1 Orientation
(See below)
†
Device
NC7WP08K8X
NC7WP08L8X
Package
US8
Marking
WP08
Y5
Shipping
Q4
Q4
3000 / Tape & Reel
5000 / Tape & Reel
MicroPak, UQFN8
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Pin 1 Orientation in Tape and Reel
MicroPak is a trademark of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other
countries.
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6
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UQFN8 1.6X1.6, 0.5P
CASE 523AY
ISSUE O
DATE 31 AUG 2016
0.40
(6X)
1.60
A
0.05
C
1.60
B
0.45
(2X)
2X
1.60
1.61
0.05
C
PIN#1 IDENT
0.50
TOP VIEW
0.25
(8X)
RECOMMENDED
LAND PATTERN
0.50 0.05
0.05
0.05
C
C
NOTES:
SEATING
PLANE
A. PACKAGE CONFORMS TO JEDEC MO−255
C
VARIATION UAAD.
0.025 0.025
B. DIMENSIONS ARE IN MILLIMETERS.
SIDE VIEW
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 2009.
1.60 0.05
D. LAND PATTERN RECOMMENDATION IS
EXISTING INDUSTRY LAND PATTERN.
(0.10)
(0.20)3X
(0.09)
DETAIL A
1
2
3
(0.20)
4
8
1.60 0.05
0.30 0.05
0.30 0.05 (7X)
0.50
(0.15)
7
6
5
0.20 0.05 (8X)
0.30 0.05
0.10
0.05
C
C
A
B
1.00 0.05
DETAIL A
SCALE : 2X
BOTTOM VIEW
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON13591G
UQFN8 1.6X1.6, 0.5P
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
US8
CASE 846AN
ISSUE O
DATE 31 DEC 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON13778G
US8
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
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