NCP103AMX220TCG [ONSEMI]
150 mA CMOS Low Dropout Regulator;
| 型号： | NCP103AMX220TCG |
| 厂家： | 
ONSEMI |
| 描述： | 150 mA CMOS Low Dropout Regulator 输出元件 调节器 |
| 文件： | 总15页 (文件大小：676K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NCP103
150 mA CMOS Low Dropout
Regulator
The NCP103 is 150 mA LDO that provides the engineer with a very
stable, accurate voltage with low noise suitable for space constrained,
noise sensitive applications. In order to optimize performance for
battery operated portable applications, the NCP103 employs the
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dynamic quiescent current adjustment for very low I consumption at
Q
no−load.
MARKING
DIAGRAM
Features
1
• Operating Input Voltage Range: 1.7 V to 5.5 V
UDFN4
MX SUFFIX
CASE 517CU
XX M
1
• Available in Fixed Voltage Options: 0.9 V to 3.5 V
Contact Factory for Other Voltage Options
• Very Low Quiescent Current of Typ. 50 mA
XX = Specific Device Code
= Date Code
• Standby Current Consumption: Typ. 0.1 mA
• Low Dropout: 75 mV Typical at 150 mA
M
•
1% Accuracy at Room Temperature
PIN CONNECTION
• High Power Supply Ripple Rejection: 75 dB at 1 kHz
• Thermal Shutdown and Current Limit Protections
• Stable with a 1 mF Ceramic Output Capacitor
• Available in uDFN 1.0 x 1.0 mm Package
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
EN
3
IN
4
Typical Applicaitons
• PDAs, Mobile phones, GPS, Smartphones
2
1
®
®
• Wireless Handsets, Wireless LAN, Bluetooth , Zigbee
GND
OUT
• Portable Medical Equipment
• Other Battery Powered Applications
(Bottom View)
ORDERING INFORMATION
See detailed ordering, marking and shipping information on
page 14 of this data sheet.
V
V
IN
OUT
IN
OUT
NCP103
GND
C
C
OUT
1 mF
Ceramic
IN
EN
ON
OFF
Figure 1. Typical Application Schematic
© Semiconductor Components Industries, LLC, 2016
1
Publication Order Number:
December, 2017 − Rev. 13
NCP103/D
NCP103
IN
ENABLE
LOGIC
THERMAL
EN
SHUTDOWN
BANDGAP
REFERENCE
MOSFET
DRIVER WITH
CURRENT LIMIT
OUT
AUTO LOW
POWER MODE
ACTIVE
DISCHARGE*
EN
GND
*Active output discharge function is present only in NCP103AMXyyyTCG devices.
yyy denotes the particular V option.
OUT
Figure 2. Simplified Schematic Block Diagram
PIN FUNCTION DESCRIPTION
Pin No.
Pin Name
Description
1
OUT
Regulated output voltage pin. A small ceramic capacitor with minimum value of 1 mF is needed from this
pin to ground to assure stability.
2
3
GND
EN
Power supply ground.
Driving EN over 0.9 V turns on the regulator. Driving EN below 0.4 V puts the regulator into shutdown
mode.
4
−
IN
Input pin. A small capacitor is needed from this pin to ground to assure stability.
EPAD
Exposed pad should be connected directly to the GND pin. Soldered to a large ground copper plane allows
for effective heat removal.
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
VIN
Value
Unit
V
Input Voltage (Note 1)
−0.3 V to 6 V
Output Voltage
VOUT
VEN
−0.3 V to VIN + 0.3 V or 6 V
V
Enable Input
−0.3 V to VIN + 0.3 V or 6 V
V
Output Short Circuit Duration
Maximum Junction Temperature
Storage Temperature
tSC
∞
150
s
TJ(MAX)
TSTG
°C
°C
V
−55 to 150
2000
ESD Capability, Human Body Model (Note 2)
ESD Capability, Machine Model (Note 2)
ESDHBM
ESDMM
200
V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per EIA/JESD22−A114,
ESD Machine Model tested per EIA/JESD22−A115,
Latchup Current Maximum Rating tested per JEDEC standard: JESD78.
THERMAL CHARACTERISTICS (Note 3)
Rating
Symbol
Value
Unit
Thermal Characteristics, uDFN4 1x1 mm
R
170
°C/W
q
JA
Thermal Resistance, Junction−to−Air
3. Single component mounted on 1 oz, FR 4 PCB with 645 mm Cu area.
2
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2
NCP103
ELECTRICAL CHARACTERISTICS −40°C ≤ T ≤ 85°C; V = V
+ 1 V for V
options greater than 1.5 V. Otherwise V
=
J
IN
OUT(NOM)
OUT
IN
2.5 V, whichever is greater; I
= 1 mA, C = C
= 1 mF, unless otherwise noted. V = 0.9 V. Typical values are at T = +25°C.
OUT
IN
OUT EN J
Min./Max. are for T = −40°C and T = +85°C respectively.
J
J
Parameter
Test Conditions
Symbol
Min
1.7
−40
−2
Typ
Max
5.5
+40
+2
Unit
V
Operating Input Voltage
V
IN
V
≤ 2.0 V
V
OUT
mV
%
OUT
Output Voltage Accuracy
−40°C ≤ T ≤ 85°C
J
V
> 2.0 V
OUT
Line Regulation
Load Regulation
Load Transient
VOUT + 0.5 V ≤ VIN ≤ 5.5 V (V ≥ 1.7 V)
Reg
0.01
10
0.1
30
%/V
mV
mV
IN
LINE
LOAD
LOAD
IOUT = 1 mA to 150 mA
Reg
I
= 1 mA to 150 mA or 150 mA to 1 mA Tran
−30/
+20
OUT
in 1 ms, C
= 1 mF
OUT
V
= 1.5 V
= 1.85 V
= 2.8 V
= 3.0 V
= 3.1 V
= 3.3 V
180
120
75
235
165
125
120
120
110
OUT
V
OUT
V
OUT
OUT
OUT
OUT
Dropout Voltage (Note 4)
I
= 150 mA
V
DO
mV
OUT
V
72
V
V
70
65
Output Current Limit
Ground Current
V
= 90% V
I
150
0.9
550
50
mA
mA
mA
V
OUT
OUT(nom)
IOUT = 0 mA
VEN ≤ 0.4 V, VIN = 5.5 V
CL
I
95
1
Q
Shutdown Current
I
0.01
DIS
EN Pin Threshold Voltage
High Threshold
Low Threshold
V
Voltage increasing
Voltage decreasing
V
EN_HI
EN_LO
EN
V
EN
V
0.4
1.0
EN Pin Input Current
VEN = 5.5 V
I
0.3
75
mA
EN
Power Supply Rejection Ratio
V
IN
= 3.6 V, V
= 3.1 V
f = 1 kHz
PSRR
dB
OUT
I
= 150 mA
OUT
Output Noise Voltage
V
IN
= 2.5 V, V
= 1.8 V, I
= 150 mA
V
N
60
mV
rms
OUT
OUT
f = 10 Hz to 100 kHz
Thermal Shutdown Temperature
Thermal Shutdown Hysteresis
Temperature increasing from TJ = +25°C
T
160
20
°C
SD
Temperature falling from T
T
SDH
°C
SD
Active Output Discharge Resistance
VEN < 0.4 V, Version A only
R
100
W
DIS
4. Characterized when VOUT falls 100 mV below the regulated voltage at VIN = VOUT(NOM) + 1 V.
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
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3
NCP103
TYPICAL CHARACTERISTICS
1.206
1.204
1.202
1.200
1.198
1.196
1.194
1.192
1.190
1.188
2.815
2.810
2.805
2.800
2.795
2.790
2.785
I
= 1 mA
OUT
I
= 1 mA
OUT
I
= 150 mA
OUT
I
= 150 mA
OUT
V
= 3.8 V
= 2.8 V
= 1 mF
V
V
C
C
= 2.5 V
IN
IN
2.780
2.775
2.770
V
OUT
= 1.2 V
= 1 mF
OUT
C
C
IN
IN
= 1 mF
= 1 mF
OUT
OUT
−40 −30 −20 −10
0
10 20 30 40 50 60 70 80 90
−40 −30 −20 −10
0
10 20 30 40 50 60 70 80 90
T , JUNCTION TEMPERATURE (°C)
J
T , JUNCTION TEMPERATURE (°C)
J
Figure 3. Output Voltage vs. Temperature
Figure 4. Output Voltage vs. Temperature
V
OUT = 1.2 V
V
OUT = 2.8 V
80
70
60
50
40
30
20
10
0
600
550
500
450
400
350
300
250
200
150
100
50
V
V
C
C
= 3.8 V
IN
−40°C
85°C
= 2.8 V
= 1 mF
OUT
IN
= 1 mF
OUT
25°C
85°C
25°C
−40°C
V
C
C
= 2.8 V
OUT
= 1 mF
IN
= 1 mF
OUT
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
0.001
0.01
0.1
1
10
100
1000
V
IN
, INPUT VOLTAGE (V)
I , OUTPUT CURRENT (mA)
OUT
Figure 5. Quiescent Current vs. Input Voltage
Figure 6. Ground Current vs. Output Current
600
540
480
420
360
300
240
180
120
60
0.1
0.08
0.06
0.04
0.02
0
I
= 150 mA
OUT
−0.02
−0.04
−0.06
−0.08
−1
V
V
I
C
C
= 1.7 V to 5.5 V
= 1.2 V
IN
V
V
C
C
= 3.8 V
IN
OUT
I
= 1 mA
OUT
= 2.8 V
= 1 mF
= 1 mA
OUT
OUT
= 1 mF
IN
IN
= 1 mF
= 1 mF
OUT
OUT
0
−40 −30 −20 −10
0
10 20 30 40 50 60 70 80 90
−40 −30 −20 −10
0
10 20 30 40 50 60 70 80 90
T , JUNCTION TEMPERATURE (°C)
J
T , JUNCTION TEMPERATURE (°C)
J
Figure 7. Ground Current vs. Temperature
Figure 8. Line Regulation vs. Output Current
V
OUT = 1.2 V
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NCP103
TYPICAL CHARACTERISTICS
0.1
0.08
0.06
0.04
0.02
0
10
9
8
7
6
5
−0.02
−0.04
−0.06
−0.08
−0.1
4
V
V
= 2.5 V
IN
V
V
= 3.8 V to 5.5 V
IN
3
= 1.2 V
OUT
= 2.8 V
OUT
I
= 1 mA to 150 mA
= 1 mF
OUT
I
= 1 mA
= 1 mF
2
1
0
OUT
C
C
IN
C
C
IN
= 1 mF
OUT
= 1 mF
OUT
−40 −30 −20 −10
0
10 20 30 40 50 60 70 80 90
−40 −30 −20 −10
0
10 20 30 40 50 60 70 80 90
T , JUNCTION TEMPERATURE (°C)
J
T , JUNCTION TEMPERATURE (°C)
J
Figure 9. Line Regulation vs. Temperature
Figure 10. Load Regulation vs. Temperature
V
OUT = 2.8 V
V
OUT = 1.2 V
10
9
8
7
6
5
4
3
2
1
0
100
90
80
70
60
50
40
30
20
10
0
T = 85°C
J
T = −40°C
J
V
V
= 3.8 V
IN
= 2.8 V
OUT
V
V
C
C
= 3.8 V
IN
I
= 1 mA to 150 mA
= 1 mF
OUT
= 2.8 V
= 1 mF
OUT
C
C
T = 25°C
IN
J
IN
= 1 mF
OUT
= 1 mF
OUT
−40 −30 −20 −10
0
10 20 30 40 50 60 70 80 90
0
15 30
45 60
75 90 105 120 135 150
T , JUNCTION TEMPERATURE (°C)
J
I , OUTPUT CURRENT (mA)
OUT
Figure 11. Load Regulation vs. Temperature
Figure 12. Dropout Voltage vs. Output Current
OUT = 2.8 V
V
OUT = 2.8 V
V
100
90
80
70
60
50
40
30
20
10
0
800
750
700
650
600
550
500
450
400
350
300
I
= 150 mA
= 100 mA
OUT
V
V
= 2.8 V
= 1.2 V
OUT
I
OUT
OUT
I
= 0 mA
OUT
V
V
= V
+ 1 V or 2.5 V
IN
OUT(nom)
V
V
C
C
= 3.8 V
IN
= 90% V
OUT
OUT(nom)
= 2.8 V
= 1 mF
OUT
C
C
= 1 mF
= 1 mF
IN
IN
OUT
= 1 mF
OUT
−40 −30 −20 −10
0
10 20 30 40 50 60 70 80 90
−40 −30 −20 −10
0
10 20 30 40 50 60 70 80 90
T , JUNCTION TEMPERATURE (°C)
J
T , JUNCTION TEMPERATURE (°C)
J
Figure 13. Dropout Voltage vs. Temperature
Figure 14. Current Limit vs. Temperature
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NCP103
TYPICAL CHARACTERISTICS
800
750
700
650
600
550
500
450
400
350
300
800
750
700
V
= 2.8 V
= 1.2 V
OUT
650
600
550
500
450
400
350
300
V
OUT
V
V
C
C
= V
+ 1 V or 2.5 V
IN
OUT(nom)
= 0 V
= 1 mF
OUT
V
C
C
= 0 V
= 1 mF
= 1 mF
OUT
IN
OUT
IN
= 1 mF
OUT
−40 −30 −20 −10
0
10 20 30 40 50 60 70 80 90
3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4 5.6
, INPUT VOLTAGE (V)
T , JUNCTION TEMPERATURE (°C)
J
V
IN
Figure 15. Short−Circuit Current vs.
Temperature
Figure 16. Short−Circuit Current vs. Input
Voltage
1
350
315
280
245
210
175
140
105
70
0.9
V
= 5.5 V
= 0.4 V
EN
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
OFF −> ON
ON −> OFF
V
EN
V
V
C
C
= 3.8 V
V
V
C
C
= 5.5 V
IN
IN
= 2.8 V
= 1 mF
= 2.8 V
OUT
OUT
= 1 mF
35
IN
IN
= 1 mF
= 1 mF
OUT
OUT
0
−40 −30 −20 −10
0
10 20 30 40 50 60 70 80 90
−40 −30 −20 −10
0
10 20 30 40 50 60 70 80 90
T , JUNCTION TEMPERATURE (°C)
J
T , JUNCTION TEMPERATURE (°C)
J
Figure 17. Enable Voltage Threshold vs.
Temperature
Figure 18. Current to Enable Pin vs.
Temperature
100
80
60
40
20
0
−20
−40
−60
−80
V
V
C
C
= 5.5 V
IN
= 2.8 V
= 1 mF
OUT
IN
= 1 mF
OUT
−100
−40 −30 −20 −10
0
10 20 30 40 50 60 70 80 90
T , JUNCTION TEMPERATURE (°C)
J
Figure 19. Disable Current vs. Temperature
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NCP103
TYPICAL CHARACTERISTICS
10000
1000
100
10
I
= 150 mA
OUT
RMS Output Noise (mV)
10 Hz − 100 kHz 100 Hz − 100 kHz
60.93 59.11
I
OUT
1 mA
10 mA
150 mA
52.73
51.20
50.63
48.96
V
V
C
C
= 2.5 V
IN
= 1.2 V
= 1 mF
I
= 10 mA
OUT
OUT
IN
= 1 mF
OUT
I
= 1 mA
100
OUT
1
0.01
0.1
1
10
1000
FREQUENCY (kHz)
Figure 20. Output Voltage Noise Spectral Density for VOUT = 1.2 V, COUT = 1 mF
10000
1000
100
10
I
= 150 mA
OUT
RMS Output Noise (mV)
I
OUT
10 Hz − 100 kHz
79.23
100 Hz − 100 kHz
74.66
1 mA
10 mA
150 mA
75.03
77.28
70.37
72.66
I
= 10 mA
V
= 3.8 V
= 2.8 V
OUT
IN
V
OUT
C
C
= 1 mF
IN
I
= 1 mA
OUT
= 1 mF
OUT
1
0.01
0.1
1
10
100
1000
FREQUENCY (kHz)
Figure 21. Output Voltage Noise Spectral Density for VOUT = 2.8 V, COUT = 1 mF
10000
1000
100
10
I
= 150 mA
OUT
RMS Output Noise (mV)
I
OUT
10 Hz − 100 kHz
80.17
100 Hz − 100 kHz
75.29
1 mA
10 mA
150 mA
81.28
81.31
76.46
76.77
V
V
= 3.8 V
IN
I
= 10 mA
= 2.8 V
OUT
OUT
C
C
= 1 mF
IN
= 4.7 mF
I
= 1 mA
100
OUT
OUT
1
0.01
0.1
1
10
1000
FREQUENCY (kHz)
Figure 22. Output Voltage Noise Spectral Density for VOUT = 2.8 V, COUT = 4.7 mF
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NCP103
TYPICAL CHARACTERISTICS
100
90
80
70
60
50
40
30
20
10
0
100
I
I
I
= 1 mA
= 10 mA
= 150 mA
OUT
OUT
OUT
I
I
I
= 1 mA
= 10 mA
= 150 mA
OUT
OUT
OUT
90
80
70
60
50
40
30
20
10
0
V
V
C
= 3.8 V
IN
V
V
C
= 3.8 V
IN
= 2.8 V
= none
OUT
= 2.8 V
= none
OUT
IN
IN
MLCC, X7R,
1206 size
MLCC, X7R,
1206 size
0.1
1
10
100
1000
10000
0.1
1
10
100
1000
10000
FREQUENCY (kHz)
FREQUENCY (kHz)
Figure 23. Power Supply Rejection Ratio,
Figure 24. Power Supply Rejection Ratio,
OUT = 2.8 V, COUT = 4.7 mF
V
OUT = 1.2 V, COUT = 1 mF
V
100
10
1
UNSTABLE OPERATION
STABLE OPERATION
V
IN
= 5.5 V
C
C
= 1 mF
IN
0.1
0.01
= 1 mF
OUT
MLCC, X7R,
1206 size
0
15
30 45 60
75 90 105 120 135 150
I , OUTPUT CURRENT (mA)
OUT
Figure 25. Output Capacitor ESR vs. Output
Current
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NCP103
TYPICAL CHARACTERISTICS
V
= 3.8 V
= 2.8 V
= 1 V
V
V
V
= 3.8 V
IN
IN
OUT
V
V
= 2.8 V
= 1 V
OUT
EN
EN
V
EN
V
EN
C
C
I
= 1 mF
C
C
I
= 1 mF
OUT
= 1 mF
OUT
= 1 mF
= 1 mA
IN
IN
= 150 mA
OUT
OUT
I
INRUSH
I
INRUSH
V
OUT
V
OUT
40 ms/div
40 ms/div
Figure 26. Enable Turn−on Response,
OUT = 1 mF, IOUT = 1 mA
Figure 27. Enable Turn−on Response,
C
COUT = 1 mF, IOUT = 150 mA
V
= 3.8 V
= 2.8 V
= 1 V
= 1 mF
OUT
= 1 mF
= 1 mA
V
V
V
= 3.8 V
IN
IN
OUT
V
V
= 2.8 V
= 1 V
OUT
EN
EN
V
V
EN
C
C
I
EN
C
C
I
= 1 mF
OUT
= 1 mF
= 150 mA
IN
IN
OUT
OUT
I
I
INRUSH
INRUSH
V
OUT
V
OUT
40 ms/div
40 ms/div
Figure 28. Enable Turn−on Response,
OUT = 4.7 mF, IOUT = 1 mA
Figure 29. Enable Turn−on Response,
C
C
OUT = 4.7 mF, IOUT = 150 mA
V
V
= 4.8 V to 3.8 V
IN
V
V
= 3.8 V to 4.8 V
= 2.8 V
IN
= 2.8 V
OUT
V
IN
OUT
C
C
I
= 1 mF
OUT
C
C
I
= 1 mF
OUT
= 1 mF
= 1 mA
IN
= 1 mF
= 1 mA
IN
t
= 1 ms
RISE
V
IN
OUT
OUT
t
= 1 ms
FALL
V
OUT
V
OUT
20 ms/div
10 ms/div
Figure 30. Line Transient Response − Rising
Edge, VOUT = 2.8 V, IOUT = 1 mA
Figure 31. Line Transient Response − Falling
Edge, VOUT = 2.8 V, IOUT = 1 mA
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NCP103
TYPICAL CHARACTERISTICS
V
V
= 3.8 V to 4.8 V
= 2.8 V
V
V
= 4.8 V to 3.8 V
= 2.8 V
OUT
IN
IN
t
= 1 ms
FALL
V
IN
OUT
C
C
I
= 10 mF
= 1 mF
= 150 mA
C
C
I
= 1 mF
OUT
= 1 mF
IN
OUT
IN
= 150 mA
V
IN
OUT
OUT
t
= 1 ms
RISE
V
OUT
V
OUT
4 ms/div
4 ms/div
Figure 32. Line Transient Response − Rising
Edge, VOUT = 2.8 V, IOUT = 150 mA
Figure 33. Line Transient Response − Falling
Edge, VOUT = 2.8 V, IOUT = 150 mA
I
OUT
V
V
= 2.5 V
V
V
= 2.5 V
IN
IN
= 1.2 V
= 1.2 V
OUT
OUT
C
C
= 1 mF (MLCC)
C
C
= 1 mF (MLCC)
IN
IN
t
= 1 ms
FALL
= 1 mF (MLCC)
= 1 mF (MLCC)
OUT
OUT
I
OUT
t
= 1 ms
RISE
C
= 1 mF
OUT
V
OUT
V
OUT
C
= 4.7 mF
OUT
C
= 1 mF
C
= 1 mF
OUT
OUT
4 ms/div
20 ms/div
Figure 34. Load Transient Response − Rising
Edge, VOUT = 1.2 V, IOUT = 1 mA to 150 mA,
Figure 35. Load Transient Response − Falling
Edge, VOUT = 1.2 V, IOUT = 1 mA to 150 mA,
C
OUT = 1 mF, 4.7 mF
COUT = 1 mF, 4.7 mF
I
OUT
V
V
= 3.8 V
V
V
= 3.8 V
IN
IN
= 2.8 V
= 2.8 V
OUT
OUT
C
C
= 1 mF (MLCC)
C
C
= 1 mF (MLCC)
IN
IN
t
= 1 ms
FALL
= 1 mF (MLCC)
= 1 mF (MLCC)
OUT
OUT
I
t
= 1 ms
OUT
RISE
C
= 1 mF
OUT
C
= 4.7 mF
OUT
V
OUT
C
= 4.7 mF
OUT
V
OUT
C
= 1 mF
OUT
4 ms/div
10 ms/div
Figure 36. Load Transient Response − Rising
Edge, VOUT = 2.8 V, IOUT = 1 mA to 150 mA,
Figure 37. Load Transient Response − Falling
Edge, VOUT = 2.8 V, IOUT = 1 mA to 150 mA,
C
OUT = 1 mF, 4.7 mF
COUT = 1 mF, 4.7 mF
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10
NCP103
TYPICAL CHARACTERISTICS
I
V
V
= 3.8 V
V
V
= 3.8 V
OUT
IN
IN
= 2.8 V
= 2.8 V
OUT
OUT
C
C
= 1 mF (MLCC)
C
C
= 1 mF (MLCC)
= 1 mF (MLCC)
OUT
IN
IN
= 1 mF (MLCC)
t
= 1 ms
OUT
FALL
I
t
= 1 ms
OUT
RISE
V
OUT
V
IN
= 3.8 V
V
OUT
V
IN
= 5.5 V
V
IN
= 3.8 V
V
IN
= 5.5 V
2 ms/div
10 ms/div
Figure 38. Load Transient Response − Rising
Edge, VOUT = 2.8 V, IOUT = 1 mA to 150 mA,
Figure 39. Load Transient Response − Falling
Edge, VOUT = 2.8 V, IOUT = 1 mA to 150 mA,
V
IN = 3.8 V, 5.5 V
V
IN = 3.8 V, 5.5 V
V
V
= 5.5 V
V
V
C
C
= 5.5 V
IN
IN
Overheating
= 2.8 V
= 1.2 V
OUT
OUT
Full Load
I
= 10 mA
= 1 mF (MLCC)
= 1 mF (MLCC)
= 1 mF (MLCC)
OUT
OUT
IN
V
IN
C
C
IN
= 1 mF (MLCC)
OUT
I
OUT
V
OUT
Thermal Shutdown
V
OUT
TSD Cycling
4 ms/div
10 ms/div
Figure 40. Turn−on/off − Slow Rising VIN
Figure 41. Short−Circuit and Thermal
Shutdown
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11
NCP103
APPLICATIONS INFORMATION
General
disable state the device consumes as low as typ. 10 nA from
the V .
The NCP103 is a high performance 150 mA Low Dropout
IN
Linear Regulator. This device delivers very high PSRR
(over 75 dB at 1 kHz) and excellent dynamic performance
as load/line transients. In connection with very low
quiescent current this device is very suitable for various
battery powered applications such as tablets, cellular
phones, wireless and many others. The device is fully
protected in case of output overload, output short circuit
condition and overheating, assuring a very robust design.
If the EN pin voltage >0.9 V the device is guaranteed to
be enabled. The NCP103 regulates the output voltage and
the active discharge transistor is turned−off.
The EN pin has internal pull−down current source with
typ. value of 300 nA which assures that the device is
turned−off when the EN pin is not connected. In the case
where the EN function isn’t required the EN should be tied
directly to IN.
Input Capacitor Selection (CIN)
Output Current Limit
It is recommended to connect at least a 1mF Ceramic X5R
or X7R capacitor as close as possible to the IN pin of the
device. This capacitor will provide a low impedance path for
unwanted AC signals or noise modulated onto constant
input voltage. There is no requirement for the min. /max.
ESR of the input capacitor but it is recommended to use
ceramic capacitors for their low ESR and ESL. A good input
capacitor will limit the influence of input trace inductance
and source resistance during sudden load current changes.
Larger input capacitor may be necessary if fast and large
load transients are encountered in the application.
Output Current is internally limited within the IC to a
typical 550 mA. The NCP103 will source this amount of
current measured with a voltage drops on the 90% of the
nominal V
. If the Output Voltage is directly shorted to
= 0 V), the short circuit protection will limit
OUT
ground (V
OUT
the output current to 580 mA (typ). The current limit and
short circuit protection will work properly over whole
temperature range and also input voltage range. There is no
limitation for the short circuit duration.
Thermal Shutdown
When the die temperature exceeds the Thermal Shutdown
Output Decoupling (COUT
)
threshold (T − 160°C typical), Thermal Shutdown event
SD
The NCP103 requires an output capacitor connected as
close as possible to the output pin of the regulator. The
recommended capacitor value is 1 mF and X7R or X5R
dielectric due to its low capacitance variations over the
specified temperature range. The NCP103 is designed to
remain stable with minimum effective capacitance of
0.22 mF to account for changes with temperature, DC bias
and package size. Especially for small package size
capacitors such as 0402 the effective capacitance drops
rapidly with the applied DC bias.
is detected and the device is disabled. The IC will remain in
this state until the die temperature decreases below the
Thermal Shutdown Reset threshold (T
* 140°C
SDU
typical). Once the IC temperature falls below the 140°C the
LDO is enabled again. The thermal shutdown feature
provides the protection from a catastrophic device failure
due to accidental overheating. This protection is not
intended to be used as a substitute for proper heat sinking.
Power Dissipation
As power dissipated in the NCP103 increases, it might
become necessary to provide some thermal relief. The
maximum power dissipation supported by the device is
dependent upon board design and layout. Mounting pad
configuration on the PCB, the board material, and the
ambient temperature affect the rate of junction temperature
rise for the part.
There is no requirement for the minimum value of
Equivalent Series Resistance (ESR) for the C
but the
OUT
maximum value of ESR should be less than 3 W. Larger
output capacitors and lower ESR could improve the load
transient response or high frequency PSRR. It is not
recommended to use tantalum capacitors on the output due
to their large ESR. The equivalent series resistance of
tantalum capacitors is also strongly dependent on the
temperature, increasing at low temperature.
The maximum power dissipation the NCP103 can handle
is given by:
ƪ
ƫ
125° C * TA
Enable Operation
(eq. 1)
PD(MAX)
+
qJA
The NCP103 uses the EN pin to enable/disable its device
and to deactivate/activate the active discharge function.
If the EN pin voltage is <0.4 V the device is guaranteed to
be disabled. The pass transistor is turned−off so that there is
virtually no current flow between the IN and OUT. The
active discharge transistor is active so that the output voltage
The power dissipated by the NCP103 for given
application conditions can be calculated from the following
equations:
ǒ
Ǔ
ǒ
Ǔ
(eq. 2)
PD [ VIN IGND@IOUT ) IOUT VIN * VOUT
V
OUT
is pulled to GND through a 100 W resistor. In the
www.onsemi.com
12
NCP103
1
260
240
P
, T = 25°C, 2 oz Cu
D(MAX)
A
0.9
220
200
180
160
140
120
100
P
, T = 25°C, 1 oz Cu 0.8
D(MAX)
A
0.7
q
, 1 oz Cu
JA
0.6
0.5
0.4
q
, 2 oz Cu
JA
0
100
200
300
400
500
600
700
2
COPPER HEAT SPREADER AREA (mm )
Figure 42. qJA vs. Copper Area (uDFN4)
Reverse Current
nominal value. This time is dependent on various
The PMOS pass transistor has an inherent body diode
which will be forward biased in the case that V > V .
application conditions such as V
For example typical value for V
, C
= 1.2 V, C
and T .
OUT(NOM)
OUT
A
= 1 mF,
OUT
IN
OUT
OUT
Due to this fact in cases, where the extended reverse current
condition can be anticipated the device may require
additional external protection.
I
= 1 mA and T = 25°C is 90 ms.
A
OUT
PCB Layout Recommendations
To obtain good transient performance and good regulation
characteristics place C and C capacitors close to the
Power Supply Rejection Ratio
IN
OUT
The NCP103 features very good Power Supply Rejection
ratio. If desired the PSRR at higher frequencies in the range
device pins and make the PCB traces wide. In order to
minimize the solution size, use 0402 capacitors. Larger
copper area connected to the pins will also improve the
device thermal resistance. The actual power dissipation can
be calculated from the equation above (Equation 2). Expose
pad should be tied the shortest path to the GND pin.
100 kHz − 10 MHz can be tuned by the selection of C
OUT
capacitor and proper PCB layout.
Turn−On Time
The turn−on time is defined as the time period from EN
assertion to the point in which V
will reach 98% of its
OUT
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13
NCP103
ORDERING INFORMATION
Device
Voltage
Option
Marking
Rotation
†
Marking
Option
Package
Shipping
NCP103AMX090TCG
NCP103AMX100TCG
NCP103AMX105TCG
NCP103AMX110TCG
NCP103AMX120TCG
NCP103AMX125TCG
NCP103AMX130TCG
NCP103AMX150TCG
NCP103AMX160TCG
NCP103AMX180TCG
NCP103AMX185TCG
NCP103AMX210TCG
NCP103AMX220TCG
NCP103AMX240TCG
NCP103AMX250TCG
NCP103AMX260TCG
NCP103AMX270TCG
NCP103AMX280TCG
NCP103AMX285TCG
NCP103AMX300TCG
NCP103AMX310TCG
NCP103AMX320TCG
NCP103AMX330TCG
NCP103AMX345TCG
NCP103AMX350TCG
NCP103AMX360TCG
NCP103BMX100TCG
NCP103BMX105TCG
NCP103BMX110TCG
NCP103BMX120TCG
NCP103BMX125TCG
NCP103BMX130TCG
NCP103BMX150TCG
NCP103BMX160TCG
NCP103BMX180TCG
NCP103BMX185TBG
NCP103BMX185TCG
NCP103BMX210TCG
NCP103BMX220TCG
NCP103BMX250TCG
NCP103BMX260TCG
NCP103BMX280TCG
NCP103BMX285TCG
NCP103BMX300TCG
NCP103BMX310TCG
NCP103BMX330TCG
NCP103BMX345TCG
NCP103BMX350TCG
0.9 V
1.0 V
1.05 V
1.1 V
1.2 V
1.25 V
1.3 V
1.5 V
1.6 V
1.8 V
1.85 V
2.1 V
2.2 V
2.4 V
2.5 V
2.6 V
2.7 V
2.8 V
2.85 V
3.0 V
3.1 V
3.2 V
3.3 V
3.45 V
3.5 V
3.6 V
1.0 V
1.05 V
1.1 V
1.2 V
1.25 V
1.3 V
1.5 V
1.6 V
1.8 V
1.85 V
1.85 V
2.1 V
2.2 V
2.5 V
2.6 V
2.8 V
2.85 V
3.0 V
3.1 V
3.3 V
3.45 V
3.5 V
AQ
5
0°
180°
0°
A
E
180°
0°
D
D
180°
0°
AD
E
0°
Y
180°
180°
0°
K
F
P
180°
180°
0°
R
With active output
discharge function
uDFN4
(Pb-Free)
3000 / Tape & Reel
AL
AX
V
0°
180°
0°
AK
J
0°
K
0°
L
0°
P
0°
AY
Q
AE
3
0°
0°
0°
180°
0°
AV
5
270°
90°
270°
90°
270°
0°
A
E
D
D
CD
E
90°
270°
270°
0°
Y
K
CJ
CJ
P
0°
Without active output
discharge function
uDFN4
(Pb-Free)
3000 / Tape & Reel
270°
270°
0°
R
CH
V
270°
90°
90°
90°
90°
90°
0°
J
K
L
P
Q
CE
3
270°
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
www.onsemi.com
14
NCP103
PACKAGE DIMENSIONS
UDFN4 1.0x1.0, 0.65P
CASE 517CU
ISSUE A
NOTES:
3X C0.18
X 45 5
A
B
D
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
C0.27 x 0.25
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.03 AND 0.07
FROM THE TERMINAL TIPS.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
PIN ONE
REFERENCE
E
A
L2
2X
2X
0.05
0.05
C
C
DETAIL A
MILLIMETERS
DIM MIN
−−−
A1 0.00
MAX
0.60
0.05
A
TOP VIEW
SIDE VIEW
A3
b
0.15 REF
0.20
0.30
0.10
C
D
1.00 BSC
0.58
1.00 BSC
0.65 BSC
(A3)
A1
D2 0.38
E
e
L
0.20
0.30
0.37
0.05
C
L2 0.27
SEATING
PLANE
NOTE 4
C
RECOMMENDED
MOUNTING FOOTPRINT*
e
e/2
2X
0.58
3X
0.65
DETAIL A
3X L
D2
PITCH
1
4
2
0.43
DETAIL B
4X
0.23
PACKAGE
OUTLINE
D2
1.30
455
3
4X b
1
0.53
3X
0.10
4X
0.30
M
M
0.10
C A
B
DETAIL B
0.05
C
NOTE 3
DIMENSIONS: MILLIMETERS
BOTTOM VIEW
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
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