NCP105AMX250TCG [ONSEMI]
LDO Regulator - High PSRR 150 mA;
| 型号： | NCP105AMX250TCG |
| 厂家： | 
ONSEMI |
| 描述： | LDO Regulator - High PSRR 150 mA |
| 文件： | 总16页 (文件大小：1440K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NCP105
LDO Regulator - High PSRR
150 mA
The NCP105 is 150 mA LDO that provides the engineer with a very
stable, accurate voltage with low noise suitable for space constrained,
noise sensitive applications. In order to optimize performance for
battery operated portable applications, the NCP105 employs the
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dynamic quiescent current adjustment for very low I consumption at
Q
no−load.
MARKING
DIAGRAMS
Features
• Operating Input Voltage Range: 1.7 V to 5.5 V
• Available in Fixed Voltage Options: 0.8 V to 3.6 V
Contact Factory for Other Voltage Options
• Very Low Quiescent Current of Typ. 50 mA
XDFN4
CASE 711AJ
XX M
1
1
XX = Specific Device Code
M
= Date Code
• Soft Start Feature with Two V
Slew Rate Speed
OUT
5
1
• Standby Current Consumption: Typ. 0.1 mA
TSOP−5
CASE 483
XX M G
5
• Low Dropout: 125 mV Typical at 150 mA @ 2.8 V
G
1
•
1% Accuracy at Room Temperature
• High Power Supply Ripple Rejection: 70 dB at 1 kHz
• Thermal Shutdown and Current Limit Protections
• Available in XDFN4 and TSOP−5 Packages
• Stable with a 1 mF Ceramic Output Capacitor
• These are Pb−Free Devices
XX
M
G
= Device Code
= Date Code*
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may
vary depending upon manufacturing location.
Typical Applicaitons
PIN CONNECTIONS
• PDAs, Mobile phones, GPS, Smartphones
®
®
EN
3
IN
4
• Wireless Handsets, Wireless LAN, Bluetooth , Zigbee
• Portable Medical Equipment
• Other Battery Powered Applications
V
V
IN
OUT
IN
OUT
NCP105
GND
C
C
OUT
1 mF
Ceramic
IN
EN
2
1
ON
GND
OUT
(Bottom View)
OFF
Figure 1. Typical Application Schematic
IN
OUT
N/C
1
2
3
5
4
GND
EN
(Top View)
ORDERING INFORMATION
See detailed ordering, marking and shipping information on
page 14 of this data sheet.
© Semiconductor Components Industries, LLC, 2018
1
Publication Order Number:
September, 2019 − Rev. 1
NCP105/D
NCP105
IN
ENABLE
LOGIC
THERMAL
EN
SHUTDOWN
BANDGAP
REFERENCE
MOSFET
DRIVER WITH
CURRENT LIMIT
OUT
AUTO LOW
POWER MODE
ACTIVE
DISCHARGE*
EN
GND
*Active output discharge function is present only in NCP105A and NCP105C devices.
yyy denotes the particular V option.
OUT
Figure 2. Simplified Schematic Block Diagram
PIN FUNCTION DESCRIPTION
Pin No.
Pin No.
(XDFN4)
(TSOP5)
Pin Name
Description
1
5
OUT
Regulated output voltage pin. A small ceramic capacitor with minimum value of 1 mF is need-
ed from this pin to ground to assure stability.
2
3
2
3
GND
EN
Power supply ground.
Driving EN over 0.9 V turns on the regulator. Driving EN below 0.4 V puts the regulator into
shutdown mode.
4
−
−
1
4
−
IN
Input pin. A small capacitor is needed from this pin to ground to assure stability.
Not connected. This pin can be tied to ground to improve thermal dissipation.
N/C
EPAD
Exposed pad should be connected directly to the GND pin. Soldered to a large ground cop-
per plane allows for effective heat removal.
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
VIN
Value
Unit
V
Input Voltage (Note 1)
−0.3 V to 6 V
Output Voltage
VOUT
VEN
−0.3 V to V + 0.3 V or 6 V
V
IN
Enable Input
−0.3 V to 6 V
∞
V
Output Short Circuit Duration
Maximum Junction Temperature
Storage Temperature
tSC
s
TJ(MAX)
TSTG
150
°C
°C
V
−55 to 150
2000
ESD Capability, Human Body Model (Note 2)
ESD Capability, Machine Model (Note 2)
ESDHBM
ESDMM
200
V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per EIA/JESD22−A114,
ESD Machine Model tested per EIA/JESD22−A115,
Latchup Current Maximum Rating tested per JEDEC standard: JESD78.
THERMAL CHARACTERISTICS (Note 3)
Rating
Symbol
Value
Unit
Thermal Characteristics, XDFN4 1x1 mm
Thermal Resistance, Junction−to−Air
R
208
°C/W
q
JA
Thermal Characteristics, TSOP−5
Thermal Resistance, Junction−to−Air
R
162
°C/W
q
JA
2
3. Single component mounted on 1 oz, FR 4 PCB with 645 mm Cu area.
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2
NCP105
ELECTRICAL CHARACTERISTICS −40°C ≤ T ≤ 85°C; V = V
+ 1 V for V
options greater than 1.5 V. Otherwise V
=
J
IN
OUT(NOM)
OUT
IN
2.5 V, whichever is greater; I
= 1 mA, C = C
= 1 mF, unless otherwise noted. V = 0.9 V. Typical values are at T = +25°C.
OUT
IN
OUT
EN
J
Min./Max. are for T = −40°C and T = +85°C respectively (Note 4).
J
J
Parameter
Test Conditions
Symbol
Min
1.7
−40
−2
Typ
Max
5.5
+40
+2
Unit
V
Operating Input Voltage
Output Voltage Accuracy
V
IN
−40°C ≤ T ≤ 85°C
V
V
≤ 2.0 V
V
OUT
mV
%
J
OUT
> 2.0 V
OUT
Line Regulation
V
OUT
+ 0.5 V ≤ V ≤ 5.5 V (V ≥ 1.7 V)
Reg
0.01
6
0.1
15
%/V
mV
IN
IN
LINE
Load Regulation − XDFN4 package
Load Regulation − TSOP−5 package
I
= 1 mA to 150 mA
Reg
LOAD
OUT
14
25
Dropout Voltage − XDFN4 package
I
I
= 150 mA
= 150 mA
V
V
V
V
V
V
= 1.8 V
= 2.8 V
= 3.3 V
= 1.8 V
= 2.8 V
= 3.3 V
V
220
125
105
225
130
110
600
50
330
210
165
380
260
215
mV
mV
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
DO
DO
CL
(Note 5)
Dropout Voltage − TSOP−5 package
(Note 5)
V
Output Current Limit
Quiescent Current
Shutdown Current
V
OUT
= 90% V
I
200
0.9
mA
mA
mA
V
OUT(nom)
I
= 0 mA
I
95
1
OUT
Q
V
EN
≤ 0.4 V, V = 5.5 V
I
DIS
0.01
IN
EN Pin Threshold Voltage
High Threshold
Low Threshold
V
Voltage increasing
Voltage decreasing
V
EN_HI
EN_LO
EN
EN
V
V
0.4
V
OUT
Slew Rate (Note 6)
V
OUT
= 3.3 V, I
= 10 mA Normal (version
A and B)
V
OUT_SR
190
20
mV/ms
OUT
Slow (version C
and D)
EN Pin Input Current
V
= 5.5 V
I
0.3
70
1.0
mA
EN
EN
Power Supply Rejection Ratio
V
IN
= 3.8 V, V
OUT
= 3.5 V
f = 1 kHz
PSRR
dB
OUT
I
= 10 mA
Output Noise Voltage
f = 10 Hz to 100 kHz
V
70
160
20
mV
rms
N
Thermal Shutdown Temperature
Thermal Shutdown Hysteresis
Active Output Discharge Resistance
Temperature increasing from T = +25°C
T
SD
°C
J
Temperature falling from T
T
SDH
°C
SD
V
EN
< 0.4 V, Version A and C only
R
100
W
DIS
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Performance guaranteed over the indicated operating temperature range by design and/or characterization. Production tested at
T = T = 25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
J
A
5. Characterized when VOUT falls 100 mV below the regulated voltage at VIN = VOUT(NOM) + 1 V.
6. Please refer OPN to determine slew rate. NCP105A, NCP105B − Normal speed. NCP105C, NCP105D − slower speed
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3
NCP105
TYPICAL CHARACTERISTICS
1.820
1.220
1.215
1.210
1.205
1.200
1.195
1.190
1.185
V
V
C
C
= 2.8 V
IN
1.815
1.810
1.805
1.800
1.795
1.790
1.785
1.780
= 1.8 V
= 1 mF
OUT
IN
= 1 mF
OUT
I
= 10 mA
OUT
I
= 10 mA
OUT
I
= 150 mA
OUT
I
= 150 mA
OUT
V
V
C
C
= 2.5 V
IN
= 1.2 V
= 1 mF
1.180
1.175
1.170
OUT
IN
1.775
1.770
= 1 mF
OUT
−40−30−20 −10
0
10 20 30 40 50 60 70 80 90
−40−30−20 −10
0
10 20 30 40 50 60 70 80 90
T , JUNCTION TEMPERATURE (°C)
J
T , JUNCTION TEMPERATURE (°C)
J
Figure 3. Output Voltage vs. Temperature −
Figure 4. Output Voltage vs. Temperature −
V
OUT = 1.2 V − XDFN4
VOUT = 1.8 V − XDFN4
2.820
2.815
2.810
2.805
2.800
2.795
2.790
2.785
2.780
3.310
3.305
3.300
3.295
3.290
3.285
3.280
3.275
3.270
V
V
C
C
= 4.3 V
V
V
C
C
= 3.8 V
IN
IN
= 3.3 V
= 1 mF
= 2.8 V
= 1 mF
OUT
OUT
IN
IN
= 1 mF
= 1 mF
OUT
OUT
I
= 10 mA
OUT
I
= 10 mA
OUT
I
= 150 mA
OUT
I
= 150 mA
OUT
2.775
2.770
3.265
3.260
−40−30−20 −10
0
10 20 30 40 50 60 70 80 90
−40−30−20 −10
0
10 20 30 40 50 60 70 80 90
T , JUNCTION TEMPERATURE (°C))
J
T , JUNCTION TEMPERATURE (°C)
J
Figure 5. Output Voltage vs. Temperature −
Figure 6. Output Voltage vs. Temperature −
VOUT = 3.3 V − XDFN4
V
OUT = 2.8 V − XDFN4
0.005
0.004
0.003
10
9
V
= 3.3 V
OUT
V
= 2.8 V
V
V
V
= 1.2 V
OUT
OUT
OUT
OUT
8
= 1.8 V
= 2.8 V
0.002
0.001
0
7
V
OUT
= 1.2 V
6
V
OUT
= 3.3 V
5
V
OUT
= 1.8 V
−0.001
−0.002
−0.003
4
3
V
I
C
C
= V
+ 0.5 to 5.5 V
IN
OUT_NOM
V
I
C
C
= V
+ 1 V
IN
OUT_NOM
= 1 mA to 150 mA
= 10 mA
OUT
2
1
0
OUT
= 1 mF
IN
OUT
= 1 mF
IN
OUT
−0.004
−0.005
= 1 mF
= 1 mF
−40−30−20 −10
0
10 20 30 40 50 60 70 80 90
−40−30−20 −10
0
10 20 30 40 50 60 70 80 90
T , JUNCTION TEMPERATURE (°C)
J
T , JUNCTION TEMPERATURE (°C)
J
Figure 7. Line Regulation vs. Temperature
Figure 8. Load Regulation vs. Temperature −
XDFN4
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NCP105
TYPICAL CHARACTERISTICS
400
350
300
250
200
150
100
70
V
C
C
= V
+ 1 V
T = 25°C
IN
OUT_NOM
J
63
56
49
42
35
28
21
14
T = 85°C
J
T = −40°C
J
= 1 mF
IN
OUT
= 1 mF
T = 25°C
J
T = 85°C
J
T = −40°C
J
V
V
I
C
C
= 2.8 V
IN
= 1.8 V
OUT
= 0 mA
OUT
= 1 mF
IN
50
0
= 1 mF
OUT
7
0
0.001 0.01
0.1
1
10
100
1000
0
1
2
3
4
5
6
I , OUTPUT CURRENT (mA)
OUT
V , INPUT VOLTAGE (V)
IN
Figure 9. Ground Current vs. Load Current
Figure 10. Quiescent Current vs. Input Voltage
OUT = 1.8 V
V
250
225
200
175
150
125
100
75
200
180
160
140
120
100
80
T = 85°C
J
V
C
C
= 2.8 V
= 1 mF
= 1 mF
V
C
C
= 1.8 V
= 1 mF
= 1 mF
OUT
OUT
IN
IN
OUT
OUT
meas for V
− 100 mV
meas for V
− 100 mV
T = 85°C
J
OUT_NOM
OUT_NOM
T = −40°C
J
T = −40°C
J
60
T = 25°C
J
50
40
T = 25°C
J
25
0
20
0
0
15 30 45 60 75 90 105 120 135 150
, OUTPUT CURRENT (mA)
0
15 30 45 60 75 90 105 120 135 150
, OUTPUT CURRENT (mA)
I
I
OUT
OUT
Figure 11. Dropout Voltage vs. Load Current −
OUT = 1.8 V
Figure 12. Dropout Voltage vs. Load Current −
V
VOUT = 2.8 V
150
135
120
105
90
720
700
680
660
640
620
600
580
560
V
C
C
= 3.3 V
= 1 mF
= 1 mF
OUT
IN
T = 85°C
J
OUT
meas for V
− 100 mV
OUT_NOM
75
T = −40°C
J
60
45
V
V
C
C
= 4.3 V
IN
= 90% V
OUT
OUT(nom)
30
T = 25°C
J
= 1 mF
IN
540
520
15
0
= 1 mF
OUT
0
15 30 45 60 75 90 105 120 135 150
, OUTPUT CURRENT (mA)
−40 −30−20 −10
0
10 20 30 40 50 60 70 80 90
I
T , JUNCTION TEMPERATURE (°C)
OUT
J
Figure 13. Dropout Voltage vs. Load Current −
OUT = 3.3 V
Figure 14. Current Limit vs. Temperature
V
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NCP105
TYPICAL CHARACTERISTICS
700
680
660
640
620
600
580
560
540
1.0
0.9
0.8
0.7
0.6
0.5
0.4
OFF −> ON
ON −> OFF
V
V
C
C
= 4.3 V
0.3
V
V
C
C
= 3.8 V
IN
IN
= 0 V (short)
= 1 mF
= 1 mF
= 2.8 V
= 1 mF
OUT
OUT
0.2
IN
IN
520
500
0.1
0
= 1 mF
OUT
OUT
−40 −30 −20 −10
0
10 20 30 40 50 60 70 80 90
−40 −30−20 −10
0
10 20 30 40 50 60 70 80 90
T , JUNCTION TEMPERATURE (°C)
J
T , JUNCTION TEMPERATURE (°C)
J
Figure 15. Short Circuit Current vs.
Temperature
Figure 16. Enable Thresholds Voltage
250
225
200
175
150
125
100
75
30
27
24
21
18
15
12
9
V
V
C
C
= 4.3 V
IN
= 3.3 V
OUT
= 1 mF
IN
= 1 mF
OUT
V
V
C
C
= 4.3 V
IN
= 3.3 V
OUT
50
25
0
6
= 1 mF
IN
3
0
= 1 mF
OUT
−40 −30 −20 −10
0
10 20 30 40 50 60 70 80 90
−40 −30−20 −10
0
10 20 30 40 50 60 70 80 90
T , JUNCTION TEMPERATURE (°C)
J
T , JUNCTION TEMPERATURE (°C)
J
Figure 17. Current to Enable Pin vs.
Temperature
Figure 18. Disable Current vs. Temperature
100
90
80
70
60
50
40
30
20
100
10
Unstable Operation
1
Stable Operation
V
V
C
C
= 4.3 V
IN
= 3.3 V
OUT
= 1 mF
IN
10
0
= 1 mF
OUT
0.1
−40 −30 −20 −10
0
10 20 30 40 50 60 70 80 90
0
15 30 45 60 75 90 105 120 135 150
T , JUNCTION TEMPERATURE (°C)
J
I , OUTPUT CURRENT (mA)
OUT
Figure 19. Discharge Resistance vs.
Temperature
Figure 20. Maximum COUT ESR Value vs. Load
Current
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NCP105
TYPICAL CHARACTERISTICS
10
1
I
I
I
= 1 mA
= 10 mA
= 150 mA
OUT
OUT
OUT
RMS Output Noise (mV
10 Hz − 100 kHz 100 Hz − 100 kHz
)
RMS
I
OUT
1 mA
10 mA
150 mA
65.6
63.1
60.8
61.9
59.5
58.3
0.1
V
V
= 2.5 V
IN
0.01
= 1.2 V
OUT
C
C
= 1 mF (MLCC)
IN
= 1 mF (MLCC)
OUT
0.001
10
10
10
100
1K
10K
100K
1M
10M
FREQUENCY (Hz)
Figure 21. Output Voltage Noise Spectral Density – VOUT = 1.2 V
10
1
I
I
I
= 1 mA
= 10 mA
= 150 mA
OUT
OUT
OUT
RMS Output Noise (mV
10 Hz − 100 kHz 100 Hz − 100 kHz
)
RMS
I
OUT
1 mA
10 mA
150 mA
93.4
92.1
87.9
86.6
0.1
114.4
107.5
V
V
C
C
= 3.8 V
IN
0.01
= 2.8 V
OUT
= 1 mF (MLCC)
IN
= 1 mF (MLCC)
OUT
0.001
100
1K
10K
100K
1M
10M
FREQUENCY (Hz)
Figure 22. Output Voltage Noise Spectral Density – VOUT = 2.8 V
10
1
I
I
I
= 1 mA
= 10 mA
= 150 mA
OUT
OUT
OUT
RMS Output Noise (mV
)
RMS
I
OUT
10 Hz − 100 kHz 100 Hz − 100 kHz
1 mA
10 mA
150 mA
104.0
102.9
115.8
98.0
96.7
0.1
110.8
V
IN
V
= 4.3 V
0.01
= 3.3 V
OUT
C
C
= 1 mF (MLCC)
IN
= 1 mF (MLCC)
OUT
0.001
100
1K
10K
100K
1M
10M
FREQUENCY (Hz)
Figure 23. Output Voltage Noise Spectral Density – VOUT = 3.3 V
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NCP105
TYPICAL CHARACTERISTICS
100
90
80
70
60
50
40
30
20
100
I
I
I
= 1 mA
= 10 mA
= 150 mA
I
I
I
= 1 mA
= 10 mA
= 150 mA
OUT
OUT
OUT
OUT
OUT
OUT
90
80
70
60
50
40
30
20
V
V
C
C
= 2.5 V + 100 mVpp
IN
V
V
C
C
= 2.8 V + 100 mVpp
IN
= 1.2 V
OUT
= 1.8 V
OUT
= none
IN
= none
IN
10
0
10
0
= 1 mF (MLCC)
OUT
= 1 mF (MLCC)
OUT
100
1K
10K
100K
1M
10M
100
1K
10K
100K
1M
10M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 24. Power Supply Rejection Ratio,
Figure 25. Power Supply Rejection Ratio,
VOUT = 1.8 V
V
OUT = 1.2 V
100
90
80
70
60
50
40
30
20
100
90
80
70
60
50
40
30
I
= 1 mA
= 10 mA
= 150 mA
I
I
I
= 1 mA
= 10 mA
= 150 mA
OUT
OUT
OUT
OUT
I
OUT
I
OUT
V
V
C
C
= 4.3 V + 100 mVpp
= 3.3 V
= none
V
V
C
C
= 3.8 V + 100 mVpp
= 2.8 V
IN
IN
OUT
OUT
20
10
0
= none
IN
IN
OUT
10
0
= 1 mF (MLCC)
= 1 mF (MLCC)
OUT
100
1K
10K
100K
1M
10M
100
1K
10K
100K
1M
10M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 26. Power Supply Rejection Ratio,
OUT = 2.8 V
Figure 27. Power Supply Rejection Ratio,
VOUT = 3.3 V
V
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NCP105
TYPICAL CHARACTERISTICS
V
EN
V
EN
I
I
INPUT
INPUT
V
V
C
= 2.8 V
IN
V
V
C
= 2.8 V
IN
= 1.8 V
OUT
V
OUT
V
OUT
= 1.8 V
OUT
= 1 mF (MLCC)
OUT
= 1 mF (MLCC)
OUT
200 ms/div
200 ms/div
Figure 28. Enable Turn−on Response −
OUT = 0 mA, Slow Option − C
Figure 29. Enable Turn−on Response −
IOUT = 150 mA, Slow Option − C
I
V
EN
V
EN
I
I
INPUT
INPUT
A option
C option
A option
C option
V
V
C
= 2.8 V
IN
V
V
C
= 2.8 V
IN
= 1.8 V
V
OUT
V
OUT
OUT
= 1.8 V
OUT
= 1 mF (MLCC)
OUT
= 1 mF (MLCC)
OUT
50 ms/div
100 ms/div
Figure 30. VOUT Slew−Rate Comparison A and
C option − IOUT = 10 mA
Figure 31. VOUT Slew−Rate Comparison A and
C option − IOUT = 150 mA
3.0 V
3.0 V
t
= 1 ms
t
= 1 ms
RISE,FALL
V
V
RISE,FALL
V
2.0 V
IN
2.0 V
IN
V
OUT
= 1.2 V
V
OUT
= 1.2 V
C
C
= 1 mF (MLCC)
= 1 mF (MLCC)
C
C
= 1 mF (MLCC)
= 1 mF (MLCC)
IN
IN
OUT
OUT
V
OUT
OUT
10 ms/div
10 ms/div
Figure 32. Line Transient Response −
OUT = 10 mA
Figure 33. Line Transient Response −
I
IOUT = 150 mA
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9
NCP105
TYPICAL CHARACTERISTICS
4.8 V
4.8 V
t
= 1 ms
V
RISE,FALL
t
= 1 ms
IN
3.8 V
V
V
RISE,FALL
3.8 V
IN
V
C
C
= 2.8 V
OUT
V
OUT
= 2.8 V
= 1 mF (MLCC)
= 1 mF (MLCC)
IN
C
C
= 1 mF (MLCC)
= 1 mF (MLCC)
IN
OUT
OUT
V
OUT
OUT
10 ms/div
10 ms/div
Figure 34. Line Transient Response −
Figure 35. Line Transient Response −
IOUT = 10 mA
IOUT = 150 mA
t
= 1 ms
V
V
= 2.5 V
RISE
IN
I
OUT
= 1.2 V
V
V
C
= 2.5 V
OUT
IN
C
I
= 1 mF (MLCC)
= 1 mA to 150 mA
= 1.2 V
IN
OUT
= 1 mF (MLCC)
= 1 mA to 150 mA
OUT
IN
I
OUT
I
OUT
t
= 1 ms
FALL
C
C
= 1 mF
OUT
C
C
= 1 mF
OUT
V
OUT
= 4.7 mF
OUT
V
OUT
= 4.7 mF
OUT
5 ms/div
10 ms/div
Figure 36. Load Transient Response −
Figure 37. Load Transient Response −
V
OUT = 1.2 V
VOUT = 1.2 V
V
IN
= 3.8 V, V
= 2.8 V
OUT
C
= 1 mF (MLCC)
= 1 mA to 150 mA
IN
I
OUT
I
OUT
t
= 1 ms
RISE
V
C
C
= 3.8 V, V
= 1 mF (MLCC)
= 2.8 V
t
= 1 ms
IN
OUT
FALL
I
OUT
IN
= 1 mA to 150 mA
OUT
C
C
= 1 mF
OUT
C
C
= 1 mF
OUT
V
OUT
= 4.7 mF
OUT
V
OUT
= 4.7 mF
OUT
5 ms/div
10 ms/div
Figure 38. Load Transient Response −
OUT = 2.8 V
Figure 39. Load Transient Response −
V
VOUT = 2.8 V
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10
NCP105
TYPICAL CHARACTERISTICS
V
IN
= 4.3 V, V
= 3.3 V
OUT
C
= 1 mF (MLCC)
= 1 mA to 150 mA
IN
I
OUT
I
OUT
t
= 1 ms
RISE
V
C
= 4.3 V, V
= 1 mF (MLCC)
= 3.3 V
t
= 1 ms
IN
OUT
FALL
I
OUT
IN
I
= 1 mA to 150 mA
OUT
C
C
= 1 mF
OUT
C
C
= 1 mF
OUT
V
OUT
= 4.7 mF
OUT
V
OUT
= 4.7 mF
OUT
5 ms/div
10 ms/div
Figure 40. Load Transient Response −
Figure 41. Load Transient Response −
V
OUT = 3.3 V
VOUT = 3.3 V
V
IN
V
IN
V
OUT
V
OUT
V
V
C
C
= 3.8 V
IN
V
V
C
C
= 3.8 V
IN
= 3.3 V
OUT
= 2.8 V
OUT
= 1 mF (MLCC)
IN
= 1 mF (MLCC)
IN
= 1 mF (MLCC)
OUT
= 1 mF (MLCC)
OUT
10 ms/div
10 ms/div
Figure 42. Turn−on/off − Slow Rising
IN − IOUT = 10 mA
Figure 43. Turn−on/off − Slow Rising
VIN − IOUT = 150 mA
V
I
OUT
V
OUT
TSD On
TSD Off
= 5.5 V, V
V
IN
= 1.8 V
OUT
C
= 1 mF (MLCC), C
= 1 mF (MLCC)
IN
OUT
5 ms/div
Figure 44. Overheating Protection − TSD
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11
NCP105
APPLICATIONS INFORMATION
General
disable state the device consumes as low as typ. 10 nA from
the V .
The NCP105 is a high performance 150 mA Low Dropout
IN
Linear Regulator. This device delivers very high PSRR
(over 70 dB at 1 kHz) and excellent dynamic performance
as load/line transients. In connection with very low
quiescent current this device is very suitable for various
battery powered applications such as tablets, cellular
phones, wireless and many others. The device is fully
protected in case of output overload, output short circuit
condition and overheating, assuring a very robust design.
If the EN pin voltage >0.9 V the device is guaranteed to
be enabled. The NCP105 regulates the output voltage and
the active discharge transistor is turned−off.
The EN pin has internal pull−down current source with
typ. value of 300 nA which assures that the device is
turned−off when the EN pin is not connected. In the case
where the EN function isn’t required the EN should be tied
directly to IN.
Input Capacitor Selection (CIN)
Output Current Limit
It is recommended to connect at least a 1 mF Ceramic X5R
or X7R capacitor as close as possible to the IN pin of the
device. This capacitor will provide a low impedance path for
unwanted AC signals or noise modulated onto constant
input voltage. There is no requirement for the min. /max.
ESR of the input capacitor but it is recommended to use
ceramic capacitors for their low ESR and ESL. A good input
capacitor will limit the influence of input trace inductance
and source resistance during sudden load current changes.
Larger input capacitor may be necessary if fast and large
load transients are encountered in the application.
Output Current is internally limited within the IC to a
typical 600 mA. The NCP105 will source this amount of
current measured with a voltage drops on the 90% of the
nominal V
. If the Output Voltage is directly shorted to
= 0 V), the short circuit protection will limit
OUT
ground (V
OUT
the output current to 630 mA (typ). The current limit and
short circuit protection will work properly over whole
temperature range and also input voltage range. There is no
limitation for the short circuit duration.
Thermal Shutdown
When the die temperature exceeds the Thermal Shutdown
Output Decoupling (COUT
)
threshold (T − 160°C typical), Thermal Shutdown event
SD
The NCP105 requires an output capacitor connected as
close as possible to the output pin of the regulator. The
recommended capacitor value is 1 mF and X7R or X5R
dielectric due to its low capacitance variations over the
specified temperature range. The NCP105 is designed to
remain stable with minimum effective capacitance of
0.47 mF to account for changes with temperature, DC bias
and package size. Especially for small package size
capacitors such as 0402 the effective capacitance drops
rapidly with the applied DC bias.
is detected and the device is disabled. The IC will remain in
this state until the die temperature decreases below the
Thermal Shutdown Reset threshold (T
− 140°C typical).
SDU
Once the IC temperature falls below the 140°C the LDO is
enabled again. The thermal shutdown feature provides the
protection from a catastrophic device failure due to
accidental overheating. This protection is not intended to be
used as a substitute for proper heat sinking.
Power Dissipation
As power dissipated in the NCP105 increases, it might
become necessary to provide some thermal relief. The
maximum power dissipation supported by the device is
dependent upon board design and layout. Mounting pad
configuration on the PCB, the board material, and the
ambient temperature affect the rate of junction temperature
rise for the part.
There is no requirement for the minimum value of
Equivalent Series Resistance (ESR) for the C
but the
OUT
maximum value of ESR should be less than 1.8 W. Larger
output capacitors and lower ESR could improve the load
transient response or high frequency PSRR. It is not
recommended to use tantalum capacitors on the output due
to their large ESR. The equivalent series resistance of
tantalum capacitors is also strongly dependent on the
temperature, increasing at low temperature.
The maximum power dissipation the NCP105 can handle
is given by:
ƪ
ƫ
85° C * TA
Enable Operation
(eq. 1)
PD(MAX)
+
qJA
The NCP105 uses the EN pin to enable/disable its device
and to deactivate/activate the active discharge function.
If the EN pin voltage is <0.4 V the device is guaranteed to
be disabled. The pass transistor is turned−off so that there is
virtually no current flow between the IN and OUT. The
active discharge transistor is active so that the output voltage
The power dissipated by the NCP105 for given
application conditions can be calculated from the following
equations:
ǒ
Ǔ
ǒV
Ǔ
(eq. 2)
P
D [ VIN IGND@IOUT ) IOUT IN * VOUT
V
OUT
is pulled to GND through a 100 W resistor. In the
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12
NCP105
400
350
300
250
200
150
100
0.40
0.35
0.30
0.25
0.20
0.15
0.10
P
, T = 25°C, 2 oz Cu
A
D(MAX)
P
, T = 25°C, 1 oz Cu
A
D(MAX)
q
, 1 oz Cu
JA
q
, 2 oz Cu
JA
0.05
0
50
0
0
100
200
300
400
500
600
700
2
COPPER HEAT SPREADER AREA (mm )
Figure 45. qJA and PD (MAX) vs. Copper Area (XDFN4)
250
225
200
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
175
150
125
100
75
q
, 1 oz Cu
JA
q
, 2 oz Cu
JA
P
, T = 25°C, 2 oz Cu
A
D(MAX)
P
, T = 25°C, 1 oz Cu
A
D(MAX)
50
0.1
0
25
0
0
100
200
300
400
500
2
600
700
COPPER HEAT SPREADER AREA (mm )
Figure 46. qJA and PD (MAX) vs. Copper Area (TSOP−5)
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13
NCP105
Reverse Current
The NCP105 provides two options of V
ramp−up
OUT
The PMOS pass transistor has an inherent body diode
which will be forward biased in the case that V > V .
Due to this fact in cases, where the extended reverse current
condition can be anticipated the device may require
additional external protection.
time. The NCP105A and NCP105B have normal slew rate,
typical 190 mV/ms and NCP105C and NCP105D provide
slower option with typical value 20 mV/ms which is suitable
for camera sensor and other sensitive devices.
OUT
IN
PCB Layout Recommendations
Power Supply Rejection Ratio
To obtain good transient performance and good regulation
The NCP105 features very good Power Supply Rejection
ratio. If desired the PSRR at higher frequencies in the range
characteristics place C and C
capacitors close to the
IN
OUT
device pins and make the PCB traces wide. In order to
minimize the solution size, use 0402 capacitors. Larger
copper area connected to the pins will also improve the
device thermal resistance. The actual power dissipation can
be calculated from the equation above (Equation 2). Expose
pad should be tied the shortest path to the GND pin.
100 kHz − 10 MHz can be tuned by the selection of C
OUT
capacitor and proper PCB layout.
Turn−On Time
The turn−on time is defined as the time period from EN
assertion to the point in which VOUT will reach 98% of its
nominal value. This time is dependent on various
application conditions such as V
C
and T .
OUT(NOM) OUT A
ORDERING INFORMATION − XDFN4 PACKAGE
Voltage
Option
1.05 V
1.2 V
Device
Marking
TA
Description
Package
Shipping
NCP105AMX100TCG
NCP105AMX120TCG
NCP105AMX180TBG
NCP105AMX180TCG
NCP105AMX250TCG
NCP105AMX280TCG
NCP105AMX300TCG
NCP105AMX330TCG
NCP105AMX345TCG
TC
1.8 V
TD
150 mA, Active Discharge,
XDFN4
(Pb−Free)
3000 / Tape &
Reel
2.5 V
2.8 V
3.0 V
3.3 V
3.45 V
TE
TF
TG
TH
TJ
Normal Slew−rate
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14
NCP105
PACKAGE DIMENSIONS
TSOP−5
CASE 483
ISSUE M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
NOTE 5
5X
D
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
0.20 C A B
2X
0.10
T
M
5
4
3
2X
0.20
T
B
S
1
2
K
B
A
DETAIL Z
G
A
MILLIMETERS
TOP VIEW
DIM
A
B
C
D
MIN
2.85
1.35
0.90
0.25
MAX
3.15
1.65
1.10
0.50
DETAIL Z
J
G
H
J
K
M
S
0.95 BSC
C
0.01
0.10
0.20
0
0.10
0.26
0.60
10
3.00
0.05
H
SEATING
PLANE
END VIEW
C
_
_
SIDE VIEW
2.50
SOLDERING FOOTPRINT*
1.9
0.074
0.95
0.037
2.4
0.094
1.0
0.039
0.7
0.028
mm
inches
ǒ
Ǔ
SCALE 10:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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15
NCP105
PACKAGE DIMENSIONS
XDFN4 1.0x1.0, 0.65P
CASE 711AJ
ISSUE A
4X L2
NOTES:
A
B
D
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.20 mm FROM THE TERMINAL TIPS.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
PIN ONE
REFERENCE
E
4X b2
2X
0.05
C
MILLIMETERS
DETAIL A
DIM MIN
0.33
A1 0.00
MAX
0.43
0.05
0.05
C
2X
A
TOP VIEW
A3
b
b2 0.02
0.10 REF
0.15
0.25
0.12
(A3)
0.05
0.05
C
D
1.00 BSC
D2 0.43
0.53
A
E
e
L
1.00 BSC
0.65 BSC
0.20
C
0.30
0.17
SEATING
PLANE
NOTE 4
A1
L2 0.07
C
SIDE VIEW
e
RECOMMENDED
e/2
MOUNTING FOOTPRINT*
DETAIL A
4X L
D2
1
4
2
02.5X2
0.65
PITCH
PACKAGE
OUTLINE
D2
4X
0.39
455
3
4X
0.11
1.20
4X b
M
0.05
C A B
4X
0.24
NOTE 3
4X
0.26
BOTTOM VIEW
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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