NCP1219BD100R2G [ONSEMI]

PWM Controller with Adjustable Skip Level and External Latch Input; PWM控制器,可调节跳过级和外部锁存输入
NCP1219BD100R2G
型号: NCP1219BD100R2G
厂家: ONSEMI    ONSEMI
描述:

PWM Controller with Adjustable Skip Level and External Latch Input
PWM控制器,可调节跳过级和外部锁存输入

稳压器 开关式稳压器或控制器 电源电路 开关式控制器 光电二极管
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中文:  中文翻译
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NCP1219  
PWM Controller with  
Adjustable Skip Level and  
External Latch Input  
The NCP1219 represents a new, pin to pin compatible, generation  
of the successful 7pin current mode NCP12XX product series. The  
controller allows for excellent standby power consumption by use of  
its adjustable skip mode and integrated high voltage startup FET.  
Internal frequency jittering, ramp compensation, timerbased fault  
detection and a latch input make this controller an excellent  
candidate for converters where ruggedness and component cost are  
the key constraints.  
http://onsemi.com  
SOIC7  
D SUFFIX  
CASE 751U  
The Dynamic Self Supply (DSS) drastically simplifies the  
transformer design in avoiding the use of an auxiliary winding to  
supply the NCP1219. This feature is particularly useful in  
applications where the output voltage varies during operation (e.g.  
battery chargers). Due to its high voltage technology, the IC can be  
directly connected to the high voltage dc rail.  
MARKING DIAGRAM  
8
1219XZ  
ALYW  
G
1
Features  
FixedFrequency CurrentMode Operation with Ramp  
Compensation (65 kHz and 100 kHz Options)  
Dynamic Self Supply Eliminates the Need for an Auxiliary Winding  
TimerBased Fault Protection for Improved Overload Detection  
Cycle Skip Reduces Input Power in Standby Mode  
Latch and AutoRecovery Overload Protection Options  
Internal High Voltage Startup Circuit  
1219 = Specific Device Code  
X
= Overcurrent  
= (A = latch, B = autoretry)  
Z
= Frequency  
= (6 = 65 kHz, 1 = 100 kHz)  
= Assembly Location  
= Wafer Lot  
A
L
Y
W
G
= Year  
= Work Week  
= PbFree Package  
Accurate Current Limit Detector ( 5%)  
Adjustable Skip Level  
Latch Input for Easy Implementation of Overvoltage and  
PIN CONNECTIONS  
Overtemperature Protection  
1
Skip/latch  
FB  
HV  
Frequency Modulation for Softened EMI Signature  
500 mA/800 mA Peak Source/Sink Current Drive Capability  
Pin to Pin Compatible with the Existing NCP12XX Series  
These Devices are PbFree and Halogen Free/BFR Free*  
V
CC  
CS  
Drv  
GND  
(Top View)  
Typical Applications  
ACDC Adapters for Notebooks, LCD Monitors  
Offline Battery Chargers  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 19 of this data sheet.  
Consumer Electronic Appliances STB, DVD, DVDR  
*For additional information on our PbFree strategy and soldering details, please  
downloadthe ON Semiconductor Soldering and Mounting Techniques Reference  
Manual, SOLDERRM/D.  
©
Semiconductor Components Industries, LLC, 2009  
1
Publication Order Number:  
October, 2009 Rev. 3  
NCP1219/D  
NCP1219  
+
EMI  
Filter  
Output  
Voltage  
AC  
Input  
latch input*  
HV  
Skip/latch  
FB  
CS  
V
CC  
GND  
* Optional  
DRV  
NCP1219  
R
ramp  
*
Figure 1. Typical Application Circuit  
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2
NCP1219  
Latched overload  
I
I
when V > V  
CC inhibit  
start  
2 V  
(Option A)  
when V < V  
inhibit  
CC  
inhibit  
R
42.0k*  
latchoff, reset when  
upper  
V
latch  
V
< V  
CC  
CC(reset)  
R
S
HV  
Skip/latch  
*
-
50 ms  
filter  
R
+
Q
Q
S
R
lower  
R
skip  
51.3k*  
(Option A)  
+
-
V
Skip  
V
Skip(max)  
Skip  
Comparator  
V
CC(on)  
V
V
FB(open)  
Skip/latch  
-
TSD  
+
-
+
16.7k*  
V
FB  
FB  
Normal = V  
CC(min)  
75 ms*  
filter  
soft−  
start  
set  
Fault = V  
CC(hiccup)  
SoftStart/PWM Clamp  
V
FB  
/ 3  
V
ILIM  
+
time  
t
SSTART  
V
CC(reset)  
clamp  
detect  
tOVLD  
timer  
UVLO  
V
CC  
reset  
+
-
V
DD  
I
ramp(peak)  
PWM  
-
0
Fault  
+
CS  
I
Management  
ramp  
Double Hiccup  
Counter  
R
ramp  
V
CS  
LEB  
CS  
disable  
internal  
bias  
R
CS  
Maximum  
Duty Ratio  
detect  
V
CC  
DRV  
Q
R
Oscillator  
S
GND  
7.5%* Jittering  
* Typical values are shown  
Figure 2. Functional Block Diagram  
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3
NCP1219  
Table 1. PIN FUNCTION DESCRIPTION  
Pin  
Name  
Description  
1
Skip/latch  
This pin provides a latch input to permanently disable the device under a fault condition. It also allows the user to  
adjust the skip threshold. A resistor between this pin and GND provides noise immunity to the latch input and sets  
the skip threshold. The voltage on this pin is determined by the combination of the internal voltage divider and the  
external resistor to ground. The default skip threshold is 1.1 V (typical) if no external resistor is used. An internal  
clamp prevents the skip level from increasing above 1.3 V if the Skip/latch pin is pulled high to latch the controller.  
2
3
FB  
CS  
The voltage on this pin is proportional to the output load on the converter. An internal resistor divider sets the  
voltage on this pin above the regulation threshold (3 V) and an external optocoupler pulls the pin low to achieve  
regulation. While the FB voltage is above its regulation threshold, the overload timer is enabled. If the overload  
timer expires, the controller enters a double hiccup mode (option B) or is latched (option A) depending on the ver-  
sion of the device. The converter enters skip mode if the FB voltage is below the skip threshold.  
A voltage ramp proportional to the primary current is applied to this pin. The maximum current is reached once the  
ramp voltage reaches 1 V (typical). A 100 mA (typical) current source provides ramp compensation. The amount of  
ramp compensation is adjusted with a series resistor between the CS pin and the current sense resistor.  
4
5
GND  
DRV  
Analog ground.  
Main output of the PWM Controller. DRV has a source resistance of 12.6 W (typical) and a sink resistance of 6.7 W  
(typical).  
6
VCC  
Positive input supply. This pin connects to an external capacitor for energy storage. An internal current source  
supplies current from the HV pin to this pin. Once the V voltage reaches V  
(12.7 V typical), the current  
CC  
CC(on)  
CC  
source turns off and the DRV is enabled. The current source turns on once V falls to V  
(9.9 V typical).  
CC(min)  
This mode of operation is known as dynamic self supply (DSS).  
If the bias current consumption exceeds the startup current, and V drops 0.5 V (typical) below V  
the con-  
CC  
CC(min)  
verter turns off and enters a double hiccup mode. If the V voltage is below 0.67 V (typical) the startup current is  
CC  
reduced to 200 mA (typical), reducing power dissipation.  
8
HV  
This is the input of the high voltage startup regulator and connects directly to the bulk voltage. A controlled current  
source supplies current from this pin to the V capacitor, eliminating the need for an external startup resistor. The  
CC  
charge current is 12.8 mA (typical).  
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4
NCP1219  
Table 2. MAXIMUM RATINGS (Notes 1 4)  
Rating  
Symbol  
Value  
0.3 to 500  
100  
Unit  
V
HV Voltage  
V
HV  
HV  
HV Current  
I
mA  
V
Supply Voltage  
V
0.3 to 20  
100  
CC  
CC  
Supply Current  
I
mA  
V
Skip/latch Voltage  
Skip/latch Current  
FB Voltage  
V
0.3 to 9.5  
100  
Skip/latch  
Skip/latch  
I
mA  
V
V
0.3 to 5.0  
100  
FB  
FB  
FB Current  
I
mA  
V
CS Voltage  
V
0.3 to 5.0  
100  
CS  
CS  
CS Current  
I
mA  
V
DRV Voltage  
V
0.3 to 20  
500 to 800  
–40 to 150  
–60 to 150  
DRV  
DRV  
DRV Current  
I
mA  
°C  
°C  
W
Operating Junction Temperature  
Storage Temperature Range  
T
J
T
stg  
Power Dissipation (T = 25°C, 2.0 Oz Cu, 1.0 Sq Inch Printed Circuit Copper Clad)  
P
D
A
D Suffix, Plastic Package Case 751U (SOIC7) (Note 4)  
0.92  
Thermal Resistance, Junction to Ambient (2.0 Oz Cu Printed Circuit Copper Clad)  
D Suffix, Plastic Package Case 751U (SOIC7)  
°C/W  
Junction to Air, Low conductivity PCB (Note 3)  
Junction to Lead, Low conductivity PCB (Note 3)  
Junction to Air, High conductivity PCB (Note 4)  
R
R
177  
75  
136  
69  
θ
JA  
θ
JL  
R
θ
JA  
Junction to Lead, High conductivity PCB (Note 4)  
R
θ
JL  
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the  
RecommendedOperating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect  
device reliability.  
1. This device series contains ESD protection and exceeds the following tests:  
Pins 1– 6: Human Body Model 3000 V per JEDEC JESD22A114F.  
Pins 1– 6: Machine Model Method 300 V per JEDEC JESD22A115A.  
Pin 8 is the HV startup of the device and is rated to the maximum rating of the part, or 500 V.  
2. This device contains LatchUp protection and exceeds 100 mA per JEDEC Standard JESD78.  
2
3. As mounted on a 40x40x1.5 mm FR4 substrate with a single layer of 80 mm of 2 oz copper traces and heat spreading area. As specified for  
a JEDEC 51 low conductivity test PCB. Test conditions were under natural convection or zero air flow.  
2
4. As mounted on a 40x40x1.5 mm FR4 substrate with a single layer of 650 mm of 2 oz copper traces and heat spreading area. As specified  
for a JEDEC 51 high conductivity test PCB. Test conditions were under natural convection or zero air flow.  
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5
 
NCP1219  
Table 3. ELECTRICAL CHARACTERISTICS (V = 60 V, V = 11.3 V, V = 2 V, V  
= 0 V, V = 0 V, V  
= open, C  
=
HV  
CC  
FB  
Skip/latch  
CS  
DRV  
CC  
0.1 mF, for typical values T = 25°C, for min/max values, T is –40°C to 125°C, unless otherwise noted)  
J
J
Characteristics  
Conditions  
Symbol  
Min  
Typ  
Max  
Unit  
STARTUP AND SUPPLY CIRCUITS  
Supply Voltage  
V
Startup Threshold  
V
Increasing  
Decreasing  
Decreasing  
Decreasing  
Decreasing  
V
11.2  
9.0  
8.4  
4.9  
12.7  
9.9  
9.4  
5.7  
4.0  
13.8  
10.8  
10.6  
6.3  
CC  
CC(on)  
Minimum Operating Voltage  
Undervoltage Lockout  
Double Hiccup Threshold  
Logic Reset Voltage  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC(MIN)  
UVLO  
V
CC(hiccup)  
V
CC(reset)  
UVLO Filter Delay  
t
0.35  
100  
50  
0.67  
200  
20  
ms  
V
UVLO(delay)  
Inhibit Threshold Voltage  
Inhibit Bias Current  
I
= 500 mA  
V
0.90  
350  
28  
inhibit  
inhibit  
inhibit  
V
= 0 V  
I
mA  
V
CC  
Minimum Startup Voltage  
Startup Current  
I
= 0.5 mA, V = V  
– 0.5 V  
V
start(min)  
start  
CC  
CC(on)  
V
= V  
– 0.5 V  
I
5.5  
12.8  
18.5  
100  
50  
mA  
mA  
mA  
V
CC  
CC (on)  
start  
I
HV(reverse)  
Startup Circuit Reverse Current  
OffState Leakage Current  
Breakdown Voltage (Note 5)  
V
= 0 V, V = 14 V  
HV  
CC  
V
HV  
= 500 V, V = 14 V  
I
HV(off)  
12  
CC  
I
= 50 mA  
V
500  
HV  
BR(DS)  
Supply Current  
mA  
Device Disabled/Fault  
V
V
= 5.2 V, V = open  
I
I
0.6  
1.4  
2.2  
2.4  
0.8  
2.1  
2.7  
3.2  
Skip/latch  
FB  
CC1  
Device Enabled/No Switching  
Device Switching (65 kHz)  
Device Switching (100 kHz)  
= open, V = 0 V  
Skip/latch FB  
CC2  
V
V
= open, C  
= 1000 pF  
I
Skip/latch  
DRV  
CC3A  
CC3B  
= open, C  
= 1000 pF  
I
Skip/latch  
DRV  
CURRENT SENSE  
Current Sense Voltage Threshold  
Leading Edge Blanking Duration  
Propagation Delay  
Apply voltage step on CS pin  
V
0.95  
100  
1.0  
184  
59  
1.05  
330  
150  
V
ILIM  
t
ns  
ns  
LEB  
V
> V  
to 50% DRV turns off,  
= 1000 pF  
t
delay  
CS  
ILIM  
C
DRV  
Ramp Compensation Peak Current  
Ramp Compensation Valley Current  
FEEDBACK INPUT  
I
100  
0
mA  
mA  
ramp(peak)  
I
ramp(valley)  
Open Feedback Voltage  
Internal Pullup Resistance  
Feedback Pullup Current  
Feedback to Current Set Point Ratio  
SOFTSTART  
V
3.2  
3.6  
16.7  
280  
3.0  
3.9  
V
FB(open)  
R
FB  
kW  
mA  
V
FB  
= 0 V  
I
FB  
141  
392  
I
ratio  
SoftStart Period  
Measured at 0.9 V  
t
4.8  
ms  
ILIM  
SSTART  
OSCILLATOR  
Oscillator Frequency  
65 kHz Option  
f
kHz  
OSC  
T = 25_C  
61.75  
58  
55  
95  
89  
65  
100  
68.25  
71  
71  
105  
107  
107  
J
T = 40_C to 85_C  
J
T = 40_C to 125_C  
J
100 kHz Option  
T = 25_C  
J
T = 40_C to 85_C  
J
T = 40_C to 125_C  
85  
J
Frequency Modulation in  
7.5  
%
Percentage of f  
OSC  
Frequency Modulation Period  
Maximum Duty Ratio  
6.0  
80  
ms  
%
D
75  
85  
5. Guaranteed by the I  
test.  
HV(off)  
6. Guaranteed by design only.  
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6
 
NCP1219  
Table 3. ELECTRICAL CHARACTERISTICS (V = 60 V, V = 11.3 V, V = 2 V, V  
= 0 V, V = 0 V, V  
= open, C  
=
HV  
CC  
FB  
Skip/latch  
CS  
DRV  
CC  
0.1 mF, for typical values T = 25°C, for min/max values, T is –40°C to 125°C, unless otherwise noted)  
J
J
Characteristics  
Conditions  
Symbol  
Min  
Typ  
Max  
Unit  
GATE DRIVE  
Drive Resistance  
DRV Sink  
DRV Source  
W
V
= 0 V, V  
= 1 V  
R
R
2.0  
6.0  
6.7  
12.6  
13  
25  
FB  
V
DRV  
SNK  
= V – 1 V  
DRV  
CC  
SRC  
Rise Time (10% to 90%)  
Fall Time (90% to 10%)  
LATCH INPUT  
C
C
= 1000 pF (10% to 90%)  
= 1000 pF (90% to 10%)  
t
t
30  
20  
ns  
ns  
DRV  
r
DRV  
f
Latch Voltage Threshold  
Latch Filter Delay  
V
3.4  
3.9  
50  
4.6  
V
latch  
V
= 5.2 V, apply voltage step  
on Skip/latch pin  
t
ms  
Skip/latch  
latch(delay)  
CYCLE SKIP  
Default Skip Threshold  
Skip Clamp Voltage  
Skip Comparator Hysteresis  
V
increasing, V  
increasing, V  
= Open  
= 2.0 V  
= 0.5 V  
= 2.0 V  
V
skip  
0.9  
1.1  
1.1  
1.3  
75  
1.3  
1.5  
V
V
FB  
Skip/latch  
V
V
FB  
Skip/latch  
skip(MAX)  
skip(HYS1)  
skip(HYS2)  
V
FB  
V
FB  
decreasing, V  
decreasing, V  
V
V
mV  
mV  
Skip/latch  
Skip Clamp Comparator  
Hysteresis  
75  
Skip/latch  
Skip Current  
V
= 0 V  
I
30  
47  
56  
mA  
Skip/latch  
skip  
FAULTS PROTECTION  
Thermal Shutdown (Note 6)  
Thermal Shutdown Hysteresis  
Thermal Shutdown Delay  
Overload Timer  
Temperature Increasing  
Temperature Decreasing  
T
155  
40  
°C  
°C  
ms  
SHDN  
T
SHDN(HYS)  
SHDN(delay)  
T
75  
Apply voltage step on FB pin  
t
118  
ms  
OVLD  
5. Guaranteed by the I  
test.  
HV(off)  
6. Guaranteed by design only.  
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7
 
NCP1219  
TYPICAL CHARACTERISTICS  
15  
14  
13  
1.40  
1.26  
1.12  
0.98  
0.84  
0.70  
0.56  
0.42  
0.28  
I
= 500 mA  
inhibit  
V
12  
11  
10  
9
CC(on)  
V
CC(MIN)  
UVLO  
8
7
V
CC(reset)  
0.14  
0
6
5
50 25  
0
25  
50  
75  
100  
125 150  
50 25  
0
25  
50  
75  
100  
125 150  
T , JUNCTION TEMPERATURE (°C)  
J
T , JUNCTION TEMPERATURE (°C)  
J
Figure 3. Supply Voltage Thresholds vs.  
Junction Temperature  
Figure 4. Inhibit Threshold Voltage vs.  
Junction Temperature  
300  
280  
260  
240  
220  
200  
180  
160  
140  
15.0  
14.5  
14.0  
13.5  
13.0  
12.5  
12.0  
11.5  
11.0  
V
= V  
= 60 V  
HV  
V
CC  
= 0 V  
V
CC  
0.5 V  
CC(on)  
120  
100  
10.5  
10.0  
50 25  
0
25  
50  
75  
100  
125 150  
50 25  
0
25  
50  
75  
100  
125 150  
T , JUNCTION TEMPERATURE (°C)  
J
T , JUNCTION TEMPERATURE (°C)  
J
Figure 5. Inhibit Current vs. Junction  
Temperature  
Figure 6. Startup Current vs. Junction  
Temperature  
30  
16  
14  
12  
10  
8
V
HV  
= 60 V  
V
HV  
V
CC  
= 60 V  
= 14 V  
27  
24  
21  
18  
15  
12  
9
6
4
6
2
0
3
0
0
2
4
6
8
10 12 14  
16 18 20  
50 25  
0
25  
50  
75  
100 125 150  
V , SUPPLY VOLTAGE (V)  
CC  
T , JUNCTION TEMPERATURE (°C)  
J
Figure 7. Startup Current vs. Supply Voltage  
Figure 8. Startup Circuit Leakage Current vs.  
Junction Temperature  
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8
NCP1219  
TYPICAL CHARACTERISTICS  
3.0  
50  
45  
40  
35  
30  
25  
20  
15  
10  
I
(f  
~ 100 kHz)  
~ 65 kHz)  
CC3 OSC  
2.7  
2.4  
2.1  
1.8  
1.5  
1.2  
0.9  
0.6  
0.3  
0.0  
V
= 14 V  
CC  
I
(f  
CC3 OSC  
I
CC2  
T = 40°C  
J
I
CC1  
T = 125°C  
J
5
0
0
75  
150  
225  
300  
375  
450  
525  
50  
25  
0
25  
50  
75  
100 125 150  
V , HV VOLTAGE (V)  
HV  
T , JUNCTION TEMPERATURE (°C)  
J
Figure 9. Startup Circuit Leakage Current vs.  
HV Voltage  
Figure 10. Supply Current vs. Junction  
Temperature  
1.05  
1.04  
1.03  
1.02  
1.01  
1.00  
0.99  
0.98  
0.97  
0.96  
0.95  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
T = 25°C  
J
f
= 100 kHz  
OSC  
f
= 65 kHz  
OSC  
0.5  
0
9
10 11 12 13 14 15 16 17 18 19 20 21  
, SUPPLY VOLTAGE (V)  
50 25  
0
25  
50  
75  
100 125 150  
V
CC  
T , JUNCTION TEMPERATURE (°C)  
J
Figure 11. Operating Supply Current vs.  
Supply Voltage  
Figure 12. Current Sense Voltage Threshold  
vs. Junction Temperature  
300  
280  
260  
240  
220  
200  
180  
160  
140  
125  
115  
105  
95  
85  
75  
65  
55  
45  
120  
100  
35  
25  
50 25  
0
25  
50  
75  
100  
125  
150  
50 25  
0
25  
50  
75  
100  
125 150  
T , JUNCTION TEMPERATURE (°C)  
J
T , JUNCTION TEMPERATURE (°C)  
J
Figure 13. Leading Edge Blanking Time vs.  
Junction Temperature  
Figure 14. Current Sense Propagation Delay  
vs. Junction Temperature  
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NCP1219  
TYPICAL CHARACTERISTICS  
120  
110  
100  
90  
85  
84  
83  
82  
81  
80  
79  
100 kHz Option  
80  
65 kHz Option  
70  
78  
77  
76  
75  
60  
50  
40  
50 25  
0
25  
50  
75  
100 125 150  
50 25  
0
25  
50  
75  
100  
125 150  
T , JUNCTION TEMPERATURE (°C)  
J
T , JUNCTION TEMPERATURE (°C)  
J
Figure 15. Oscillator Frequency vs. Junction  
Temperature  
Figure 16. Maximum Duty Ratio vs. Junction  
Temperature  
20  
18  
5.0  
V
CC  
= 11.3 V  
4.8  
4.6  
4.4  
4.2  
4.0  
16  
14  
12  
10  
8
Source, V  
= V 1 V  
CC  
DRV  
3.8  
3.6  
3.4  
6
4
Sink, V  
= 1 V  
DRV  
2
0
3.2  
3.0  
50 25  
0
25  
50  
75  
100 125  
150  
50 25  
0
25  
50  
75  
100  
125 150  
T , JUNCTION TEMPERATURE (°C)  
J
T , JUNCTION TEMPERATURE (°C)  
J
Figure 17. Drive Sink and Source Resistances  
vs. Junction Temperature  
Figure 18. Latch Voltage Threshold vs.  
Junction Temperature  
1.55  
1.50  
1.30  
1.25  
1.20  
1.15  
1.10  
1.05  
1.00  
V
= open  
Skip/latch  
V
= 2 V  
Skip/latch  
1.45  
1.40  
1.35  
1.30  
1.25  
0.95  
0.90  
0.85  
1.20  
1.15  
1.10  
1.05  
0.80  
50 25  
0
25  
50  
75  
100  
125 150  
50 25  
0
25  
50  
75  
100  
125 150  
T , JUNCTION TEMPERATURE (°C)  
J
T , JUNCTION TEMPERATURE (°C)  
J
Figure 19. Default Skip Threshold vs. Junction  
Temperature  
Figure 20. Skip Clamp Voltage vs. Junction  
Temperature  
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10  
NCP1219  
TYPICAL CHARACTERISTICS  
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
1.2  
R
skip  
= 48.7 kW  
1.0  
0.8  
0.6  
0.4  
0.2  
0
0.3  
0.2  
50 25  
0
25  
50  
75  
100  
125 150  
1
10  
, EXTERNAL SKIP RESISTOR (kW)  
Skip  
100  
1000  
10000  
T , JUNCTION TEMPERATURE (°C)  
J
R
Figure 21. Adjustable Skip Threshold vs.  
Junction Temperature  
Figure 22. Skip Threshold vs. Skip Resistor  
140  
135  
10  
9
130  
125  
120  
115  
110  
8
7
6
5
4
105  
3
100  
95  
2
1
0
90  
50 25  
0
25  
50  
75  
100  
125 150  
50 25  
0
25  
50  
75  
100  
125 150  
T , JUNCTION TEMPERATURE (°C)  
J
T , JUNCTION TEMPERATURE (°C)  
J
Figure 23. SoftStart Period vs. Junction  
Figure 24. Overload Timer Period vs. Junction  
Temperature  
Temperature  
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11  
NCP1219  
DETAILED OPERATING DESCRIPTION  
The NCP1219 is part of a product family of current mode  
supply current consumption exceeds the startup current,  
V will decay below V . The NCP1219 has an  
CC  
controllers designed for acdc applications requiring low  
standby power. The controller operates in skip or burst  
mode at light load. Its high integration reduces component  
count resulting in a more compact and lower cost power  
supply. This device family has 2 options, A and B. Option  
A latches where as option B auto restarts after an overload  
fault.  
CC(MIN)  
undervoltage lockout (UVLO) to prevent operation at low  
levels. The UVLO threshold is typically 9.4 V. The  
V
CC  
DRV signal is immediately disabled upon reaching UVLO.  
It is reenabled if V increases above UVLO before the  
CC  
50 ms (typical) timer expires. Otherwise, the controller  
enters double hiccup mode.  
The internal high voltage startup circuit with dynamic  
self supply (DSS) allows the controller to operate without  
an auxiliary supply, simplifying the transformer design.  
This feature is particularly useful in applications where the  
output voltage varies during operation (e.g. printer  
adapters).  
Other features found in the NCP1219 are frequency  
jittering, adjustable ramp compensation, timer based fault  
detection and a dedicated latch input.  
The controller enters a double hiccup mode if an  
overload (option B), thermal shutdown, UVLO or latch  
fault is detected. A double hiccup fault disables the DRV  
signal, sets the controller in a low current mode and allows  
V
CC  
to discharge to V , typically 5.7 V. This cycle  
CC(hiccup)  
is repeated twice to minimize power dissipation in external  
components during a fault event. Figures 25 and 26 show  
double hiccup mode operation with a fault occurring while  
the startup circuit is disabled and enabled, respectively. A  
softstart sequence is initiated the second time V reaches  
CC  
High Voltage Startup Circuit  
V . If the fault is present or the controller is latched  
CC(on)  
The NCP1219 internal high voltage startup circuit  
eliminates the need for external startup components and  
provides a faster startup time compared to an external  
startup resistor. The startup circuit consists of a constant  
current source that supplies current from the HV pin to the  
upon reaching V , the controller stays in hiccup mode.  
CC(on)  
During this mode, V  
never drops below 4 V, the  
CC  
controller logic reset level. This prevents latched faults  
from being cleared unless power to the controller is  
completely removed (i.e. unplugging the supply from the  
AC line). There are two options available in the NCP1219,  
options A and B. Option A latches off after the overload  
timer expires if an overload fault is detected. In this case,  
supply capacitor on the V pin (C ). The HV pin is rated  
CC  
CC  
at 500 V allowing direct connection to the bulk capacitor.  
The startup current (I ) is typically 12.8 mA.  
start  
The startup current source is disabled once the V  
CC  
V
CC  
cycles between V  
and V  
without  
CC(on)  
CC(hiccup)  
voltage reaches V , typically 12.7 V. The controller is  
CC(on)  
enabling the DRV signal until the power to the controller  
is reset. On the other hand, option B has autoretry circuitry  
allowing the DRV signal to restart after a double hiccup  
sequence triggered by an overload condition.  
then biased by the V capacitor. The current source is  
CC  
enabled once the V  
voltage decays to its minimum  
CC  
operating threshold (V  
) typically 9.9 V. If the  
CC(MIN)  
V
CC(on)  
V
CC(MIN)  
UVLO  
V
CC(hiccup)  
V
CC(reset)  
Fault1  
Fault  
DRV  
ON  
OFF  
ON  
Figure 25. VCC Double Hiccup Operation with a Fault Occurring While the Startup Circuit is Disabled.  
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12  
 
NCP1219  
V
CC(on)  
V
CC(MIN)  
UVLO  
V
CC(hiccup)  
V
CC(reset)  
Fault2  
Fault  
ON  
OFF  
ON  
DRV  
Figure 26. VCC Double Hiccup Operation with a Fault Occurring While the Startup Circuit is Enabled  
An internal supervisory circuit monitors the V voltage  
to prevent the controller from dissipating excessive power  
In comparison, the power dissipation when the startup  
circuit is disabled and V is being supplied by the  
CC  
CC  
if the V  
pin is accidentally grounded. A lower level  
auxiliary winding is a function of the V voltage. This is  
CC  
CC  
current source (I  
) charges C from 0 V to V ,  
shown in Equation 2.  
inhibit  
CC  
inhibit  
typically 0.67 V. Once V exceeds V  
current source is enabled. This behavior is illustrated in  
Figure 27. This slightly increases the total time to charge  
, the startup  
CC  
inhibit  
PAUX + ICC3 @ VCC  
(eq. 2)  
It is recommended that an external filter capacitor be  
placed as close as possible to the V pin to improve the  
CC  
V , but it is generally not noticeable.  
CC  
noise immunity.  
Startup Current  
SoftStart Operation  
Figures 28 and 29 show how the softstart feature is  
included in the pulsewidth modulation (PWM)  
comparator. When the NCP1219 starts up, a softstart  
I
start  
voltage V  
begins at 0 V. V  
increases  
SSTART  
SSTART  
gradually from 0 V to 1.0 V in 4.8 ms and stays at 1.0 V  
afterward. V is compared with the divided by 3  
SSTART  
feedback pin voltage (V /3). The lesser of V  
and  
FB  
SSTART  
(V /3) becomes the modulation voltage, V  
, in the  
PWM  
V
CC  
I
FB  
inhibit  
PWM duty ratio generation. Initially, (V /3) is above  
FB  
FB(open)  
V
V
V
CC(on)  
inhibit  
CC(MIN)  
1.0 V because the FB pin is brought to V  
, typically  
is  
3.6 V, by the internal pullup resistor. As a result, V  
PWM  
Figure 27. Startup Current at Various VCC Levels  
limited by the softstart function and slowly ramps up the  
duty ratio (and therefore the primary current) for the initial  
4.8 ms. This provides a greatly reduced stress on the power  
devices during startup.  
The startup circuit is rated at a maximum voltage of  
500 V. If the device operates in the DSS mode, power  
dissipation should be controlled to avoid exceeding the  
maximum power dissipation of the controller. If dissipation  
on the controller is excessive, a resistor can be placed in  
series with the HV pin. This will reduce power dissipation  
on the controller and transfer it to the series resistor.  
Standby mode losses and normal mode power dissipation  
can be reduced by biasing the controller with an auxiliary  
V
)
SSTART  
V /3  
FB  
0
1
winding. The auxiliary winding needs to maintain V  
CC  
above V  
once the startup circuit is disabled.  
V
PWM  
CC(MIN)  
The power dissipation of the controller when operated in  
DSS mode, P , can be calculated using equation 1, where  
Figure 28. VPWM is the lesser of VSSTART and (VFB/3)  
DSS  
I
is the operating current of the NCP1219 during  
CC3  
switching and V is the voltage at the HV pin. The HV pin  
HV  
is most often connected to the bulk capacitor.  
PDSS + ICC3 @ (VHV * VCC  
)
(eq. 1)  
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13  
 
NCP1219  
Softstart voltage, V  
V
bulk  
SSTART  
I
ramp(peak)  
I
ramp  
1 V  
V
CS  
+
180 ns  
LEB  
time  
PWM  
Output  
R
S
Q
t
CS  
I
D
SSTART  
80%  
V
PWM  
max duty  
Feedback pin voltage divided by 3, V /3  
(1 V max. signal)  
FB  
Clock  
R
CS  
1 V  
Figure 30. CurrentMode Implementation  
Figure 31 shows the timing diagram for the  
currentmode pulse width modulation operation. An  
internal clock sets the output RS latch, pulling the DRV pin  
high. The latch is then reset when the voltage on the CS pin  
time  
time must be less than t  
OVLD  
to prevent fault condition  
Pulse Width Modulation voltage, V  
PWM  
intersects the modulation voltage, V . This generates  
PWM  
the duty ratio of the DRV pulse. The maximum duty ratio  
is internally limited to 80% (typical) by the output RS latch.  
1 V  
PWM  
Output  
time  
t
SSTART  
Drain Current, I  
D
V
PWM  
time  
V
CS  
t
SSTART  
Figure 29. SoftStart (Time = 0 at VCC = VCC(on)  
)
clock  
CurrentMode Pulse Width Modulation  
The NCP1219 is a currentmode, fixed frequency pulse  
width modulation controller with ramp compensation. The  
PWM block of the NCP1219 is shown in Figure 30. The  
DRV signal is enabled by a clock pulse. At this time,  
current begins to flow in the power MOSFET and the sense  
resistor. A corresponding voltage is generated on the CS  
pin of the device, ranging from very low to as high as the  
Figure 31. CurrentMode Timing Diagram  
The V  
voltage is the scaled representation of the FB  
PWM  
pin voltage. The scale factor, I , is 3. The FB pin voltage  
ratio  
is provided by an external error amplifier, whose output is  
a function of the power supply output. An FB signal  
between V  
and 3 V determines the duty ratio of the  
skip  
controller output. The FB voltage operates in a closed loop  
with the output voltage to regulate the power supply.  
It is recommended that an external filter capacitor be  
placed as close to the FB pin as possible to improve the  
noise immunity.  
maximum modulation voltage, V  
(maximum of 1 V).  
PWM  
This sets the primary current on a cyclebycycle basis.  
Equation 3 gives the maximum drain current, I  
,
D(MAX)  
where R is the current sense resistor value and V  
is  
CS  
ILIM  
the current sense voltage threshold.  
VILIM  
RCS  
ID(MAX)  
+
(eq. 3)  
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14  
 
NCP1219  
Ramp Compensation  
ǒ
Ǔ@ %slope  
Soff,primary   RCS  
Ramp compensation is a known mean to cure  
subharmonic oscillations. These oscillations take place at  
half the switching frequency and occur only during  
continuous conduction mode (CCM) with a duty ratio  
greater than 50%. To lower the current loop gain, one  
usually injects 50 to 75% of the inductor current down  
slope. The NCP1219 generates an internal current ramp  
that is synchronized with the clock. This current ramp is  
then routed to the CS pin. Figures 32 and 33 depict how the  
ramp is generated and utilized. Ramp compensation is  
Rramp  
+
(eq. 5)  
I
 f  
ramp(peak) OSC  
D
ǒ
Ǔ
where R is the current sense resistor and %slope is the  
percentage of the current downslope to be used for ramp  
compensation.  
The NCP1219 has a peak ramp compensation current of  
100 mA. A frequency of 65 kHz with an 80% maximum  
duty ratio corresponds to an 8.1 mA/ms ramp. For a typical  
flyback design, let’s assume that the primary inductance is  
CS  
simply formed by placing a resistor, R  
, between the CS  
ramp  
350 mH, the converter output is 19 V, the V of the output  
pin and the sense resistor.  
f
diode is 1 V and the N :N ratio is 10:1. The off time  
primary current slope is given by Equation 6.  
P
S
Ramp current, I  
ramp  
N
P
) V )ǒ Ǔ  
(Vout  
I
f
ramp(peak)  
N
S
mA  
+ 571  
(eq. 6)  
ms  
LP  
When projected over an R of 0.1 W (for example), this  
CS  
becomes 57 mV/ms. If we select 50% of the downslope as  
the required amount of ramp compensation, then we shall  
time  
0
80% of period  
100% of period  
inject 28.5 mV/ms. Therefore, R  
is simply equal to  
ramp  
Equation 7.  
Figure 32. Internal Ramp Compensation Current  
Source  
mV  
28.5  
ms  
Rramp  
+
+ 3.5 kW  
(eq. 7)  
mA  
8.1  
ms  
Ramp compensation greater than 50% of the inductor  
down slope can be used if necessary; however,  
overcompensating will degrade the transient response of  
the system. The addition of ramp compensation also  
reduces the total available output power of the system.  
DRV  
Clock  
I
ramp(peak)  
Internal Oscillator  
Current  
Ramp  
R
ramp  
The internal oscillator of the NCP1219 provides the  
clock signal that sets the DRV signal high and limits the  
duty ratio to 80% (typical). The oscillator has a fixed  
frequency of 65 kHz or 100 kHz. The NCP1219 employs  
frequency jittering to smooth the EMI signature of the  
system by spreading the energy of the main switching  
component across a range of frequencies. An internal low  
frequency oscillator continuously varies the switching  
frequency of the controller by 7.5%. The period of  
modulation is 6 ms, typical. Figure 34 illustrates the  
oscillator frequency modulation.  
CS  
Oscillator  
R
CS  
Figure 33. Inserting a Resistor in Series with the  
Current Sense Information Provides Ramp  
Compensation  
In order to calculate the value of the ramp compensation  
resistor, R  
, the off time primary current slope,  
must be calculated using Equation 4,  
ramp  
S
off,primary  
N
P
) V ) @ ǒ Ǔ  
(Vout  
f
N
S
Soff,primary  
+
(eq. 4)  
LP  
where V is the converter output voltage, V is the forward  
out  
f
diode drop of the secondary diode, N /N is the primary to  
P
S
secondary turns ratio, and L is the primary inductance of  
P
the transformer. The value of R  
Equation 5,  
can be calculated using  
ramp  
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15  
 
NCP1219  
Oscillator Frequency  
Startup current source is  
is V  
Startup current source is  
charging the V capacitor  
off when V  
CC  
CC  
CC(on)  
VCC(on)  
FOSC + 7.5%  
FOSC  
FOSC 7.5%  
VCC(hiccup)  
time  
6 ms  
Startup current source turns  
on when V reaches V  
CC  
CC(hiccup)  
time  
Figure 35. Latchoff VCC Timing Diagram  
The external latch feature allows the circuit designers to  
implement different kinds of latching protection. Figure 36  
shows an example circuit in which a bipolar transistor is  
used to pull the Skip/latch pin above the latch threshold.  
Figure 34. Oscillator Frequency Modulation  
Gate Drive  
The output drive of the NCP1219 is designed to directly  
drive the gate of an nchannel power MOSFET. The DRV  
pin is capable of sourcing 500 mA and sinking 800 mA of  
drive current. It has typical rise and fall times of 30 ns and  
20 ns, respectively, driving a 1 nF capacitive load.  
The power dissipation of the output stage while driving  
the capacitance of the power MOSFET must be considered  
when calculating the NCP1219 power dissipation. The  
driver power dissipation can be calculated using  
Equation 8,  
The R  
value is chosen to prevent the Skip/latch pin from  
LIM  
exceeding the maximum rated voltage. The NCP1219  
applications note (AND8393/D) details several simple  
circuits to implement overtemperature protection (OTP)  
and overvoltage protection (OVP).  
V
CC  
R
LIM  
PDRV + fOSC @ QG @ VCC  
(eq. 8)  
Fault  
output  
where Q is the gate charge of the power MOSFET.  
G
Skip/latch  
FB  
External Latch Input  
HV  
Board level protection functionality is often  
incorporated using external circuits to suit a specific  
application. An external fault condition can be used to  
disable the controller by bringing the voltage on the  
Skip/latch pin above the latch threshold, V  
typical). When an external fault condition is detected, the  
DRV signal is stopped, and the controller enters low current  
C
skip  
R
skip  
CS  
VCC  
DRV  
(3.9 V  
latch  
GND  
NCP1219  
operation mode. The external capacitor C  
discharges  
CC  
Figure 36. Circuit Example of an External  
and V  
drops until V  
is reached. The high  
CC  
CC(hiccup)  
Latchoff Circuit  
voltage startup circuit turns on and I  
charges C until  
CC  
start  
An internal blanking filter prevents fast voltage spikes  
caused by noise from latching the part. However, it is  
recommended that an external filter capacitor be placed as  
close as possible to the Skip/latch pin to further improve the  
noise immunity.  
V
V
is reached. V  
cycles between V  
and  
CC(on)  
CC  
CC(on)  
until V reaches V . Voltage must be  
CC(hiccup)  
CC  
CC(reset)  
removed from the HV pin, disabling the startup current and  
allowing C to discharge to V . Therefore, the  
CC  
CC(reset)  
controller is reset by unplugging the power supply from the  
wall to allow V to discharge. Figure 35 illustrates the  
bulk  
timing diagram of V in the latchoff condition.  
CC  
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16  
 
NCP1219  
Skip Cycle Operation  
Skip peak current, %I , is the percentage of the  
CSSKIP  
During standby or light load operation the duty ratio on  
the controller becomes very small. At this point, a  
significant portion of the power dissipation is related to the  
power MOSFET switching on and off. To reduce this power  
dissipation, the NCP1219 “skips” pulses when the FB level  
drops below the skip threshold. The level at which this  
occurs is completely adjustable by setting a resistor on the  
Skip/latch pin.  
maximum peak current at which the controller enters skip  
mode. %I can be any value from 0 to 43% as defined  
CSSKIP  
by Equation 9. However, the higher %I  
is, the greater  
CSSKIP  
the drain current when skip is entered. This increases  
acoustic noise. Conversely, the lower %I is, the  
CSSKIP  
larger the percentage of energy is expended turning the  
switch on and off. Therefore, it is important to adjust  
%I  
to the optimal level for a given application.  
CSSKIP  
By discontinuing pulses, the output voltage slowly drops  
and the FB voltage rises. When the FB voltage rises above  
V
skip  
%ICSSKIP  
+
@ 100  
(eq. 9)  
3 V  
the V  
level, DRV is turned back on. This feature  
skip  
Figure 38 shows the details of the Skip/latch pin  
circuitry. The voltage on the Skip/latch pin determines the  
voltage required on the FB pin to place the controller into  
skip mode. If the pin is left open, the default skip threshold  
produces the timing diagram shown in Figure 37.  
V
skip  
V
FB  
is 1.1 V. This corresponds to a 37% %I  
(%I  
=
CSSKIP  
CSSKIP  
Skip  
1.1 V / 3.0 V * 100% = 37%). Therefore, the controller will  
enter skip mode when the peak current is less than 37% of  
the maximum peak current.  
I
D
Figure 37. Skip Operation  
latch-off, reset  
< V  
2 V  
when V  
CC  
CC(reset)  
R
Vlatch  
upper  
42.0 k  
Skip/latch  
-
50 us  
filter  
S
+
+
R Q  
R
lower  
51.3 k  
V
R
skip  
C
skip  
Skip/latch  
VSkip  
-
Vskip(MAX)  
Vskip/Latch  
+
V
-
FB  
Skip  
Comparator  
To DRV  
latch  
reset  
Figure 38. Skip Adjust Circuit  
The skip level is reduced by placing an external resistor,  
, between the Skip/latch and GND pins. Figure 39  
R
skip  
summarizes the operating voltage regions of the Skip/latch  
pin.  
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17  
 
NCP1219  
V
skip/latch  
Within the adjustable V  
range, the skip level changes  
skip  
according to Equation 10.  
9.5 V (maximum pin voltage)  
2 V @ (Rlower ø Rskip  
)
Vskip  
+
(eq. 10)  
(Rlower ø Rskip) ) Rupper  
Controller is latched  
An internal clamp limits the skip threshold (V  
)
skip(MAX)  
to 1.3 V. Increasing the voltage on the Skip/latch pin  
beyond the value of the internal clamp will induce no  
further change in the skip level. This prevents the act of  
disabling the controller in the presence of an external latch  
event from causing it to enter skip mode. The relationship  
V
latch  
Skip threshold clamped to Vskip(MAX)  
Vskip(MAX)(maximum skip threshold)  
Adjustable Vskip range.  
0 V (no skip)  
between %I  
,
V
,
V
,
and  
R
skip  
is  
CSSKIP  
Skip/latch  
skip  
summarized in Table 4.  
Figure 39. NCP1219 VSkip/latch Pin Operating  
Regions  
Table 4. %ICSskip and Skip Threshold Relationship with Rskip  
%ICS  
V
V
skip  
R
skip  
Comment  
skip  
Skip/latch  
0%  
12%  
25%  
37%  
43%  
43 %  
0 V  
0 V  
0 W  
11.8 kW  
52.3 kW  
Open  
Never skips  
0.36 V  
0.75 V  
1.10 V  
2.00 V  
3.00 V  
0.36 V  
0.75 V  
1.10 V  
1.30 V  
1.30 V  
Default Skip Threshold  
No further increase in Skip threshold  
No further increase in Skip threshold  
External NonLatched Shutdown  
Figure 40 summarizes the operating regions of the FB  
pin. An external nonlatched shutdown can be easily  
implemented by simply pulling FB below the skip level.  
This is an inherent feature of the standby skip operation,  
allowing additional flexibility in the SMPS design.  
Skip/latch  
HV  
FB  
VCC  
DRV  
CS  
OFF  
GND  
NCP1219  
opto  
coupler  
V
FB  
Fault operation when staying  
in this region longer than 118 ms  
3 V  
Figure 41. Example Circuit for NonLatched  
Shutdown  
PWM operation  
Overload Protection  
Figure 42 details the timer based fault detection circuitry.  
When an overload (or short circuit) event occurs, the output  
voltage collapses and the optocoupler does not conduct  
V
skip  
0 V  
No DRV pulses  
current. This opens the FB pin and V is internally pulled  
FB  
higher than 3.0 V. Since V /3 is greater than 1 V, the  
FB  
Figure 40. NCP1219 Operation Threshold  
Figure 41 shows an example implementation of a  
nonlatched shutdown circuit using a bipolar transistor to  
pull the FB pin low.  
controller activates an error flag and starts a timer, t  
OVLD  
(118 ms typical). If the output recovers during this time, the  
timer is reset and the device continues to operate normally.  
http://onsemi.com  
18  
 
NCP1219  
However, if the fault lasts for more than 118 ms, then the  
The NCP1219 also has an internal temperature shutdown  
circuit. If the junction temperature of the controller reaches  
155°C (typical), the driver turns off and the controller  
enters double hiccup mode.  
driver turns off and the device enters the V double hiccup  
CC  
mode described earlier.  
4.8 V  
Latched and AutoRetry Options  
The NCP1219A offers a latched fault circuitry. An  
overload fault condition detected by the controller results  
in a latchoff shutdown, requiring the controller to be reset  
V
FB  
FB  
by cycling V (removing the ac line input). NCP1219B  
CC  
V
FB  
3
provides an autoretry circuit. All fault conditions except  
the external latch fault result in the controller entering  
double hiccup mode, attempting to restart the controller  
Fault  
+
118 ms  
delay  
disable Drv  
V
SS  
Softstart  
1 V max  
every other V cycle, as mentioned earlier.  
CC  
Figure 42. Block Diagram of TimerBased Fault  
Detection  
Table 5. ORDERING INFORMATION  
Device  
Overcurrent  
Frequency  
Package  
Shipping  
NCP1219AD65R2G  
NCP1219BD65R2G  
NCP1219AD100R2G  
NCP1219BD100R2G  
Latch  
65 kHz  
65 kHz  
AutoRecovery  
Latch  
SOIC7 (PbFree)  
2500 / Tape & Reel  
100 kHz  
100 kHz  
AutoRecovery  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
http://onsemi.com  
19  
NCP1219  
PACKAGE DIMENSIONS  
SOIC7  
CASE 751U01  
ISSUE D  
A−  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION A AND B ARE DATUMS AND T  
IS A DATUM SURFACE.  
4. DIMENSION A AND B DO NOT INCLUDE  
MOLD PROTRUSION.  
5. MAXIMUM MOLD PROTRUSION 0.15 (0.006)  
PER SIDE.  
8
5
4
S
M
M
B
B−  
0.25 (0.010)  
1
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN MAX  
G
A
B
C
D
G
H
J
K
M
N
S
4.80  
3.80  
1.35  
0.33  
5.00 0.189 0.197  
4.00 0.150 0.157  
1.75 0.053 0.069  
0.51 0.013 0.020  
0.050 BSC  
0.25 0.004 0.010  
0.25 0.007 0.010  
1.27 0.016 0.050  
C
R X 45  
_
1.27 BSC  
J
0.10  
0.19  
0.40  
0
T−  
SEATING  
PLANE  
K
8
0
8
_
_
_
_
M
H
D 7 PL  
0.25  
5.80  
0.50 0.010 0.020  
6.20 0.228 0.244  
M
S
S
0.25 (0.010)  
T
B
A
The products described herein (NCP1219) may be covered by one or more of the following U.S. patents: 6,271,735, 6,362,067, 6,385,060,  
6,597,221, 6,633,193, 6,587,351, 6,940,320. There may be other patents pending.  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any  
liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental  
damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over  
time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under  
its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body,  
or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death  
may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees,  
subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of  
personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.  
SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 8002829855 Toll Free  
USA/Canada  
Europe, Middle East and Africa Technical Support:  
Phone: 421 33 790 2910  
Japan Customer Focus Center  
Phone: 81357733850  
ON Semiconductor Website: www.onsemi.com  
Order Literature: http://www.onsemi.com/orderlit  
Literature Distribution Center for ON Semiconductor  
P.O. Box 5163, Denver, Colorado 80217 USA  
Phone: 3036752175 or 8003443860 Toll Free USA/Canada  
Fax: 3036752176 or 8003443867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
For additional information, please contact your loca  
Sales Representative  
NCP1219/D  

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