NCP1445 [ONSEMI]

4.0 A 280 kHz/560 kHz Boost Regulators; 4.0 280千赫/ 560 kHz的升压稳压器
NCP1445
型号: NCP1445
厂家: ONSEMI    ONSEMI
描述:

4.0 A 280 kHz/560 kHz Boost Regulators
4.0 280千赫/ 560 kHz的升压稳压器

稳压器
文件: 总20页 (文件大小:166K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
NCP1442, NCP1443,  
NCP1444, NCP1445  
4.0 A 280 kHz/560 kHz  
Boost Regulators  
The NCP1442/3/4/5 products are 280 kHz/560 kHz switching  
regulators with a high efficiency, 4.0 A integrated switch. These parts  
operate over a wide input voltage range, from 2.7 V to 30 V. The  
flexibility of the design allows the chips to operate in most power  
supply configurations, including boost, flyback, forward, inverting,  
and SEPIC. The ICs utilize current mode architecture, which allows  
excellent load and line regulation, as well as a practical means for  
limiting current. Combining high−frequency operation with a highly  
integrated regulator circuit results in an extremely compact power  
supply solution. The circuit design includes provisions for features  
such as frequency synchronization, shutdown, and feedback controls  
for either positive or negative voltage regulation.  
http://onsemi.com  
PowerFLEX]  
7−PIN  
F SUFFIX  
CASE 936J  
1
7
7 LEAD, TO−220  
T SUFFIX  
CASE 821P  
1
Part Number  
NCP1442  
NCP1443  
NCP1444  
NCP1445  
Frequency  
280 kHz  
280 kHz  
560 kHz  
560 kHz  
Feedback Voltage Polarity  
Positive  
7
PIN CONNECTIONS AND  
MARKING DIAGRAMS  
Negative  
Positive  
Negative  
NC  
Features  
NC  
P144xT  
AWLYWW  
P144xF  
AWLYWW  
Pb−Free Packages are Available*  
Integrated Power Switch: 4.0 A Guaranteed  
Wide Input Range: 2.7 V to 30 V  
High Frequency Allows for Small Components  
Minimum External Components  
1
7
PowerFLEX  
7−PIN  
1
7
7 LEAD, TO−220  
Easy External Synchronization  
Built−in Overcurrent Protection  
Frequency Foldback Reduces Component Stress During an  
Overcurrent Condition  
NCP1443/5  
NCP1442/4  
1. V  
Pin 1. V  
C
C
2. TEST  
3. NFB  
4. GND  
2. FB  
3. TEST  
4. GND  
Thermal Shutdown with Hysteresis  
Regulates Either Positive or Negative Output Voltages  
Shut Down Current: 50 mA Maximum  
5. V  
5. V  
SW  
SW  
6. SS  
6. SS  
7. V  
7. V  
CC  
CC  
Applications  
x
A
= Device Number 2, 3, 4, or 5  
= Assembly Location  
Boost Converter  
WL = Wafer Lot  
= Year  
WW = Work Week  
Inverting Converter  
Distributed Power  
Portable Computers  
Battery Powered Systems  
Y
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 18 of this data sheet.  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
Semiconductor Components Industries, LLC, 2004  
1
Publication Order Number:  
October, 2004 − Rev. 7  
NCP1442/D  
NCP1442, NCP1443, NCP1444, NCP1445  
V
SW  
10 mH  
3.3 V  
+
+
+
MBRS320T3  
22 k  
33 mF  
33 mF  
33 mF  
7
5 V  
/1.5 A  
OUT  
V
CC  
1
5
V
C
V
SW  
2
3
NC  
SS  
FB  
4
220 pF  
SS  
+
+
+
6
GND  
0.01 mF  
33 mF  
33 mF  
33 mF  
GND  
7.5 k  
5.1 k  
GND  
Figure 1. Application Diagram − NCP1442/4,  
3.3 V to 5.0 V/1.5 A Boost Converter  
MAXIMUM RATINGS  
Rating  
Value  
Unit  
Thermal Resistance Junction−to−Air, TO220−7 Version In Air (Socketed)  
66.7  
1.45  
°C/W  
Thermal Resistance Junction−to−Air, TO220−7 Version On Cold Plate (25°C)  
Thermal Resistance Junction−to−Air, PowerFLEX on 2.1 sq. in. 1 oz.  
53.8  
0 to +150  
−65 to +150  
230 Peak  
2.0  
°C/W  
°C  
Junction Temperature Range, T  
J
Storage Temperature Range, T  
°C  
STORAGE  
Lead Temperature Soldering: Reflow (Note 1)  
ESD, Human Body Model  
°C  
kV  
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit  
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,  
damage may occur and reliability may be affected.  
1. 60 second maximum above 183°C.  
MAXIMUM RATINGS  
Pin Name  
IC Power Input  
Pin Symbol  
V
V
I
I
SINK  
MAX  
MIN  
SOURCE  
V
CC  
30 V  
30 V  
6.0 V  
10 V  
−0.3 V  
−0.3 V  
−0.3 V  
−0.3 V  
N/A  
200 mA  
1.0 mA  
10 mA  
1.0 mA  
Shutdown/Sync  
SS  
1.0 mA  
10 mA  
1.0 mA  
Loop Compensation  
Voltage Feedback Input  
V
C
FB  
(NCP1442/4 only)  
Negative Feedback Input  
(Transient, 10 ms)  
NFB  
10 V  
−10 V  
1.0 mA  
1.0 mA  
(NCP1443/5 only)  
Test Pin  
Test  
6.0 V  
0.3 V  
40 V  
−0.3 V  
−0.3 V  
−0.3 V  
1.0 mA  
9.0 A  
1.0 mA  
10 mA  
9.0 A  
Ground  
GND  
Switch Input  
V
SW  
10 mA  
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2
 
NCP1442, NCP1443, NCP1444, NCP1445  
ELECTRICAL CHARACTERISTICS (2.7 V < V < 30 V; 0°C < T < 85°C; 0°C < T < 125°C; For all NCP1442/3/4/5 specifications  
CC  
A
J
unless otherwise stated.) (See Note 2)  
Characteristic  
Test Conditions  
Min  
Typ  
Max  
Unit  
Positive and Negative Error Amplifiers  
FB Reference Voltage (NCP1442/4 only)  
NFB Reference Voltage (NCP1443/5 only)  
FB Input Current (NCP1442/4 only)  
NFB Input Current (NCP1443/5 only)  
V
V
tied to FB; measure at FB  
= 1.25 V  
1.246  
−2.60  
−1.0  
1.276  
−2.475  
0.1  
1.300  
−2.40  
1.0  
V
V
C
C
FB = V  
mA  
mA  
%/V  
REF  
NFB = NV  
−16  
−10  
−5.0  
0.03  
REF  
FB Reference Voltage Line Regulation  
(NCP1442/4 only)  
V
C
= FB  
−0.03  
0.01  
NFB Reference Voltage Line Regulation  
(NCP1443/5 only)  
V
C
= 1.25 V  
−0.05  
0.01  
0.05  
%/V  
Positive Error Amp Transconductance  
Negative Error Amp Transconductance  
Positive Error Amp Gain  
I
I
= ± 25 mA  
= ± 5.0 mA  
300  
115  
200  
100  
−90  
200  
1.5  
550  
160  
500  
180  
−50  
460  
1.64  
0.47  
1.05  
800  
225  
mMho  
mMho  
V/V  
V/V  
mA  
VC  
VC  
(Note 3)  
(Note 3)  
Negative Error Amp Gain  
320  
−25  
1500  
1.9  
V
C
V
C
V
C
V
C
V
C
Source Current  
Sink Current  
FB = 1.0 V or NFB = −1.9 V, V = 1.25 V  
C
FB = 1.5 V or NFB = −3.1 V, V = 1.25 V  
mA  
C
High Clamp Voltage  
Low Clamp Voltage  
Threshold  
FB = 1.0 V or NFB = −1.9 V; V sources 25 mA  
V
C
FB = 1.5 V or NFB = −3.1 V, V sinks 25 mA  
0.30  
0.70  
0.70  
1.30  
V
C
Reduce V from 1.5 V until switching stops  
V
C
Oscillator  
Base Operating Frequency  
Reduced Operating Frequency  
Maximum Duty Cycle  
Base Operating Frequency  
Reduced Operating Frequency  
Maximum Duty Cycle  
FB Frequency Shift Threshold  
NFB Frequency Shift Threshold  
Sync/Shutdown  
NCP1442/3, FB = 1.0 V or NFB = −1.9 V  
NCP1442/3, FB = 0 V or NFB = 0 V  
NCP1442/3  
240  
30  
280  
68  
320  
120  
kHz  
kHz  
%
90  
96  
NCP1444/5, FB = 1.0 V or NFB = −1.9 V  
NCP1444/5, FB = 0 V or NFB = 0 V  
NCP1444/5  
480  
60  
560  
120  
92  
640  
160  
kHz  
kHz  
%
82  
Frequency drops to reduced operating frequency  
Frequency drops to reduced operating frequency  
0.36  
−0.80  
0.40  
−0.68  
0.44  
−0.50  
V
V
Sync Range  
NCP1442/3  
500  
1000  
2.5  
kHz  
kHz  
V
Sync Range  
NCP1444/5  
Sync Pulse Transition Threshold  
SS Bias Current  
Rise time = 20 ns  
SS = 0 V  
−10  
−1.0  
0.2  
mA  
mA  
SS = 3.0 V  
4.0  
Shutdown Threshold  
Shutdown Delay  
0.50  
0.85  
1.20  
V
2.7 V V 12 V  
12  
12  
100  
40  
500  
400  
ms  
ms  
CC  
12 V < V 30 V  
CC  
2. For the FR4 suffix parts, production testing is performed at 25°C and 85°C; limits at 0°C are guaranteed by design.  
3. Guaranteed by design, not 100% tested in production.  
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3
 
NCP1442, NCP1443, NCP1444, NCP1445  
ELECTRICAL CHARACTERISTICS (continued) (2.7 V < V < 30 V; 0°C < T < 85°C; 0°C < T < 125°C; For all  
CC  
A
J
NCP1442/3/4/5 specifications unless otherwise stated.) (See Note 2)  
Characteristic  
Power Switch  
Test Conditions  
Min  
Typ  
Max  
Unit  
Switch Saturation Voltage  
I
I
I
= 4.0 A  
0.6  
0.14  
0.9  
1.0  
0.5  
0.4  
V
V
V
SWITCH  
SWITCH  
SWITCH  
= 10 mA, 2.7 V < V < 12 V  
= 10 mA, 12 V < V < 30 V  
CC  
CC  
Switch Current Limit  
Minimum Pulse Width  
50% duty cycle (Note 4)  
80% duty cycle (Note 4)  
5.0  
4.0  
6.0  
8.0  
A
A
FB = 0 V or NFB = 0 V, I  
= 4.0 A (Note 4)  
200  
250  
300  
ns  
SW  
Switch Transconductance, DI / DIV  
2.7 V V 12 V, 10 mA I  
4.0 A  
4.0 A  
SW  
8.0  
10  
30  
50  
mA/A  
CC  
SW  
CC  
SW  
12 V < V 30 V, 10 mA I  
CC  
Switch Leakage  
General  
V
SW  
= 40 V, V = 0V  
2.0  
20  
mA  
CC  
Operating Current  
Shutdown Mode Current  
I
= 0  
15  
27  
mA  
SW  
V
V
< 0.8 V, SS = 0 V, 2.7 V V 12 V  
< 0.8 V, SS = 0 V, 12 V V 30 V  
16  
25  
60  
60  
mA  
C
C
CC  
CC  
Minimum Operation Input Voltage  
Thermal Shutdown  
V
switching, maximum I  
10 mA  
SW =  
150  
2.2  
180  
25  
2.6  
210  
V
SW  
(Note 4)  
(Note 4)  
°C  
°C  
Thermal Hysteresis  
4. Guaranteed by design, not 100% tested in production.  
PACKAGE PIN DESCRIPTION  
Package Pin Number  
Pin Symbol  
Function  
1
V
C
Loop compensation pin. The V pin is the output of the error amplifier and is used for loop  
compensation, current limit and soft start. Loop compensation can be implemented by a sim-  
ple RC network as shown in the application diagram on page 2.  
C
2 (NCP1442/4 only)  
FB  
Positive regulator feedback pin. This pin senses a positive output voltage and is referenced to  
1.276 V. When the voltage at this pin falls below 0.4 V, chip switching frequency reduces to  
20% of the nominal frequency.  
2 (NCP1443/5 only)  
3 (NCP1442/4 only)  
Test  
NFB  
GND  
These pins are connected to internal test logic and should either be left floating or tied to  
ground. Connection to a voltage between 2.0 V and 6.0 V shuts down the internal oscillator  
and leaves the power switch running.  
3 (NCP1443/5 only)  
Negative feedback pin. This pin senses a negative output voltage and is referenced to −2.475  
V. When the voltage at this pin goes above −0.65 V, chip switching frequency reduces to 20%  
of the nominal frequency.  
4
5
6
Ground pin. This pin provides a ground for the controller circuitry and the internal power  
switch. This pin is internally connected to the metal pad of the package to provide an addition-  
al ground connection as well as an effective means of dissipating heat.  
V
SW  
High current switch pin. This pin connects internally to the collector of the power switch. The  
open voltage across the power switch can be as high as 40 V. To minimize radiation, use a  
trace as short as practical.  
SS  
Synchronization and shutdown pin. This pin may be used to synchronize the part to nearly  
twice the base frequency. A TTL low will shut the part down and put it into low current mode.  
If synchronization is not used, this pin should be either tied high or left floating for normal  
operation.  
7
V
CC  
Input power supply pin. This pin supplies power to the part and should have a bypass capaci-  
tor connected to GND.  
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NCP1442, NCP1443, NCP1444, NCP1445  
V
CC  
Thermal  
Shutdown  
Shutdown  
2.0 V  
Regulator  
V
SW  
PWM  
Latch  
R
Oscillator  
S
Delay  
Timer  
Switch  
Q
Driver  
Sync  
SS  
Frequency  
Shift 5:1  
×5  
200 k  
2.0 V  
Slope  
Compensation  
Negative  
Error Amp  
15 mW  
250 k  
NFB  
+
GND  
Ramp  
Summer  
NCP1443/5  
only  
PWM  
Comparator  
−0.65 V Detector  
0.4 V Detector  
+
FB  
+
NCP1442/4  
only  
Positive  
Error Amp  
1.276 V  
V
C
Figure 2. Block Diagram  
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5
NCP1442, NCP1443, NCP1444, NCP1445  
20  
12  
V
V
= 30 V  
= 12 V  
CC  
10  
8
V
= 30 V  
CC  
CC  
15  
10  
V
= 12 V  
CC  
V
CC  
= 2.7 V  
6
V
CC  
= 2.7 V  
4
5
0
2
0
DI  
SW  
= 2.99 A  
0
20  
40  
60  
80  
0
20  
40  
60  
80  
T , AMBIENT TEMPERATURE (°C)  
A
T , AMBIENT TEMPERATURE (°C)  
A
Figure 3. Supply Current versus Temperature  
Figure 4. DICC / DISW versus Temperature  
800  
700  
600  
500  
400  
300  
200  
300  
295  
290  
285  
280  
275  
270  
265  
T = 25°C  
A
T = 85°C  
A
V
= 2.7 V  
3.5  
CC  
260  
100  
0
255  
250  
0
10  
20  
30  
40  
50  
60  
70  
80  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
4.0  
I , SWITCH CURRENT (A)  
SW  
T , AMBIENT TEMPERATURE (°C)  
A
Figure 5. Switch Saturation Voltage versus  
Switch Current  
Figure 6. Switching Frequency versus  
Temperature (NCP1442/3 Only)  
600  
595  
590  
585  
580  
575  
570  
125  
100  
75  
T = 25°C  
A
T = 85°C  
A
50  
565  
25  
0
560  
555  
V
CC  
= 12 V  
550  
0.45  
0
10  
20  
30  
40  
50  
60  
70  
80  
0.38 0.39  
0.40  
0.41  
0.42  
0.43  
0.44  
T , AMBIENT TEMPERATURE (°C)  
A
V
FB  
, POSITIVE FEEDBACK VOLTAGE (V)  
Figure 7. Switching Frequency versus  
Temperature (NCP1444/5 Only)  
Figure 8. Switching Frequency versus Positive  
Feedback Voltage  
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NCP1442, NCP1443, NCP1444, NCP1445  
125  
1.276  
1.275  
V
V
= 30 V  
= 12 V  
CC  
100  
75  
1.274  
1.273  
T = 85°C  
A
CC  
T = 25°C  
A
1.272  
1.271  
V
CC  
= 2.7 V  
50  
1.270  
25  
0
V
CC  
= 12 V  
1.269  
1.268  
−0.665 −0.67 −0.675 −0.68 −0.685 −0.69 −0.695  
0
10  
20  
30  
40  
50  
60  
70  
80  
V
NFB  
, NEGATIVE FEEDBACK VOLTAGE (V)  
T , AMBIENT TEMPERATURE (°C)  
A
Figure 9. Switching Frequency versus  
Negative Feedback Voltage  
Figure 10. Feedback Reference Voltage versus  
Temperature (NCP1442/4 Only)  
0.30  
0.29  
0.28  
0.27  
0.26  
0.25  
0.24  
0.23  
0.22  
−2.46  
−2.47  
−2.48  
V
= 12 V  
CC  
V
CC  
= 2.7 V  
V
= 12 V  
CC  
V
CC  
= 2.7 V  
V
CC  
= 30 V  
−2.49  
−2.50  
V
= 30 V  
CC  
0.21  
0.20  
0
20  
40  
60  
80  
0
20  
40  
60  
80  
T , AMBIENT TEMPERATURE (°C)  
A
T , AMBIENT TEMPERATURE (°C)  
A
Figure 11. Feedback Reference Voltage versus  
Temperature (NCP1443/5 Only)  
Figure 12. Error Amplifier Bias Current versus  
Temperature (NCP1442/3 Only)  
−8  
−9  
97.0  
96.5  
96.0  
95.5  
95.0  
94.5  
94.0  
V
CC  
= 30 V  
12 V  
2.7 V  
−10  
11  
−12  
−13  
V
CC  
= 2.7 V  
V
CC  
= 12 V  
93.5  
93.0  
V
CC  
= 30 V  
60  
−14  
0
20  
40  
60  
80  
80  
0
20  
40  
T , AMBIENT TEMPERATURE (°C)  
A
T , AMBIENT TEMPERATURE (°C)  
A
Figure 13. Error Amplifier Bias Current versus  
Temperature (NCP1443/5 Only)  
Figure 14. Maximum Duty Cycle versus  
Temperature  
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NCP1442, NCP1443, NCP1444, NCP1445  
1.0  
0.9  
0.8  
1.14  
1.12  
1.10  
1.08  
1.06  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
1.04  
1.02  
0.1  
0
1.00  
0
10  
20  
30  
40  
50  
60  
70  
80  
0
10  
20  
30  
40  
50  
60  
70  
80  
T , AMBIENT TEMPERATURE (°C)  
A
T , AMBIENT TEMPERATURE (°C)  
A
Figure 15. VC Threshold Voltage versus  
Temperature  
Figure 16. Shutdown Threshold versus  
Temperature  
180  
250  
200  
150  
100  
160  
140  
120  
100  
80  
V
CC  
= 2.7 V  
V
= 2.7 V  
CC  
V
V
= 12 V  
= 30 V  
V
V
= 12 V  
= 30 V  
CC  
CC  
60  
40  
50  
0
CC  
CC  
20  
0
0
10  
20  
30  
40  
50  
60  
70  
80  
0
10  
20  
30  
40  
50  
60  
70  
80  
T , AMBIENT TEMPERATURE (°C)  
A
T , AMBIENT TEMPERATURE (°C)  
A
Figure 17. Shutdown Delay versus Temperature  
(NCP1442)  
Figure 18. Shutdown Delay versus Temperature  
(NCP1444)  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
45  
40  
35  
30  
25  
20  
15  
T = 85°C  
A
T = 25°C  
A
10  
0.5  
0
5
0
30  
0
5
10  
15  
(V)  
20  
25  
30  
0
5
10  
15  
20  
25  
V
V
CC  
, SUPPLY VOLTAGE (V)  
SS  
Figure 19. ISS versus VSS  
Figure 20. Supply Current versus Supply  
Voltage During Shutdown  
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NCP1442, NCP1443, NCP1444, NCP1445  
570  
560  
550  
540  
530  
520  
510  
500  
490  
−600  
−650  
−700  
−750  
−800  
−850  
−900  
−950  
480  
470  
0
20  
40  
60  
80  
0
20  
40  
60  
80  
T , AMBIENT TEMPERATURE (°C)  
A
T , AMBIENT TEMPERATURE (°C)  
A
Figure 21. Error Amplifier Transconductance  
versus Temperature  
Figure 22. Negative Error Amplifier  
Transconductance versus Temperature  
100  
0
100  
50  
−100  
−200  
−300  
0
−50  
−100  
−400  
−500  
−150  
−200  
−0.25 −0.2 −0.15 −0.1 −0.05  
0
0.05 0.1 0.15 0.2 0.25  
−0.3  
−0.2  
V −V  
ref  
−0.1  
, FEEDBACK VOLTAGE (mV)  
NFB  
0
0.1  
0.2  
V
ref  
−V , FEEDBACK VOLTAGE (mV)  
FB  
Figure 23. Error Amplifier Output Current  
versus Positive Feedback Voltage  
Figure 24. Error Amplifier Output Current versus  
Negative Feedback Voltage  
6.0  
5.5  
5.0  
4.5  
4.0  
3.5  
3.0  
0
20  
40  
60  
80  
T , AMBIENT TEMPERATURE (°C)  
A
Figure 25. Switch Leakage Current versus  
Temperature  
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9
NCP1442, NCP1443, NCP1444, NCP1445  
APPLICATIONS INFORMATION  
THEORY OF OPERATION  
The oscillator is trimmed to guarantee frequency  
accuracy. The output of the oscillator turns on the power  
switch at a frequency of 280 kHz (NCP1442/3) or 560 kHz  
(NCP1444/5), as shown in Figure 26. The power switch is  
turned off by the output of the PWM Comparator.  
Current Mode Control  
V
CC  
Oscillator  
A TTL−compatible sync input at the SS pin is capable of  
syncing up to 1.8 times the base oscillator frequency. As  
shown in Figure 27, in order to sync to a higher frequency,  
a positive transition turns on the power switch before the  
output of the oscillator goes high, thereby resetting the  
oscillator. The sync operation allows multiple power  
supplies to operate at the same frequency.  
S
R
L
Q
+
V
C
Power Switch  
D1  
PWM  
Comparator  
V
SW  
In Out  
Driver  
C
O
R
LOAD  
X5  
SUMMER  
W
15 m  
A sustained logic low at the SS pin will shut down the IC  
and reduce the supply current.  
Slope Compensation  
An additional feature includes frequency shift to 20% of  
the nominal frequency when either the NFB or FB pins  
trigger the threshold. During power up, overload, or short  
circuit conditions, the minimum switch on−time is limited  
by the PWM comparator minimum pulse width. Extra  
switch off−time reduces the minimum duty cycle to protect  
external components and the IC itself.  
Figure 26. Current Mode Control Scheme  
The NCP144X family incorporates a current mode  
control scheme, in which the PWM ramp signal is derived  
from the power switch current. This ramp signal is compared  
to the output of the error amplifier to control the on−time of  
the power switch. The oscillator is used as a fixed−frequency  
clock to ensure a constant operational frequency. The  
resulting control scheme features several advantages over  
conventional voltage mode control. First, derived directly  
from the inductor, the ramp signal responds immediately to  
line voltage changes. This eliminates the delay caused by the  
output filter and error amplifier, which is commonly found  
in voltage mode controllers. The second benefit comes from  
inherent pulse−by−pulse current limiting by merely  
clamping the peak switching current. Finally, since current  
mode commands an output current rather than voltage, the  
filter offers only a single pole to the feedback loop. This  
allows both a simpler compensation and a higher  
gain−bandwidth over a comparable voltage mode circuit.  
Without discrediting its apparent merits, current mode  
control comes with its own peculiar problems, mainly,  
subharmonic oscillation at duty cycles over 50%. The  
NCP144X family solves this problem by adopting a slope  
compensation scheme in which a fixed ramp generated by  
the oscillator is added to the current ramp. A proper slope  
rate is provided to improve circuit stability without  
sacrificing the advantages of current mode control.  
As previously mentioned, this block also produces a ramp  
for the slope compensation to improve regulator stability.  
Error Amplifier  
200 k  
2.0 V  
250 k  
NFB  
+
NCP1443/5  
negative error−amp  
V
C
C1  
120 pF  
1MW  
0.01 mF  
Voltage  
Clamp  
+
1.276 V  
R1  
5 kW  
FB  
NCP1442/4  
positive error−amp  
Figure 28. Error Amplifier Equivalent Circuit  
For NCP1443/5, the NFB pin is internally referenced to  
−2.475 V with approximately a 250 kW input impedance.  
For NCP1442/4, the FB pin is directly connected to the  
inverting input of the positive error amplifier, whose  
non−inverting input is fed by the 1.276 V reference. Both  
amplifiers are transconductance amplifiers with a high  
output impedance of approximately 1.0 MW, as shown in  
Oscillator and Shutdown  
Figure 28. The V pin is connected to the output of the error  
amplifiers and is internally clamped between 0.5 V and  
C
Sync  
Current  
Ramp  
1.7 V. A typical connection at the V pin includes a capacitor  
C
in series with a resistor to ground, forming a pole/zero for  
loop compensation.  
V
SW  
An external shunt can be connected between the V pin  
C
Figure 27. Timing Diagram of Sync and Shutdown  
and ground to reduce its clamp voltage. Consequently, the  
current limit of the internal power transistor current is  
reduced from its nominal value.  
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10  
 
NCP1442, NCP1443, NCP1444, NCP1445  
Switch Driver and Power Switch  
output through the inductor and diode. Once V reaches  
CC  
The switch driver receives a control signal from the logic  
section to drive the output power switch. The switch is  
grounded through emitter resistors (15 mW total) to the  
GND pin. The peak switching current is clamped by an  
internal circuit. The clamp current is guaranteed to be  
greater than 4.0 A and varies with duty cycle due to slope  
compensation. The power switch can withstand a maximum  
approximately 1.5 V, the internal power switch briefly turns  
on. This is a part of the NCP144X’s normal operation. The  
turn−on of the power switch accounts for the initial current  
swing.  
When the V pin voltage rises above the threshold, the  
C
internal power switch starts to switch and a voltage pulse can  
be seen at the V pin. Detecting a low output voltage at the  
SW  
voltage of 40 V on the collector (V pin). The saturation  
voltage of the switch is typically less than 1.0 V to minimize  
power dissipation.  
FB pin, the built−in frequency shift feature reduces the  
switching frequency to a fraction of its nominal value,  
reducing the minimum duty cycle, which is otherwise  
limited by the minimum on−time of the switch. The peak  
current during this phase is clamped by the internal current  
limit.  
When the FB pin voltage rises above 0.4 V, the frequency  
increases to its nominal value, and the peak current begins  
to decrease as the output approaches the regulation voltage.  
The overshoot of the output voltage is prevented by the  
active pull−on, by which the sink current of the error  
amplifier is increased once an overvoltage condition is  
detected. The overvoltage condition is defined as when the  
FB pin voltage is 50 mV greater than the reference voltage.  
SW  
Short Circuit Condition  
When a short circuit condition happens in a boost circuit,  
the inductor current will increase during the whole  
switching cycle, causing excessive current to be drawn from  
the input power supply. Since control ICs don’t have the  
means to limit load current, an external current limit circuit  
(such as a fuse or relay) has to be implemented to protect the  
load, power supply and ICs.  
In other topologies, the frequency shift built into the IC  
prevents damage to the chip and external components. This  
feature reduces the minimum duty cycle and allows the  
transformer secondary to absorb excess energy before the  
switch turns back on.  
COMPONENT SELECTION  
Frequency Compensation  
The goal of frequency compensation is to achieve  
desirable transient response and DC regulation while  
ensuring the stability of the system. A typical compensation  
network, as shown in Figure 30, provides a frequency  
response of two poles and one zero. This frequency response  
is further illustrated in the Bode plot shown in Figure 31.  
I
L
V
OUT  
V
CC  
V
C
V
C
R1  
NCP1442/3/4/5  
C2  
C1  
GND  
Figure 29. Startup Waveforms of Circuit Shown in  
the Application Diagram. Load = 400 mA.  
Figure 30. A Typical Compensation Network  
The NCP144X can be activated by either connecting the  
The high DC gain in Figure 31 is desirable for achieving  
DC accuracy over line and load variations. The DC gain of  
a transconductance error amplifier can be calculated as  
follows:  
V
pin to a voltage source or by enabling the SS pin.  
CC  
Startup waveforms shown in Figure 29 are measured in the  
boost converter demonstrated in the Block Diagram  
(Figure 2). Recorded after the input voltage is turned on, this  
waveform shows the various phases during the power up  
transition.  
Gain  
+ G   R  
M O  
DC  
where:  
= error amplifier transconductance;  
When the V voltage is below the minimum supply  
CC  
G
M
voltage, the V  
pin is in high impedance. Therefore,  
SW  
R = error amplifier output resistance 1.0 MW.  
O
current conducts directly from the input power source to the  
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11  
 
NCP1442, NCP1443, NCP1444, NCP1445  
The low frequency pole, f is determined by the error  
amplifier output resistance and C1 as:  
P1,  
−V  
OUT  
2 V  
R
1
P
f
+
P1  
200 kW  
R1  
2pC1R  
O
R
IN  
NFB  
+
The first zero generated by C1 and R1 is:  
250 kW  
1
f
+
R2  
Z1  
2pC1R1  
The phase lead provided by this zero ensures that the loop  
has at least a 45° phase margin at the crossover frequency.  
Therefore, this zero should be placed close to the pole  
generated in the power stage which can be identified at  
frequency:  
Negative Error−Amp  
Figure 32. Negative Error Amplifier and NFB Pin  
It is shown that if R1 is less than 10 k, the deviation from  
the design target will be less than 0.1 V. If the tolerances of  
the negative voltage reference and NFB pin input current are  
1
f
P
+
2pC R  
O LOAD  
where:  
considered, the possible offset of the output V  
in the range of:  
varies  
OFFSET  
C = equivalent output capacitance of the error amplifier  
O
120pF;  
*0.0.5 (R1 ) R2)  
R
= load resistance.  
LOAD  
ǒ
Ǔ* (15 mA   R1) v V  
OFFSET  
R2  
0.0.5 (R1 ) R2)  
The high frequency pole, f , can be placed at the output  
P2  
filter’s ESR zero or at half the switching frequency. Placing  
the pole at this frequency will cut down on switching noise.  
The frequency of this pole is determined by the value of C2  
and R1:  
v ǒ  
Ǔ* (5 mA   R1)  
R2  
VSW Voltage Limit  
In the boost topology, V pin maximum voltage is set by  
SW  
1
f
+
P2  
the maximum output voltage plus the output diode forward  
voltage. The diode forward voltage is typically 0.5 V for  
Schottky diodes and 0.8 V for ultrafast recovery diodes:  
2pC2R1  
One simple method to ensure adequate phase margin is to  
design the frequency response with a −20 dB per decade  
slope, until unity−gain crossover. The crossover frequency  
V
+ V  
)V  
OUT(MAX)  
SW(MAX)  
F
should be selected at the midpoint between f and f where  
Z1  
P2  
where:  
V = output diode forward voltage.  
the phase margin is maximized.  
F
In the flyback topology, peak V voltage is governed by:  
SW  
V
+ V  
)(V  
CC(MAX)  
)V )   N  
OUT  
SW(MAX)  
F
f
P1  
where:  
N = transformer turns ratio, primary over secondary.  
When the power switch turns off, there exists a voltage  
spike superimposed on top of the steady−state voltage.  
Usually this voltage spike is caused by transformer leakage  
f
Z1  
f
P2  
inductance charging stray capacitance between the V and  
SW  
GND pins. To prevent the voltage at the V  
pin from  
SW  
exceeding the maximum rating, a transient voltage  
suppressor in series with a diode is paralleled with the  
primary windings. Another method of clamping switch  
voltage is to connect a transient voltage suppressor between  
Frequency (LOG)  
Figure 31. Bode Plot of the Compensation Network  
Shown in Figure 30  
the V pin and ground.  
SW  
Negative Voltage Feedback  
Since the negative error amplifier has finite input  
impedance as shown in Figure 32, its induced error has to be  
considered. If a voltage divider is used to scale down the  
negative output voltage for the NFB pin, the equation for  
calculating output voltage is:  
*2.475 (R1 ) R2)  
+ ǒ  
Ǔ*10 mA   R1  
*V  
OUT  
R2  
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12  
 
NCP1442, NCP1443, NCP1444, NCP1445  
I
L
Magnetic Component Selection  
I
IN  
When choosing a magnetic component, one must consider  
factors such as peak current, core and ferrite material, output  
voltage ripple, EMI, temperature range, physical size and  
cost. In boost circuits, the average inductor current is the  
+
V
CC  
C
IN  
product of output current and voltage gain (V  
/V ),  
OUT CC  
assuming 100% energy transfer efficiency. In continuous  
conduction mode, inductor ripple current is:  
R
ESR  
V
(V  
CC OUT  
* V  
)
CC  
I
+
RIPPLE  
(f)(L)(V  
OUT)  
where:  
f = 280 kHz for NCP1442/3 and 560 kHz for NCP1444/5.  
The peak inductor current is equal to average current plus  
half of the ripple current, which should not cause inductor  
saturation. The above equation can also be referenced when  
selecting the value of the inductor based on the tolerance of  
the ripple current in the circuits. Small ripple current  
provides the benefits of small input capacitors and greater  
output current capability. A core geometry like a rod or  
barrel is prone to generating high magnetic field radiation,  
but is relatively cheap and small. Other core geometries,  
such as toroids, provide a closed magnetic loop to prevent  
EMI.  
Figure 34. Boost Circuit Effective Input Filter  
The situation is different in a flyback circuit. The input  
current is discontinuous and a significant pulsed current is  
seen by the input capacitors. Therefore, there are two  
requirements for capacitors in a flyback regulator: energy  
storage and filtering. To maintain a stable voltage supply to  
the chip, a storage capacitor larger than 20 mF with low ESR  
is required. To reduce the noise generated by the inductor,  
insert a 1.0 mF ceramic capacitor between V and ground  
CC  
as close as possible to the chip.  
Input Capacitor Selection  
Output Capacitor Selection  
In boost circuits, the inductor becomes part of the input  
filter, as shown in Figure 34. In continuous mode, the input  
current waveform is triangular and does not contain a large  
pulsed current, as shown in Figure 33. This reduces the  
requirements imposed on the input capacitor selection.  
During continuous conduction mode, the peak to peak  
inductor ripple current is given in the previous section. As  
we can see from Figure 33, the product of the inductor  
current ripple and the input capacitor’s effective series  
V
OUT  
ripple  
resistance (ESR) determine the V  
ripple. In most  
CC  
applications, input capacitors in the range of 10 mF to  
100 mF with an ESR less than 0.3 W work well up to a full  
4.0 A switch current.  
I
L
Figure 35. Typical Output Voltage Ripple  
V
CC  
ripple  
By examining the waveforms shown in Figure 35, we can  
see that the output voltage ripple comes from two major  
sources,  
charging/discharging of the output capacitor. In boost  
circuits, when the power switch turns off, I flows into the  
namely  
capacitor  
ESR  
and  
the  
I
IN  
L
output capacitor causing an instant DV = I × ESR. At the  
IN  
I
L
same time, current I − I  
charges the capacitor and  
L
OUT  
increases the output voltage gradually. When the power  
switch is turned on, I is shunted to ground and I  
L
OUT  
discharges the output capacitor. When the I ripple is small  
L
enough, I can be treated as a constant and is equal to input  
L
Figure 33. Boost Input Voltage and Current  
Ripple Waveforms  
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13  
 
NCP1442, NCP1443, NCP1444, NCP1445  
V
IN  
current I . Summing up, the output voltage peak−peak  
IN  
ripple can be calculated by:  
V
CC  
(I * I  
(1 * D)  
(f)  
IN  
OUT)  
OUT)  
V
+
OUT(RIPPLE)  
(C  
R2  
R3  
I
D
OUT  
(C  
)
) I   ESR  
IN  
V
C
)(f)  
OUT  
D1  
The equation can be expressed more conveniently in  
terms of V , V  
and I  
for design purposes as  
CC  
OUT  
OUT  
follows:  
I
(V  
(C  
* V  
)(f)  
)
CC  
OUT OUT  
1
OUT  
V
+
 
OUT(RIPPLE)  
(C  
)(f)  
R1  
OUT  
C1  
(I )(ESR)  
)(V  
OUT OUT  
)
V
CC  
C2  
The capacitor RMS ripple current is:  
Ǹ
2
2
) (D)  
OUT  
I
+
(I * I  
) (1 * D))(I  
RIPPLE  
IN  
OUT  
Figure 36. Current Limiting using a Diode Clamp  
V
* V  
OUT  
V
CC  
OUT Ǹ  
+ I  
CC  
Another solution to the current limiting problem is to  
externally measure the current through the switch using a  
sense resistor. Such a circuit is illustrated in Figure 37.  
Although the above equations apply only for boost  
circuits, similar equations can be derived for flyback  
circuits.  
V
CC  
Reducing the Current Limit  
In some applications, the designer may prefer a lower  
limit on the switch current than 4.0 A. An external shunt can  
V
C
PGND  
AGND  
be connected between the V pin and ground to reduce its  
C
+
V
IN  
clamp voltage. Consequently, the current limit of the  
internal power transistor current is reduced from its nominal  
value.  
R1  
C2  
The voltage on the V pin can be evaluated with the  
equation:  
C
C1  
R2  
C3  
Q1  
V
+ I R A  
SW E V  
C
Output  
Ground  
where:  
R = .015 W, the value of the internal emitter resistor;  
R
SENSE  
E
Figure 37. Current Limiting using a Current Sense  
Resistor  
A = 5.0 V/V, the gain of the current sense amplifier.  
V
Since R and A cannot be changed by the end user, the  
E
V
only available method for limiting switch current below  
The switch current is limited to:  
4.0 A is to clamp the V pin at a lower voltage. If the  
C
V
R
BE(Q1)  
SENSE  
maximum switch or inductor current is substituted into the  
equation above, the desired clamp voltage will result.  
A simple diode clamp, as shown in Figure 36, clamps the  
I
+
SWITCH(PEAK)  
where:  
V voltage to a diode drop above the voltage on resistor R3.  
C
V
BE(Q1)  
= the base−emitter voltage drop of Q1, typically  
Unfortunately, such a simple circuit is not generally  
0.65 V.  
acceptable if V is loosely regulated.  
IN  
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14  
 
NCP1442, NCP1443, NCP1444, NCP1445  
The improved circuit does not require a regulated voltage  
The dashed box contains the normal compensation  
circuitry to limit the bandwidth of the error amplifier.  
to operate properly. Unfortunately, a price must be paid for  
this convenience in the overall efficiency of the circuit. The  
designer should note that the input and output grounds are  
no longer common. Also, the addition of the current sense  
Resistors R2 and R3 form a voltage divider off of the V  
SW  
pin. In normal operation, V  
looks similar to a square  
SW  
wave, and is dependent on the converter topology. Formulas  
for calculating V in the boost and flyback topologies are  
resistor, R , results in a considerable power loss which  
SENSE  
SW  
increases with the duty cycle. Resistor R2 and capacitor C3  
form a low−pass filter to remove noise.  
given in the section “V Voltage Limit.” The voltage on  
SW  
V
SW  
charges capacitor C3 when the switch is off, causing  
the voltage at the V pin to shift upwards. When the switch  
turns on, C3 discharges through R3, producing a negative  
C
Subharmonic Oscillation  
Subharmonic oscillation (SHM) is a problem found in  
current−mode control systems, where instability results  
when duty cycle exceeds 50%. SHM only occurs in  
switching regulators with a continuous inductor current.  
This instability is not harmful to the converter and usually  
does not affect the output voltage regulation. SHM will  
increase the radiated EM noise from the converter and can  
cause, under certain circumstances, the inductor to emit  
high−frequency audible noise.  
SHM is an easily remedied problem. The rising slope of  
the inductor current is supplemented with internal “slope  
compensation” to prevent any duty cycle instability from  
carrying through to the next switching cycle. In the  
NCP144X family, slope compensation is added during the  
entire switch on−time, typically in the amount of  
180 mA/ms.  
slope at the V pin. This negative slope provides the slope  
compensation.  
The amount of slope compensation added by this circuit  
C
is  
*(1*D)  
R
f
3
SW  
(1 * D)R A  
E V  
DI  
DT  
R C f  
3 SW  
3
SW ǒ  
Ǔ
ǒ1 * e Ǔǒ  
Ǔ
+ V  
R )R  
2 3  
where:  
DI/DT = the amount of slope compensation added (A/s);  
= the voltage at the switch node when the transistor  
V
SW  
is turned off (V);  
= the switching frequency, typically 280 kHz  
f
SW  
(NCP1442/3) or 560 kHz (NCP1444/5) (Hz);  
D = the duty cycle;  
R = 0.015 W, the value of the internal emitter resistor;  
E
A = 5.0 V/V, the gain of the current sense amplifier.  
V
In some cases, SHM can rear its ugly head despite the  
presence of the onboard slope compensation. The simple  
cure to this problem is more slope compensation to avoid the  
unwanted oscillation. In that case, an external circuit, shown  
in Figure 38, can be added to increase the amount of slope  
compensation used. This circuit requires only a few  
components and is “tacked on” to the compensation  
network.  
In selecting appropriate values for the slope compensation  
network, the designer is advised to choose a convenient  
capacitor, then select values for R2 and R3 such that the  
amount of slope compensation added is 100 mA/ms. Then  
R2 may be increased or decreased as necessary. Of course,  
the series combination of R2 and R3 should be large enough  
to avoid drawing excessive current from V . Additionally,  
SW  
to ensure that the control loop stability is improved, the time  
constant formed by the additional components should be  
chosen such that:  
V
SW  
V
SW  
1 * D  
R C  
3 3  
t
f
SW  
V
C
Finally, it is worth mentioning that the added slope  
compensation is a trade−off between duty cycle stability and  
transient response. The more slope compensation a designer  
adds, the slower the transient response will be, due to the  
external circuitry interfering with the proper operation of the  
error amplifier.  
R1  
R2  
C1  
C2  
Soft−Start  
Through the addition of an external circuit, a soft−start  
function can be added to the NCP1442/3/4/5 family of  
components. Soft−start circuitry prevents the V pin from  
C
slamming high during startup, thereby inhibiting the  
inductor current from rising at a high slope.  
C3  
R3  
This circuit, shown in Figure 39, requires a minimum  
number of components and allows the soft−start circuitry to  
activate any time the SS pin is used to restart the converter.  
Figure 38. Technique for Increasing Slope  
Compensation  
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15  
 
NCP1442, NCP1443, NCP1444, NCP1445  
The internal control circuitry, including the oscillator and  
V
IN  
linear regulator, requires a small amount of power even  
when the switch is turned off. The specifications section of  
V
V
CC  
this datasheet reveals that the typical operating current, I ,  
Q
SS  
SS  
due to this circuitry is 5.5 mA. Additional guidance can be  
found in the graph of operating current vs. temperature. This  
graph shows that IQ is strongly dependent on input voltage,  
C
V , and the ambient temperature, T . Then:  
IN  
A
P
+ V  
I
IN Q  
BIAS  
D2  
D1  
Since the onboard switch is an NPN transistor, the base  
drive current must be factored in as well. This current is  
R1  
C1  
drawn from the V pin, in addition to the control circuitry  
IN  
current. The base drive current is listed in the specifications  
C2  
C3  
as DI /DI , or switch transconductance. As before, the  
CC  
SW  
designer will find additional guidance in the graphs. With  
that information, the designer can calculate:  
I
CC  
P
+ V  
I   
IN SW  
  D  
DRIVER  
DI  
SW  
Figure 39. Soft−Start  
where:  
= the current through the switch;  
D = the duty cycle or percentage of switch on−time.  
I
SW  
Resistor R1 and capacitors C1 and C2 form the  
compensation network. At turn on, the voltage at the V pin  
C
starts to come up, charging capacitor C3 through Schottky  
I
and D are dependent on the type of converter. In a  
SW  
diode D2, clamping the voltage at the V pin such that  
boost converter,  
C
switching begins when V reaches the V threshold,  
typically 1.05 V (refer to graphs for detail over  
temperature).  
C
C
I
I
^ I   D   
LOAD  
SW(AVG)  
efficiency  
V
* V  
IN  
OUT  
D ^  
V
+ V  
)V  
F(D2) C3  
C
V
OUT  
Therefore, C3 slows the startup of the circuit by limiting  
In a flyback converter,  
the voltage on the V pin. The soft−start time increases with  
C
V
I
OUT LOAD  
I
I
^
 
the size of C3.  
SW(AVG)  
V
efficiency  
IN  
Diode D1 discharges C3 when SS is low. If the shutdown  
function is not used with this part, the cathode of D1 should  
V
OUT  
)
D ^  
n
n
V
s V  
IN  
p
be connected to V .  
OUT  
IN  
where:  
n = number of turns in the transformer secondary winding.  
Calculating Junction Temperature  
To ensure safe operation of the NCP1442/3/4/5, the  
designer must calculate the on−chip power dissipation and  
determine its expected junction temperature. Internal  
thermal protection circuitry will turn the part off once the  
junction temperature exceeds 180°C ± 30°. However,  
repeated operation at such high temperatures will ensure a  
reduced operating life.  
Calculation of the junction temperature is an imprecise  
but simple task. First, the power losses must be quantified.  
There are three major sources of power loss on the  
NCP144X:  
s
n = number of turns in the transformer primary winding.  
p
The switch saturation voltage, V  
, is the last major  
(CE)SAT  
source of on−chip power loss.  
V
is the  
(CE)SAT  
collector−emitter voltage of the internal NPN transistor  
when it is driven into saturation by its base drive current. The  
value for V  
can be obtained from the specifications  
(CE)SAT  
or from the graphs, as “Switch Saturation Voltage.” Thus,  
P
^ V  
I
  D  
SAT  
(CE)SAT SW  
Finally, the total on−chip power losses are:  
biasing of internal control circuitry, P  
BIAS  
P
+ P  
)P  
BIAS  
)P  
DRIVER SAT  
D
switch driver, P  
DRIVER  
switch saturation, P  
SAT  
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16  
NCP1442, NCP1443, NCP1444, NCP1445  
Power dissipation in a semiconductor device results in the  
generation of heat in the junctions at the surface of the chip.  
This heat is transferred to the surface of the IC package, but  
a thermal gradient exists due to the resistive properties of the  
package molding compound. The magnitude of the thermal  
surface of the chip might be considered to reduce T . A  
copper “landing pad” can be connected to ground −  
designers are referred to ON Semiconductor applications  
note SR006 for more information on properly sizing a  
copper area.  
A
gradient is expressed in manufacturers’ data sheets as q  
or junction−to−ambient thermal resistance. The on−chip  
,
JA  
Circuit Layout Guidelines  
In any switching power supply, circuit layout is very  
important for proper operation. Rapidly switching currents  
combined with trace inductance generates voltage  
transitions that can cause problems. Therefore the following  
guidelines should be followed in the layout.  
junction temperature can be calculated if q , the air  
temperature near the surface of the IC, and the on−chip  
power dissipation are known.  
JA  
T + T )(P q  
D JA  
)
J
A
where:  
T = IC or FET junction temperature (°C);  
1. In boost circuits, high AC current circulates within the  
loop composed of the diode, output capacitor, and  
on−chip power transistor. The length of associated  
traces and leads should be kept as short as possible. In  
the flyback circuit, high AC current loops exist on both  
sides of the transformer. On the primary side, the loop  
consists of the input capacitor, transformer, and  
on−chip power transistor, while the transformer,  
rectifier diodes, and output capacitors form another  
loop on the secondary side. Just as in the boost circuit,  
all traces and leads containing large AC currents  
should be kept short.  
J
T = ambient temperature (°C);  
A
P = power dissipated by part in question (W);  
D
q
= junction−to−ambient thermal resistance (°C/W).  
JA  
For ON Semiconductor components, the value for q can  
JA  
be found on page 19 of the datasheet, under “Package  
Thermal Data.” Note that this value is different for every  
package style and every manufacturer. For the NCP144X,  
q
varies between 10−50°C/W, depending upon the size of  
JA  
the copper pad to which the IC is mounted.  
Once the designer has calculated T , the question of  
J
2. Separate the low current signal grounds from the  
power grounds. Use single point grounding or ground  
plane construction for the best results.  
3. Locate the voltage feedback resistors as near the IC as  
possible to keep the sensitive feedback wiring short.  
Connect feedback resistors to the low current analog  
ground.  
whether the NCP144X can be used in an application is  
settled. If T exceeds 150°C, the absolute maximum  
J
allowable junction temperature, the NCP144X is not  
suitable for that application.  
If T approaches 150°C, the designer should consider  
J
possible means of reducing the junction temperature.  
Perhaps another converter topology could be selected to  
reduce the switch current. Increasing the airflow across the  
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17  
NCP1442, NCP1443, NCP1444, NCP1445  
ORDERING INFORMATION  
Operating  
Temperature Range  
Device  
Package  
Shipping  
NCP1442FR4  
7 Lead PowerFLEX Short−Leaded  
2000 Tape & Reel  
2000 Tape & Reel  
NCP1442FR4G  
7 Lead PowerFLEX Short−Leaded  
(Pb−Free)  
NCP1442T  
7 Lead TO−220 (Straight Lead)  
50 Units/Rail  
NCP1443FR4  
NCP1443FR4G  
7 Lead PowerFLEX Short−Leaded  
2000 Tape & Reel  
2000 Tape & Reel  
7 Lead PowerFLEX Short−Leaded  
(Pb−Free)  
0°C < T < 85°C  
A
NCP1443T  
7 Lead TO−220 (Straight Lead)  
7 Lead PowerFLEX Short−Leaded  
7 Lead TO−220 (Straight Lead)  
7 Lead PowerFLEX Short−Leaded  
7 Lead TO−220 (Straight Lead)  
50 Units/Rail  
2000 Tape & Reel  
50 Units/Rail  
NCP1444FR4  
NCP1444T  
NCP1445FR4  
NCP1445T  
2000 Tape & Reel  
50 Units/Rail  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
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18  
NCP1442, NCP1443, NCP1444, NCP1445  
PACKAGE DIMENSIONS  
PowerFLEX  
7−PIN  
F SUFFIX  
CASE 936J−01  
ISSUE O  
NOTES:  
1. DIMENSIONS AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD  
FLASH OR GATE PROTRUSIONS. MOLD FLASH  
AND GATE PROTRUSIONS NOT TO EXCEED  
0.025 (0.635) MAX.  
C
A
L
AE  
B
M
P N  
J
INCHES  
DIM MIN MAX  
MILLIMETERS  
MIN  
8.89  
8.89  
1.78  
0.66  
0.13  
0.79  
MAX  
9.14  
9.14  
2.03  
0.76  
0.38  
1.04  
A
B
0.350  
0.350  
0.070  
0.026  
0.005  
0.031  
0.360  
0.360  
0.080  
0.030  
0.015  
0.041  
C
D 7 PL  
D
DETAIL AG  
G 7 PL  
E
F
G
0.050 BSC  
1.270 BSC  
H
0.008  
0.410  
0.012  
0.420  
0.199  
10.41  
9.27  
0.301  
10.67  
9.53  
J
0.076 (0.003)  
R
K
0.365 00.375  
0.040 REF  
(TOP OFFSET)  
S
L
1.02 REF  
M
N
0.361  
0.310  
0.394  
0.002  
0.070  
0.001  
0.367  
0.320  
0.400  
−−−  
9.16  
7.87  
10.00  
0.05  
1.78  
0.03  
9.31  
8.13  
10.16  
−−−  
−T−  
V
K
SEATING  
R 0.25 (0.010)  
P
PLANE  
R
S
0.080  
0.005  
2.03  
0.13  
U
E
H
12 °  
12 °  
V
U
W
Y
0.296 REF  
0.075 REF  
0.071 REF  
0.140 REF  
0.220 REF  
0.281 REF  
12 °  
7.52 REF  
1.91 REF  
1.81 REF  
3.56 REF  
5.58 REF  
7.14 REF  
12 °  
THERMAL  
DIE PAD  
AA  
AB  
AC  
AD  
AE  
AF  
AF  
F
R 0.20 (0.008)  
W
3 °  
6 °  
3°  
6°  
AA  
Y
DETAIL AG  
AB  
AC  
AD  
PACKAGE THERMAL DATA  
Parameter  
PowerFLEX 7−PIN  
1.0−4.0  
Unit  
R
R
Typical  
Typical  
°C/W  
°C/W  
q
q
JC  
JA  
10−50*  
*Depending on thermal properties of substrate. R  
R
+ R  
q
JC CA.  
q
q
JA =  
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19  
NCP1442, NCP1443, NCP1444, NCP1445  
PACKAGE DIMENSIONS  
7 LEAD TO−220  
T SUFFIX  
CASE 821P−03  
ISSUE B  
NOTES:  
ꢀꢁ1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
ꢀꢁ2. CONTROLLING DIMENSION: MILLIMETER.  
ꢀꢁ3. 821P−01 AND −02 OBSOLETE. NEW  
STANDARD IS 821P−03.  
C
A
E
M
N
Q
U
MILLIMETERS  
INCHES  
MIN  
B
DIM MIN  
MAX  
10.54  
9.40  
4.83  
0.81  
1.40  
MAX  
0.415  
0.370  
0.190  
0.032  
0.055  
L
A
B
C
D
E
F
9.91  
8.23  
4.19  
0.66  
0.89  
0.390  
0.324  
0.165  
0.026  
0.035  
K
7.62 TYP  
0.3 TYP  
G
H
J
1.22  
2.16  
0.30  
24.00  
26.67  
6.10  
7 °  
1.32  
2.92  
0.64  
26.54  
29.03  
6.48  
−−−  
0.048  
0.085  
0.012  
0.945  
1.050  
0.240  
7 °  
0.052  
0.115  
0.025  
1.045  
1.143  
0.255  
−−−  
J
D 7 PL  
G 6 PL  
H
K
L
F
M
N
Q
U
3.53  
4 °  
3.96  
6 °  
0.139  
4 °  
0.156  
6 °  
PowerFLEX is a trademark of Texas Instruments Incorporated.  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 800−282−9855 Toll Free  
USA/Canada  
ON Semiconductor Website: http://onsemi.com  
Order Literature: http://www.onsemi.com/litorder  
Literature Distribution Center for ON Semiconductor  
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA  
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada  
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
Japan: ON Semiconductor, Japan Customer Focus Center  
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051  
Phone: 81−3−5773−3850  
For additional information, please contact your  
local Sales Representative.  
NCP1442/D  

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