NCP151AAMX180070TCG [ONSEMI]
LDO Regulator - Dual, High PSRR 300mA;
| 型号： | NCP151AAMX180070TCG |
| 厂家： | 
ONSEMI |
| 描述： | LDO Regulator - Dual, High PSRR 300mA 光电二极管 输出元件 调节器 |
| 文件： | 总10页 (文件大小：643K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NCP151
LDO Regulator - Dual,
High PSRR
300ꢀmA
The NCP151 is a dual linear regulator capable of supplying 300 mA
output current from 1.7 V input voltage. The device provides wide
output voltage range from 0.8 V up to 3.6 V. In order to optimize
performance for battery operated portable applications, the NCP151
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employs the dynamic quiescent current adjustment for very low I
Q
consumption at no−load.
1
Features
XDFN4
• Operating Input Voltage Range 1.7 V to 5.5 V
• Available in Fixed Voltage Option: 0.8 V to 3.6 V
CASE 711AJ
•
2% Accuracy Over Load/Temperature
MARKING DIAGRAM
• Low Quiescent Current Typ. 100 mA
• Low Dropout: 210 mV for 300 mA @ 2.8 V
• Low Dropout: 370 mV for 300 mA @ 1.8 V
• High PSRR: Typ. 70 dB at 1 kHz @ OUT1, OUT2
• Stable with a 1 mF Small Case Size Ceramic Capacitors
• Available in XDFN4, 1 mm × 1 mm × 0.4 mm
XX M
1
XX
M
= Specific Device Code
= Date Code
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
PIN CONNECTIONS
Compliant
IN
4
OUT2
3
Typical Applications
• PDAs, Mobile Phones, GPS, Smartphones
®
®
EPAD
• Wireless Handsets, Wireless LAN Devices, Bluetooth , Zigbee
• Bitcoin Miners
• Portable Medical Equipment
• Other Battery Powered Equipment
1
2
OUT1
GND
(Top View)
NCP151
V
IN1
ORDERING INFORMATION
IN
V
OUT2
OUT2
OUT1
V
OUT1
See detailed ordering and shipping information on page 2 of
this data sheet.
GND
C
1 mF
IN1
C
1 mF
OUT2
C
1 mF
OUT1
Figure 1. Typical Application Schematic
© Semiconductor Components Industries, LLC, 2017
1
Publication Order Number:
September, 2019 − Rev. 4
NCP151/D
NCP151
IN
Thermal
shutdown
Bandgap
reference
−
MOSFET driver
with current limit
Integrated
soft−start
+
OUT1
GND
OUT2
−
MOSFET driver
with current limit
Integrated
soft−start
Bandgap
reference
+
Thermal
shutdown
Figure 2. Simplified Schematic Block Diagram
PIN FUNCTION DESCRIPTION
Pin No.
XDFN4
Pin Name
Description
4
IN
Input voltage supply pin.
1
3
OUT1
OUT2
GND
Regulated output voltage. The output should be bypassed with small 1 mF ceramic capacitor.
Regulated output voltage. The output should be bypassed with small 1 mF ceramic capacitor.
Common ground connection.
2
EPAD
EPAD
Expose pad can be tied to ground plane for better power dissipation.
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
Unit
V
Input Voltage (Note 1)
Output Voltage
V
IN
−0.3 V to 6 V
V
, V
−0.3 to V + 0.3,
V
OUT1
OUT2
IN
max 6 V
unlimited
150
Output Short Circuit Duration
t
s
°C
°C
V
SC
Maximum Junction Temperature
Storage Temperature
T
J
T
−55 to 150
2000
STG
ESD Capability, Human Body Model (Note 2)
ESD Capability, Machine Model (Note 2)
ESD
HBM
ESD
200
V
MM
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per EIA/JESD22−A114.
ESD Machine Model tested per EIA/JESD22−A115.
Latchup Current Maximum Rating tested per JEDEC standard: JESD78.
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2
NCP151
THERMAL CHARACTERISTICS
Rating
Symbol
Value
Unit
Thermal Characteristics, XDFN4 (Note 3), Thermal Resistance,
Junction−to−Air
R
170
°C/W
q
JA
3. Measured according to JEDEC board specification. Detailed description of the board can be found in JESD51−7.
ELECTRICAL CHARACTERISTICS
−40°C ≤ T ≤ 85°C; V = V
+ 1 V for V
options greater than 1.5 V. Otherwise V = 2.5 V , whichever is greater,
J
IN
OUT(NOM)
OUT IN
I
= 1 mA; C = C
= 1 mF, unless otherwise noted. Typical values are at T = +25°C.
OUT
IN
OUT
J
Parameter
Symbol
Test Conditions
Min
1.7
−40
−2
Typ
Max
5.5
+40
+2
Unit
Operating Input Voltage
Output Voltage Accuracy
V
IN
V
mV
%
V
OUT
V
≤ 2 V
OUT(NOM)
V
2 V
OUT(NOM) >
Line Regulation
LineReg
LoadReg
V
+ 0.5 V ≤ V ≤ 5.5 V,
IN
0.01
0.1
%/V
OUT(NOM)
IN
(V ≥ 1.7 V)
Load Regulation
I
= 1 mA to 300 mA
12
30
mV
mV
OUT
Dropout Voltage (Note 5)
V
OUT1
OUT2
V
= 2.8 V
= 1.8 V
I
= 300 mA
= 300 mA
210
370
600
600
100
100
370
560
DO1
DO2
OUT(NOM)
OUT(NOM)
OUT
OUT
V
V
I
Current Limit
I
OUT1, OUT2, V
= 90% V
OUT(NOM)
325
mA
CL
SC
OUT
Short Circuit Current
Quiescent Current
I
OUT1, OUT2, V
= 0 V
OUT
I
Q
I
= 0 mA, I = 0 mA
OUT2
200
mA
OUT1
V
OUT
Slew Rate (Note 6)
V
V
OUT
= 1.8 V I = 10 mA
, OUT
Normal
(Version A)
mV/ms
OUT_SR
Slow
30
70
(Version C)
Power Supply Rejection Ratio
PSSR
V
IN
= 3.8 V V = 2.8 V,
OUT1
f = 1 kHz
dB
,
I
= 10 mA
OUT
Output Voltage Noise
V
N
f = 10 Hz to 100 kHz, I
= 10 mA
70
mV
RMS
OUT1
Thermal Shutdown Threshold
T
Temperature rising
Temperature failing
160
140
°C
°C
SDH
T
SDL
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Performance guaranteed over the indicated operating temperature range by design and/or characterization. Production tested at T = 25°C.
A
Low duty cycle pulse techniques are used during the testing to maintain the junction temperature as close to ambient as possible.
5. Dropout voltage is characterized when V
falls 100 mV below V
.
OUT
OUT(NOM)
6. Please refer OPN to determine slew rate. NCP151A − normal speed. NCP151C − slower speed.
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3
NCP151
TYPICAL CHARACTERISTICS
2.802
2.800
2.798
2.796
2.794
2.792
2.790
2.788
1.800
1.798
1.796
1.794
1.792
1.790
1.788
1.786
1 mA
1 mA
300 mA
300 mA
1.784
1.782
2.786
2.784
−40 −20
0
20
40
60
80
100
100
1
−40
−20
0
20
40
60
80
100
T , JUNCTION TEMPERATURE (°C)
T , JUNCTION TEMPERATURE (°C)
J
J
Figure 3. Output Voltage vs. Temperature
Figure 4. Output Voltage vs. Temperature
1.0
14
12
0.8
0.6
0.4
10
8
6
4
0.2
0
V
IN
= V
+ 1 V
OUT,NOM
= 1 mA to 300 mA
2
0
I
OUT
−40
−20
0
20
40
60
80
−40
−20
0
20
40
60
80
100
T , JUNCTION TEMPERATURE (°C)
T , JUNCTION TEMPERATURE (°C)
J
J
Figure 5. Load Regulation vs. Temperature
Figure 6. Line Regulation vs. Temperature
600
500
400
300
200
1.2
1.0
0.8
0.6
T = 25°C
J
0.4
I
= I
OUT2
OUT1
T = −40°C
J
0.2
0
100
0
T = 85°C
J
I
, I
= 0 A
OUT1−LOAD OUT2
1u
10u
100u
1m
10m
100m
1u
10u
100u
1m
10m
100m
1
I , OUTPUT CURRENT (A)
OUT
I , OUTPUT CURRENT (A)
OUT
Figure 7. Ground Current vs. Output Current
Figure 8. Ground Current vs. Output Current −
VOUT,NOM = 1.8 V − One Output Load
Different Load Combinations
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4
NCP151
TYPICAL CHARACTERISTICS
450
400
350
300
250
200
150
100
450
I
I
= 300 mA
OUT
T = 85°C
400
350
300
250
200
150
100
J
T = 25°C
J
T = −40°C
J
= 100 mA
OUT
I
= 20 mA
60
OUT
50
0
50
0
−40
0
30 60 90 120 150 180 210 240 270 300
, OUTPUT CURRENT (mA)
−20
0
20
40
80
100
I
T , JUNCTION TEMPERATURE (°C)
J
OUT
Figure 9. Dropout Voltage vs. Output Current −
Figure 10. Dropout Voltage vs. Temperature −
V
OUT,NOM = 1.8 V
VOUT,NOM = 1.8 V
250
200
250
200
150
100
T = 85°C
J
I
= 300 mA
T = 25°C
J
OUT
OUT
150
100
T = −40°C
J
I
= 100 mA
50
0
50
0
I
= 20 mA
60
OUT
−40
−20
0
20
40
80
100
0
30 60 90 120 150 180 210 240 270 300
, OUTPUT CURRENT (mA)
I
T , JUNCTION TEMPERATURE (°C)
J
OUT
Figure 11. Dropout Voltage vs. Output Current
Figure 12. Dropout Voltage vs. Temperature −
− VOUT,NOM = 2.8 V
VOUT,NOM = 2.8 V
800
100
10
1
750
700
650
600
550
500
450
400
Stable Region
I
SC
I
CL
Unstable Region
V
V
C
= 2.8 V
IN
= 1.8 V
= C = 1 mF
OUT
0.1
IN
OUT
V
C
= 1.8 V
OUT
I
I
: V
: V
= 90% V
CL
SC
OUT OUT,NOM
350
300
= C
= 1 mF
IN
OUT
= 0 V
60
OUT
0.01
−40 −20
0
20
40
80
100
0
50
100
150
200
250
300
T , JUNCTION TEMPERATURE (°C)
J
I , OUTPUT CURRENT (mA)
OUT
Figure 13. Short−circuit Current, Current Limit
Figure 14. Maximum COUT ESR Value vs.
Output Current
vs. Temperature
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5
NCP151
TYPICAL CHARACTERISTICS
10
1
I
= 300 mA
OUT
RMS Output Noise (mV)
10 Hz − 100 kHz 100 Hz − 100 kHz
72.7 69.2
I
OUT
0.1
1 mA
10 mA
300 mA
71.5
78.7
67.9
76.1
I
= 10 mA
OUT
0.01
0.001
V
V
C
= 2.8 V
IN
I
= 1 mA
= 1.8 V
OUT
OUT
= C
= 1 mF
IN
OUT
10
100
1K
10K
100K
1M
FREQUENCY (kHz)
Figure 15. Spectral Noise Density vs. Frequency, VOUT = 1.8 V
10
1
I
= 300 mA
OUT
RMS Output Noise (mV)
I
OUT
10 Hz − 100 kHz
93.8
100 Hz − 100 kHz
88.5
1 mA
10 mA
300 mA
0.1
92.3
86.9
I
= 10 mA
OUT
111.1
106.2
0.01
V
IN
= 3.8 V
I
= 1 mA
OUT
V
OUT
= 2.8 V
C
= C
= 1 mF
IN
OUT
0.001
10
100
1K
10K
100K
1M
FREQUENCY (kHz)
Figure 16. Spectral Noise Density vs. Frequency, VOUT = 2.8 V
90
80
90
80
70
60
50
40
30
I
= 1 mA
I
= 1 mA
OUT
OUT
70
60
50
40
30
I
OUT
= 10 mA
20
10
0
V
V
C
= 2.8 V + 100 mV
20
10
0
V
V
C
= 3.8 V + 100 mV
IN
PP
IN
PP
I
= 10 mA
OUT
= 1.8 V
= 2.8 V
OUT
OUT
= C
= 1 mF
= C
= 1 mF
I
= 300 mA
1M
IN
OUT
IN
OUT
OUT
I
= 300 mA
1M 10M
OUT
10
100
1K
10K
100K
10M
10
100
1K
10K
100K
f, FREQUENCY (Hz)
f, FREQUENCY (Hz)
Figure 17. PSRR vs. Frequency, VOUT = 1.8 V
Figure 18. PSRR vs. Frequency, VOUT = 2.8 V
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6
NCP151
TYPICAL CHARACTERISTICS
4.8 V
= 1 ms
4.8 V
= 1 ms
t
t
EDGE
3.8 V
EDGE
3.8 V
3.8 V
3.8 V
V
V
V
V
IN
IN
OUT1
OUT1
V
V
= 2.8 V
= 1.8 V
= 300 mA
= 1 mA
OUT1
V
V
= 2.8 V
= 1.8 V
= 1 mA
OUT1
OUT2
OUT2
I
I
OUT1
OUT2
I
I
OUT1
OUT2
= 300 mA
V
OUT2
V
OUT2
Figure 19. Line Transient Response,
Figure 20. Line Transient Response,
VIN = 3.8 V to 4.8 V to 3.8 V
V
IN = 3.8 V to 4.8 V to 3.8 V
300 mA
300 mA
1 mA
1 mA
1 mA
1 mA
t
= 1 ms
t
= 1 ms
EDGE
EDGE
I
I
OUT2
OUT1
V
V
V
OUT1
OUT1
V
V
V
I
= 3.8 V
IN
= 2.8 V
= 1.8 V
OUT1
OUT2
V
= 3.8 V
IN
V
V
= 2.8 V
= 1.8 V
OUT1
= 0 A
OUT2
OUT1
OUT2
I
= 0 A
OUT2
V
OUT2
Figure 21. Load Transient Response,
OUT1 = 1 mA to 300 mA to 1 mA
Figure 22. Load Transient Response,
IOUT2 = 1 mA to 300 mA to 1 mA
I
V
OUT1
I
OUT2
V
OUT2
V
IN
= 5.5 V
V
V
= 2.8 V
= 1.8 V
OUT1
OUT2
I
= 0 A
OUT1
C
= C
= 1 mF
IN
OUT
Figure 23. Thermal Shutdown
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7
NCP151
APPLICATIONS INFORMATION
General
Larger output capacitors and lower ESR could improve
The NCP151 is a dual output 300 mA Low Dropout Linear
the load transient response or high frequency PSRR. It is not
recommended to use tantalum capacitors on the output due
to their large ESR. The equivalent series resistance of
tantalum capacitors is also strongly dependent on the
temperature, increasing at low temperature.
Regulator. This device delivers high PSRR (70 dB at 1 kHz)
and very good dynamic performance as load/line transients.
In connection with low quiescent current this device is very
suitable for various battery powered applications such as
tablets, cellular phones, wireless and many others. Each
output is fully protected in case of output overload, output
short circuit condition and overheating, assuring a very robust
design. The NCP151 device is housed in DFN−4 1 mm x 1 mm
package which is useful for space constrains application.
Output Current Limit
Output Current is internally limited within the IC to a
typical 600 mA. The NCP151 will source this amount of
current measured with a voltage drops on the 90% of the
nominal V
. If the Output Voltage is directly shorted to
= 0 V), the short circuit protection will limit
OUT
Input Capacitor Selection (CIN)
ground (V
OUT
Input capacitor connected as close as possible is necessary
for ensure device stability. The X7R or X5R capacitor
should be used for reliable performance over temperature
range. The value of the input capacitor should be 1 mF or
greater to ensure the best dynamic performance. This
capacitor will provide a low impedance path for unwanted
AC signals or noise modulated onto constant input voltage.
There is no requirement for the ESR of the input capacitor
but it is recommended to use ceramic capacitors for their low
ESR and ESL. A good input capacitor will limit the
influence of input trace inductance and source resistance
during sudden load current changes.
the output current to 600 mA (typ). The current limit and
short circuit protection will work properly over whole
temperature range and also input voltage range. There is no
limitation for the short circuit duration.
Thermal Shutdown
When the die temperature exceeds the Thermal Shutdown
threshold (TSD − 160°C typical), Thermal Shutdown event
is detected and the affected channel is turn−off. Second
channel still working. The channel which is overheated will
remain in this state until the die temperature decreases below
the Thermal Shutdown Reset threshold (TSDU − 140°C
typical).
Output Decoupling
The channel which is overheated will remain in this state
until the die temperature decreases below the Thermal
Shutdown Reset threshold (TSDU − 140°C typical). Once
the device temperature falls below the 140°C the appropriate
channel is enabled again. The thermal shutdown feature
provides the protection from a catastrophic device failure
due to accidental overheating. This protection is not
intended to be used as a substitute for proper heat sinking.
The long duration of the short circuit condition to some
output channel could cause turn−off other output when heat
sinking is not enough and temperature of the other output
reach TSD temperature.
The NCP151 requires an output capacitor connected as
close as possible to the output pin of the regulator. The
recommended capacitor value is 1 mF and X7R or X5R
dielectric due to its low capacitance variations over the
specified temperature range. The NCP151 is designed to
remain stable with minimum effective capacitance of
0.68ĂmF to account for changes with temperature, DC bias
and package size. Especially for small package size
capacitors such as 0201 the effective capacitance drops
rapidly with the applied DC bias. Please refer to Figure 24.
There is no requirement for the minimum value of
Equivalent Series Resistance (ESR) for the C
maximum value of ESR should be less than 1.7 W.
but the
OUT
Power Dissipation
As power dissipated in the NCP151 increases, it might
become necessary to provide some thermal relief. The
maximum power dissipation supported by the device is
dependent upon board design and layout. Mounting pad
configuration on the PCB, the board material, and the
ambient temperature affect the rate of junction temperature
rise for the part. The maximum power dissipation the
NCP151 can handle is given by:
ƪ
ƫ
85° C * TA
PD(MAX)
+
(eq. 1)
qJA
The power dissipated by the NCP151 for given
application conditions can be calculated from the following
equations:
Figure 24. Capacity vs. DC Bias Voltage
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8
NCP151
Turn−On Time
The turn−on time is defined as the time period from EN
assertion to the point in which V will reach 98% of its
ǒV Ǔ
D [ VIN IGND ) IOUT1 IN * VOUT1
P
(eq. 2)
ǒV
Ǔ
) IOUT2 IN * VOUT2
OUT
nominal value. This time is dependent on various
application conditions such as V
The NCP151 provides two options of V
The NCP151A have normal slew rate, typical 100 mV/ms
and NCP151C and provide slower option with typical value
30 mV/ms which is suitable for camera sensor and other
sensitive devices.
C
and T .
Reverse Current
The PMOS pass transistor has an inherent body diode
which will be forward biased in the case that V > V .
Due to this fact in cases, where the extended reverse current
condition can be anticipated the device may require
additional external protection.
OUT(NOM) OUT
A
ramp−up time.
OUT
OUT
IN
PCB Layout Recommendations
Power Supply Rejection Ratio
To obtain good transient performance and good regulation
The NCP151 features very good Power Supply Rejection
ratio. If desired the PSRR at higher frequencies in the range
characteristics place C and C
capacitors close to the
IN
OUT
device pins and make the PCB traces wide. In order to
minimize the solution size, use 0402 capacitors. Larger
copper area connected to the pins will also improve the
device thermal resistance. The actual power dissipation can
be calculated from the equation above (Equation 2). Expose
pad should be tied the shortest path to the GND pin.
100 kHz − 10 MHz can be tuned by the selection of C
capacitor and proper PCB layout.
OUT
200
195
190
185
180
175
0.36
P
, T = 25°C, 2 oz Cu
A
D(MAX)
0.35
0.34
0.33
0.32
0.31
q
, 1 oz Cu
JA
P
, T = 25°C, 1 oz Cu
A
D(MAX)
q
, 2 oz Cu
500
JA
170
165
0.30
0.29
0
100
200
300
400
600
2
PCB COPPER AREA (mm )
Figure 25. qJA vs. Copper Area (XDFN4)
ORDERING INFORMATION
Voltage option
OUT1/OUT2
Vout Slew Rate
OUT1/OUT2
†
Device
Marking
YE
Package
Shipping
NCP151AAMX180070TCG
NCP151AAMX180075TCG
NCP151AAMX280180TCG
NCP151AAMX330180TCG
NCP151CCMX280180TCG
1.8 V/0.70 V
1.8 V/0.75 V
2.8 V/1.8 V
3.3 V/1.8 V
2.8 V/1.8 V
Normal/Normal
Normal/Normal
Normal/Normal
Normal/Normal
Slow/Slow
YA
XDFN4
CASE 711AJ
(Pb−Free)
3000 Units/
Tape & Reel
YC
YD
ZC
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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9
NCP151
PACKAGE DIMENSIONS
XDFN4 1.0x1.0, 0.65P
CASE 711AJ
ISSUE A
4X L2
NOTES:
A
B
D
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.20 mm FROM THE TERMINAL TIPS.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
PIN ONE
REFERENCE
E
4X b2
2X
0.05
C
MILLIMETERS
DETAIL A
DIM MIN
0.33
A1 0.00
MAX
0.43
0.05
0.05
C
2X
A
TOP VIEW
A3
b
b2 0.02
0.10 REF
0.15
0.25
0.12
(A3)
0.05
0.05
C
D
1.00 BSC
D2 0.43
0.53
A
E
e
L
1.00 BSC
0.65 BSC
0.20
C
0.30
0.17
SEATING
NOTE 4
A1
L2 0.07
C
SIDE VIEW
PLANE
e
RECOMMENDED
e/2
MOUNTING FOOTPRINT*
DETAIL A
4X L
D2
1
4
2
02.5X2
0.65
PITCH
PACKAGE
OUTLINE
D2
4X
0.39
455
3
4X
0.11
1.20
4X b
M
0.05
C A B
4X
0.24
NOTE 3
4X
0.26
BOTTOM VIEW
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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