NCP154MX180300TAG [ONSEMI]
Dual 300 mA, Low IQ, Low Dropout, Dual Input Voltage Regulator;型号: | NCP154MX180300TAG |
厂家: | ONSEMI |
描述: | Dual 300 mA, Low IQ, Low Dropout, Dual Input Voltage Regulator 光电二极管 输出元件 调节器 |
文件: | 总18页 (文件大小:584K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
NCP154
Dual 300 mA, Low IQ, Low
Dropout, Dual Input Voltage
Regulator
The NCP154 is 300 mA, Dual Output Linear Voltage Regulator that
offers two independent input pins and provides a very stable and
accurate voltage with ultra low noise and very high Power Supply
Rejection Ratio (PSRR) suitable for RF applications. The device
doesn’t require any additional noise bypass capacitor to achieve ultra
low noise performance. In order to optimize performance for battery
operated portable applications, the NCP154 employs the Adaptive
Ground Current Feature for low ground current consumption during
light-load conditions.
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XDFN8, 1.2x1.6
CASE 711AS
PIN CONNECTIONS
Features
• Operating Input Voltage Range: 1.9 V to 5.25 V
• Two Independent Input Voltage Pins
EN1
8
GND
OUT1
OUT2
GND
1
2
3
4
• Two Independent Output Voltage (for detail please refer to Ordering
IN1
IN2
EN2
7
6
5
Information)
EP
• Low IQ of typ. 55 mA per Channel
• High PSRR: 75 dB at 1 kHz
• Very Low Dropout: 140 mV Typical at 300 mA
• Thermal Shutdown and Current Limit Protections
• Stable with a 1 mF Ceramic Output Capacitor
• Available in XDFN8 1.2 × 1.6 mm Package
• Active Output Discharge for Fast Output Turn-Off
• These are Pb-free Devices
XDFN8
(Top View)
MARKING DIAGRAM
Typical Applications
• Smartphones, Tablets
XM
G
®
®
• Wireless Handsets, Wireless LAN, Bluetooth , ZigBee Interfaces
• Other Battery Powered Applications
X
M
= Specific Device Code
= Date Code
G
= Pb−Free Package
NCP154
V
IN1
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 17 of this data sheet.
V
V
IN1
IN2
OUT1
V
OUT1
OUT2
IN2
OUT2
EN1
EN2
C
1 mF
C
IN2
1 mF
C
1 mF
C
OUT1
1 mF
IN1
OUT2
GND
Figure 1. Typical Application Schematic
© Semiconductor Components Industries, LLC, 2015
1
Publication Order Number:
January, 2015 − Rev. 2
NCP154/D
NCP154
IN1
ENABLE
LOGIC
THERMAL
SHUTDOWN
EN1
BANDGAP
REFERENCE
MOSFET
DRIVER WITH
CURRENT LIMIT
OUT1
ACTIVE
DISCHARGE
EN1
GND
IN2
ENABLE
LOGIC
THERMAL
SHUTDOWN
EN2
BANDGAP
REFERENCE
MOSFET
DRIVER WITH
CURRENT LIMIT
OUT2
ACTIVE
DISCHARGE
EN2
GND
Figure 2. Simplified Schematic Block Diagram
Table 1. PIN FUNCTION DESCRIPTION
Pin No.
Pin Name
GND
Description
1
2
Power supply ground. Soldered to the copper plane allows for effective heat dissipation.
OUT1
Regulated output voltage of the first channel. A small 1 mF ceramic capacitor is needed from this pin to
ground to assure stability.
3
OUT2
Regulated output voltage of the second channel. A small 1 mF ceramic capacitor is needed from this pin to
ground to assure stability.
4
5
GND
EN2
Power supply ground. Soldered to the copper plane allows for effective heat dissipation.
Driving EN2 over 0.9 V turns-on OUT2. Driving EN below 0.4 V turns-off the OUT2 and activates the active
discharge.
6
7
8
IN2
IN1
Inputs pin for second channel. It is recommended to connect 1 mF ceramic capacitor close to the device pin.
Inputs pin for first channel. It is recommended to connect 1 mF ceramic capacitor close to the device pin.
EN1
Driving EN1 over 0.9 V turns-on OUT1. Driving EN below 0.4 V turns-off the OUT1 and activates the active
discharge.
−
EP
Exposed pad must be tied to ground. Soldered to the copper plane allows for effective thermal dissipation.
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NCP154
Table 2. ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
VIN1, VIN2
Value
Unit
V
Input Voltage (Note 1)
−0.3 V to 6 V
Output Voltage
V
, V
OUT2
, V
EN2
−0.3 V to V + 0.3 V or 6 V
V
OUT1
IN
Enable Inputs
V
−0.3 V to V + 0.3 V or 6 V
V
EN1
IN
Output Short Circuit Duration
Maximum Junction Temperature
Storage Temperature
t
Indefinite
150
s
SC
T
°C
°C
V
J(MAX)
T
STG
−55 to 150
2,000
ESD Capability, Human Body Model (Note 2)
ESD Capability, Machine Model (Note 2)
ESD
HBM
ESD
200
V
MM
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
Latchup Current Maximum Rating tested per JEDEC standard: JESD78.
Table 3. THERMAL CHARACTERISTICS (Note 3)
Rating
Symbol
Value
Unit
Thermal Characteristics, XDFN8 1.2 × 1.6 mm,
Thermal Resistance, Junction-to-Air
°C/W
q
160
JA
2
3. Single component mounted on 1 oz, FR4 PCB with 645 mm Cu area.
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3
NCP154
Table 4. ELECTRICAL CHARACTERISTICS
(−40°C ≤ T ≤ 85°C; V = V
+ 1 V or 2.5 V, whichever is greater; V = 0.9 V, I
= 1 mA, C = C
= 1 mF.
OUT
J
IN
OUT(NOM)
EN
OUT
IN
Typical values are at T = +25°C. Min/Max values are specified for T = −40°C and T = 85°C respectively.) (Note 4)
J
J
J
Parameter
Test Conditions
Symbol
Min
1.9
−2
Typ
Max
5.25
+2
Unit
V
Operating Input Voltage
VIN
V
V
> 2 V
%
OUT
Output Voltage Accuracy
−40°C ≤ T ≤ 85°C
VOUT
J
≤ 2 V
−60
+60
0.1
mV
%/V
mV
mV
mV
mV
mV
mV
mV
mA
mA
OUT
Line Regulation
Load Regulation
VOUT + 0.5 V ≤ VIN ≤ 5 V
Reg
0.02
15
LINE
IOUT = 1 mA to 300 mA
Reg
40
LOAD
V
V
V
V
V
V
= 1.5 V
= 1.8 V
= 2.7 V
= 2.8 V
= 3.0 V
= 3.3 V
360
335
165
160
150
140
400
55
470
390
275
270
260
250
OUT(nom)
OUT(nom)
OUT(nom)
OUT(nom)
OUT(nom)
OUT(nom)
Dropout Voltage (Note 5)
Output Current Limit
I
= 300 mA
VDO
OUT
V
OUT
= 90% V
ICL
IQ
OUT(nom)
IOUT = 0 mA, EN1=V , EN2=0V or EN2=V , EN1=0V
100
200
1
IN
IN
Quiescent Current
IOUT1 = IOUT2 = 0 mA, V
= V
= V
IN
IQ
110
0.1
mA
EN1
EN2
Shutdown current (Note 6)
VEN ≤ 0.4 V, V = 5.25 V
IDIS
mA
IN
EN Pin Threshold Voltage
High Threshold
VEN Voltage increasing
VEN Voltage decreasing
VEN_HI
VEN_LO
0.9
V
Low Threshold
0.4
1.0
EN Pin Input Current
VEN = VIN = 5.25 V
IEN
PSRR
VN
0.3
75
mA
VIN = VOUT+1 V for VOUT > 2 V, V = 2.5 V,
IN
Power Supply Rejection Ratio
f = 1 kHz
dB
for VOUT ≤ 2 V, IOUT = 10 mA
Output Noise Voltage
f = 10 Hz to 100 kHz
75
50
mV
rms
Active Discharge Resistance
V
IN
= 4 V, V < 0.4 V
R
DIS
W
EN
Thermal Shutdown Temperature Temperature increasing from TJ = +25°C
Thermal Shutdown Hysteresis Temperature falling from TSD
TSD
160
20
°C
°C
TSDH
−
−
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Performance guaranteed over the indicated operating temperature range by design and/or characterization. Production tested at
T = T = 25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
J
A
5. Characterized when V
falls 100 mV below the regulated voltage at V = V
+ 1 V.
OUT
IN
OUT(NOM)
6. Shutdown Current is the current flowing into the IN pin when the device is in the disable state.
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NCP154
TYPICAL CHARACTERISTICS
1.05
1.04
1.03
1.02
1.01
1.00
0.99
0.98
0.97
1.85
1.84
1.83
1.82
I
= 1 mA
OUT
I
= 1 mA
OUT
1.81
1.80
1.79
1.78
1.77
I
= 300 mA
OUT
I
= 300 mA
OUT
V
V
= 2.5 V
V
V
= 2.8 V
IN
IN
= 1.0 V
= 1.8 V
OUT
OUT
0.96
0.95
1.76
1.75
C
= C
= 1 mF
C
= C
= 1 mF
IN
OUT
IN
OUT
−40 −25 −10
5
20
35
50
65
80
95
−40 −25 −10
5
20
35
50
65
80
95
T , JUNCTION TEMPERATURE (°C)
J
T , JUNCTION TEMPERATURE (°C)
J
Figure 3. Output Voltage vs. Temperature –
OUT = 1.0 V
Figure 4. Output Voltage vs. Temperature –
VOUT = 1.0 V
V
2.85
2.84
2.83
2.82
2.81
2.80
3.35
3.34
3.33
3.32
3.31
3.30
3.29
I
= 1 mA
OUT
I
= 1 mA
OUT
I
= 300 mA
OUT
I
= 300 mA
OUT
2.79
2.78
2.77
3.28
3.27
V
V
= 3.8 V
V
V
= 4.3 V
IN
IN
= 2.8 V
= 3.3 V
OUT
OUT
2.76
2.75
3.26
3.25
C
= C
= 1 mF
C
= C
= 1 mF
IN
OUT
IN
OUT
−40 −25 −10
5
20
35
50
65
80
95
−40 −25 −10
5
20
35
50
65
80 95
T , JUNCTION TEMPERATURE (°C)
J
T , JUNCTION TEMPERATURE (°C)
J
Figure 5. Output Voltage vs. Temperature –
OUT = 1.0 V
Figure 6. Output Voltage vs. Temperature –
VOUT = 1.0 V
V
600
540
480
420
360
300
240
180
120
60
54
48
42
36
30
24
18
12
85°C
V
V
C
= 4.3 V
IN
= 3.3 V
= C = 1 mF
OUT
T = 85°C
J
−40°C
25°C
IN
OUT
T = 25°C
J
T = −40°C
J
V
V
C
= 4.3 V
IN
= 3.3 V
= C = 1 mF
OUT
60
0
6
0
IN
OUT
0
30 60 90 120 150 180 210 240 270 300
, OUTPUT CURRENT (mA)
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
, INPUT VOLTAGE (V)
I
V
IN
OUT
Figure 7. Ground Current vs. Output Current
Figure 8. Quiescent Current vs. Input Voltage
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NCP154
TYPICAL CHARACTERISTICS
60
58
56
54
52
50
48
46
44
0.10
0.08
0.06
0.04
0.02
0
−0.02
−0.04
V
V
C
= 2.5 V
V
V
C
= 4.3 V
−0.06
IN
IN
= 1.0 V
= 3.3 V
OUT
OUT
42
40
−0.08
−0.10
= C
= 1 mF
= C
= 1 mF
IN
OUT
IN
OUT
−40 −25 −10
5
20
35
50
65
80
95
95
95
−40 −25 −10
5
20
35
50
65
80
95
T , JUNCTION TEMPERATURE (°C)
J
T , JUNCTION TEMPERATURE (°C)
J
Figure 9. Quiescent Current vs. Temperature
Figure 10. Line Regulation vs. Temperature –
OUT = 1.0 V
V
0.10
0.08
0.06
0.04
0.02
0
30
27
24
21
18
15
12
9
−0.02
−0.04
−0.06
V
V
= 4.3 V
V
IN
= 2.5 V
IN
6
= 3.3 V
V
OUT
= 1.0 V
OUT
−0.08
−0.10
3
0
C
= C
= 1 mF
C
= C
= 1 mF
IN
OUT
IN
OUT
−40 −25 −10
5
20
35
50
65
80
−40 −25 −10
5
20
35
50
65
80 95
T , JUNCTION TEMPERATURE (°C)
J
T , JUNCTION TEMPERATURE (°C)
J
Figure 11. Line Regulation vs. Temperature –
OUT = 3.3 V
Figure 12. Load Regulation vs. Temperature –
VOUT = 1.0 V
V
30
27
24
21
18
15
12
9
200
175
150
125
100
75
V
V
C
= 4.3 V
IN
T = 85°C
V
V
C
= 4.3 V
J
IN
= 3.3 V
= C = 1 mF
OUT
= 3.3 V
= C = 1 mF
OUT
IN
OUT
T = 25°C
J
IN
OUT
T = −40°C
J
50
6
25
0
3
0
−40 −25 −10
5
20
35
50
65
80
0
25 50 75 100 125 150 175 200 225 250 275 300
, OUTPUT CURRENT (mA)
T , JUNCTION TEMPERATURE (°C)
J
I
OUT
Figure 13. Load Regulation vs. Temperature –
OUT = 3.3 V
Figure 14. Dropout Voltage vs. Output Current
– VOUT = 3.3 V
V
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NCP154
TYPICAL CHARACTERISTICS
200
180
160
140
120
100
80
400
V
V
C
= 4.3 V
IN
I
I
= 300 mA
350
OUT
= 3.3 V
= C = 1 mF
OUT
IN
OUT
300
250
200
= 150 mA
OUT
150
100
60
I
= 0 mA
OUT
40
50
0
20
0
−40 −25 −10
5
20
35
50
65
80
95
1.5 1.7 1.9 2.1 2.3 2.5 2.7 2.9 3.1 3.3 3.5
, OUTPUT VOLTAGE (V)
T , JUNCTION TEMPERATURE (°C)
V
OUT
J
Figure 15. Dropout Voltage vs. Temperature
Figure 16. Dropout Voltage vs. Output Voltage
600
575
550
525
500
475
450
425
600
575
550
525
500
475
V
C
= 0 V
V
C
= 90% V
OUT(NOM)
OUT
OUT
= C
= 1 mF
= C
= 1 mF
IN
OUT
IN
OUT
V
= 3.8 V
IN
V
= 3.8 V
IN
V
IN
= 5.25 V
V
IN
= 5.25 V
450
425
400
400
375
350
375
350
−40 −25 −10
5
20
35
50
65
80
95
−40 −25 −10
5
20
35
50
65
80
95
T , JUNCTION TEMPERATURE (°C)
J
T , JUNCTION TEMPERATURE (°C)
J
Figure 17. Current Limit vs. Temperature
Figure 18. Short Circuit Current vs.
Temperature
530
520
510
500
490
480
470
460
450
30
27
24
21
18
15
12
9
V
V
V
= 4.3 V
IN
= 0 V
OUT
= 0 V
EN
C
= C
= 1 mF
IN
OUT
V
C
= 0 V
OUT
= C
= 1 mF
IN
OUT
6
440
430
3
0
2.5 2.8 3.1 3.4 3.7 4.0 4.3 4.6 4.9 5.2 5.5
, INPUT VOLTAGE (V)
−40 −25 −10
5
20
35
50
65
80 95
V
IN
T , JUNCTION TEMPERATURE (°C)
J
Figure 19. Short Circuit Current vs. Input
Voltage
Figure 20. Disable Current vs. Temperature
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NCP154
TYPICAL CHARACTERISTICS
1.0
0.9
450
400
350
0.8
0.7
0.6
0.5
0.4
0.3
0.2
OFF → ON
ON → OFF
300
250
200
150
100
V
V
= 4.3 V
IN
V
V
C
= 4.3 V
IN
= 3.3 V
OUT
= 3.3 V
= C = 1 mF
OUT
50
0
C
= C
= 1 mF
0.1
0
IN
OUT
IN
OUT
−40 −25 −10
5
20
35
50
65
80
95
−40 −25 −10
5
20
35
50
65
80
95
T , JUNCTION TEMPERATURE (°C)
J
T , JUNCTION TEMPERATURE (°C)
J
Figure 21. Enable Thresholds vs. Temperature
Figure 22. Current to Enable Pin vs.
Temperature
100
90
80
70
60
50
40
30
100
90
1 mA
10 mA
80
70
60
50
40
30
20
100 mA
V
V
C
C
= 2.5 V + 100 mV
PP
IN
300 mA
150 mA
= 1.0 V
OUT
V
V
C
= 4 V
IN
20
= none
IN
= 1 V
OUT
= 1 mF, MLCC
10
0
10
0
OUT
= C
= 1 mF
IN
OUT
−40 −25 −10
5
20
35
50
65
80
95
0.1
1
10
100
1,000 10,000
T , JUNCTION TEMPERATURE (°C)
J
FREQUENCY (kHz)
Figure 23. Discharge Resistivity vs.
Temperature
Figure 24. Power Supply Rejection Ratio,
OUT = 1.0 V
V
100
90
80
70
60
50
40
30
20
100
10
1 mA
10 mA
V
= 3.3 V
OUT
100 mA
V
OUT
= 1.0 V
1
V
V
C
C
= 4.3 V + 100 mV
IN
PP
V
C
= V
= C
+ 1 V or 2.5 V
= 1 mF, MLCC,
IN
OUT
300 mA
150 mA
= 3.3 V
OUT
IN
OUT
= none
IN
size 1206
10
0
= 1 mF, MLCC
OUT
0.1
0.1
1
10
100
1,000
10,000
0
30 60 90 120 150 180 210 240 270 300
, OUTPUT CURRENT (mA)
FREQUENCY (kHz)
I
OUT
Figure 25. Power Supply Rejection Ratio,
OUT = 3.3 V
Figure 26. Output Capacitor ESR vs. Output
Current
V
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NCP154
TYPICAL CHARACTERISTICS
10
1
RMS Output Noise (mV)
10 Hz – 100 kHz 100 Hz – 100 kHz
I
150 mA
10 mA
OUT
1 mA
40.83
36.03
36.54
37.05
40.27
35.38
35.97
36.48
1 mA
0.1
10 mA
150 mA
300 mA
0.01
V
V
C
= 2.5 V
IN
= 1.0 V
= C = 1 mF
OUT
300 mA
IN
OUT
0.001
0.01
0.1
1
10
100
1000
FREQUENCY (kHz)
Figure 27. Output Voltage Noise Spectral Density for VOUT = 1.0 V, COUT = 1 mF
10
1
RMS Output Noise (mV)
10 Hz – 100 kHz 100 Hz – 100 kHz
I
300 mA
10 mA
OUT
1 mA
1 mA
10 mA
150 mA
300 mA
77.84
71.71
71.95
72.71
77.28
70.48
70.88
71.67
0.1
0.01
V
V
C
= 2.8 V
IN
= 1.8 V
= C = 1 mF
OUT
150 mA
1000
IN
OUT
0.001
0.01
0.1
1
10
100
FREQUENCY (kHz)
Figure 28. Output Voltage Noise Spectral Density for VOUT = 1.8 V, COUT = 1 mF
10
1
RMS Output Noise (mV)
150 mA
10 mA
10 Hz – 100 kHz 100 Hz – 100 kHz
I
1 mA
OUT
1 mA
10 mA
150 mA
300 mA
119.7
113.47
113.84
115.95
117.87
111.47
112.05
114.03
0.1
0.01
V
V
C
= 4.3 V
IN
300 mA
= 3.3 V
= C = 1 mF
OUT
IN
OUT
0.001
0.01
0.1
1
10
100
1000
FREQUENCY (kHz)
Figure 29. Output Voltage Noise Spectral Density for VOUT = 3.3 V, COUT = 1 mF
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NCP154
TYPICAL CHARACTERISTICS
V
EN
V
EN
I
IN
I
IN
V
V
= 2.5 V
= 1.0 V
= 10 mA
V
V
I
OUT
= 2.5 V
IN
OUT
IN
V
OUT
V
OUT
= 1.0 V
= 10 mA
OUT
I
OUT
C
= C
= 1 mF
C
= C
= 4.7 mF
IN
OUT
IN
OUT
40 ms/div
40 ms/div
Figure 30. Enable Turn−on Response –
OUT = 1.0 V, COUT = 1 mF
Figure 31. Enable Turn−on Response –
V
VOUT = 1.0 V, COUT = 4.7 mF
V
EN
V
EN
I
IN
I
IN
V
V
I
= 4.3 V
V
V
I
= 4.3 V
IN
OUT
IN
OUT
= 3.3 V
= 10 mA
= 3.3 V
= 10 mA
V
OUT
V
OUT
OUT
OUT
C
= C
= 1 mF
C
= C
= 4.7 mF
IN
OUT
IN
OUT
40 ms/div
40 ms/div
Figure 32. Enable Turn−on Response –
OUT = 3.3 V, COUT = 1 mF
Figure 33. Enable Turn−on Response –
V
VOUT = 3.3 V, COUT = 4.7 mF
V
= 4.8 V to 3.8 V
= 10 mA
= none
IN
V
= 3.8 V to 4.8 V
= 10 mA
= none
IN
I
OUT
I
OUT
C
C
IN
V
IN
C
C
IN
= 1 mF
OUT
= 1 mF
OUT
t
= 1 ms
RISE
t
= 1 ms
V
IN
FALL
V
OUT
V
OUT
8 ms/div
8 ms/div
Figure 34. Line Transient Response – Rising
Edge, VOUT = 3.3 V, IOUT = 10 mA
Figure 35. Line Transient Response – Falling
Edge, VOUT = 3.3 V, IOUT = 10 mA
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10
NCP154
TYPICAL CHARACTERISTICS
V
IN
= 4.8 V to 3.8 V
I
C
C
= 300 mA
= none
OUT
IN
V
IN
= 1 mF
OUT
t
= 1 ms
RISE
t
= 1 ms
V
= 3.8 V to 4.8 V
= 300 mA
= none
FALL
IN
V
IN
I
OUT
C
C
IN
= 1 mF
OUT
V
OUT
V
OUT
4 ms/div
4 ms/div
Figure 36. Line Transient Response– Rising
Edge, VOUT = 3.3 V, IOUT = 300 mA
Figure 37. Line Transient Response– Falling
Edge, VOUT = 3.3 V, IOUT = 300 mA
V
IN
= 4.8 V to 3.8 V
I
C
C
= 10 mA
= none
OUT
IN
V
IN
= 4.7 mF
OUT
V
= 3.8 V to 4.8 V
= 10 mA
= none
IN
t
= 1 ms
t
= 1 ms
RISE
FALL
V
IN
I
OUT
C
C
IN
= 4.7 mF
OUT
V
OUT
V
OUT
4 ms/div
4 ms/div
Figure 38. Line Transient Response– Rising Edge,
Figure 39. Line Transient Response– Falling
V
OUT = 3.3 V, IOUT = 10 mA, COUT = 4.7 mF
Edge, VOUT = 3.3 V, IOUT = 10 mA, COUT = 4.7 mF
I
OUT1
V
V
I
= 2.8 V
IN
t
= 500 ns
RISE
= 1.0 V, V
= 1.8 V
OUT1
OUT2
t
= 500 ns
FALL
= 10 mA
V
V
= 2.8 V
OUT2
IN
C
= 1 mF, C
= 1 mF
= 1.0 V, V
= 1.8 V
OUT1
OUT2
OUT1
OUT2
I
OUT1
I
= 10 mA
OUT2
C
= 1 mF, C
= 1 mF
OUT1
OUT2
V
OUT1
V
V
OUT1
V
OUT2
OUT2
4 ms/div
100 ms/div
Figure 40. Load Transient Response − 1.0 V –
Figure 41. Load Transient Response − 1.0 V –
Rising Edge, IOUT1 = 100 mA to 300 mA
Falling Edge, IOUT1 = 300 mA to 100 mA
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11
NCP154
TYPICAL CHARACTERISTICS
I
OUT1
t
= 500 ns
RISE
V
V
= 2.8 V
IN
= 1.0 V, V
= 1.8 V
OUT1
OUT2
t
= 500 ns
FALL
I
= 10 mA
OUT2
V
V
= 2.8 V
IN
C
= 1 mF, C
= 1 mF
OUT1
OUT2
= 1.0 V, V
= 1.8 V
I
OUT1
OUT2
OUT1
I
= 10 mA
OUT2
C
= 1 mF, C
= 1 mF
OUT1
OUT2
V
OUT1
V
V
OUT1
V
OUT2
OUT2
4 ms/div
10 ms/div
Figure 42. Load Transient Response − 1.0 V –
Rising Edge, IOUT1 = 1 mA to 300 mA
Figure 43. Load Transient Response − 1.0 V –
Falling Edge, IOUT1 = 300 mA to 1 mA
I
OUT1
t
= 500 ns
RISE
V
V
= 2.8 V
IN
= 1.0 V, V
= 1.8 V
OUT1
OUT2
I
= 10 mA
OUT2
V
V
= 2.8 V
C
= 1 mF, C
OUT1
= 1 mF
IN
OUT2
I
OUT1
= 1.0 V, V
= 1.8 V
t
= 500 ns
OUT1
OUT2
FALL
I
= 10 mA
OUT2
C
= 1 mF, C
= 1 mF
OUT1
OUT2
V
V
OUT1
V
V
OUT1
OUT2
OUT2
4 ms/div
4 ms/div
Figure 44. Load Transient Response − 1.0 V –
Rising Edge, IOUT1 = 50 mA to 300 mA
Figure 45. Load Transient Response − 1.0 V –
Falling Edge, IOUT1 = 300 mA to 50 mA
I
OUT1
V
V
I
= 4.3 V
t
= 500 ns
IN
RISE
= 3.3 V, V
= 2.8 V
OUT1
OUT2
t
= 500 ns
FALL
= 10 mA
V
V
= 4.3 V
OUT2
IN
C
= 1 mF, C
= 1 mF
= 3.3 V, V
= 2.8 V
OUT1
OUT2
OUT1
OUT2
I
OUT1
I
= 10 mA
OUT2
C
= 1 mF, C
= 1 mF
OUT1
OUT2
V
V
OUT1
V
V
OUT1
OUT2
OUT2
4 ms/div
100 ms/div
Figure 46. Load Transient Response − 3.3 V –
Figure 47. Load Transient Response – 3.3 V –
Rising Edge, IOUT1 = 100 mA to 300 mA
Falling Edge, IOUT1 = 300 mA to 100 mA
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12
NCP154
TYPICAL CHARACTERISTICS
I
OUT1
t
= 500 ns
RISE
V
V
= 4.3 V
IN
= 3.3 V, V
= 2.8 V
OUT1
OUT2
t
= 500 ns
FALL
I
= 10 mA
OUT2
V
V
= 4.3 V
IN
C
= 1 mF, C
= 1 mF
OUT1
OUT2
= 3.3 V, V
= 2.8 V
I
OUT1
OUT2
OUT1
I
= 10 mA
OUT2
C
= 1 mF, C
= 1 mF
OUT1
OUT2
V
V
OUT1
V
V
OUT1
OUT2
OUT2
4 ms/div
10 ms/div
Figure 48. Load Transient Response − 3.3 V –
Rising Edge, IOUT1 = 1 mA to 300 mA
Figure 49. Load Transient Response – 3.3 V –
Falling Edge, IOUT1 = 300 mA to 1 mA
I
t
= 500 ns
OUT1
RISE
V
V
= 4.3 V
IN
= 3.3 V, V
= 2.8 V
OUT1
OUT2
I
= 10 mA
OUT2
V
V
= 4.3 V
C
= 1 mF, C
OUT1
= 1 mF
IN
OUT2
I
OUT1
= 3.3 V, V
= 2.8 V
t
= 500 ns
OUT1
OUT2
FALL
I
= 10 mA
OUT2
C
= 1 mF, C
= 1 mF
OUT1
OUT2
V
V
OUT1
V
V
OUT1
OUT2
OUT2
4 ms/div
4 ms/div
Figure 50. Load Transient Response − 3.3 V –
Rising Edge, IOUT1 = 50 mA to 300 mA
Figure 51. Load Transient Response – 3.3 V –
Falling Edge, IOUT1 = 300 mA to 50 mA
V
EN
V
EN
t
= 500 ns
t
= 500 ns
RISE
RISE
V
V
I
= 4.3 V
V
V
= 4.3 V
= 3.3 V
= 0 mA
IN
OUT
IN
OUT
= 3.3 V
= 0 mA
V
OUT
V
OUT
I
OUT
OUT
C
= 4.7 mF
C
= 4.7 mF
OUT
OUT
C = 1 mF, 4.7 mF
OUT
C
= 1 mF, 4.7 mF
OUT
C
= 1 mF
OUT
C
= 1 mF
OUT
200 ms/div
200 ms/div
Figure 52. Enable Turn−Off – VOUT = 1.0 V
Figure 53. Enable Turn−Off – VOUT = 3.3 V
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13
NCP154
TYPICAL CHARACTERISTICS
Short circuit
current
Overheating
V
IN
I
OUT
V
V
OUT1
OUT2
TSD cycling
= 5.25 V
V
OUT
Thermal
Shutdown
V
V
C
IN
V
V
= 4.3 V
= 3.3 V, V
OUT2
= 10 mA, I
OUT2
= 3.3 V
OUT
IN
OUT1
Short circuit
event
= 2.8 V
= 10 mA
= 1 mF
= C
= 1 mF
IN
OUT
I
OUT1
C
= C
= C
IN
OUT1 OUT2
20 ms/div
4 ms/div
Figure 54. Turn−on/off − Slow Rising VIN
Figure 55. Short Circuit and Thermal
Shutdown
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14
NCP154
General
If the EN pin voltage >0.9 V the device is guaranteed to
The NCP154 is a dual output high performance 300 mA
be enabled. The NCP154 regulates the output voltage and
the active discharge transistor is turned−off.
Low Dropout Linear Regulator. This device delivers very
high PSRR (75 dB at 1 kHz) and excellent dynamic
performance as load/line transients. In connection with low
quiescent current this device is very suitable for various
battery powered applications such as tablets, cellular phones,
wireless and many others. Each output is fully protected in
case of output overload, output short circuit condition and
overheating, assuring a very robust design. The NCP154
device is housed in XDFN−8 1.6 mm x 1.2 mm package
which is useful for space constrains application.
The both EN pin has internal pull−down current source
with typ. value of 300 nA which assures that the device is
turned−off when the EN pin is not connected. In the case
where the EN function isn’t required the EN should be tied
directly to IN.
Output Current Limit
Output Current is internally limited within the IC to a
typical 400 mA. The NCP154 will source this amount of
current measured with a voltage drops on the 90% of the
nominal V
. If the Output Voltage is directly shorted to
= 0 V), the short circuit protection will limit
OUT
Input Capacitor Selection (CIN)
ground (V
OUT
It is recommended to connect at least a 1 mF Ceramic X5R
or X7R capacitor as close as possible to the IN pin of the
device. This capacitor will provide a low impedance path for
unwanted AC signals or noise modulated onto constant
input voltage. There is no requirement for the min. or max.
ESR of the input capacitor but it is recommended to use
ceramic capacitors for their low ESR and ESL. A good input
capacitor will limit the influence of input trace inductance
and source resistance during sudden load current changes.
Larger input capacitor may be necessary if fast and large
load transients are encountered in the application.
the output current to 520 mA (typ). The current limit and
short circuit protection will work properly over whole
temperature range and also input voltage range. There is no
limitation for the short circuit duration. This protection
works separately for each channel. Short circuit on the one
channel do not influence second channel which will work
according to specification.
Thermal Shutdown
When the die temperature exceeds the Thermal Shutdown
threshold (T − 160°C typical), Thermal Shutdown event
SD
is detected and the affected channel is turn−off. Second
channel still working. The channel which is overheated will
remain in this state until the die temperature decreases below
Output Decoupling (COUT
)
The NCP154 requires an output capacitor for each output
connected as close as possible to the output pin of the
regulator. The recommended capacitor value is 1 mF and
X7R or X5R dielectric due to its low capacitance variations
over the specified temperature range. The NCP154 is
designed to remain stable with minimum effective
capacitance of 0.33 mF to account for changes with
temperature, DC bias and package size. Especially for small
package size capacitors such as 0201 the effective
capacitance drops rapidly with the applied DC bias.
the Thermal Shutdown Reset threshold (T
typical). Once the device temperature falls below the 140°C
the appropriate channel is enabled again. The thermal
− 140°C
SDU
shutdown feature provides the protection from
a
catastrophic device failure due to accidental overheating.
This protection is not intended to be used as a substitute for
proper heat sinking. The long duration of the short circuit
condition to some output channel could cause turn−off other
output when heat sinking is not enough and temperature of
There is no requirement for the minimum value of
the other output reach T temperature.
SD
Equivalent Series Resistance (ESR) for the C
but the
OUT
Power Dissipation
maximum value of ESR should be less than 3 W. Larger
output capacitors and lower ESR could improve the load
transient response or high frequency PSRR. It is not
recommended to use tantalum capacitors on the output due
to their large ESR. The equivalent series resistance of
tantalum capacitors is also strongly dependent on the
temperature, increasing at low temperature.
As power dissipated in the NCP154 increases, it might
become necessary to provide some thermal relief. The
maximum power dissipation supported by the device is
dependent upon board design and layout. Mounting pad
configuration on the PCB, the board material, and the
ambient temperature affect the rate of junction temperature
rise for the part.
The maximum power dissipation the NCP154 can handle
is given by:
Enable Operation
The NCP154 uses the dedicated EN pin for each output
channel. This feature allows driving outputs separately.
If the EN pin voltage is <0.4 V the device is guaranteed to
be disabled. The pass transistor is turned−off so that there is
virtually no current flow between the IN and OUT. The active
discharge transistor is active so that the output voltage V
is pulled to GND through a 50 W resistor. In the disable state
the device consumes as low as typ. 10 nA from the V .
o
ƪ
ƫ
125 C * TA
PD(MAX)
+
(eq. 1)
qJA
The power dissipated by the NCP154 for given
application conditions can be calculated from the following
equations:
OUT
ǒ
Ǔ
ǒ
Ǔ )
PD [ VIN1 @ IGND1 ) VIN2 @ IGND2
(eq. 2)
IN
ǒ
Ǔ
ǒ
Ǔ
) IOUT1 VIN1 * VOUT1 ) IOUT2 VIN2 * VOUT2
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15
NCP154
240
220
200
180
160
140
120
100
1.00
0.75
P
, T = 25°C, 2 oz Cu
D(MAX)
A
P , T = 25°C, 1 oz Cu
D(MAX) A
q
, 1 oz Cu
, 2 oz Cu
JA
q
JA
0.50
0.25
80
60
0
100
200
300
400
500
600
700
2
COPPER HEAT SPREADER AREA (mm )
Figure 56. qJA vs. Copper Area (XDFN-8)
Reverse Current
Turn−On Time
The PMOS pass transistor has an inherent body diode
which will be forward biased in the case that V > V .
The turn−on time is defined as the time period from EN
assertion to the point in which V will reach 98% of its
OUT
IN
OUT
Due to this fact in cases, where the extended reverse current
condition can be anticipated the device may require
additional external protection.
nominal value. This time is dependent on various
application conditions such as V , C , T .
OUT(NOM) OUT
A
PCB Layout Recommendations
To obtain good transient performance and good regulation
characteristics place input and output capacitors close to the
device pins and make the PCB traces wide. In order to
minimize the solution size, use 0402 capacitors. Larger
copper area connected to the pins will also improve the
device thermal resistance. The actual power dissipation can
be calculated from the equation above (Equation 2). Expose
pad should be tied the shortest path to the GND pin.
Power Supply Rejection Ratio
The NCP154 features very good Power Supply Rejection
ratio. If desired the PSRR at higher frequencies in the range
100 kHz – 10 MHz can be tuned by the selection of C
capacitor and proper PCB layout.
OUT
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16
NCP154
Table 5. ORDERING INFORMATION
Voltage Option*
†
(OUT1/OUT2)
2.8 V / 2.8 V
1.8 V / 2.8 V
3.3 V / 1.8 V
3.0 V / 1.8 V
3.3 V / 2.8 V
3.3 V / 3.3 V
3.3 V / 3.0 V
3.0 V / 3.0 V
1.0 V / 1.8 V
1.5 V / 2.8 V
1.8 V / 2.9 V
1.8 V / 3.0 V
2.8 V / 2.7 V
3.1 V / 3.1 V
3.3 V / 2.85 V
1.8 V / 2.7 V
Device
NCP154MX280280TAG
NCP154MX180280TAG
NCP154MX330180TAG
NCP154MX300180TAG
NCP154MX330280TAG
NCP154MX330330TAG
NCP154MX330300TAG
NCP154MX300300TAG
NCP154MX100180TAG
NCP154MX150280TAG
NCP154MX180290TAG
NCP154MX180300TAG
NCP154MX280270TAG
NCP154MX310310TAG
NCP154MX330285TAG
NCP154MX180270TAG
Marking
DA
Package
Shipping
DC
DD
DE
DF
DG
DH
DJ
XDFN−8
(Pb-Free)
3000 / Tape & Reel
DK
DL
DM
DN
DP
DQ
DR
DT
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*Contact factory for other voltage options. Output voltage range 1.0 V to 3.3 V with step 50 mV.
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17
NCP154
PACKAGE DIMENSIONS
XDFN8 1.6x1.2, 0.4P
CASE 711AS
ISSUE A
NOTES:
L
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
D
A
B
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
8X
L1
DETAIL A
MILLIMETERS
OPTIONAL
DIM
A
A1
b
MIN
0.30
0.00
0.13
MAX
0.45
0.05
0.23
CONSTRUCTION
E
PIN ONE
IDENTIFIER
EXPOSED Cu
MOLD CMPD
1.60 BSC
D
2X
0.10
C
1.20
1.20 BSC
1.40
D2
E
0.20
0.40 BSC
0.15
0.05 REF
0.40
E2
e
L
2X
0.10
C
TOP VIEW
DETAIL B
0.25
OPTIONAL
L1
A
CONSTRUCTION
DETAIL B
0.10
0.08
C
C
A1
8X
RECOMMENDED
MOUNTING FOOTPRINT*
SEATING
PLANE
NOTE 3
C
SIDE VIEW
D2
8X
0.35
1.44
PACKAGE
OUTLINE
DETAIL A
1
4
1.40
E2
8X
L1
1
0.44
0.40
PITCH
8X
0.26
8
5
DIMENSIONS: MILLIMETERS
8X b
8X
L
e
0.10
0.05
C
C
A
B
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
e/2
BOTTOM VIEW
Bluetooth is a registered trademark of Bluetooth SIG.
ZigBee is a registered trademark of ZigBee Alliance.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where
personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,
any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
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Phone: 81−3−5817−1050
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
For additional information, please contact your local
Sales Representative
NCP154/D
相关型号:
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