NCP160AMX500TBG [ONSEMI]
LDO 稳压器，250 mA， 超高 PSRR，超低噪音;
| 型号： | NCP160AMX500TBG |
| 厂家： | 
ONSEMI |
| 描述： | LDO 稳压器，250 mA， 超高 PSRR，超低噪音 稳压器 |
| 文件： | 总20页 (文件大小：800K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NCP160
250 mA, Ultra-Low Noise
and High PSRR LDO
Regulator for RF and
Analog Circuits
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The NCP160 is a linear regulator capable of supplying 250 mA
output current. Designed to meet the requirements of RF and analog
circuits, the NCP160 device provides low noise, high PSRR, low
quiescent current, and very good load/line transients. The device is
designed to work with a 1 mF input and a 1 mF output ceramic
capacitor. It is available in two thickness ultra−small 0.35P, 0.65 mm x
0.65 mm Chip Scale Package (CSP) and XDFN−4 0.65P, 1 mm x
1 mm.
MARKING
DIAGRAMS
X
A1
WLCSP4
CASE 567KA
Features
X
A1
• Operating Input Voltage Range: 1.9 V to 5.5 V
• Available in Fixed Voltage Option: 1.8 V to 5.14 V
WLCSP4
CASE 567JZ
•
2% Accuracy Over Load/Temperature
• Ultra Low Quiescent Current Typ. 18 mA
• Standby Current: Typ. 0.1 mA
1
XX M
XDFN4
CASE 711AJ
• Very Low Dropout: 80 mV at 250 mA
• Ultra High PSRR: Typ. 98 dB at 20 mA, f = 1 kHz
1
X or XX = Specific Device Code
• Ultra Low Noise: 10 mV
RMS
M
= Date Code
• Stable with a 1 mF Small Case Size Ceramic Capacitors
• Available in −WLCSP4 0.65 mm x 0.65 mm x 0.4 mm CASE 567KA
−WLCSP4 0.65 mm x 0.65 mm x 0.33 mm CASE 567JZ
−XDFN4 1 mm x 1 mm x 0.4 mm
PIN CONNECTIONS
IN
OUT
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
A2
A1
Typical Applications
B1
B2
• Battery−powered Equipment
• Wireless LAN Devices
EN
GND
• Smartphones, Tablets
(Top View)
• Cameras, DVRs, STB and Camcorders
V
V
OUT
IN
IN
OUT
NCP160
GND
C
1 mF
Ceramic
EN
IN
C
OUT
1 mF
Ceramic
ON
OFF
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information on page 16 of
this data sheet.
Figure 1. Typical Application Schematics
© Semiconductor Components Industries, LLC, 2015
1
Publication Order Number:
May, 2015 − Rev. 6
NCP160/D
NCP160
IN
ENABLE
LOGIC
THERMAL
EN
SHUTDOWN
BANDGAP
MOSFET
REFERENCE
INTEGRATED
SOFT−START
DRIVER WITH
CURRENT LIMIT
OUT
* ACTIVE DISCHARGE
Version A only
EN
GND
Figure 2. Simplified Schematic Block Diagram
PIN FUNCTION DESCRIPTION
Pin No.
CSP4
Pin No.
XDFN4
Pin
Name
Description
A1
A2
B1
B2
−
4
IN
Input voltage supply pin
1
3
OUT
EN
Regulated output voltage. The output should be bypassed with small 1 mF ceramic capacitor.
Chip enable: Applying V < 0.4 V disables the regulator, Pulling V > 1.2 V enables the LDO.
EN
EN
2
GND
EPAD
Common ground connection
EPAD
Expose pad can be tied to ground plane for better power dissipation
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
Unit
V
Input Voltage (Note 1)
V
IN
−0.3 V to 6
Output Voltage
V
OUT
−0.3 to V + 0.3, max. 6 V
V
IN
Chip Enable Input
V
−0.3 to V + 0.3, max. 6 V
V
CE
SC
IN
Output Short Circuit Duration
Maximum Junction Temperature
Storage Temperature
t
unlimited
150
s
T
°C
°C
V
J
T
STG
−55 to 150
2000
ESD Capability, Human Body Model (Note 2)
ESD Capability, Machine Model (Note 2)
ESD
HBM
ESD
200
V
MM
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per EIA/JESD22−A114
ESD Machine Model tested per EIA/JESD22−A115
Latchup Current Maximum Rating tested per JEDEC standard: JESD78.
THERMAL CHARACTERISTICS
Rating
Symbol
Value
Unit
Thermal Characteristics, CSP4 (Note 3)
108
Thermal Resistance, Junction−to−Air
R
°C/W
q
JA
Thermal Characteristics, XDFN4 (Note 3)
Thermal Resistance, Junction−to−Air
198.1
3. Measured according to JEDEC board specification. Detailed description of the board can be found in JESD51−7
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2
NCP160
ELECTRICAL CHARACTERISTICS −40°C ≤ T ≤ 125°C; V = V
+ 1 V; I
= 1 mA, C = C
= 1 mF, unless otherwise
J
IN
OUT(NOM)
OUT
IN
OUT
noted. V = 1.2 V. Typical values are at T = +25°C (Note 4).
EN
J
Parameter
Test Conditions
Symbol
Min
Typ
Max
Unit
Operating Input Voltage
Output Voltage Accuracy
V
1.9
5.5
V
IN
V
= V
+ 1 V
≤ 250 mA
IN
OUT(NOM)
OUT
V
OUT
−2
+2
%
0 mA ≤ I
Line Regulation
Load Regulation
V
+ 1 V ≤ V ≤ 5.5 V
Line
Reg
0.02
0.001
180
110
95
%/V
OUT(NOM)
IN
I
= 1 mA to 250 mA
Load
%/mA
OUT
Reg
V
V
V
= 1.8 V
= 2.5 V
= 2.8 V
= 2.85 V
= 3.0 V
= 3.3 V
= 3.5 V
= 4.5 V
= 5.0 V
= 5.14 V
250
175
160
160
155
145
140
120
105
105
OUT(NOM)
OUT(NOM)
OUT(NOM)
V
95
OUT(NOM)
V
90
OUT(NOM)
OUT(NOM)
OUT(NOM)
OUT(NOM)
OUT(NOM)
Dropout Voltage (Note 5)
I
= 250 mA
V
DO
mV
OUT
V
80
V
V
V
75
65
75
V
60
OUT(NOM)
Output Current Limit
Short Circuit Current
Quiescent Current
V
V
= 90% V
I
250
1.2
700
690
18
OUT
OUT(NOM)
CL
mA
V
OUT
= 0 V
I
SC
I
= 0 mA
I
23
1
mA
mA
OUT
Q
Shutdown Current
≤ 0.4 V, V = 4.8 V
I
0.01
EN
IN
DIS
EN Pin Threshold Voltage
EN Input Voltage “H”
EN Input Voltage “L”
V
ENH
V
V
ENL
0.4
0.5
EN Pull Down Current
Turn−On Time
V
EN
= 4.8 V
I
0.2
mA
ms
EN
C
= 1 mF, From assertion of V to
EN
V
OUT
120
= 95% V
OUT
OUT(NOM)
Power Supply Rejection Ratio
I
= 20 mA
f = 100 Hz
91
98
82
48
OUT
f = 1 kHz
f = 10 kHz
f = 100 kHz
PSRR
dB
Output Voltage Noise
f = 10 Hz to 100 kHz
I
= 1 mA
= 250 mA
14
10
OUT
V
N
mV
RMS
I
OUT
Thermal Shutdown Threshold
Temperature rising
Temperature falling
T
160
140
280
°C
°C
W
SDH
T
SDL
Active Output Discharge Resistance
Line Transient (Note 6)
V
< 0.4 V, Version A only
R
DIS
EN
V
IN
= (V
+ 1 V) to (V
+
OUT(NOM)
OUT(NOM)
−1
1.6 V) in 30 ms, I
= 1 mA
OUT
Tran
mV
mV
LINE
V
IN
= (V
+ 1.6 V) to (V
+
OUT(NOM)
OUT(NOM)
+1
1 V) in 30 ms, I
= 1 mA
OUT
Load Transient (Note 6)
−40
I
= 1 mA to 200 mA in 10 ms
= 200 mA to 1mA in 10 ms
OUT
Tran
LOAD
I
+40
OUT
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Performance guaranteed over the indicated operating temperature range by design and/or characterization. Production tested at T = 25°C.
A
Low duty cycle pulse techniques are used during the testing to maintain the junction temperature as close to ambient as possible.
5. Dropout voltage is characterized when V
6. Guaranteed by design.
falls 100 mV below V
.
OUT
OUT(NOM)
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3
NCP160
TYPICAL CHARACTERISTICS
1.820
1.815
1.810
1.805
1.800
1.795
1.790
2.520
2.515
2.510
2.505
2.500
2.495
2.490
I
I
= 10 mA
OUT
I
I
= 10 mA
OUT
= 250 mA
= 250 mA
OUT
OUT
V
V
C
C
= 2.8 V
V
V
C
C
= 3.5 V
IN
IN
= 1.8 V
= 2.5 V
= 1 mF
OUT
OUT
= 1 mF
IN
IN
1.785
1.780
2.485
2.480
= 1 mF
= 1 mF
OUT
OUT
−40 −20
0
20
40
60
80 100 120 140
−40 −20
0
20
40
60
80
100 120 140
T , JUNCTION TEMPERATURE (°C)
J
T , JUNCTION TEMPERATURE (°C)
J
Figure 3. Output Voltage vs. Temperature −
OUT = 1.8 V − XDFN Package
Figure 4. Output Voltage vs. Temperature −
VOUT = 2.5 V − XDFN Package
V
3.33
3.32
3.35
3.34
3.31
3.30
3.29
3.28
3.27
3.33
3.32
3.31
3.30
3.29
I
= 10 mA
I
= 10 mA and 250 mA
OUT
OUT
I
= 250 mA
OUT
V
V
C
C
= 4.3 V
V
V
C
C
= 4.3 V
IN
IN
= 3.3 V
= 1 mF
= 3.3 V
= 1 mF
OUT
OUT
IN
IN
3.26
3.25
3.28
3.27
= 1 mF
= 1 mF
OUT
OUT
−40 −20
0
20
40
60
80
100 120 140
−40 −20
0
20
40
60
80 100 120 140
T , JUNCTION TEMPERATURE (°C)
J
T , JUNCTION TEMPERATURE (°C)
J
Figure 5. Output Voltage vs. Temperature −
OUT = 3.3 V − XDFN Package
Figure 6. Output Voltage vs. Temperature −
VOUT = 3.3 V − CSP Package
V
5.19
5.18
0.010
0.009
0.008
0.007
0.006
0.005
0.004
0.003
0.002
5.17
5.16
5.15
5.14
5.13
I
= 10 mA
OUT
I
= 250 mA
OUT
V
V
C
C
= 2.8 V
IN
V
V
C
C
= 5.5 V
IN
= 1.8 V
= 1 mF
OUT
= 5.14 V
= 1 mF
OUT
IN
IN
5.12
5.11
0.001
0
= 1 mF
OUT
= 1 mF
OUT
−40 −20
0
20
40
60
80 100 120 140
−40 −20
0
20
40
60
80 100 120 140
T , JUNCTION TEMPERATURE (°C)
J
T , JUNCTION TEMPERATURE (°C)
J
Figure 7. Output Voltage vs. Temperature −
VOUT = 5.14 V − XDFN Package
Figure 8. Line Regulation vs. Temperature −
VOUT = 1.8 V
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NCP160
TYPICAL CHARACTERISTICS
0.010
0.009
0.008
0.007
0.006
0.005
0.004
0.003
0.002
0.020
V
V
C
C
= 4.3 V
V
V
C
C
= 5.5 V
0.018
0.016
0.014
0.012
0.010
0.008
0.006
0.004
IN
IN
= 3.3 V
= 1 mF
= 5.14 V
= 1 mF
OUT
OUT
IN
IN
= 1 mF
= 1 mF
OUT
OUT
0.001
0
0.002
0
−40 −20
0
20
40
60
80
100 120 140
−40 −20
0
20
40
60
80 100 120 140
T , JUNCTION TEMPERATURE (°C)
J
T , JUNCTION TEMPERATURE (°C)
J
Figure 9. Line Regulation vs. Temperature −
OUT = 3.3 V
Figure 10. Line Regulation vs. Temperature −
VOUT = 5.14 V
V
0.0020
0.0018
0.0016
0.0014
0.0012
0.0010
0.0008
0.0006
0.0020
0.0018
0.0016
0.0014
0.0012
0.0010
0.0008
0.0006
0.0004
V
V
C
C
= 2.8 V
V
V
C
C
= 4.3 V
IN
IN
= 1.8 V
= 1 mF
= 3.3 V
= 1 mF
OUT
OUT
0.0004
IN
IN
= 1 mF
0.0002
0
= 1 mF
0.0002
0
OUT
OUT
−40 −20
0
20
40
60
80 100 120 140
−40 −20
0
20
40
60
80 100 120 140
T , JUNCTION TEMPERATURE (°C)
J
T , JUNCTION TEMPERATURE (°C)
J
Figure 11. Load Regulation vs. Temperature −
OUT = 1.8 V
Figure 12. Load Regulation vs. Temperature −
VOUT = 3.3 V
V
0.0020
0.0018
0.0016
0.0014
0.0012
0.0010
0.0008
0.0006
0.0004
1.50
1.35
1.20
1.05
0.90
0.75
0.60
0.45
0.30
V
V
C
C
= 5.5 V
IN
= 5.14 V
= 1 mF
OUT
IN
T = 125°C
= 1 mF
J
OUT
T = 25°C
J
T = −40°C
J
V
V
C
C
= 2.8 V
IN
= 1.8 V
= 1 mF
OUT
IN
0.0002
0
0.15
0
= 1 mF
OUT
−40 −20
0
20
40
60
80 100 120 140
0
25 50 75 100 125 150 175 200 225 250
, OUTPUT CURRENT (mA)
T , JUNCTION TEMPERATURE (°C)
I
OUT
J
Figure 13. Load Regulation vs. Temperature −
VOUT = 5.14 V
Figure 14. Ground Current vs. Load Current −
VOUT = 1.8 V
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NCP160
TYPICAL CHARACTERISTICS
1.50
1.35
1.20
1.05
0.90
0.75
0.60
0.45
0.30
1.50
1.35
1.20
T = 125°C
J
T = 125°C
1.05
0.90
0.75
0.60
0.45
0.30
J
T = 25°C
J
T = 25°C
J
T = −40°C
J
T = −40°C
J
V
V
= 5.5 V
V
V
= 4.3 V
IN
IN
= 5.14 V
= 3.3 V
OUT
OUT
C
C
= 1 mF
C
C
= 1 mF
IN
IN
0.15
0
0.15
0
= 1 mF
= 1 mF
OUT
OUT
0
0
0
25 50 75 100 125 150 175 200 225 250
, OUTPUT CURRENT (mA)
0
25 50 75 100 125 150 175 200 225 250
, OUTPUT CURRENT (mA)
I
I
OUT
OUT
Figure 15. Ground Current vs. Load Current −
Figure 16. Ground Current vs. Load Current −
VOUT = 5.14 V
V
OUT = 3.3 V
150
135
120
105
90
250
225
200
175
150
T = 125°C
J
T = 25°C
J
T = 125°C
J
125
100
75
75
60
T = 25°C
J
T = −40°C
J
45
T = −40°C
J
V
C
C
= 1.8 V
= 1 mF
= 1 mF
V
OUT
= 3.3 V
OUT
50
30
C
C
= 1 mF
IN
OUT
IN
25
0
15
0
= 1 mF
OUT
25 50 75 100 125 150 175 200 225 250
, OUTPUT CURRENT (mA)
0
25 50 75 100 125 150 175 200 225 250
, OUTPUT CURRENT (mA)
I
I
OUT
OUT
Figure 17. Dropout Voltage vs. Load Current −
OUT = 1.8 V
Figure 18. Dropout Voltage vs. Load Current −
VOUT = 3.3 V
V
150
135
120
105
90
250
225
200
175
150
125
100
75
I
= 250 mA
OUT
V
OUT
= 1.8 V
T = 125°C
J
75
C
C
= 1 mF
IN
60
= 1 mF
T = 25°C
J
OUT
45
T = −40°C
J
I
= 0 mA
V
OUT
= 5.14 V
OUT
30
50
C
C
= 1 mF
IN
15
0
25
0
= 1 mF
OUT
25 50 75 100 125 150 175 200 225 250
, OUTPUT CURRENT (mA)
−40 −20
0
20
40
60
80
100 120 140
I
T , JUNCTION TEMPERATURE (°C)
J
OUT
Figure 19. Dropout Voltage vs. Load Current −
VOUT = 5.14 V
Figure 20. Dropout Voltage vs. Temperature−
VOUT = 1.8 V
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NCP160
TYPICAL CHARACTERISTICS
200
180
160
140
120
100
80
150
135
120
XDFN
105
90
75
60
45
30
15
0
XDFN
CSP4
Package
CSP4
60
Package
40
20
0
0
25 50 75 100 125 150 175 200 225 250
0
25 50 75 100 125 150 175 200 225 250
I , OUTPUT CURRENT (mA)
OUT
I , OUTPUT CURRENT (mA)
OUT
Figure 21. Comparison Dropout for XDFN and
CSP – 1.8 V
Figure 22. Comparison Dropout for XDFN and
CSP – 3.3 V
100
80
60
40
20
0
XDFN
CSP4
Package
0
25 50 75 100 125 150 175 200 225 250
, OUTPUT CURRENT (mA)
I
OUT
Figure 23. Comparison Dropout for XDFN and
CSP – 5.14 V
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NCP160
TYPICAL CHARACTERISTICS
150
135
120
105
90
100
90
I
= 250 mA
OUT
80
I
= 250 mA
OUT
70
60
50
40
30
20
I
= 0 mA
OUT
75
60
I
= 0 mA
= 3.3 V
OUT
45
V
C
C
= 5.14 V
V
C
C
OUT
OUT
30
= 1 mF
= 1 mF
IN
OUT
IN
OUT
15
0
10
0
= 1 mF
= 1 mF
−40 −20
0
20
40
60
80
100 120 140
−40 −20
0
20
40
60
80
100 120 140
T , JUNCTION TEMPERATURE (°C)
J
T , JUNCTION TEMPERATURE (°C)
J
Figure 24. Dropout Voltage vs. Temperature−
OUT = 3.3 V
Figure 25. Dropout Voltage vs. Temperature−
VOUT = 5.14 V
V
750
740
730
720
710
700
690
700
690
680
670
660
650
640
630
620
V
V
C
C
= 4.3 V
IN
680
670
V
V
C
C
= 4.3 V
IN
= 0 V (Short)
= 1 mF
OUT
= 90% V
OUT
OUT(nom)
IN
= 1 mF
IN
= 1 mF
660
650
610
600
OUT
= 1 mF
OUT
−40 −20
0
20
40
60
80
100 120 140
−40 −20
0
20
40
60
80 100 120 140
T , JUNCTION TEMPERATURE (°C)
J
T , JUNCTION TEMPERATURE (°C)
J
Figure 26. Current Limit vs. Temperature
Figure 27. Short Circuit Current vs.
Temperature
1.0
0.9
0.50
0.45
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.40
0.35
0.30
0.25
0.20
0.15
0.10
OFF −> ON
ON −> OFF
V
V
C
C
= 4.3 V
V
V
C
C
= 4.3 V
IN
IN
= 3.3 V
= 1 mF
= 3.3 V
OUT
OUT
= 1 mF
= 1 mF
OUT
IN
IN
0.1
0
= 1 mF
0.05
0
OUT
−40 −20
0
20
40
60
80
100 120 140
−40 −20
0
20
40
60
80 100 120 140
T , JUNCTION TEMPERATURE (°C)
J
T , JUNCTION TEMPERATURE (°C)
J
Figure 28. Enable Threshold Voltage vs.
Temperature
Figure 29. Enable Current Temperature
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NCP160
TYPICAL CHARACTERISTICS
100
90
80
70
60
50
40
30
20
300
290
280
270
260
250
240
230
220
V
V
C
C
= 4.3 V
IN
= 3.3 V
= 1 mF
OUT
IN
= 1 mF
OUT
V
V
C
C
= 4.3 V
IN
= 3.3 V
= 1 mF
OUT
IN
10
0
210
200
= 1 mF
OUT
−40 −20
0
20
40
60
80
100 120 140
−40 −20
0
20
40
60
80
100 120 140
T , JUNCTION TEMPERATURE (°C)
J
T , JUNCTION TEMPERATURE (°C)
J
Figure 30. Disable Current vs. Temperature
Figure 31. Discharge Resistivity vs.
Temperature
10,000
1000
100
I
= 250 mA
OUT
I
= 10 mA
OUT
RMS Output Noise (mV)
I
= 1 mA
I
10 Hz − 100 kHz
14.62
100 Hz − 100 kHz
OUT
OUT
1 mA
10 mA
250 mA
14.10
10.48
9.82
11.12
V
V
C
C
= 2.8 V
10.37
IN
= 1.8 V
= 1 mF
10
1
OUT
IN
= 1 mF
OUT
0.01
0.1
1
10
100
1000
FREQUENCY (kHz)
Figure 32. Output Voltage Noise Spectral Density − VOUT = 1.8 V
10,000
1000
100
I
= 250 mA
OUT
I
= 10 mA
OUT
RMS Output Noise (mV)
I
= 1 mA
OUT
I
10 Hz − 100 kHz
16.9
100 Hz − 100 kHz
15.79
OUT
1 mA
10 mA
250 mA
12.64
11.13
11.96
10.64
V
V
C
C
= 4.3 V
IN
10
1
= 3.3 V
= 1 mF
OUT
IN
= 1 mF
OUT
0.01
0.1
1
10
100
1000
FREQUENCY (kHz)
Figure 33. Output Voltage Noise Spectral Density − VOUT = 3.3 V
www.onsemi.com
9
NCP160
TYPICAL CHARACTERISTICS
120
100
80
120
I = 10 mA
OUT
I
= 10 mA
OUT
V
V
C
= 2.5 V
V
V
C
= 3.6 V
IN
IN
= 1.8 V
= 3.3 V
100
80
OUT
OUT
= 1 mF
= 1 mF
OUT
OUT
60
60
I
= 20 mA
I
= 20 mA
OUT
OUT
40
40
I
= 100 mA
I
= 100 mA
OUT
OUT
20
0
20
0
I
= 250 mA
0.1
I
= 250 mA
0.1
OUT
OUT
0.01
1
10
100
1k
10k
0.01
1
10
100
1k
10k
FREQUENCY (kHz)
FREQUENCY (kHz)
Figure 34. Power Supply Rejection Ratio,
OUT = 1.8 V
Figure 35. Power Supply Rejection Ratio,
VOUT = 3.3 V
V
100
90
100
10
I
= 10 mA
OUT
V
V
C
= 5.5 V
IN
= 5.14 V
OUT
80
= 1 mF
OUT
Unstable Operation
Stable Operation
70
60
50
40
30
20
I
= 20 mA
OUT
1
I
= 100 mA
OUT
I
= 250 mA
0.1
OUT
10
0
0.1
0.01
1
10
100
1k
10k
0
50
100
150
200
250
300
FREQUENCY (kHz)
I , OUTPUT CURRENT (mA)
OUT
Figure 36. Power Supply Rejection Ratio,
OUT = 5.14 V
Figure 37. Stability vs. ESR
V
V
EN
V
EN
I
I
INPUT
INPUT
V
C
C
= 2.8 V, V
= 1.8 V
V
C
C
= 2.8 V, V
= 1.8 V
IN
OUT
IN
OUT
V
OUT
V
OUT
= 1 mF (MLCC)
= 1 mF (MLCC)
= 1 mF (MLCC)
= 1 mF (MLCC)
IN
IN
OUT
OUT
100 ms/div
100 ms/div
Figure 38. Enable Turn−on Response −
OUT = 1 mF, IOUT = 10 mA
Figure 39. Enable Turn−on Response −
C
COUT = 1 mF, IOUT = 250 mA
www.onsemi.com
10
NCP160
TYPICAL CHARACTERISTICS
4.8 V
3.3 V
3.8 V
V
IN
2.3 V
V
IN
V
OUT
V
OUT
V
C
C
= 1.8 V, I
= 1 mF (MLCC)
= 1 mF (MLCC)
= 10 mA
V
C
C
= 3.3 V, I
= 1 mF (MLCC)
= 1 mF (MLCC)
= 10 mA
OUT
OUT
OUT
OUT
IN
IN
OUT
OUT
20 ms/div
20 ms/div
Figure 40. Line Transient Response −
OUT = 1.8 V
Figure 41. Line Transient Response −
VOUT = 3.3 V
V
5.5 V
V
IN
V
IN
5.3 V
V
OUT
V
OUT
V
C
C
= 5.14 V, I
= 1 mF (MLCC)
= 1 mF (MLCC)
= 10 mA
OUT
OUT
IN
V
= 2.8 V, C = 1 mF (MLCC),
OUT IN
I
= 10 mA, C
= 1 mF (MLCC)
OUT
OUT
OUT
20 ms/div
4 ms/div
Figure 42. Line Transient Response −
Figure 43. Turn−on/off − Slow Rising VIN
V
OUT = 5.14 V
I
OUT
I
t
= 1 ms
OUT
RISE
t
= 1 ms
FALL
V
OUT
V
OUT
V
IN
= 2.8 V, V
= 1.8 V
V
IN
= 2.8 V, V
= 1.8 V
OUT
OUT
C
C
= 1 mF (MLCC)
= 1 mF (MLCC)
C
C
= 1 mF (MLCC)
= 1 mF (MLCC)
IN
IN
OUT
OUT
4 ms/div
20 ms/div
Figure 44. Load Transient Response −
1 mA to 250 mA − VOUT = 1.8 V
Figure 45. Load Transient Response −
250 mA to 1 mA − VOUT = 1.8 V
www.onsemi.com
11
NCP160
TYPICAL CHARACTERISTICS
I
OUT
I
OUT
t
= 1 ms
RISE
t
= 1 ms
FALL
V
OUT
V
OUT
V
IN
= 4.3 V, V
= 3.3 V
V
IN
= 4.3 V, V
= 3.3 V
OUT
OUT
C
C
= 1 mF (MLCC)
= 1 mF (MLCC)
C
C
= 1 mF (MLCC)
= 1 mF (MLCC)
IN
IN
OUT
OUT
4 ms/div
20 ms/div
Figure 46. Load Transient Response −
1 mA to 250 mA − VOUT = 3.3 V
Figure 47. Load Transient Response −
250 mA to 1 mA − VOUT = 3.3 V
I
OUT
I
OUT
t
= 1 ms
RISE
t
= 1 ms
FALL
V
OUT
V
OUT
V
IN
= 5.5 V, V
= 5.14 V
V
IN
= 5.5 V, V
= 5.14 V
OUT
OUT
C
C
= 1 mF (MLCC)
= 1 mF (MLCC)
C
C
= 1 mF (MLCC)
= 1 mF (MLCC)
IN
IN
OUT
OUT
4 ms/div
20 ms/div
Figure 48. Load Transient Response −
1 mA to 250 mA − VOUT = 5.14 V
Figure 49. Load Transient Response −
250 mA to 1 mA − VOUT = 5.14 V
Short Circuit Event
Overheating
V
EN
TSD Cycling
I
OUT
V
OUT
V
V
= 3.8 V
Thermal Shutdown
V
OUT
IN
C
= 4.7 mF
V
IN
= 5.5 V, V
= 3.3 V
OUT
= 2.8 V
OUT
OUT
C
= 1 mF (MLCC)
C
= 1 mF (MLCC)
IN
IN
C
= 1 mF (MLCC)
OUT
C
= 1 mF
OUT
10 ms/div
400 ms/div
Figure 50. Short Circuit and Thermal
Shutdown
Figure 51. Enable Turn−off
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12
NCP160
APPLICATIONS INFORMATION
General
transient response or high frequency PSRR. It is not
The NCP160 is an ultra−low noise 250 mA low dropout
recommended to use tantalum capacitors on the output due
to their large ESR. The equivalent series resistance of
tantalum capacitors is also strongly dependent on the
temperature, increasing at low temperature.
regulator designed to meet the requirements of RF
applications and high performance analog circuits. The
NCP160 device provides very high PSRR and excellent
dynamic response. In connection with low quiescent current
this device is well suitable for battery powered application
such as cell phones, tablets and other. The NCP160 is fully
protected in case of current overload, output short circuit and
overheating.
Enable Operation
The NCP160 uses the EN pin to enable/disable its device
and to deactivate/activate the active discharge function.
If the EN pin voltage is <0.4 V the device is guaranteed to
be disabled. The pass transistor is turned−off so that there is
virtually no current flow between the IN and OUT. The
active discharge transistor is active so that the output voltage
Input Capacitor Selection (CIN)
Input capacitor connected as close as possible is necessary
for ensure device stability. The X7R or X5R capacitor
should be used for reliable performance over temperature
range. The value of the input capacitor should be 1 mF or
greater to ensure the best dynamic performance. This
capacitor will provide a low impedance path for unwanted
AC signals or noise modulated onto constant input voltage.
There is no requirement for the ESR of the input capacitor
but it is recommended to use ceramiccapacitors for their low
ESR and ESL. A good input capacitor will limit the
influence of input trace inductance and source resistance
during sudden load current changes.
V
OUT
is pulled to GND through a 280 Ω resistor. In the
disable state the device consumes as low as typ. 10 nA from
the V .
IN
If the EN pin voltage >1.2 V the device is guaranteed to
be enabled. The NCP160 regulates the output voltage and
the active discharge transistor is turned−off.
The EN pin has internal pull−down current source with
typ. value of 200 nA which assures that the device is
turned−off when the EN pin is not connected. In the case
where the EN function isn’t required the EN should be tied
directly to IN.
Output Decoupling (COUT
)
Output Current Limit
The NCP160 requires an output capacitor connected as
close as possible to the output pin of the regulator. The
recommended capacitor value is 1 mF and X7R or X5R
dielectric due to its low capacitance variations over the
specified temperature range. The NCP160 is designed to
remain stable with minimum effective capacitance of 0.7 mF
to account for changes with temperature, DC bias and
package size. Especially for small package size capacitors
such as 0201 the effective capacitance drops rapidly with the
applied DC bias. Please refer Figure 52.
Output Current is internally limited within the IC to a
typical 700 mA. The NCP60 will source this amount of
current measured with a voltage drops on the 90% of the
nominal V
. If the Output Voltage is directly shorted to
= 0 V), the short circuit protection will limit
OUT
ground (V
OUT
the output current to 690 mA (typ). The current limit and
short circuit protection will work properly over whole
temperature range and also input voltage range. There is no
limitation for the short circuit duration.
Thermal Shutdown
When the die temperature exceeds the Thermal Shutdown
threshold (T * 160°C typical), Thermal Shutdown event
SD
is detected and the device is disabled. The IC will remain in
this state until the die temperature decreases below the
Thermal Shutdown Reset threshold (T
− 140°C typical).
SDU
Once the IC temperature falls below the 140°C the LDO is
enabled again. The thermal shutdown feature provides the
protection from a catastrophic device failure due to
accidental overheating. This protection is not intended to be
used as a substitute for proper heat sinking.
Power Dissipation
As power dissipated in the NCP160 increases, it might
become necessary to provide some thermal relief. The
maximum power dissipation supported by the device is
dependent upon board design and layout. Mounting pad
configuration on the PCB, the board material, and the
ambient temperature affect the rate of junction temperature
rise for the part.
Figure 52. Capacity vs DC Bias Voltage
There is no requirement for the minimum value of
Equivalent Series Resistance (ESR) for the C
but the
OUT
maximum value of ESR should be less than 2 W. Larger
output capacitors and lower ESR could improve the load
www.onsemi.com
13
NCP160
The maximum power dissipation the NCP160 can handle
The power dissipated by the NCP160 for given
application conditions can be calculated from the following
equations:
is given by:
o
ƪ
ƫ
125 C * TA
PD(MAX)
+
(eq. 1)
ǒ
Ǔ
(eq. 2)
PD [ VIN @ IGND ) IOUT VIN * VOUT
qJA
160
150
140
130
120
110
100
90
1.6
P
P
, T = 25°C, 2 oz Cu
D(MAX)
A
1.4
, T = 25°C, 1 oz Cu
1.2
1.0
0.8
0.6
0.4
D(MAX)
A
q
, 1 oz Cu
JA
JA
q
, 2 oz Cu
500
0.2
0
80
0
100
200
300
400
600
700
2
PCB COPPER AREA (mm )
Figure 53. qJA and PD (MAX) vs. Copper Area (CSP4)
220
210
200
190
180
170
160
1.0
0.9
q
, 2 oz Cu
JA
0.8
0.7
0.6
0.5
q
, 1 oz Cu
JA
P
P
, T = 25°C, 2 oz Cu
D(MAX)
A
, T = 25°C, 1 oz Cu
D(MAX)
A
0.4
0.3
150
0
100
200
300
400
500
600
700
2
PCB COPPER AREA (mm )
Figure 54. qJA and PD (MAX) vs. Copper Area (XDFN44)
www.onsemi.com
14
NCP160
Reverse Current
Turn−On Time
The PMOS pass transistor has an inherent body diode
which will be forward biased in the case that V > V .
The turn−on time is defined as the time period from EN
assertion to the point in which V will reach 98% of its
OUT
IN
OUT
Due to this fact in cases, where the extended reverse current
condition can be anticipated the device may require
additional external protection.
nominal value. This time is dependent on various
application conditions such as V , C , T .
OUT(NOM) OUT
A
PCB Layout Recommendations
To obtain good transient performance and good regulation
characteristics place C and C capacitors close to the
Power Supply Rejection Ratio
The NCP160 features very high Power Supply Rejection
ratio. If desired the PSRR at higher frequencies in the range
100 kHz – 10 MHz can be tuned by the selection of C
capacitor and proper PCB layout.
IN
OUT
device pins and make the PCB traces wide. In order to
minimize the solution size, use 0402 or 0201 capacitors with
appropriate capacity. Larger copper area connected to the
pins will also improve the device thermal resistance. The
actual power dissipation can be calculated from the equation
above (Equation 2). Expose pad can be tied to the GND pin
for improvement power dissipation and lower device
temperature.
OUT
www.onsemi.com
15
NCP160
ORDERING INFORMATION
Nominal
Output
Voltage
†
Device
Description
Marking
Rotation
0°
Package
Shipping
NCP160AFCS180T2G
NCP160AFCS250T2G
NCP160AFCS280T2G
NCP160AFCS285T2G
NCP160AFCS300T2G
NCP160AFCS320T2G
NCP160AFCS330T2G
NCP160AFCS350T2G
NCP160AFCS450T2G
NCP160AFCS500T2G
NCP160AFCS514T2G
NCP160BFCS180T2G
NCP160BFCS250T2G
NCP160BFCS280T2G
NCP160BFCS285T2G
NCP160BFCS300T2G
NCP160BFCS330T2G
NCP160BFCS350T2G
NCP160BFCS450T2G
NCP160BFCS500T2G
NCP160BFCS514T2G
NCP160AFCT180T2G
NCP160AFCT250T2G
NCP160AFCT280T2G
NCP160AFCT285T2G
NCP160AFCT300T2G
NCP160AFCT330T2G
NCP160AFCT350T2G
NCP160AFCT450T2G
NCP160AFCT500T2G
NCP160AFCT514T2G
NCP160BFCT180T2G
NCP160BFCT210T2G
NCP160BFCT250T2G
NCP160BFCT280T2G
NCP160BFCT285T2G
NCP160BFCT300T2G
NCP160BFCT330T2G
NCP160BFCT350T2G
NCP160BFCT450T2G
NCP160BFCT500T2G
NCP160BFCT514T2G
1.8 V
2.5 V
2.8 V
2.85 V
3.0 V
3.2 V
3.3 V
3.5 V
4.5 V
5.0 V
5.14 V
1.8 V
2.5 V
2.8 V
2.85 V
3.0 V
3.3 V
3.5 V
4.5 V
5.0 V
5.14 V
1.8 V
2.5 V
2.8 V
2.85 V
3.0 V
3.3 V
3.5 V
4.5 V
5.0 V
5.14 V
1.8 V
2.1 V
2.5 V
2.8 V
2.85 V
3.0 V
3.3 V
3.5 V
4.5 V
5.0 V
5.14 V
A
D
E
F
J
0°
0°
0°
0°
WLCSP4
CASE 567KA
(Pb-Free)
5000 /
Tape &
Reel
V
K
L
0°
250 mA, Active Discharge
0°
0°
P
R
Q
A
D
E
F
J
0°
0°
0°
90°
90°
90°
90°
90°
90°
90°
90°
90°
90°
0°
WLCSP4
CASE 567KA
(Pb-Free)
5000 /
Tape &
Reel
250 mA, Non-Active
Discharge
K
L
P
R
Q
A
D
E
F
J
0°
0°
0°
WLCSP4
CASE 567JZ
(Pb-Free)
5000 /
Tape &
Reel
0°
250 mA, Active Discharge
K
L
0°
0°
P
R
Q
A
T
D
E
F
J
0°
0°
0°
90°
90°
90°
90°
90°
90°
90°
90°
90°
90°
90°
WLCSP4
CASE 567JZ
(Pb-Free)
5000 /
Tape &
Reel
250 mA, Non-Active
Discharge
K
L
P
R
Q
www.onsemi.com
16
NCP160
ORDERING INFORMATION
Device
Nominal Output Voltage
Description
Marking
DF
Package
Shipping
NCP160AMX180TBG
NCP160AMX250TBG
NCP160AMX280TBG
NCP160AMX285TBG
NCP160AMX300TBG
NCP160AMX320TBG
NCP160AMX330TBG
NCP160AMX350TBG
NCP160AMX450TBG
NCP160AMX500TBG
NCP160AMX514TBG
NCP160BMX180TBG
NCP160BMX250TBG
NCP160BMX280TBG
NCP160BMX285TBG
NCP160BMX300TBG
NCP160BMX330TBG
NCP160BMX350TBG
NCP160BMX450TBG
NCP160BMX500TBG
NCP160BMX514TBG
1.8 V
2.5 V
2.8 V
2.85 V
3.0 V
3.2 V
3.3 V
3.5 V
4.5 V
5.0 V
5.14 V
1.8 V
2.5 V
2.8 V
2.85 V
3.0 V
3.3 V
3.5 V
4.5 V
5.0 V
5.14 V
DG
DH
DJ
3000 /
Tape &
Reel
(Available
Soon)
DK
DY
DA
DL
XDFN-4
250 mA, Active Discharge
(Pb-Free)
DM
DW
DC
EF
EG
EH
EJ
3000 /
Tape &
Reel
(Available
Soon)
EK
XDFN-4
250 mA, Non-Active Discharge
(Pb-Free)
EA
EL
EM
EW
EC
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
www.onsemi.com
17
NCP160
PACKAGE DIMENSIONS
WLCSP4, 0.64x0.64
CASE 567KA
ISSUE O
NOTES:
A
D
B
E
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
PIN A1
REFERENCE
2X
0.05
0.05
C
C
MILLIMETERS
DIM
A
A1
A2
b
D
E
e
MIN
0.35
0.14
MAX
0.45
0.18
2X
TOP VIEW
0.25 REF
0.185
0.215
A2
0.64 BSC
0.64 BSC
0.35 BSC
0.05
C
C
A
0.05
RECOMMENDED
SOLDERING FOOTPRINT*
A1
SEATING
PLANE
NOTE 3
C
SIDE VIEW
PACKAGE
OUTLINE
A1
e
4X
b
4X0.20
e
0.35
PITCH
0.05
0.03
C
C
A B
B
0.35
PITCH
A
DIMENSIONS: MILLIMETERS
1
2
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
BOTTOM VIEW
www.onsemi.com
18
NCP160
PACKAGE DIMENSIONS
XDFN4 1.0x1.0, 0.65P
CASE 711AJ
ISSUE O
4X L2
NOTES:
A
B
D
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.20 mm FROM THE TERMINAL TIPS.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
PIN ONE
REFERENCE
E
4X b2
2X
0.05
C
MILLIMETERS
DETAIL A
DIM MIN
0.33
A1 0.00
MAX
0.43
0.05
0.05
C
2X
A
TOP VIEW
A3
b
b2 0.02
0.10 REF
0.15
0.25
0.12
(A3)
0.05
0.05
C
D
1.00 BSC
D2 0.43
0.53
1.00 BSC
0.65 BSC
A
E
e
L
C
0.20
0.30
0.17
SEATING
PLANE
NOTE 4
A1
L2 0.07
C
SIDE VIEW
e
RECOMMENDED
e/2
DETAIL A
MOUNTING FOOTPRINT*
4X L
D2
1
4
2
2X
0.52
0.65
PITCH
PACKAGE
OUTLINE
D2
455
3
4X
0.39
4X
0.11
1.20
4X b
M
0.05
C A B
NOTE 3
BOTTOM VIEW
4X
4X
0.26
0.24
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
19
NCP160
PACKAGE DIMENSIONS
WLCSP4, 0.64x0.64
CASE 567JZ
ISSUE O
NOTES:
A
D
B
E
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
PIN A1
REFERENCE
2X
0.05
0.05
C
C
MILLIMETERS
DIM
A
A1
A2
b
MIN
−−−
0.04
MAX
0.33
0.08
2X
TOP VIEW
0.23 REF
0.195
0.225
A2
D
E
e
0.64 BSC
0.64 BSC
0.35 BSC
0.05
C
C
A
0.05
RECOMMENDED
SOLDERING FOOTPRINT*
A1
SEATING
PLANE
NOTE 3
C
SIDE VIEW
PACKAGE
OUTLINE
A1
e
4X
b
4X0.20
e
0.35
PITCH
0.03
C A B
B
0.35
PITCH
A
DIMENSIONS: MILLIMETERS
1
2
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
BOTTOM VIEW
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which
the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or
unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable
copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
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Phone: 81−3−5817−1050
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
For additional information, please contact your local
Sales Representative
NCP160/D
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