NCP5608 [ONSEMI]
Multiple LED Charge Pump Driver; 多个LED电荷泵驱动器
| 型号： | NCP5608 |
| 厂家： | 
ONSEMI |
| 描述： | Multiple LED Charge Pump Driver |
| 文件： | 总16页 (文件大小：191K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NCP5608
Multiple LED Charge Pump
Driver
The NCP5608 is a high efficiency boost converter operating in
current loop, based on a charge pump multi mode, to drive White
LED. The current mode regulation allows a uniform and
programmable brightness of the LEDs. The chip has been optimized
for small ceramic capacitors, capable to supply up to 2.0 W output
power.
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MARKING
DIAGRAM
Features
24
1
• 2.7 to 5.5 V Input Voltage Range
• Up to 500 mA Output Current
NCP
5608
ALYW
G
24 PIN TQFN (4x4)
MT SUFFIX
CASE 511AA
• Capable to Drive 8 LED
• Multi Mode Charge Pump Based Converter
• I2C Serial Link Protocol
A
L
Y
W
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
• Consistent High Efficiency
• Independently Block Programmable Output Currents
= Pb−Free Package
• Programmable 3 or 4 Operating Backlight LED at Zero Extra
Losses
• Constant Output Current Regulation
• Built−in Dimming Function
PIN CONNECTIONS
• Tight Automatic LED Current Matching
• Thermal Shutdown Protection
• Low Battery Return Noise
24 23 22 21 20 19
1
2
18
17
AGND
V
OUT
• This is a Pb−Free Device*
IREFFL
C1P
Typical Applications
IREFBK 3
16 C1N
• LED Display Back Light Control
• Keyboard Back Light
• High Power Photo Flash
• Multiple Displays
4
5
6
15
14
13
SDA
SCL
LED8
LED7
PGND
CCMP
7
8
9
10 11 12
ORDERING INFORMATION
†
Device
NCP5608MTR2G
Package
Shipping
TQFN24 4000 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
downloadthe ON Semiconductor Soldering and Mounting Techniques Reference
Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
June, 2006 − Rev. 1
NCP5608/D
NCP5608
Vbat
+V
CC
C3
C6
GND
1 mF/16 V
4.7 mF/16 V
C5
21
TP2
VOUT
C2P
GND
U1
NCP5608
4.7 mF/16 V
C4
24
19
AVbat
PVbat
GND
20
17
C2N
C1P
4.7 mF/16 V
VOUT
18
VOUT
D1
D3
D5
D7
16
6
7
8
LED1
LED2
LED3
LED1
LED2
CIN
R1
5.6 k
R2
5.6 k
LWY87S
LWY87S
LWG6SG
D2
MCU
CCMP
SCL
LWY87S
5
4
3
2
9
10
11
12
14
LED3
LED4
LED5
LED6
D4
D6
LED4
LED5
LED6
LED7
SDA
LWY87S
IREFBK
IREFFL
IREFBK
IREFFL
GND
LWG6SG
LWG6SG
1
R3
R4
7.5 k
AGND
PGND
LED7
LED8
7.5 k
LWG6SG D8
13
15
LED8
Z1
GND
GND
Figure 1. Typical Application
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2
NCP5608
C1
C2
C3
16
17
20
21
22
23
CHARGE PUMP
CONVERTER
PVbat
19
18
VOUT
Vbat
30 mA
30 mA
30 mA
30 mA
7
8
LED1
LED2
24
3
AVbat
IREFBK
IREFFL
BKL−A
BKL−A
ANALOG
CONTROL
2
PWFL−A
1
AGND
GND
Vbat
9
10
LED3
LED4
BKL
6
5
CCMP
SCL
DIGITAL CONTROL
Vbat
4
SDA
100 mA
100 mA
100 mA
100 mA
11
12
LED5
LED6
PWFL
PWFL−A
Vbat
THERMAL SHUTDOWN
17
15
13
LED7
LED8
PGND
GND
Figure 2. NCP5608 Block Diagram
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NCP5608
PIN FUNCTION DESCRIPTION
Pin
Symbol
Type
Description
1
AGND
GROUND
This pin is the NCP5608 analog ground and shall be connected to the system ground. Care
must be observed to minimize the total parasitic inductance between the pin and the ground
plane.
2
3
4
IREFFL
IREFBK
SDA
OUTPUT, ANALOG This pin is used to set up the current reference for the FLASH output currents (LED5 to
LED8). The reference current is derived from the internal bandgap voltage to ground by
means of an external resistor. (Note 1)
OUTPUT, ANALOG This pin is used to set up the current reference for the BACK LIGHT output currents (LED1
to LED4). The reference current is derived from the internal bandgap voltage to ground by
means of an external resistor. (Note 1)
INPUT, DIGITAL
This pin, associated with the SCL signal, carries the DATA signal to set up the selected
output LED current.
The DATA signal is built with a single SDA line to support the I2C protocol.
5
6
SCL
INPUT, DIGITAL
ANALOG, INPUT
This is the clock signal associated with the SDA pins. The pin carries the standard CLOCK
signal to operate the I2C protocol.
CCMP
This pin is connected to the internal I2C bias network and must be either left open, or
bypassed to ground by a 10 nF ceramic capacitor when the I2C voltage drops below 1.8 V.
Such a capacitor compensate the voltage drop during normal operation, keeping in mind it is
not mandatory when the I2C voltage is 1.8 V and above.
7
8
LED1
LED2
LED3
LED4
INPUT, POWER
INPUT, POWER
INPUT, POWER
INPUT, POWER
This pin sinks to ground the current flowing into the first LED, and is intended to be used in
backlight application. The current is limited to 30 mA max. (Note 2)
This pin sinks to ground the current flowing into the second LED, and is intended to be used
in backlight application. The current is limited to 30 mA max. (Note 2)
9
This pin sinks to ground the current flowing into the third LED, and is intended to be used in
backlight application. The current is limited to 30 mA max. (Note 2)
10
This pin sinks to ground the current flowing into the fourth LED, and is intended to be used
in backlight application. The current is limited to 30 mA max. (Note 2)
On the other hand, LED4 can be disconnected when only three LEDs are used in the
backlight application. (Table 1)
11
12
13
LED5
LED6
INPUT, POWER
INPUT, POWER
POWER
This pin sinks to ground the current flowing into the fifth LED (100 mA max), and is intended
to be used in Flash application. (Note 2)
This pin sinks to ground the current flowing into the sixth LED (100 mA max), and is
intended to be used in Flash or high power application. (Note 2)
PWRGND
This pin provides the ground reference for the power elements and must be connected to
the system ground by a heavy track. Using the ground plane technique is strongly
recommended. Care must be observed to minimize the total parasitic inductance between
the pin and the ground plane.
14
15
LED7
LED8
INPUT, POWER
INPUT, POWER
This pin sinks to ground the current flowing into the seventh LED (100 mA max), and is
intended to be used in flash or high power application. (Note 2)
This pin sinks to ground the current flowing into the eighth LED (100 mA max), and is
intended to be used in flash or high power application. (Note 2)
16
17
18
C1N
C1P
POWER
POWER
This pin is the second side of the C1 fly capacitor.
This pin is the first side of the C1 fly capacitor.
VOUT
OUTPUT, POWER
This pin provides the output power to the external LED. Since the regulation is based on a
current loop, the voltage will varies as the output current varies in the application. The Vout
pin must be bypassed to GND by a 4.7 mF ceramic capacitor. (Note 3)
19
PVBAT
INPUT, POWER
This pin provides the supply voltage to the charge pump converter. The pin must be
connected to the AVbat supply source and bypassed to GND by a 10 mF/16 V ceramic
capacitor. (Note 3) Using a power plane is recommended.
20
21
22
23
24
C2N
C2P
POWER
POWER
This pin is the second side of the C2 fly capacitor.
This pin is the first side of the C2 fly capacitor.
This pin is the second side of the C3 fly capacitor.
This pin is the first side of the C3 fly capacitor.
C3P
POWER
C3N
AVbat
POWER
INPUT, POWER
This pin provides the supply voltage to the analog and digitals blocks. The pin must be
connected to the PVbat supply source and bypassed to GND by a 1 mF/16 V ceramic
capacitor. (Note 3) Using a power plane is recommended.
1. To achieve a good accuracy of the LED current, 1% tolerance resistor, with 100 ppm stability, or better, shall be used. The reference current
is internally mirrored and sized according to the programmed value for a given external LED.
2. Total DC−DC output current is limited to 500 mA.
3. Ceramic X7R, ESR < 50 mW ESL < 0.5 nH, SMD types capacitors are mandatory to achieve the Iout specifications. On the other hand, care
must be observed to take into account the DC bias impact on the capacitance value; see ceramic capacitor manufacturer data sheets.
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NCP5608
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Power Supply
V
bat
7.0
V
Digital Input Voltage
Digital Input Current
SDA, SCL
−
−0.3 v V v V
+ 0.3
V
in
BAT
1.0
mA
ESD Capability (Note 4)
Human Body Model (HBM)
Machine Model (MM)
V
ESD
2.0
200
kV
V
QFN24 Package
Power Dissipation @ T = +85°C (Note 5)
Thermal Resistance, Junction−to−Air (according to JEDEC/EIA JESD51−12)
P
250
160
mW
°C/W
A
D
JA
R
q
Operating Ambient Temperature Range
T
−40 to +85
−40 to +125
+150
°C
°C
°C
°C
mA
−
A
Operating Junction Temperature Range
T
J
Maximum Junction Temperature
T
Jmax
Storage Temperature Range
T
stg
−65 to +150
"100
Latchup Current Maximum Rating (per JEDEC standard: JESD78) Class II
Moisture Sensitivity Level (Note 6)
−
MSL
1
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
RecommendedOperating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
4. This device series contains ESD protection and exceeds the following tests:
Human Body Model (HBM): JESD22−A114.
Machine Model (MM): JESD22−A115.
5. The maximum package power dissipation limit must not be exceeded.
6. Moisture Sensitivity Level (MSL): per IPC/JEDEC standard: J−STD−020A.
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NCP5608
POWER SUPPLY SECTION (Typical values are referenced to T = +25°C, Min & Max values are referenced −40°C to +85°C ambient
A
temperature, unless otherwise noted.)
Pin
Symbol
Rating
Min
Typ
Max
Unit
19, 24
PV
AV
Power Supply
2.7
−
5.5
V
bat,
bat
18
18
18
24
19
I
Continuous DC Current in the Load @ V = 8xLED, V = 3.4 V
500
−
−
60
−
−
mA
mA
V
out
out
bat
Isch
Vout
Continuous Output Short Circuit Current
Output Voltage Compliance (OVP)
120
5.5
5.0
4.8
−
I
Standby Current, @ I = 0 mA, @ 2.7 V < Vbat < 4.2 V
−
mA
mA
stdb
out
I
Operating Current, @ I > 0 mA
out
op
PV = 3.6 V
−
−
0.5
0.8
−
−
bat
PV = 4.2 V
bat
Fpwr
Charge Pump Operating Frequency (Any C
Output LED to LED Current Matching,
Capacitor Pins)
−
2.0
−
1.3
−
2.0
−
MHz
%
FLY
7, 8, 9, 10
7, 8, 9, 10
I
MAT
@ V = 3.6 V, I
= 20 mA, LED1 to LED4 are Identical
"0.5
"2.0
"0.5
"2.0
bat
LED
I
Output Current Tolerance, LED1 to LED4
@ V = 3.6 V, I = 20 mA
%
%
%
ms
TOL
MAT
bat
LED
11, 12, 14,
15
I
Output LED to LED Current Matching,
@ V = 3.6 V, I = 80 mA, LED5 to LED8 are Identical
2.0
−
2.0
−
bat
LED
11, 12, 14,
15
I
Output Current Tolerance, LED5 to LED8
@ V = 3.6 V, I = 80 mA
TOL
bat
LED
18
t
DC−DC Start Time (C = 4.7 mF )
start
out
− from Vbat Operating to Full Load Operation
−
−
−
150
160
30
−
−
−
T
Thermal Shutdown Protection
°C
°C
SD
T
SDH
Thermal Shutdown Protection Hysteresis
ANALOG SECTION (Typical values are referenced to T = +25°C, Min & Max values are referenced −25°C to +85°C ambient
A
temperature, unless otherwise noted.)
Pin
3
Symbol
Rating
Min
1.0
−
Typ
−
Max
100
−
Unit
mA
−
I
Backlight Reference Current @ Vref = 600 mV (Notes 7, 8)
REFBK
3
Reference Current (I
) to Backlight Ratio
40
−
REF
2
I
Flash Reference Current @ Vref = 600 mV (Notes 7, 8)
Reference Current (I ) to Flash Ratio
1.0
−
100
−
mA
−
REFFL
2
40
−
REF
4, 5
C
in
Input Capacitance (Parameter not tested, guaranteed by design)
−
10
pF
7. The overall output current tolerance depends upon the accuracy of the external resistor. Using 1% or better resistor is recommended.
8. The external circuit must not force the I pin voltage either higher or lower than the 600 mV specified.
REF
DIGITAL PARAMETERS SECTION @ 2.70 V v V v 5.5 V (T = −25°C to +85°C unless otherwise noted.)
CC
A
Note: Digital inputs undershoot v −0.30 V to ground. Digital inputs overshoot v 0.30 V to V
.
CC
Pin
5
Symbol
Rating
Min
Typ
−
Max
400
Unit
kHz
V
F
CLK
Input I2C Clock, Duty Cycle = 50%
−
4, 5
4, 5
V
IH
Positive−Going Input High Voltage Threshold (SDA, SCL)
Negative−Going Input High Voltage Threshold (SDA, SCL)
0.7 V
−
V
cc
+ 0.5 V
0.4
CC
V
IL
0
−
V
9. The V Bias pins can be either left open, or biased by the same voltage as the external MCU power supply source. An external 10 nF capacitor
CC
might be necessary to improve the I2C function when operating with SDA and SCL signal amplitude below 1.8 V.
10.Expernal pullup resistors shall be connected to properly bias the SDA and SCL logic levels according to the I2C specifications.
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NCP5608
APPLICATIONS INFORMATION
DC−DC OPERATION
5.0 V. The converter resumes normal operation when the
voltage drops below 5.0 V (no latch−up mechanism).
Consequently, the chip can operate with no load during any
test procedures, but in the case of special applications, it is
recommended to connect the unused LED driver either to
The converter is based on a charge pump technique to
generate a DC voltage capable to supply the white LED
load. The system regulates the current flowing into each
LED by means of internal current mirrors associated with
the white diodes. Consequently, the output voltage will be
equal to the Vf of the LED, plus the 300 mV (typical)
developed across the internal NMOS mirror. Typically,
assuming a standard white LED forward biased at 10 mA,
the output voltage will be 3.2 V.
The third external capacitor makes possible the 1.33X
extra mode of operation, with a significant efficiency
improvement of the converter over the normal battery
voltage span. The threshold levels have been defined to
optimize this range of operating voltages, assuming a high
efficiency is not relevant when the system is connected to
a battery charger (i.e. Vbat > 4.5 V).
the V
supply to avoid any uncontrolled operation.
OUT
The structure is built with power MOS devices to
accommodate the modes selected by the analog functions.
The current flowing into each LED is continuously
regulated according to the value defined by the
programming message. The total current is limited to
500 mA DC.
The system runs with two cycles:
− Cycle#1
Fly capacitors are charged from the battery.
− Cycle#2
Energy accumulated into the fly capacitors is
transferred to the load.
The built−in OVP circuit continuously monitors each
output and stops the converter when the voltage is above
Li−Ion
2.90 V − 4.10 V
PIN 19
GND
Q1
Q3
Q6
Q7
Q10
C3N
Q11
C1N
C1 C1P
Q5
C2N
C2 C2P
PIN 21
Q9
C3 C3P
PIN 16
PIN 17
PIN 20
PIN 23
PIN 22
Q2
Q4
Q8
Q12
V
OUT
PIN 18
CURRENT CONTROL
LEDx
GND
PWRGND
PIN 13
GND
Figure 3. Basic DC−DC NCP5608 Converter Structure
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NCP5608
LOAD CURRENT CALCULATION
The load current is derived from the 600 mV reference
voltage provided by the internal band gap associated to the
Vbat
V
OUT
PIN 18
external resistor connected across the I
and I
REFFL
REFBK
pins and GND (see Figure 4). In any case, no voltage shall
be forced at I or I pins, either downward or
REFBK
REFFL
upward. The backlight block, LED1 − LED4, is powered by
the current reference defined at the I pin. The output
REFBK
LEDx
current can be dimmed by means of a dynamic modulation
of the I pin.
+
−
600 mV
REFBK
The I
reference current is multiplied by the
REFBK
PWRGND
PIN 13
constant ka to yield the output backlight LED load current.
Since the reference voltage is based on a temperature
compensated bandgap, a tight tolerance resistor will
provide a very accurate load current.
The ka parameter is derived from the constant 40
multiplied by the binary defined in the PWRLED_BK
register. Consequently, ka varies from 40 (1.0 mA
output/LED) to 1200 to support the full output current
range. The resistor is calculated from the Ohm’s law
ANALOG
CONTROL
PIN 3
I
REFBK
R1
GND
Figure 4. Typical Backlight
Reference Current Operation
(Similar Circuit Applies for Power Flash Section)
GND
(R = Vref/I ) and a more practical equation can be
arranged to define the resistor value for a given output
current:
REF
Note: Due to relative high impedance connected at the
reference current pins, cares must be observed to minimize
the noise pick−up and stray current present at PCB level.
Multi layer layout, with dedicated ground screen, is
mandatory.
Let Iout = 4*I
, then:
LED
R
+ (Vref * ka * 30)ńI
BK
BK
BK
out
(eq. 1)
R
R
+ (0.6 * 1200)ńI
out
+ 720ńI
out
SERIAL LINK I2C PROTOCOL
Consequently, the resistor value will range between
The chip is remotely controlled by means of a byte
transferred along a serial link between the MCU and the
NCP5608. The industrial standard I2C protocol is used,
although one can drive the SCL and SDA signal from
standard MCU I/O pins . Two dedicated internal registers
are used to decode the SDA content and to store the output
currents.
R
R
= 720/(30 mA*4) = 6000 W and
= 720/(0.5 mA*4) = 360 kW for the low power block.
BK
BK
Similarly, the PowerFlash block, LED5−LED8, is
powered by the current reference defined at the I
pin. The same calculation as before applies, assuming
kb = 40, the maximum output current being 100 mA/LED:
REFFL
Let Iout = 4*I , then:
LED
The I2C message carries three bytes within the same
frame:
R
+ (Vref * kb * 100)ńI
FL
FL
FL
out
(eq. 2)
R
R
+ (0.6 * 4000)ńI
out
Byte #1:
+ 2400ńI
out
The content of this byte is the physical address
of the NCP5608 in the I2C bus.
Finally, the resistor value will range between
= 2400/(100 mA*4) = 6000 W and
= 2400/(1 mA*4) = 600 kW for the High Power Flash
block.
On the other hand, the output currents can be dimmed by
means of a dynamic modulation of their respective
/I pins current references. Obviously, the
tolerance of such resistors must be 1% or better, with a
100 ppm thermal coefficient, to get the expected overall
tolerance.
R
R
FL
Byte #2:
FL
The content of this byte contains the address
of the selected block.
Byte #3:
I
This byte contains the output current value to
set up the selected block.
REFBK REFFL
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8
NCP5608
In order to improve the efficiency of the back light block
when three LED only are used, one can disconnect the
fourth LED by setting B6 = Low simultaneously with the
third byte (see Table 1).
Table 1. Programming Table
Byte
B7
0
B6
1
B5
1
B4
1
B3
0
B2
0
B1
1
B0
0
Comments
This is the I2C address
Byte #1
Byte #2
Byte #2
Byte #3
0
0
0
0
0
0
0
1
$01 = Select the Back Light internal register
$02 = Select the Power Flash internal register
0
0
0
0
0
0
1
0
1
0
0
X
X
X
X
X
Assuming Byte #2 = $01, then:
Bits[0..4] = Back Light output current
Bit[5..6] = shall be Low
Bit[7]
= control the fourth LED in the Back Light Block:
th
B7 = 0 ³ LED 4 disconnect
th
B7 = 1³ LED 4 connected
Byte #3
0
X
X
X
X
X
X
X
Assuming Byte #2 = $02, then:
Bits[0..6] = Power Flash output current
Bit[7] = shall be Low
LED CURRENT CONTROL REGISTERS
The eight LED are split in two blocks:
Back Light Block:
Flash or High Power Block:
LED1 to LED4, current limited to 30 mA per
LED
LED5 to LED8, current limited to 100 mA per
LED
The programmed value of a given bank of LED is memorized into the appropriate registers. There is one register for each
set of LED:
PWRLED_BK[0..4]
Stores the Back Light output current.
PWRLED_FL[0..6]
Stores the Power Flash output current.
The total output current is limited to 500 mA, whatever be the configuration.
Table 2. Internal LED Current Control Register
Internal LEDs registers
Bit
Unit
B7
B6
B5
B4
B3
B2
B1
B0
BLED4
(Note 12)
RFU
(Note 11)
RFU
(Note 11)
16
8.0
4.0
2.0
1.0
mA
mA
PWRLED_BK[7..0]
PWRLED_FL[7..0]
RFU
(Note 11)
64
32
16
8.0
4.0
2.0
1.0
11. Reserved for future use.
12.Activates/deactivates LED4.
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NCP5608
OUTPUT LED PROGRAMMING SEQUENCE
2. Calculate the reference current (Irefbk and Ireffl ):
Irefbk = ILED−BK/1200 and
Ireffl = ILED−FL/4000
3. Calculate the external resistor value
RBK = 0.6/Irefbk
Once the maximum output current has been set up by the
external resistor (see Load Current Calculation paragraph
above), the I2C protocol can be used to dynamically adjust
the brightness of the selected block.
At this point, the dimming of each block depends upon
the content of the appropriate register (PWRLD_BK[4..0]
or PWRLED_FL[6..0]). The LED current can be
calculated according to the digital value stored into the
registers.
RFL = 0.6/Ireffl
4. The dimming of flash and backlight LED will be
now achieved by changing the PWRLD_BK[4..0]
and PWRLED_FL[6..0] registers content to get the
operating LED current along the curves 0 mA to
ILED−BK−MAX mA and 0 mA to ILED−FL mA:
BK−NSteps = number of steps stored into the
PWRLD_BK register (value, in decimal, of the
PWRLD_BK[4..0] register)
The LED can be programmed in four steps:
1. Define the maximum ILEDBK−MAX and
ILEDFL−MAX currents requested by the Back
Light and Flash applications (set by external
resistors). This is the maximum current that will
be reached when the registers will be at their
respective full range (PWRLD_BK[4..0] = $1F =
31 Decimal, PWRLED_FL[6..0] = $7F= 127
decimal).
FL−NSteps = number of steps stored into the
PWRLED_FL register (value, in decimal, of the
PWRLD_FL[6..0] register)
ILEDBK = (ILEDBK−MAX/31) * BK−NSteps
ILEDFL = (ILEDFL−MAX/127) * FL−NSteps
PHYSICAL ADDRESS
The physical I2C address dedicated to the NCP5608 to support the I2C protocol is: 0111 001X → $72. The external
controller must fulfill the I2C protocol to drive the chip: see I2C−BUS SPECIFICATION, Version 2.1. The NCP5608
operates as a Slave only and never takes over the I2C control.
Table 3. NCP5608 Operation Truth Table
PWRLED_BK (0−7)
PWRLED_FL (0−7)
Output Voltage
Forced to zero
Vfbk + Vsense
Vfbk + Vsense
Comments
$00
>$80
>$00
$00
X
DC−DC = OFF
DC−DC = ON, LED1 to LED4 active
X
DC−DC = ON, LED1 to LED3 active
LED4 deactivated
X
>$00
Vffl + Vsense
DC−DC = ON
The I2C protocol is based on the standard format defined
in the industry. Basically, the DATA is transferred from the
MCU to the NCP5608 registers by means of the SDA
message associated to the SCL clock. The MCU presents
the 8 bits during the low state of the SCK signal and the
peripheral device ( in our case, the NCP5608) shall reads
the bits during the high state of the same clock. The transfer
is MSB first as depicted in Figure 5.
MPU send bit
PHYSICALADDRESS FRAME
MPU enables clock
DATA FRAME
B7
B6
B5
B4
B3
B2
B1
B0
ACK B7
B6
B5
B4
B3
B2
B1
B0
ACK
CLOCK
DATA
The NCP5608 reads one bit
Stop
Start
The NCP5608 send ACK
NOTE: See I2C−BUS SPECIFICATION, Version 2.1, January 2000, for further timing details.
Figure 5. Basic I2C Timings
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NCP5608
The three bytes, defined to program the chip, must be
will be updated on the last I2C clock positive going slope
of the third byte, the DATA being transferred to the
appropriate latchup register as defined by the content of the
second byte.
The DC−DC charge pump is deactivated when both
registers are set to zero as depicted in Table 3.
sent during the same transaction as depicted in Figure 6 and
Figure 7. Leaving aside the ACK signal, the NCP5608
does not provide any digital feedback. The selected
PWRLED−BK or PWRLED−FL register described above
will be updated according to the content of the third byte
serially sent to the chip. Finally, the selected bank of LED
Figure 6. Typical Transaction I2C Sequence:
I2C Address
Figure 7. Typical Full I2C Data Transfer
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NCP5608
TYPICAL OPERATING CHARACTERISTICS
90
90
I
= 40 mA
out
I
= 60 mA
I
= 80 mA
I
out
out
I
= 120 mA
I
= 80 mA
= 40 mA
out
out
out
I
= 200 mA
85 out
85
80
75
I
= 100 mA
out
80
75
70
65
60
70
65
60
I
= 20 mA
out
55
50
55
50
45
4.4
45
4.4
4.2
4.0
3.8
3.6
3.4
3.2
3.0
4.2
4.0
3.8
3.6
3.4
3.2
3.0
Vbat (V)
Vbat (V)
Figure 8. Back Light Efficiency vs. Battery Voltage
(LED1 to LED4)
Figure 9. Power Flash Efficiency vs. Battery Voltage
(LED5 to LED8)
Vbat = 4.2 V
80
6
I
= 300 mA
out
75
70
65
60
55
50
45
−40°C
4
2
I
= 400 mA
out
85°C
0
−2
−4
−6
25°C
0
20
40
60
80
Iout (mA)
100
120
140
160
4.4
4.2
4.0
3.8
3.6
3.4
3.2
3.0
Vbat (V)
Figure 10. Power Flash Efficiency vs. Battery Voltage
(LED5 to LED8) at Full Power
Figure 11. Back Light Output Current Tolerance
(LED1 to LED4)
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NCP5608
TYPICAL OPERATING WAVEFORMS
Vbat = 4.2 V
6
4
2
0
25°C
−2
−4
−6
0
50 100 150 200 250 300 350 400 450
Iout (mA)
Figure 12. Power Flash Output Current Tolerance
(LED5 to LED8)
Figure 13. Typical Powerup Response
Vbat
+V
CC
C3
C6
GND
1 mF/16 V
4.7 mF/16 V
C5
21
TP2
VOUT
C2P
GND
U1
NCP5608
4.7 mF/16 V
C4
24
19
AVbat
PVbat
GND
20
17
C2N
C1P
4.7 mF/16 V
VOUT
18
VOUT
D1
D3
D5
D7
16
6
7
8
LED1
LED1
LED2
CIN
R1
5.6 k
R2
5.6 k
LWY87S
LWY87S
LWG6SG
D2
LED2
LED3
MCU
CCMP
SCL
LWY87S
5
4
3
2
9
10
11
12
LED3
LED4
LED5
LED6
D4
D6
LED4
LED5
LED6
LED7
SDA
LWY87S
IREFBK
IREFFL
IREFBK
IREFFL
GND
LWG6SG
LWG6SG
1
14
15
R3
R4
6.2 k
AGND
PGND
LED7
LED8
6.2 k
LWG6SG D8
13
LED8
Z1
GND
GND
Figure 14. Typical Application
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NCP5608
Table 4. Recommended Passive Parts
Part
Manufacturer
Description
Footprint 0805
Part Number
C2012X5R1C105MT
C3216X5R1C475MT
C3216X5R1C106MT
Ceramic Cap. 1 μF/16 V
Ceramic Cap. 4.7 μF/6.3 V
Ceramic Cap. 10 μF/6.3 V
TDK
TDK
TDK
Footprint 1206
Footprint 1206
TYPICAL LEDS LOAD MAPPING
C5
C5
GND
GND
4.7 mF
4.7 mF
Vout
Vout
LED1
LED2
LED3
LED4
LED5
LED6
LED7
LED8
GND
LED1
LED2
LED3
LED4
LED5
LED6
LED7
LED8
GND
GND
GND
Figure 15. Examples of Possible LED Connections
C5
C5
C5
GND
GND
GND
4.7 mF
4.7 mF
4.7 mF
Vout
Vout
Vout
LED1
LED2
LED3
LED4
LED5
LED6
LED7
LED8
GND
LED1
LED2
LED3
LED4
LED5
LED6
LED7
LED8
LED1
LED2
LED3
LED4
LED5
LED6
LED7
LED8
GND
GND
GND
GND
GND
Figure 16. Examples of Possible LED Arrangements
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NCP5608
V
CC
J1
1
2
GND
C2
+C1
220 mF/10 V
PWR
1 mF/6.3 V
C5
21
TP1
VOUT
C2P
GND
C6
4.7 mF/16 V
GND
4.7 mF/10 V
U1
NCP5608
24
19
AVbat
PVbat
GND
20
17
C2N
C1P
VOUT
18
VOUT
VCC
D1
D2
16
6
7
8
LED1
LED2
LED3
LED1
LED2
CIN
J2
LWY87S
D3
1
2
4
6
8
10
CCMP
3
5
7
9
LWY87S
SCL
5
4
3
2
1
9
10
11
12
SCL
LED3
LED4
LED5
LED6
LWY87S
D4
SDA
IREFFL
IREFBK
LED4
LED5
LED6
LED7
SDA
LWY87S
DIGITAL
PORT
IREFBK
IREFFL
GND
D5
14
15
LWW5SG
GOLDEN DRAGON
AGND
PGND
LED7
LED8
13
LED8
Z1
GND
GND
Figure 17. Demo Board Schematic Diagram
ABBREVIATIONS
FB
FeedBack
POR
I2C
Power On Reset: internal pulse to reset the chip when the power supply is applied
Inter Integrated Chip Communication
SDA
SCL
REGBL
REGFL
Serial DATA, Bidirectional line, associated to the I2C protocol
Serial Clock, associated to the I2C protocol
Register Back Light
Register Flash
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NCP5608
PACKAGE DIMENSIONS
24 PIN TQFN, 4X4
CASE 511AA−01
ISSUE O
NOTES:
D
A
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
B
E
PIN ONE
REFERENCE
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
MILLIMETERS
2X
DIM
A
A1
A3
b
D
D2
E
MIN
0.70
0.00
NOM
0.75
0.03
MAX
0.80
0.05
0.15
C
0.20 REF
0.25
4.00 BSC
2.50
4.00 BSC
2.50
2X
0.15
C
0.18
2.40
2.40
0.30
2.60
2.60
A3
E2
e
0.10
C
0.50 BSC
K
L
0.20
0.30
−−−
0.40
−−−
0.50
A
SEATING
PLANE
0.08
C
A1
C
D2
20X
e
L
7
12
13
6
1
E2
e/2
18
24
19
K
24X b
0.10 C A B
NOTE 3
0.05 C
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