NCP583SQ15T1G [ONSEMI]
Ultra−Low Iq 150 mA CMOS LDO Regulator with Enable; 超低Iq的150毫安CMOS LDO稳压器启用
| 型号： | NCP583SQ15T1G |
| 厂家： | 
ONSEMI |
| 描述： | Ultra−Low Iq 150 mA CMOS LDO Regulator with Enable |
| 文件： | 总10页 (文件大小：72K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NCP583
Ultra−Low Iq 150 mA CMOS
LDO Regulator with Enable
The NCP583 series of low dropout regulators are designed for
portable battery powered applications which require precise output
voltage accuracy and low quiescent current. These devices feature an
enable function which lowers current consumption significantly and
are offered in two small packages; SC−82AB and the SOT−563.
A 1.0 mF ceramic capacitor is the recommended value to be used
with these devices on the output pin.
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MARKING
DIAGRAMS
Features
SC−82AB
SQ SUFFIX
CASE 419C
• Ultra−Low Dropout Voltage of 250 mV at 150 mA
• Excellent Line Regulation of 0.05%/V
• Excellent Load Regulation of 20 mV
• High Output Voltage Accuracy of "2%
• Ultra−Low Iq Current of 1.0 mA
xxx M G
4
G
1
1
• Very Low Shutdown Current of 0.1 mA
• Wide Output Voltage Range of 1.5 V to 3.3 V
SOT−563
XV SUFFIX
CASE 463A
xxx M G
6
G
• Low Temperature Drift Coefficient on the Output Voltage of
1
1
"100 ppm/°C
• Fold Back Protection Circuit
• Input Voltage up to 6.5 V
xxx = Device Code
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
• These are Pb−Free Devices
Typical Applications
*Date Code orientation and/or position may
vary depending upon manufacturing location.
• Portable Equipment
• Hand−Held Instrumentation
• Camcorders and Cameras
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 8 of this data sheet.
V
in
V
out
−
+
V
ref
Current Limit
CE
GND
Figure 1. Simplified Block Diagram
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
April, 2006 − Rev. 5
NCP583/D
NCP583
PIN FUNCTION DESCRIPTION
SOT−563
Pin
SC−82AB
Pin
Symbol
Description
1
4
Power supply input voltage.
V
in
2
3
2
3
GND
Power supply ground.
Regulated output voltage.
V
out
4
5
6
−
−
1
NC
GND
CE
No connect.
Power supply ground.
Chip enable pin.
MAXIMUM RATINGS
Rating
Symbol
Value
6.5
Unit
V
Input Voltage
V
in
Input Voltage (CE or CE Pin)
Output Voltage
V
6.5
V
CE
V
−0.3 to V +0.3
V
out
out
in
Output Current
I
180
mA
mW
Power Dissipation
SC−82AB
SOT−563
P
D
150
500
Operating Junction Temperature Range
Storage Temperature Range
T
−40 to +85
+150
°C
°C
J
T
stg
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
RecommendedOperating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
ELECTRICAL CHARACTERISTICS (V = V + 1.0 V, T = 25°C, unless otherwise noted.)
in
out
A
Characteristic
Symbol
Min
Typ
−
Max
Unit
V
Input Voltage
Output Voltage (1.0 mA ≤ I ≤ 30 mA)
V
in
1.7
6.0
V
out
V
out
X 0.980
−
V X 1.020
out
V
out
Line Regulation (I = 30 mA)
(V + 0.5 V v Vin v 6.0 V)
out
Reg
−
−
0.05
20
0.20
40
%/V
out
line
Load Regulation (1.0 mA ≤ I ≤ 100 mA)
Reg
mV
V
out
load
Dropout Voltage (I = 150 mA)
V
DO
out
V
= 1.5 V
= 1.8 V
= 2.5 V
−
−
−
−
0.60
0.50
0.35
0.25
0.90
0.75
0.55
0.40
out
V
out
V
out
2.8 V v V v 3.3 V
out
Quiescent Current (I = 0 mA)
Iq
−
150
−
1.0
−
1.5
−
mA
mA
mA
mA
V
out
Output Current
I
I
out
SD
Shutdown Current (V = Gnd)
0.1
40
1.0
−
CE
Output Short Circuit Current (V = 0)
I
lim
−
out
Enable Input Threshold Voltage
High
Low
1.2
0
−
−
6.0
0.3
Vth
enh
Vth
enl
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2
NCP583
TYPICAL CHARACTERISTICS
3.0
2.5
2.0
1.5
1.0
0.5
0
2.9
2.8
2.7
2.6
2.5
V
= 3.1 V
in
3.3 V
3.5 V
2.4
2.3
2.2
2.1
2.0
I
= 1.0 mA
out
I
= 30 mA
out
I
= 50 mA
out
V
= 2.8 V
out
V
out
= 2.8 V
300
0
100
200
400
500
1.0
2.0
3.0
4.0
5.0
6.0
OUTPUT CURRENT I (mA)
out
INPUT VOLTAGE V (V)
in
Figure 2. Output Voltage vs. Output Current
Figure 3. Output Voltage vs. Input Voltage
1.2
1.0
0.8
0.6
0.4
0.2
0.0
2.86
2.84
2.82
2.80
2.78
2.76
2.74
V
out
= 2.8 V
5.0
V
out
= 2.8 V
60
4.0
0
1.0
2.0
3.0
6.0
−40
−15
10
35
85
INPUT VOLTAGE V (V)
TEMPERATURE (°C)
in
Figure 5. Output Voltage vs. Temperature
Figure 4. Quiescent Current vs. Input Voltage
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
V
out
= 1.5 V
V
out
= 2.8 V
−40
−15
10
35
60
85
−40
−15
10
35
60
85
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 6. Quiescent Current vs. Temperature
Figure 7. Quiescent Current vs. Temperature
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3
NCP583
TYPICAL CHARACTERISTICS
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0.40
V
out
= 1.5 V
85°C
0.35
0.30
0.25
85°C
25°C
25°C
−40°C
0.20
0.15
0.10
0.05
0.00
−40°C
V
= 1.8 V
out
0
25
50
75
100
125
150
0
25
50
75
100
125
150
OUTPUT CURRENT I (mA)
OUTPUT CURRENT I (mA)
out
out
Figure 8. Dropout Voltage vs. Output Current
Figure 9. Dropout Voltage vs. Output Current
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
70
60
50
40
30
20
10
0
V
= 2.8 V
= 3.8 V + 0.5 V
= 0.1 mF
out
V
in
p−p
C
out
85°C
25°C
−40°C
I
= 1.0 mA
out
I
= 30 mA
out
V
out
= 2.8 V
I
= 50 mA
out
0
25
50
75
100
125
150
10
0.1
1
100
OUTPUT CURRENT I (mA)
out
FREQUENCY, f (kHz)
Figure 11. Ripple Rejection vs. Frequency
Figure 10. Dropout Voltage vs. Output Current
70
60
50
40
30
V
V
C
= 2.8 V
= 3.8 V + 0.5 V
= 1.0 mF
out
in
p−p
out
I
= 1.0 mA
out
20
10
0
I
= 30 mA
out
I
= 50 mA
out
10
FREQUENCY, f (kHz)
0.1
1
100
Figure 12. Ripple Rejection vs. Frequency
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4
NCP583
TYPICAL CHARACTERISTICS
Cout = 0.1 mF
6
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
5
Input Voltage
4
3
2
Output Voltage
1
0
−1
0
20
40
60
80
100
120
140
160
180
200
TIME, T (ms)
Cout = 0.47 mF
6
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
5
Input Voltage
4
3
2
Output Voltage
1
0
−1
0
20
40
60
80
100
120
140
160
180
200
TIME, T (ms)
Cout = 1.0 mF
6
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
5
Input Voltage
4
3
2
Output Voltage
1
0
−1
0
20
40
60
80
100
120
140
160
180
200
TIME, T (ms)
Figure 13. Input Transient Response
(Vout = 2.8 V, Iout = 30 mA, tr = tf = 5.0 ms, Cin = 0)
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NCP583
TYPICAL CHARACTERISTICS
Cout = 1.0 mF
5.0
4.5
4.0
3.5
3.0
2.5
2.0
20
10
0
Output Current
Output Voltage
−10
0
100
200
300
400
500
600
700
800
900
1000
TIME, T (ms)
Cout = 10 mF
5.0
4.5
4.0
3.5
3.0
2.5
2.0
20
10
0
Output Current
Output Voltage
−10
0
100
200
300
400
500
600
700
800
900
1000
TIME, T (ms)
Figure 14. Load Transient Response
(Vout = 2.8 V, tr = tf = 5.0 ms, Vin = 3.8 V)
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6
NCP583
TYPICAL CHARACTERISTICS
Cout = 0.1 mF
5.0
4.5
4.0
3.5
3.0
2.5
2.0
150
100
50
Output Current
Output Voltage
0
0
20
40
60
80
100
120
140
160
180
200
TIME, T (ms)
Cout = 0.47 mF
5.0
4.5
4.0
3.5
3.0
2.5
2.0
150
100
Output Current
Output Voltage
50
0
0
20
40
60
80
100
120
140
160
180
200
TIME, T (ms)
Cout = 1.0 mF
5.0
4.5
4.0
3.5
3.0
2.5
2.0
150
100
Output Current
Output Voltage
50
0
0
20
40
60
80
100
120
140
160
180
200
TIME, T (ms)
Figure 15. Load Transient Response
(Vout = 2.8 V, tr = tf = 5.0 ms, Vin = 3.8 V)
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7
NCP583
APPLICATION INFORMATION
Input Decoupling
Output Decoupling
A 1.0 mF ceramic capacitor is the recommended value to
be connected between V and GND. For PCB layout
It is recommended to use a 0.1 mF ceramic capacitor on
the V pin. For better performance, select a capacitor with
in
out
considerations, the traces of V and GND should be
sufficiently wide in order to minimize noise and prevent
unstable operation.
low Equivalent Series Resistance (ESR). For PCB layout
considerations, place the output capacitor close to the
output pin and keep the leads short as possible.
in
ORDERING INFORMATION
Nominal
Output Voltage
Device
Output Type / Features
Marking
Package
Shipping†
NCP583SQ15T1G
Active High w/Enable
1.5
A5
SC−82AB
(Pb−Free)
3000 Tape & Reel
NCP583SQ18T1G
NCP583SQ25T1G
NCP583SQ28T1G
NCP583SQ30T1G
NCP583SQ33T1G
NCP583XV15T2G
NCP583XV18T2G
NCP583XV25T2G
NCP583XV28T2G
NCP583XV29T2G
NCP583XV30T2G
NCP583XV33T2G
Active High w/Enable
Active High w/Enable
Active High w/Enable
Active High w/Enable
Active High w/Enable
Active High w/Enable
Active High w/Enable
Active High w/Enable
Active High w/Enable
Active High w/Enable
Active High w/Enable
Active High w/Enable
1.8
2.5
2.8
3.0
3.3
1.5
1.8
2.5
2.8
2.9
3.0
3.3
A8
B5
SC−82AB
(Pb−Free)
3000 Tape & Reel
3000 Tape & Reel
3000 Tape & Reel
3000 Tape & Reel
3000 Tape & Reel
4000 Tape & Reel
4000 Tape & Reel
4000 Tape & Reel
4000 Tape & Reel
4000 Tape & Reel
4000 Tape & Reel
4000 Tape & Reel
SC−82AB
(Pb−Free)
B8
SC−82AB
(Pb−Free)
C0
SC−82AB
(Pb−Free)
C3
SC−82AB
(Pb−Free)
G15B
G18B
G25B
G28B
G29B
G30B
G33B
SOT−563
(Pb−Free)
SOT−563
(Pb−Free)
SOT−563
(Pb−Free)
SOT−563
(Pb−Free)
SOT−563
(Pb−Free)
SOT−563
(Pb−Free)
SOT−563
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Other voltages are available. Consult your ON Semiconductor representative.
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8
NCP583
PACKAGE DIMENSIONS
SOT−563
XV SUFFIX
CASE 463A−01
ISSUE F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE MATERIAL.
D
A
−X−
L
6
5
2
4
3
MILLIMETERS
DIM MIN NOM MAX
INCHES
NOM MAX
E
−Y−
MIN
H
E
A
b
C
D
E
e
0.50
0.17
0.08
1.50
1.10
0.55
0.22
0.12
1.60
1.20
0.60 0.020 0.021 0.023
0.27 0.007 0.009 0.011
0.18 0.003 0.005 0.007
1.70 0.059 0.062 0.066
1.30 0.043 0.047 0.051
0.02 BSC
1
b 56 PL
C
0.5 BSC
0.20
e
M
0.08 (0.003)
X Y
L
0.10
1.50
0.30 0.004 0.008 0.012
1.70 0.059 0.062 0.066
H
E
1.60
SOLDERING FOOTPRINT*
0.3
0.0118
0.45
0.0177
1.0
0.0394
1.35
0.0531
0.5
0.5
0.0197 0.0197
mm
inches
ǒ
Ǔ
SCALE 20:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
MountingTechniques Reference Manual, SOLDERRM/D.
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9
NCP583
PACKAGE DIMENSIONS
SC−82AB
SQ SUFFIX
CASE 419C−02
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. 419C−01 OBSOLETE. NEW STANDARD IS
419C−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
A
G
C
D 3 PL
N
MILLIMETERS
INCHES
MIN
DIM
A
B
C
D
F
G
H
J
MIN
1.8
MAX
2.2
MAX
0.087
0.053
0.043
0.016
0.020
0.059
0.004
0.010
−−−
4
3
0.071
0.045
0.031
0.008
0.012
0.043
0.000
0.004
0.004
K
1.15
0.8
1.35
1.1
B
F
S
1
2
0.2
0.4
0.3
0.5
1.1
1.5
H
J
0.0
0.1
0.10
0.1
0.26
−−−
K
L
L
0.05 (0.002)
0.05 BSC
0.2 REF
1.8
0.002 BSC
0.008 REF
0.07 0.09
N
S
2.4
SOLDERING FOOTPRINT*
1.30
0.512
0.65
0.026
1.90
0.075
0.95
0.037
0.90
0.035
mm
inches
0.70
0.028
ǒ
Ǔ
SCALE 10:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
MountingTechniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any
liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental
damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over
time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under
its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body,
or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death
may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees,
subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of
personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.
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PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
Literature Distribution Center for ON Semiconductor
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
For additional information, please contact your
local Sales Representative.
NCP583/D
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