NCP716BCSN300T1G [ONSEMI]
Wide Input Voltage Low Dropout, Ultra-Low Iq Regulator;
| 型号： | NCP716BCSN300T1G |
| 厂家： | 
ONSEMI |
| 描述： | Wide Input Voltage Low Dropout, Ultra-Low Iq Regulator |
| 文件： | 总9页 (文件大小：769K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Wide Input Voltage Low
Dropout, Ultra-Low Iq
Regulator
NCP716BC
The NCP716BC is 150 mA LDO Linear Voltage Regulator. It is a
very stable and accurate device with ultra−low ground current
consumption (4.7 mA over the full output load range) and a wide input
voltage range (up to 24 V). The regulator incorporates several
protection features such as Thermal Shutdown and Current Limiting.
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MARKING
DIAGRAM
Features
5
• Operating Input Voltage Range: 2.5 V to 24 V
XXXAYWG
TSOP−5
CASE 483
1
• Fixed Voltage Options Available:
G
5
3.0 V, 3.3 V, 3.45 V and 5.0 V
1
• Ultra Low Quiescent Current: Max. 4.7 mA over Temperature
XXX = Specific Device Code
A
Y
W
G
= Assembly Location
= Year
= Work Week
•
2% Accuracy over Full Temperature Range
• Noise: 115 mV
from 200 Hz to 100 kHz
RMS
• Thermal Shutdown and Current Limit Protection
• Available in TSOP−5 Package
= Pb−Free Package
(Note: Microdot may be in either location)
• This is a Pb−Free Device
PIN CONNECTIONS
Typical Applications
• Portable Equipment
• Communication Systems
• Industrial Measurement Systems
• Home Automation Devices
5
1
GND
IN
N/C
OUT
N/C
TSOP−5
(Top View)
Vin= (4 − 24 V)
3.0 V, 3.3 V, 3.45 V and 5.0 V/150 mA
NCP716BC
Vout
Cout
Vin
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 8 of this data sheet.
Cin
GND
1uF
1uF
Figure 1. Typical Application Schematic
© Semiconductor Components Industries, LLC, 2020
1
Publication Order Number:
December, 2020 − Rev. 3
NCP716BC/D
NCP716BC
IN
THERMAL
SHUTDOWN
UVLO
BANDGAP
REFERENCE
MOSFET
DRIVER WITH
CURRENT LIMIT
OUT
EEPROM
GND
Figure 2. Simplified Block Diagram
Table 1. PIN FUNCTION DESCRIPTION
Pin
Name
Pin No.
Description
3
OUT
Regulated output voltage pin. A small 1.0 mF ceramic capacitor is needed from this pin to ground to
assure stability.
1
2
4
5
GND
IN
Power supply ground.
Input pin. A small 1.0 mF ceramic capacitor is needed from this pin to ground to assure stability.
This pin can be tied to ground to improve thermal dissipation or left disconnected.
This pin can be tied to ground to improve thermal dissipation or left disconnected.
N/C
N/C
Table 2. ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
−0.3 to 24
−0.3 to 6
Indefinite
150
Unit
V
Input Voltage (Note 1)
V
IN
Output Voltage
V
OUT
V
Output Short Circuit Duration
Maximum Junction Temperature
Storage Temperature
t
s
SC
T
°C
°C
V
J(MAX)
T
STG
−55 to 150
2000
ESD Capability, Human Body Model (Note 2)
ESD Capability, Machine Model (Note 2)
ESD
HBM
ESD
200
V
MM
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per EIA/JESD22−A114
ESD Machine Model tested per EIA/JESD22−A115
ESD Charged Device Model tested per EIA/JESD22−C101E
Latchup Current Maximum Rating tested per JEDEC standard: JESD78.
Table 3. THERMAL CHARACTERISTICS
Rating
Symbol
Value
Unit
Thermal Characteristics, TSOP−5
R
250
°C/W
q
JA
Thermal Resistance, Junction−to−Air
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2
NCP716BC
Table 4. ELECTRICAL CHARACTERISTICS Voltage version 3.0 V
−40°C ≤ T ≤ 125°C; V = 4.0 V; I
= 1 mA, C = C
= 1.0 mF, unless otherwise noted. Typical values are at T = +25°C. (Note 5)
OUT J
J
IN
OUT
IN
Parameter
Test Conditions
Symbol
Min
2.5
Typ
Max
24
Unit
V
Operating Input Voltage
Output Voltage Accuracy
Line Regulation
V
IN
−40°C ≤ T ≤ 125°C
V
OUT
2.94
3.0
4
3.06
20
V
J
V
+ 1 V ≤ V ≤ 24 V, I
= 0.1 mA
Reg
mV
%/mA
mV
mA
mA
OUT
IN
OUT
LINE
LOAD
DO
Load Regulation
I
= 0.1 mA to 150 mA
Reg
0.0013 0.008
OUT
Dropout Voltage (Note 3)
Maximum Output Current
Ground Current
V
OUT
= 0.97 V
, I
= 150 mA
V
700
1100
OUT(NOM) OUT
(Note 6)
I
150
OUT
I
= 0 mA, −40 < T < 125°C
I
GND
3.2
55
4.7
OUT
A
Power Supply Rejection Ratio
V
= 4.0 V + 200 mVpp
modulation
f = 1 kHz
PSRR
dB
IN
I
= 1 mA, C
=10 mF
OUT
OUT
Output Noise Voltage
V
OUT
= 3.0 V, I
= 150 mA
V
NOISE
80
mV
rms
OUT
f = 100 Hz to 100 kHz
Thermal Shutdown Temperature (Note 4)
Thermal Shutdown Hysteresis (Note 4)
Temperature increasing from T = +25°C
T
180
10
°C
°C
J
SD
Temperature falling from T
T
SDH
−
−
SD
3. Characterized when V
falls 3% below the nominal V
= 3.0 V
OUT
OUT
4. Guaranteed by design and characterization.
5. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at T = T =
J
A
25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
6. Please follow the Safe Operating Area.
Table 5. ELECTRICAL CHARACTERISTICS Voltage version 3.3 V
−40°C ≤ T ≤ 125°C; V = 4.3 V; I
= 1 mA, C = C
= 1.0 mF, unless otherwise noted. Typical values are at T = +25°C. (Note 9)
OUT J
J
IN
OUT
IN
Parameter
Test Conditions
Symbol
Min
2.5
Typ
Max
24
Unit
Operating Input Voltage
Output Voltage Accuracy
Line Regulation
V
IN
V
V
−40°C ≤ T ≤ 125°C
V
OUT
3.234
3.30
4
3.366
20
J
V
+ 1 V ≤ V ≤ 24 V, I
= 0.1 mA
Reg
mV
%/mA
mV
mA
mA
OUT
IN
OUT
LINE
LOAD
DO
Load Regulation
I
= 0.1 mA to 150 mA
Reg
0.0013 0.008
OUT
Dropout Voltage (Note 7)
Maximum Output Current
Ground Current
V
OUT
= 0.97 V
, I
= 150 mA
V
685
1080
OUT(NOM) OUT
(Note 10)
I
150
OUT
I
= 0 mA, −40 < T < 125°C
I
GND
3.2
54
4.7
OUT
A
Power Supply Rejection Ratio
V
= 4.3 V + 200 mVpp
modulation
f = 1 kHz
PSRR
dB
IN
I
= 1 mA, C
=10 mF
OUT
OUT
Output Noise Voltage
V
OUT
= 3.3 V, I
= 150 mA
V
NOISE
86
mV
rms
OUT
f = 100 Hz to 100 kHz
Thermal Shutdown Temperature (Note 8)
Thermal Shutdown Hysteresis (Note 8)
Temperature increasing from T = +25°C
T
180
10
°C
°C
J
SD
Temperature falling from T
T
SDH
−
−
SD
7. Characterized when V
falls 3% below the nominal V
= 3.3 V
OUT
OUT
8. Guaranteed by design and characterization.
9. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at T = T =
J
A
25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
10.Please follow the Safe Operating Area.
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3
NCP716BC
Table 6. ELECTRICAL CHARACTERISTICS Voltage version 3.45 V
−40°C ≤ T ≤ 125°C; V = 4.45 V; I
= 1 mA, C = C
= 1.0 mF, unless otherwise noted. Typical values are at T = +25°C. (Note 13)
OUT J
J
IN
OUT
IN
Parameter
Test Conditions
Symbol
Min
2.5
Typ
Max
24
Unit
V
Operating Input Voltage
Output Voltage Accuracy
Line Regulation
V
IN
−40°C ≤ T ≤ 125°C
V
OUT
3.381
3.45
4
3.519
20
V
J
V
+ 1 V ≤ V ≤ 24 V, I
= 0.1 mA
Reg
mV
%/mA
mV
mA
mA
OUT
IN
OUT
LINE
LOAD
DO
Load Regulation
I
= 0.1 mA to 150 mA
Reg
0.0013 0.008
OUT
Dropout Voltage (Note 11)
Maximum Output Current
Ground Current
V
OUT
= 0.97 V
, I
= 150 mA
V
680
1070
OUT(NOM) OUT
(Note 14)
I
150
OUT
I
= 0 mA, −40 < T < 125°C
I
GND
3.2
54
4.7
OUT
A
Power Supply Rejection Ratio
V
IN
= 4.45 V + 200 mVpp
modulation
f = 1 kHz
PSRR
dB
I
= 1 mA, C
=10 mF
OUT
OUT
Output Noise Voltage
V
OUT
= 4.45 V, I
= 150 mA
V
NOISE
88
mV
rms
OUT
f = 100 Hz to 100 kHz
Thermal Shutdown Temperature (Note 12) Temperature increasing from T = +25°C
T
180
10
°C
°C
J
SD
Thermal Shutdown Hysteresis (Note 12)
Temperature falling from T
T
SDH
−
−
SD
11. Characterized when V falls 3% below the nominal V
= 3.45 V
OUT
OUT
12.Guaranteed by design and characterization.
13.Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at T = T =
J
A
25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
14.Please follow the Safe Operating Area.
Table 7. ELECTRICAL CHARACTERISTICS Voltage version 5.0 V
−40°C ≤ T ≤ 125°C; V = 6.0 V; I
= 1 mA, C = C
= 1.0 mF, unless otherwise noted. Typical values are at T = +25°C. (Note 17)
OUT J
J
IN
OUT
IN
Parameter
Test Conditions
Symbol
Min
2.5
Typ
Max
24
Unit
Operating Input Voltage
Output Voltage Accuracy
Line Regulation
V
IN
V
V
−40°C ≤ T ≤ 125°C
V
OUT
4.90
5.0
4
5.10
20
J
V
+ 1 V ≤ V ≤ 24 V, I
= 0.1 mA
Reg
mV
%/mA
mV
mA
mA
OUT
IN
OUT
LINE
LOAD
DO
Load Regulation
I
= 0.1 mA to 150 mA
Reg
0.0013 0.008
OUT
Dropout Voltage (Note 15)
Maximum Output Current
Ground Current
V
OUT
= 0.97 V
, I
= 150 mA
V
600
955
OUT(NOM) OUT
(Note 18)
I
150
OUT
I
= 0 mA, −40 < T < 125°C
I
GND
3.2
53
4.7
OUT
A
Power Supply Rejection Ratio
V
= 6.0 V + 200 mVpp
modulation
f = 1 kHz
PSRR
dB
IN
I
= 1 mA, C
=10 mF
OUT
OUT
Output Noise Voltage
V
OUT
= 5.0 V, I
= 150 mA
V
NOISE
115
mV
rms
OUT
f = 100 Hz to 100 kHz
Thermal Shutdown Temperature (Note 16) Temperature increasing from T = +25°C
T
180
10
°C
°C
J
SD
Thermal Shutdown Hysteresis (Note 16)
Temperature falling from T
T
SDH
−
−
SD
15.Characterized when V falls 3% below the nominal V
= 5.0 V
OUT
OUT
16.Guaranteed by design and characterization.
17.Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at T = T =
J
A
25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
18.Please follow the Safe Operating Area.
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4
NCP716BC
TYPICAL CHARACTERISTICS
3.016
3.012
3.008
3.004
5.02
5.01
5.00
4.99
NCP716BCSN500T1G
C
= C
= 1 mF
IN
OUT
I
= 1 mA
OUT
NCP716BCSN300T1G
C
= C
= 1 mA
= 4.0 V to 24 V
= 1 mF
3.000
2.996
IN
OUT
4.98
4.97
V
V
= 6.0 V
= 8.0 to 24 V
IN
IN
I
OUT
V
IN
−40 −20
0
20
40
60
80
100 120
−40 −20
0
20
40
60
80
100 120
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 3. Output Voltage vs. Temperature
Figure 4. Output Voltage vs. Temperature
3.02
3.01
3.00
2.99
5.06
5.04
5.02
5.00
NCP716BCSN500T1G
C
= C
= 1 mF
IN
OUT
T = 25°C
A
V
IN
V
IN
V
IN
V
IN
V
IN
V
IN
= 4.0 V
= 5.0 V
= 10 V
= 15 V
= 20 V
= 24 V
V
IN
V
IN
V
IN
V
IN
V
IN
= 6.0 V
= 10 V
= 15 V
= 20 V
= 24 V
NCP716BCSN300T1G
2.98
2.97
4.98
4.96
C
= C
= 1 mF
IN
OUT
T = 25°C
A
0
25
50
75
100
125
150
0
25
50
75
100
125
150
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
Figure 5. Output Voltage vs. Output Current
Figure 6. Output Voltage vs. Output Current
1200
1000
800
1000
800
600
400
NCP716BCSN300T1G
NCP716BCSN500T1G
C
= C
= 1 mF
C
= C
= 1 mF
IN
OUT
IN
OUT
T = −40°C
T = −40°C
A
A
T = 25°C
T = 25°C
A
A
T = 125°C
A
T = 125°C
A
600
400
200
0
200
0
0
25
50
75
100
125
150
0
25
50
75
100
125
150
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
Figure 7. Dropout Voltage vs. Output Current
Figure 8. Dropout Voltage vs. Output Current
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5
NCP716BC
TYPICAL CHARACTERISTICS
20
16
12
8
20
NCP716BCSN300T1G
NCP716BCSN500T1G
= C = 1 mF
T = 25°C
A
C
= C
= 1 mF
C
IN
OUT
IN
OUT
T = 25°C
A
16
12
8
I
I
I
= 0
= 50 mA
= 150 mA
I
I
I
= 0
= 50 mA
= 150 mA
OUT
OUT
OUT
OUT
OUT
OUT
4
0
4
0
0
5
10
15
20
25
0
5
10
15
20
25
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
Figure 9. Ground Current vs. Input Voltage
Figure 10. Ground Current vs. Input Voltage
7
6
5
4
3
2
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
NCP716BCSN300T1G
= 4 V
NCP716BCSN500T1G
V = 6 V
IN
V
IN
C
= C
= 1 mF
C
= C
= 1 mF
IN
OUT
IN
OUT
I
= 150 mA
I
= 150 mA
OUT
OUT
T = 25°C
A
T = 25°C
A
1
0
0.5
0
10
100
1K
10K
100K
1M
10
100
1K
10K
100K
1M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 11. Spectral Noise Density vs.
Frequency
Figure 12. Spectral Noise Density vs.
Frequency
100
80
100
80
I
I
I
= 50 mA
= 10 mA
= 1 mA
OUT
OUT
OUT
I
I
I
= 50 mA
= 10 mA
= 1 mA
OUT
OUT
OUT
60
60
40
20
0
40
20
0
NCP716BCSN300T1G
= 4 V + 200 mVpp modulation
NCP716BCSN500T1G
V = 6 V + 200 mVpp modulation
IN
V
IN
C
= 10 mF
C
= 10 mF
OUT
OUT
10
100
1K
10K
100K
1M
10
100
1K
10K
100K
1M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 13. PSRR vs. Frequency
Figure 14. PSRR vs. Frequency
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6
NCP716BC
TYPICAL CHARACTERISTICS
Figure 15. Line Transient Response
Figure 16. Line Transient Response
Figure 18. Load Transient Response
Figure 20. Turn−On Response
Figure 17. Load Transient Response
Figure 19. Turn−On Response
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7
NCP716BC
APPLICATIONS INFORMATION
Power Dissipation and Heat sinking
The NCP716BC is the member of new family of Wide
Input Voltage Range Low Dropout Regulators which
delivers Ultra Low Ground Current consumption, Good
Noise and Power Supply Rejection Ratio Performance.
The maximum power dissipation supported by the device
is dependent upon board design and layout. Mounting pad
configuration on the PCB, the board material, and the
ambient temperature affect the rate of junction temperature
rise for the part. The maximum power dissipation the
NCP716BC can handle is given by:
Input Decoupling (CIN)
It is recommended to connect at least 1.0 mF Ceramic X5R
or X7R capacitor between IN and GND pin of the device.
This capacitor will provide a low impedance path for any
unwanted AC signals or Noise superimposed onto constant
Input Voltage. The good input capacitor will limit the
influence of input trace inductances and source resistance
during sudden load current changes.
ƪT
ƫ
J(MAX) * TA
(eq. 1)
PD(MAX)
+
RqJA
The power dissipated by the NCP716BC for given
application conditions can be calculated from the following
equations:
Higher capacitance and lower ESR Capacitors will
improve the overall line transient response.
ǒ
Ǔ
ǒV
Ǔ
(eq. 2)
P
D [ VIN IGND(IOUT) ) IOUT IN * VOUT
or
Output Decoupling (COUT
)
ǒ Ǔ
D(MAX) ) VOUT IOUT
The NCP716BC does not require a minimum Equivalent
Series Resistance (ESR) for the output capacitor. The device
is designed to be stable with standard ceramics capacitors
with values of 1.0 mF or greater up to 10 mF. The X5R and
X7R types have the lowest capacitance variations over
temperature thus they are recommended.
P
(eq. 3)
VIN(MAX)
[
I
OUT ) IGND
For reliable operation, junction temperature should be
limited to +125°C maximum.
Hints
VIN and GND printed circuit board traces should be as
wide as possible. When the impedance of these traces is
high, there is a chance to pick up noise or cause the regulator
to malfunction. Place external components, especially the
output capacitor, as close as possible to the NCP716BC, and
make traces as short as possible.
ORDERING INFORMATION
†
Device
Voltage Option
Marking
Package
Shipping
NCP716BCSN300T1G
3.0 V
7AA
TSOP−5
(Pb−Free)
3000 / Tape & Reel
NCP716BCSN330T1G
NCP716BCSN345T1G
NCP716BCSN500T1G
3.3 V
3.45 V
5.0 V
7AC
7AM
7AV
TSOP−5
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
(Pb−Free)
TSOP−5
(Pb−Free)
TSOP−5
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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8
NCP716BC
PACKAGE DIMENSIONS
TSOP−5
CASE 483
ISSUE N
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
NOTE 5
5X
D
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
0.20 C A B
2X
0.10
T
M
5
4
3
2X
0.20
T
B
S
1
2
K
B
A
DETAIL Z
G
A
MILLIMETERS
TOP VIEW
DIM
A
B
C
D
MIN
2.85
1.35
0.90
0.25
MAX
3.15
1.65
1.10
0.50
DETAIL Z
J
G
H
J
K
M
S
0.95 BSC
C
0.01
0.10
0.20
0
0.10
0.26
0.60
10
3.00
0.05
H
SEATING
PLANE
END VIEW
C
_
_
SIDE VIEW
2.50
SOLDERING FOOTPRINT*
1.9
0.074
0.95
0.037
2.4
0.094
1.0
0.039
0.7
0.028
mm
inches
ǒ
Ǔ
SCALE 10:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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