NCS20072DMR2G [ONSEMI]
Operational Amplifier, Railto- Rail Output;
| 型号： | NCS20072DMR2G |
| 厂家： | 
ONSEMI |
| 描述： | Operational Amplifier, Railto- Rail Output 放大器 光电二极管 |
| 文件： | 总23页 (文件大小：963K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NCS20071, NCV20071,
NCS20072, NCV20072,
NCS20074, NCV20074
Operational Amplifier, Rail-
to-Rail Output, 3 MHz BW
www.onsemi.com
The NCx2007x series operational amplifiers provide rail−to−rail
output operation, 3 MHz bandwidth, and are available in single, dual,
and quad configurations. Rail−to−rail operation enables the user to
make optimal use of the entire supply voltage range while taking
advantage of 3 MHz bandwidth. The NCx2007x can operate on supply
voltages as low as 2.7 V over the temperature range of −40°C to
125°C. At a 2.7 V supply, the high bandwidth provides a slew rate of
2.8 V/ms while only consuming 405 mA of quiescent current per
channel. The wide supply range allows the NCx2007x to run on
supply voltages as high as 36 V, making it ideal for a broad range of
applications. Since this is a CMOS device, high input impedance and
low bias currents make it ideal for interfacing to a wide variety of
signal sensors. The NCx2007x devices are available in a variety of
compact packages. Automotive qualified options are available under
the NCV prefix.
5
1
SOT−553
CASE 463B
TSOP−5
CASE 483
8
1
Micro8]
SOIC−8
CASE 751
CASE 846A
Features
14
• Rail−To−Rail Output
• Wide Supply Range: 2.7 V to 36 V
1
TSSOP−14
CASE 948G
• Wide Bandwidth: 3 MHz typical at V = 2.7 V
S
TSSOP−8
CASE 948S
• High Slew Rate: 2.8 V/ms typical at V = 2.7 V
• Low Supply Current: 405 mA per channel at V = 2.7 V
S
S
• Low Input Bias Current: 5 pA typical
• Wide Temperature Range: −40°C to 125°C
• Available in a variety of packages
• NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
14
1
SOIC−14 NB
CASE 751A
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
DEVICE MARKING INFORMATION
See general marking information in the device marking
Compliant
section on page 2 of this data sheet.
Applications
• Current Sensing
• Signal Conditioning
• Automotive
ORDERING INFORMATION
See detailed ordering and shipping information on page 4 of
this data sheet.
End Products
• Notebook Computers
• Portable Instruments
• Power Supplies
This document contains information on some products that are still under development.
ON Semiconductor reserves the right to change or discontinue these products without
notice.
© Semiconductor Components Industries, LLC, 2016
1
Publication Order Number:
May, 2016 − Rev. 11
NCS20071/D
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
MARKING DIAGRAMS
Single Channel Configuration
NCS20071, NCV20071
5
XXXAYWG
XXMG
G
G
1
SOT−553
TSOP−5
CASE 463B
CASE 483
Dual Channel Configuration
NCS20072, NCV20072
8
1
8
K72
YWW
A G
NCS20072
ALYW
0072
AYWG
G
G
G
1
Micro8]
SOIC−8
CASE 751
TSSOP−8
CASE 948S
CASE 846A
Quad Channel Configuration
NCS20074, NCV20074
14
14
NCS2
0074
NCS20074G
AWLYWW
ALYWG
G
1
1
TSSOP−14
CASE 948G
SOIC−14 NB
CASE 751A
XXXXX = Specific Device Code
= Assembly Location
WL, L = Wafer Lot
= Year
A
Y
WW, W = Work Week
G or G = Pb−Free Package
(Note: Microdot may be in either location)
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2
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
Single Channel Configuration
NCS20071, NCV20071
IN+
OUT
VSS
1
2
3
5
4
VDD
IN−
1
2
3
5
4
VDD
OUT
+
VSS
−
IN+
IN−
SOT23−5
(TSOP−5)
SOT553−5
Quadruple Channel Configuration
NCS20074, NCV20074
Dual Channel Configuration
NCS20072, NCV20072
OUT 1
IN− 1
IN+ 1
VDD
1
2
3
4
5
6
7
14
13
12
11
10
9
OUT 4
IN− 4
IN+ 4
VSS
OUT 1
1
8
−
+
−
+
VDD
−
2
3
4
7
6
5
OUT 2
IN− 1
IN+ 1
VSS
+
IN− 2
IN+ 2
−
IN+ 3
IN− 3
OUT 3
IN+ 2
IN− 2
+
−
+
−
+
OUT 2
8
Figure 1. Pin Connections
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3
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
ORDERING INFORMATION
†
Device
Configuration
Automotive
Marking
Package
Shipping
NCS20071SN2T1G
(In Development)**
TBD
TSOP−5
(Pb−Free)
3000 / Tape and Reel
4000 / Tape and Reel
3000 / Tape and Reel
4000 / Tape and Reel
4000 / Tape and Reel
2500 / Tape and Reel
2500 / Tape and Reel
4000 / Tape and Reel
2500 / Tape and Reel
2500 / Tape and Reel
2500 / Tape and Reel
2500 / Tape and Reel
2500 / Tape and Reel
2500 / Tape and Reel
No
NCS20071XV53T2G
(In Development)**
TBD
TBD
SOT553−5
(Pb−Free)
Single
NCV20071SN2T1G*
(In Development)**
TSOP−5
(Pb−Free)
Yes
No
NCV20071XV53T2G*
(In Development)**
TBD
SOT553−5
(Pb−Free)
NCS20072DMR2G
0072
Micro8 (MSOP8)
(Pb−Free)
NCS20072DR2G
NCS20072
K72
SOIC−8
(Pb−Free)
NCS20072DTBR2G
NCV20072DMR2G*
NCV20072DR2G*
NCV20072DTBR2G*
NCS20074DR2G
TSSOP−8
(Pb−Free)
Dual
0072
Micro8 (MSOP8)
(Pb−Free)
NCS20072
K72
SOIC−8
(Pb−Free)
Yes
TSSOP−8
(Pb−Free)
NCS20074
SOIC−14
(Pb−Free)
No
NCS20074DTBR2G
NCV20074DR2G*
NCV20074DTBR2G*
NCS2
0074
TSSOP−14
(Pb−Free)
Quad
NCS20074
SOIC−14
(Pb−Free)
Yes
NCS2
0074
TSSOP−14
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
**Contact local sales office for availability.
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4
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
ABSOLUTE MAXIMUM RATINGS (Note 1)
Rating
Symbol
Limit
Unit
V
Supply Voltage (V – V ) (Note 4)
V
S
40
DD
SS
Input Voltage
V
CM
V
SS
− 0.2 to V + 0.2
V
DD
Differential Input Voltage (Note 2)
Maximum Input Current
V
V
V
ID
s
I
IN
10
100
mA
mA
mW
°C
°C
°C
V
Maximum Output Current (Note 3)
Continuous Total Power Dissipation (Note 4)
Maximum Junction Temperature
I
O
P
200
D
T
150
J
Storage Temperature Range
T
STG
−65 to 150
260
Mounting Temperature (Infrared or Convection – 20 sec)
T
mount
ESD Capability (Note 5)
Human Body Model
Machine Model − NCx20071
HBM
MM
2000
200
Machine Model − NCx20072, NCx20074
Charged Device Model − NCx20071/NCx20072
Charged Device Model − NCx20074
MM
CDM
CDM
150
2000 (C6)
1000 (C6)
Latch−Up Current (Note 6)
I
LU
100
mA
Moisture Sensitivity Level (Note 7)
MSL
Level 1
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. Maximum input current must be limited to 10 mA. Series connected resistors of at least 500 W on both inputs may be used to limit the
maximum input current to 10 mA.
3. Total power dissipation must be limited to prevent the junction temperature from exceeding the 150°C limit.
4. Continuous short circuit operation to ground at elevated ambient temperature can result in exceeding the maximum allowed junction
temperature of 150°C. Output currents in excess of the maximum output current rating over the long term may adversely affect reliability.
Shorting output to either VDD or VSS will adversely affect reliability.
5. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per ANSI/ANSI/ESDA/JEDEC JS-001−2010 (AEC−Q100−002)
ESD Machine Model tested per JESD22−A115 (AEC−Q100−003)
ESD Charged Device Model tested per ANSI/ESD S5.3.1−2009 (AEC−Q100−011)
6. Latch−up Current tested per JEDEC standard: JESD78 (AEC−Q100−004)
7. Moisture Sensitivity Level tested per IPC/JEDEC standard: J−STD−020A
THERMAL INFORMATION
Single Layer
Multi−Layer
Board (Note 8)
Board (Note 9)
Parameter
Symbol
Package
SOT23−5 / TSOP5
SOT553−5
Unit
178
167
131
194
101
128
Micro8 / MSOP8
SOIC−8
236
190
253
142
Junction−to−Ambient
q
°C/W
JA
TSSOP−8
SOIC−14
TSSOP−14
179
2
8. Values based on a 1S standard PCB according to JEDEC51−3 with 1.0 oz copper and a 300 mm copper area
2
9. Values based on a 1S2P standard PCB according to JEDEC51−7 with 1.0 oz copper and a 100 mm copper area
OPERATING RANGES
Parameter
Operating Supply Voltage (Single Supply)
Symbol
Min
2.7
Max
36
Unit
V
V
S
V
S
Operating Supply Voltage (Split Supply)
Differential Input Voltage (Note 10)
Input Common Mode Voltage Range
Ambient Temperature
1.35
18
V
V
ID
V
S
V
V
CM
V
SS
V − 1.35
DD
V
T
A
−40
125
°C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
10.Maximum input current must be limited to 10 mA. See Absolute Maximum Ratings for more information.
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5
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
ELECTRICAL CHARACTERISTICS AT VS = 2.7 V
T = 25°C; R ≥ 10 kW; V
= V
= mid−supply unless otherwise noted. All limits are guaranteed by testing or statistical analysis.
A
L
CM
OUT
Boldface limits apply over the specified temperature range, T = −40°C to 125°C. (Notes 11, 12)
A
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
INPUT CHARACTERISTICS
1.3
3
mV
mV
Input Offset Voltage
V
OS
+4
Offset Voltage Drift
DV /DT
T = 25°C to 125°C
2
5
mV/°C
OS
A
200
1500
75
Input Bias Current (Note 12)
I
IB
pA
pA
dB
2
2
NCx20072
NCx20074
500
75
Input Offset Current (Note 12)
Channel Separation
I
OS
200
NCx20072
NCx20074
100
115
50
XTLK
DC
Differential Input Resistance
R
R
C
GW
GW
pF
ID
IN
ID
Common Mode Input Resistance
Differential Input Capacitance
Common Mode Input Capacitance
5
1.5
3.5
110
C
pF
CM
90
69
90
69
V
= V + 0.2 V to
SS
CM
V
NCx20072
NCx20074
dB
dB
− 1.35 V
DD
Common Mode Rejection Ratio
CMRR
110
118
V
= V to V
−
CM
SS
DD
1.35 V (Note 13)
OUTPUT CHARACTERISTICS
96
Open Loop Voltage Gain
A
VOL
dB
mA
V
86
Op amp sinking current
Op amp sourcing current
70
50
Output Current Capability (Note 14)
Output Voltage High
I
O
0.006
0.15
0.22
0.15
0.22
V
OH
Voltage output swing from positive rail
Voltage output swing from negative rail
0.005
Output Voltage Low
V
OL
V
AC CHARACTERISTICS
Unity Gain Bandwidth
Slew Rate at Unity Gain
Phase Margin
UGBW
SR
C = 25 pF
3
MHz
V/ms
°
L
C = 20 pF, R = 2 kW
2.8
50
L
L
ö
m
C = 25 pF
L
Gain Margin
A
m
C = 25 pF
L
14
dB
Settling time to 0.1%
Settling time to 0.01%
0.6
1.2
V
= 1 Vpp,
O
Settling Time
t
S
ms
Gain = 1, C = 20 pF
L
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
11. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.
12.Performance guaranteed over the indicated operating temperature range by design and/or characterization.
13.Effective for the NCx20074 until FPCN 20949 is implemented. After the FPCN is implemented, the NCx20074 condition will change to V
CM
= V + 0.2 V to V − 1.35 V.
SS
DD
14.Power dissipation must be limited to prevent junction temperature from exceeding 150°C. See Absolute Maximum Ratings for more infor-
mation.
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6
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
ELECTRICAL CHARACTERISTICS AT VS = 2.7 V
T = 25°C; R ≥ 10 kW; V
= V
= mid−supply unless otherwise noted. All limits are guaranteed by testing or statistical analysis.
A
L
CM
OUT
Boldface limits apply over the specified temperature range, T = −40°C to 125°C. (Notes 11, 12)
A
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
NOISE CHARACTERISTICS
Total Harmonic Distortion plus Noise
THD+N
V
IN
= 0.5 Vpp, f = 1 kHz, Av = 1
f = 1 kHz
0.05
30
%
Input Referred Voltage Noise
e
n
nV/√Hz
fA/√Hz
f = 10 kHz
20
Input Referred Current Noise
i
n
f = 1 kHz
0.25
SUPPLY CHARACTERISTICS
114
135
405
Power Supply Rejection Ratio
PSRR
No Load
dB
100
525
Power Supply Quiescent Current
I
Per channel, no load
mA
DD
625
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
11. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.
12.Performance guaranteed over the indicated operating temperature range by design and/or characterization.
13.Effective for the NCx20074 until FPCN 20949 is implemented. After the FPCN is implemented, the NCx20074 condition will change to V
CM
= V + 0.2 V to V − 1.35 V.
SS
DD
14.Power dissipation must be limited to prevent junction temperature from exceeding 150°C. See Absolute Maximum Ratings for more infor-
mation.
ELECTRICAL CHARACTERISTICS AT VS = 5 V
T = 25°C; R ≥ 10 kW; V
= V
= mid−supply unless otherwise noted. All limits are guaranteed by testing or statistical analysis.
A
L
CM
OUT
Boldface limits apply over the specified temperature range, T = −40°C to 125°C. (Notes 15, 16)
A
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
INPUT CHARACTERISTICS
1.3
3
mV
mV
Input Offset Voltage
Offset Voltage Drift
V
OS
+4
DV /DT
T = 25°C to 125 °C
2
5
mV/°C
OS
A
200
1500
75
Input Bias Current (Note 16)
Input Offset Current (Note 16)
Channel Separation
I
IB
pA
pA
dB
2
2
NCx20072
NCx20074
500
75
I
OS
200
NCx20072
NCx20074
100
115
50
XTLK
DC
Differential Input Resistance
R
R
C
GW
GW
pF
ID
IN
ID
Common Mode Input Resistance
Differential Input Capacitance
Common Mode Input Capacitance
5
1.5
3.5
C
pF
CM
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
15.Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.
16.Performance guaranteed over the indicated operating temperature range by design and/or characterization.
17.Effective for the NCx20074 until FPCN 20949 is implemented. After the FPCN is implemented, the NCx20074 condition will change to V
CM
= V + 0.2 V to V − 1.35 V.
SS
DD
18.Power dissipation must be limited to prevent junction temperature from exceeding 150°C. See Absolute Maximum Ratings for more infor-
mation.
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7
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
ELECTRICAL CHARACTERISTICS AT VS = 5 V
T = 25°C; R ≥ 10 kW; V
= V
= mid−supply unless otherwise noted. All limits are guaranteed by testing or statistical analysis.
A
L
CM
OUT
Boldface limits apply over the specified temperature range, T = −40°C to 125°C. (Notes 15, 16)
A
Parameter
Symbol
Conditions
Min
Typ
125
125
Max
Unit
INPUT CHARACTERISTICS
102
80
V
= V + 0.2 V to
SS
CM
V
NCx20072
NCx20074
dB
dB
− 1.35 V
DD
Common Mode Rejection Ratio
CMRR
102
80
V
= V to V
−
CM
SS
DD
1.35 V (Note 17)
OUTPUT CHARACTERISTICS
96
120
Open Loop Voltage Gain
A
dB
mA
V
VOL
86
Op amp sinking current
Op amp sourcing current
50
60
Output Current Capability (Note 18)
Output Voltage High
I
O
0.013
0.20
0.25
0.10
0.15
V
Voltage output swing from positive rail
Voltage output swing from negative rail
OH
0.01
Output Voltage Low
V
V
OL
AC CHARACTERISTICS
Unity Gain Bandwidth
Slew Rate at Unity Gain
Phase Margin
UGBW
SR
C = 25 pF
3.2
2.7
50
MHz
V/ms
°
L
C = 20 pF, R = 2 kW
L
L
ö
m
C = 25 pF
L
Gain Margin
A
m
C = 25 pF
L
14
dB
Settling time to 0.1%
Settling time to 0.01%
1.2
5.6
V
= 3 Vpp,
O
Settling Time
t
S
ms
Gain = 1, C = 20 pF
L
NOISE CHARACTERISTICS
Total Harmonic Distortion plus Noise
THD+N
V
IN
= 2.5 Vpp, f = 1 kHz, Av = 1
0.009
30
%
f = 1 kHz
f = 10 kHz
f = 1 kHz
Input Referred Voltage Noise
e
n
nV/√Hz
fA/√Hz
20
Input Referred Current Noise
i
n
0.25
SUPPLY CHARACTERISTICS
114
135
410
Power Supply Rejection Ratio
PSRR
No Load
dB
100
530
Power Supply Quiescent Current
I
Per channel, no load
mA
DD
630
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
15.Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.
16.Performance guaranteed over the indicated operating temperature range by design and/or characterization.
17.Effective for the NCx20074 until FPCN 20949 is implemented. After the FPCN is implemented, the NCx20074 condition will change to V
CM
= V + 0.2 V to V − 1.35 V.
SS
DD
18.Power dissipation must be limited to prevent junction temperature from exceeding 150°C. See Absolute Maximum Ratings for more infor-
mation.
www.onsemi.com
8
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
ELECTRICAL CHARACTERISTICS AT VS = 10 V
T = 25°C; R ≥ 10 kW; V
= V
= mid−supply unless otherwise noted. All limits are guaranteed by testing or statistical analysis.
A
L
CM
OUT
Boldface limits apply over the specified temperature range, T = −40°C to 125°C. (Notes 19, 20)
A
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
INPUT CHARACTERISTICS
1.3
3
mV
mV
Input Offset Voltage
V
OS
+4
Offset Voltage Drift
DV /DT
T = 25°C to 125°C
2
5
mV/°C
OS
A
200
1500
75
Input Bias Current (Note 20)
I
IB
pA
pA
dB
2
2
NCx20072
NCx20074
500
75
Input Offset Current (Note 20)
Channel Separation
I
OS
200
NCx20072
NCx20074
100
115
50
XTLK
DC
Differential Input Resistance
R
R
C
GW
GW
pF
ID
IN
ID
Common Mode Input Resistance
Differential Input Capacitance
Common Mode Input Capacitance
5
1.5
3.5
130
C
pF
CM
110
87
V
= V + 0.2 V to
SS
CM
V
NCx20072
NCx20074
dB
dB
− 1.35 V
DD
Common Mode Rejection Ratio
CMRR
110
87
130
120
V
= V to V
−
CM
SS
DD
1.35 V (Note 21)
OUTPUT CHARACTERISTICS
98
Open Loop Voltage Gain
A
VOL
dB
mA
V
88
Op amp sinking current
Op amp sourcing current
50
65
Output Current Capability (Note 22)
Output Voltage High
I
O
0.023
0.08
0.10
0.3
V
OH
Voltage output swing from positive rail
Voltage output swing from negative rail
0.022
Output Voltage Low
V
OL
V
0.35
AC CHARACTERISTICS
Unity Gain Bandwidth
Slew Rate at Unity Gain
Phase Margin
UGBW
SR
C = 25 pF
3.2
2.2
50
MHz
V/ms
°
L
C = 20 pF, R = 2 kW
L
L
ö
m
C = 25 pF
L
Gain Margin
A
m
C = 25 pF
L
14
dB
Settling time to 0.1%
Settling time to 0.01%
3.4
6.8
V
= 8.5 Vpp,
O
Settling Time
t
S
ms
Gain = 1, C = 20 pF
L
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
19.Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.
20.Performance guaranteed over the indicated operating temperature range by design and/or characterization.
21.Effective for the NCx20074 until FPCN 20949 is implemented. After the FPCN is implemented, the NCx20074 condition will change to V
CM
= V + 0.2 V to V − 1.35 V.
SS
DD
22.Power dissipation must be limited to prevent junction temperature from exceeding 150°C. See Absolute Maximum Ratings for more infor-
mation.
www.onsemi.com
9
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
ELECTRICAL CHARACTERISTICS AT VS = 10 V
T = 25°C; R ≥ 10 kW; V
= V
= mid−supply unless otherwise noted. All limits are guaranteed by testing or statistical analysis.
A
L
CM
OUT
Boldface limits apply over the specified temperature range, T = −40°C to 125°C. (Notes 19, 20)
A
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
NOISE CHARACTERISTICS
Total Harmonic Distortion plus Noise
THD+N
V
IN
= 7.5 Vpp, f = 1 kHz, Av = 1
f = 1 kHz
0.004
30
%
Input Referred Voltage Noise
e
n
nV/√Hz
fA/√Hz
f = 10 kHz
20
Input Referred Current Noise
i
n
f = 1 kHz
0.25
SUPPLY CHARACTERISTICS
114
135
416
Power Supply Rejection Ratio
PSRR
No Load
dB
100
540
Power Supply Quiescent Current
I
Per channel, no load
mA
DD
640
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
19.Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.
20.Performance guaranteed over the indicated operating temperature range by design and/or characterization.
21.Effective for the NCx20074 until FPCN 20949 is implemented. After the FPCN is implemented, the NCx20074 condition will change to V
CM
= V + 0.2 V to V − 1.35 V.
SS
DD
22.Power dissipation must be limited to prevent junction temperature from exceeding 150°C. See Absolute Maximum Ratings for more infor-
mation.
ELECTRICAL CHARACTERISTICS AT VS = 36 V
T = 25°C; R ≥ 10 kW; V
= V
= mid−supply unless otherwise noted. All limits are guaranteed by testing or statistical analysis.
A
L
CM
OUT
Boldface limits apply over the specified temperature range, T = −40°C to 125°C. (Notes 23, 24)
A
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
INPUT CHARACTERISTICS
1.3
3
mV
mV
Input Offset Voltage
Offset Voltage Drift
V
OS
+4
DV /DT
T = 25°C to 125°C
2
5
mV/°C
OS
A
200
2000
1500
75
NCx20072
NCx20074
Input Bias Current (Note 24)
I
IB
pA
2
2
NCx20072
NCx20074
1000
75
Input Offset Current (Note 24)
Channel Separation
I
pA
dB
OS
200
NCx20072
NCx20074
100
115
50
XTLK
DC
Differential Input Resistance
R
R
C
GW
GW
pF
ID
IN
ID
Common Mode Input Resistance
Differential Input Capacitance
Common Mode Input Capacitance
5
1.5
3.5
C
pF
CM
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
23.Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.
24.Performance guaranteed over the indicated operating temperature range by design and/or characterization.
25.Effective for the NCx20074 until FPCN 20949 is implemented. After the FPCN is implemented, the NCx20074 condition will change to V
CM
= V + 0.2 V to V − 1.35 V.
SS
DD
26.Power dissipation must be limited to prevent junction temperature from exceeding 150°C. See Absolute Maximum Ratings for more infor-
mation.
www.onsemi.com
10
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
ELECTRICAL CHARACTERISTICS AT VS = 36 V
T = 25°C; R ≥ 10 kW; V
= V
= mid−supply unless otherwise noted. All limits are guaranteed by testing or statistical analysis.
A
L
CM
OUT
Boldface limits apply over the specified temperature range, T = −40°C to 125°C. (Notes 23, 24)
A
Parameter
Symbol
Conditions
Min
Typ
145
145
Max
Unit
INPUT CHARACTERISTICS
120
95
V
= V + 0.2 V to
SS
CM
V
NCx20072
NCx20074
− 1.35 V
DD
Common Mode Rejection Ratio
CMRR
dB
120
95
V
= V to V
−
CM
SS
DD
1.35 V (Note 25)
OUTPUT CHARACTERISTICS
98
120
Open Loop Voltage Gain
A
VOL
dB
88
Op amp sinking current
Op amp sourcing current
50
65
Output Current Capability (Note 26)
Output Voltage High
I
mA
O
0.074
0.10
0.15
0.12
0.3
Voltage output swing
from positive rail
NCx20072
NCx20074
V
OH
V
V
0.065
Output Voltage Low
V
OL
Voltage output swing from negative rail
0.35
AC CHARACTERISTICS
Unity Gain Bandwidth
Slew Rate at Unity Gain
Phase Margin
UGBW
SR
C = 25 pF
3.2
2.4
50
MHz
V/ms
°
L
C = 20 pF, R = 2 kW
L
L
ö
m
C = 25 pF
L
Gain Margin
A
m
C = 25 pF
L
14
dB
Settling time to 0.1%
Settling time to 0.01%
3.2
6.8
V
= 10 Vpp,
O
Settling Time
t
S
ms
Gain = 1, C = 20 pF
L
NOISE CHARACTERISTICS
Total Harmonic Distortion plus Noise
THD+N
V
IN
= 28.5 Vpp, f = 1 kHz, Av = 1
0.001
30
%
f = 1 kHz
f = 10 kHz
f = 1 kHz
Input Referred Voltage Noise
e
n
nV/√Hz
fA/√Hz
20
Input Referred Current Noise
i
n
0.25
SUPPLY CHARACTERISTICS
114
135
465
465
Power Supply Rejection Ratio
PSRR
No Load
dB
100
570
700
600
700
NCx20072
NCx20074
Power Supply Quiescent Current
I
Per channel, no load
mA
DD
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
23.Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.
24.Performance guaranteed over the indicated operating temperature range by design and/or characterization.
25.Effective for the NCx20074 until FPCN 20949 is implemented. After the FPCN is implemented, the NCx20074 condition will change to V
CM
= V + 0.2 V to V − 1.35 V.
SS
DD
26.Power dissipation must be limited to prevent junction temperature from exceeding 150°C. See Absolute Maximum Ratings for more infor-
mation.
www.onsemi.com
11
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
0.7
0.6
0.5
0.4
0.3
0.2
0.7
0.6
V
= 36 V
S
T = 125°C
T = 85°C
0.5
0.4
0.3
0.2
T = 25°C
V
S
= 2.7 V
T = −40°C
V
= 5 V
S
V
S
= 10 V
0
6
12
18
24
30
36
−40 −20
0
20
40
60
80
100 120
SUPPLY VOLTAGE (V)
TEMPERATURE (°C)
Figure 2. Quiescent Current Per Channel vs.
Supply Voltage
Figure 3. Quiescent Current vs. Temperature
0
−0.2
−0.4
−0.6
−0.8
−1
5
4
V
=
18 V
V
= mid−supply
S
CM
10 units
3
2
1
T = −40°C
0
−1
−2
−3
−4
−5
T = 85°C
T = 25°C
T = 125°C
−1.2
0
6
12
18
24
30
36
−18 −14 −10 −6
−2
2
6
10
14 18
SUPPLY VOLTAGE (V)
COMMON MODE VOLTAGE (V)
Figure 4. Offset Voltage vs. Supply Voltage
Figure 5. Input Offset Voltage vs. Common
Mode Voltage
5
2.5
125
100
75
180
135
90
V
S
V
S
V
S
V
S
= 2.7 V, Gain
= 36 V, Gain
= 2.7 V, Phase
= 36 V, Phase
V
=
18 V
S
Normal
operation
10 units
0
GAIN
−2.5
−5
50
45
25
0
R = 10 kW
C = 15 pF
L
L
−7.5
−10
−12.5
−15
0
−45
−90
−135
−180
−25
−50
−75
PHASE
15.5
16
16.5
17
17.5
18
18.5
10
100
1k
10k
100k
1M
10M 100M
COMMON MODE VOLTAGE (V)
FREQUENCY (Hz)
Figure 6. Input Offset Voltage vs. Common
Mode Voltage
Figure 7. Gain and Phase vs. Frequency
www.onsemi.com
12
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
60
50
40
30
20
10
0
1E+1
V
= 36 V
= 1 kHz
A = 1
V
S
V
= 5 V
S
F
IN
R = 10 kW
L
1E+0
1E−1
1E−2
1E−3
1E−4
T = 25°C
A
0
100
200
300
400
500
0
6
12
18
24
30
36
CAPACITIVE LOAD (pF)
OUTPUT VOLTAGE (Vpp)
Figure 8. Phase Margin vs. Capacitive Load
Figure 9. THD+N vs. Output Voltage
275
250
225
200
175
150
125
100
75
1E+1
1E+0
1E−1
1E−2
1E−3
1E−4
V
V
V
V
= 2.7 V
= 5 V
= 10 V
= 36 V
S
S
S
S
A = 1
V
V
= 2.7 V
S
V
= 5 V
S
V
= 10 V
= 36 V
S
V
S
50
25
0
10
10
100
1k
10k
100
1k
10k
100k
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 10. THD+N vs. Frequency
Figure 11. Input Voltage Noise vs. Frequency
140
120
100
80
5
V
S
V
S
V
S
V
S
= 2.7 V, V
= 5 V, V
V
S
V
S
V
S
V
S
= 2.7 V
= 5 V
= 10 V
= 36 V
DD
SS
4
3
= 10 V, V
DD
SS
= 36 V V
2
60
1
40
0
20
0
−1
10
100
1k
10k
100k
10
100
1k
10k
100k
1M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 12. Input Current Noise vs. Frequency
Figure 13. PSRR vs. Frequency
www.onsemi.com
13
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
120
100
80
60
40
20
0
1.4
V
S
V
S
V
S
V
S
= 2.7 V
= 5 V
= 10 V
= 36 V
T = −40°C
T = 25°C
T = 85°C
T = 125°C
1.2
1
0.8
0.6
0.4
0.2
0
R = 10 kW
T = 25°C
A
L
V
S
= 36 V
10
100
1k
10k
100k
1M
0
2
4
6
8
10
12 14
16 18 20
FREQUENCY (Hz)
OUTPUT CURRENT (mA)
Figure 14. CMRR vs. Frequency
Figure 15. High Level Output vs. Output
Current
1
0.8
0.6
0.4
0.2
0
18.1
18.05
18
Input
Output
T = −40°C
T = 25°C
T = 85°C
T = 125°C
V
= 36 V
S
A = +1
R = 10 kW
L
V
17.95
17.9
V
S
= 36 V
0
2
4
6
8
10
12 14
16 18 20
−20
0
20
40
60
OUTPUT CURRENT (mA)
TIME (ms)
Figure 16. Low Level Output vs. Output
Current
Figure 17. Non−inverting Small Signal
Transient Response
18.075
18.05
18.025
18
25
Input
Output
20
15
10
V
= 36 V
S
17.975
17.95
17.925
A = +1
R = 10 kW
L
V
V
S
= 36 V
A = +1
R = 10 kW
L
V
Input
Output
−20
0
20
40
60
−20
0
20
40
60
TIME (ms)
TIME (ms)
Figure 18. Inverting Small Signal Transient
Response
Figure 19. Non−inverting Large Signal
Transient Response
www.onsemi.com
14
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
24
22
20
18
16
14
12
10
1200
V
S
= 36 V
1000
800
600
400
200
0
I +
V
= 36 V
IB
S
I −
A = −1
R = 10 kW
L
IB
V
I
OS
Input
Output
−200
−20
0
20
40
60
−25
0
25
50
75
100
125
TIME (ms)
TEMPERATURE (°C)
Figure 20. Inverting Large Signal Transient
Response
Figure 21. Input Bias and Offset Current vs.
Temperature
50
40
0.1 Hz to 10 Hz noise
V
S
= 36 V
V
S
=
18 V, V = V /2
CM S
I +
IB
R = 10 kW, C = 100 pF
30
L
L
I −
IB
A = −1, V = 0 V
V
IN
I
OS
20
10
0
−10
−20
−30
−40
−50
0
6
12
18
24
30
36
0
1
2
3
4
5
6
7
8
9
10
COMMON MODE VOLTAGE (V)
TIME (s)
Figure 22. Input Bias Current vs. Common
Mode Voltage
Figure 23. 0.1 Hz to 10 Hz Noise
0
500
V
S
V
S
V
S
V
S
= 2.7 V
= 5 V
= 10 V
= 36 V
R = 10 kW
C = 25 pF
L
L
450
400
350
300
250
200
150
100
50
−20
−40
−60
−80
−100
−120
−140
−160
V
S
V
S
V
S
V
S
= 2.7 V
= 5 V
= 10 V
= 36 V
0
10
100
1k
10k
100k
1M
10
100
1k
10k
100k
1M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 24. Channel Separation vs. Frequency
Figure 25. Open Loop Output Impedance
www.onsemi.com
15
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
1000
500
10
V
= 36 V
S
V
= 36 V
S
8
6
10 V step
A = −1
5 Units
= mid−supply
V
V
CM
0
4
2
12−bit Setting
−500
−1000
−1500
−2000
−2500
0
1/2LSB = 0.024%
−2
−4
−6
−8
−10
−50
−25
0
25
50
75
100
125
0
5
10
15
20 25 30 35 40
45 50
TEMPERATURE (°C)
TIME (ms)
Figure 26. Offset Voltage vs. Temperature
Figure 27. Large Signal Settling Time
5
4
3
2
1
0
SR+
SR−
V
S
= 36 V
−40 −20
0
20
40
60
80
100 120
TEMPERATURE (°C)
Figure 28. Slew Rate vs. Temperature
www.onsemi.com
16
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
PACKAGE DIMENSIONS
SOT−553, 5 LEAD
CASE 463B
ISSUE C
NOTES:
D
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
A
−X−
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
L
5
4
3
MILLIMETERS
INCHES
NOM
0.022
0.009
0.005
0.063
0.047
0.020 BSC
0.008
0.063
E
−Y−
DIM
A
b
c
D
E
MIN
0.50
0.17
0.08
1.55
1.15
NOM
0.55
0.22
0.13
1.60
MAX
MIN
MAX
0.024
0.011
0.007
0.065
0.049
H
E
0.60
0.27
0.18
1.65
1.25
0.020
0.007
0.003
0.061
0.045
1
2
b 5 PL
c
1.20
e
M
e
L
0.50 BSC
0.20
1.60
0.08 (0.003)
X Y
0.10
1.55
0.30
1.65
0.004
0.061
0.012
0.065
H
E
RECOMMENDED
SOLDERING FOOTPRINT*
0.3
0.0118
0.45
0.0177
1.0
0.0394
1.35
0.0531
0.5
0.5
0.0197 0.0197
mm
inches
ǒ
Ǔ
SCALE 20:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
17
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
PACKAGE DIMENSIONS
TSOP−5
CASE 483−02
ISSUE K
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
NOTE 5
5X
D
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
0.20 C A B
2X
0.10
T
M
5
4
3
2X
0.20
T
B
S
1
2
K
B
A
DETAIL Z
G
A
MILLIMETERS
TOP VIEW
DIM
A
B
MIN
3.00 BSC
1.50 BSC
MAX
DETAIL Z
C
D
0.90
0.25
1.10
0.50
J
G
H
J
K
M
S
0.95 BSC
C
0.01
0.10
0.20
0
0.10
0.26
0.60
0.05
H
SEATING
PLANE
END VIEW
C
10
_
_
SIDE VIEW
2.50
3.00
SOLDERING FOOTPRINT*
1.9
0.074
0.95
0.037
2.4
0.094
1.0
0.039
0.7
0.028
mm
inches
ǒ
Ǔ
SCALE 10:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
18
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
PACKAGE DIMENSIONS
Micro8t
CASE 846A−02
ISSUE J
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. 846A-01 OBSOLETE, NEW STANDARD 846A-02.
H
E
E
MILLIMETERS
INCHES
NOM
−−
0.003
0.013
0.007
0.118
DIM
A
A1
b
c
D
MIN
−−
NOM
−−
MAX
MIN
−−
MAX
0.043
0.006
0.016
0.009
0.122
0.122
PIN 1 ID
e
1.10
0.15
0.40
0.23
3.10
3.10
b 8 PL
0.05
0.25
0.13
2.90
2.90
0.08
0.002
0.010
0.005
0.114
0.114
0.33
M
S
S
0.08 (0.003)
T B
A
0.18
3.00
E
3.00
0.118
e
L
H
E
0.65 BSC
0.55
4.90
0.026 BSC
0.021
0.193
SEATING
PLANE
0.40
4.75
0.70
5.05
0.016
0.187
0.028
0.199
−T−
A
0.038 (0.0015)
L
A1
c
RECOMMENDED
SOLDERING FOOTPRINT*
8X
8X
0.48
0.80
5.25
0.65
PITCH
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
19
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
PACKAGE DIMENSIONS
SOIC−8 NB
CASE 751−07
ISSUE AK
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
−X−
A
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
8
5
4
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
S
M
M
B
0.25 (0.010)
Y
1
K
−Y−
MILLIMETERS
DIM MIN MAX
INCHES
G
MIN
MAX
0.197
0.157
0.069
0.020
A
B
C
D
G
H
J
K
M
N
S
4.80
3.80
1.35
0.33
5.00 0.189
4.00 0.150
1.75 0.053
0.51 0.013
C
N X 45
_
SEATING
PLANE
1.27 BSC
0.050 BSC
−Z−
0.10
0.19
0.40
0
0.25 0.004
0.25 0.007
1.27 0.016
0.010
0.010
0.050
8
0.020
0.244
0.10 (0.004)
M
J
H
D
8
0
_
_
_
_
0.25
5.80
0.50 0.010
6.20 0.228
M
S
S
X
0.25 (0.010)
Z
Y
SOLDERING FOOTPRINT*
1.52
0.060
7.0
4.0
0.275
0.155
0.6
0.024
1.270
0.050
mm
inches
ǒ
Ǔ
SCALE 6:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
20
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
PACKAGE DIMENSIONS
TSSOP−8
CASE 948S
ISSUE C
8x K REF
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
M
S
S
V
0.10 (0.004)
T U
S
0.20 (0.008) T U
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
6. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE -W-.
8
5
4
2X L/2
B
−U−
J
J1
L
1
PIN 1
IDENT
K1
K
S
0.20 (0.008) T U
A
SECTION N−N
−V−
MILLIMETERS
INCHES
MIN
DIM MIN
MAX
3.10
4.50
1.10
0.15
0.70
MAX
0.122
0.177
0.043
0.006
0.028
A
B
2.90
4.30
---
0.114
0.169
---
−W−
C
C
0.076 (0.003)
D
0.05
0.50
0.002
0.020
F
DETAIL E
SEATING
D
−T−
G
G
J
0.65 BSC
0.026 BSC
PLANE
0.09
0.09
0.19
0.19
0.20
0.16
0.30
0.25
0.004
0.004
0.007
0.007
0.008
0.006
0.012
0.010
J1
K
0.25 (0.010)
N
K1
L
6.40 BSC
0.252 BSC
0
M
M
0
8
8
_
_
_
_
N
F
DETAIL E
www.onsemi.com
21
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
PACKAGE DIMENSIONS
TSSOP−14
CASE 948G
ISSUE B
NOTES:
14X K REF
1. DIMENSIONING AND TOLERANCING PER
M
S
S
V
ANSI Y14.5M, 1982.
0.10 (0.004)
T U
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
S
0.15 (0.006) T U
N
0.25 (0.010)
14
8
2X L/2
M
B
−U−
L
N
PIN 1
IDENT.
F
7
1
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
DETAIL E
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
S
K
0.15 (0.006) T U
A
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
K1
−V−
A
B
C
D
F
4.90
4.30
−−−
0.05
0.50
5.10 0.193 0.200
4.50 0.169 0.177
J J1
1.20
−−− 0.047
0.15 0.002 0.006
0.75 0.020 0.030
SECTION N−N
G
H
J
J1
K
0.65 BSC
0.026 BSC
0.60 0.020 0.024
0.20 0.004 0.008
0.16 0.004 0.006
0.30 0.007 0.012
0.25 0.007 0.010
0.50
0.09
0.09
0.19
−W−
C
K1 0.19
L
M
6.40 BSC
0.252 BSC
0.10 (0.004)
0
8
0
8
_
_
_
_
SEATING
−T−
H
G
DETAIL E
D
PLANE
SOLDERING FOOTPRINT*
7.06
1
0.65
PITCH
14X
0.36
14X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
22
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
PACKAGE DIMENSIONS
SOIC−14 NB
CASE 751A−03
ISSUE L
NOTES:
D
A
B
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF AT
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD PROTRUSIONS.
14
8
7
A3
E
H
5. MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
L
DETAIL A
1
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
13X b
M
M
B
0.25
A
A1
A3
b
D
E
1.35
0.10
0.19
0.35
8.55
3.80
1.75 0.054 0.068
0.25 0.004 0.010
0.25 0.008 0.010
0.49 0.014 0.019
8.75 0.337 0.344
4.00 0.150 0.157
M
S
S
B
0.25
C A
DETAIL A
h
A
X 45
_
e
H
h
L
1.27 BSC
0.050 BSC
6.20 0.228 0.244
0.50 0.010 0.019
1.25 0.016 0.049
5.80
0.25
0.40
0
0.10
M
A1
e
M
7
0
7
_
_
_
_
SEATING
PLANE
C
SOLDERING FOOTPRINT*
6.50
14X
1.18
1
1.27
PITCH
14X
0.58
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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