NCS37005DAG [ONSEMI]
Ground Fault Interrupter; 接地故障断路器
| 型号： | NCS37005DAG |
| 厂家： | 
ONSEMI |
| 描述： | Ground Fault Interrupter |
| 文件： | 总8页 (文件大小：126K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NCS37005
Product Preview
Ground Fault Interrupter
(GFI)
Description
http://onsemi.com
The NCS37005 is a signal processor for GFI applications. The
device integrates a flexible power supply (including both shunt and
LDO regulators), and differential fault detection circuits. The
proprietary fault processing circuitry offers high performance with
low turns ratio ferrite current transformers. The device also includes a
specialized DSP controller that offers best in class immunity to
nuisance loads without the need for external analog filters.
16
1
QFN 16
TSSOP 16
1
MN SUFFIX
CASE 485G
DA SUFFIX
CASE 948F
Features
MARKING DIAGRAM
• 6.0 – 18 Volt Operation (120 − 480 V AC Mains with the Appropriate
Series Impedance)
XXXXX
ALYWG
CCCCC
• −40 to 85°C
• Very Low Power Consumption: <5 mW @ 5 V
• 16 Pin QFN Package
• Low Cost/Turns Ratio Ferrite Current Transformer (CT) Detection of
Differential
XXXXX = Specific Device Code
A
L
= Assembly Location
= Wafer Lot
• Self Syncing Internal Oscillator Adjusts to AC Mains Frequency to
Guarantee Full Resolution on 50 and 60 Hz Distribution Systems
• Optimized Solenoid Deployment (coil is not energized near the AC
mains zero crossings)
Y
W
= Year
= Work Week
G or G = Pb−Free Package
CCCCC = Country of Origin
• Randomized Testing Sequence to Minimize Noise and Potential
Interactions on the AC Mains
PIN CONNECTIONS
• >5 mA SCR Driver for Additional Immunity to Supply
Noise/Interference
• Superior Immunity to Nuisance Loads/Noise (up to 10 A) without
Loss of Detection Capability or CT Saturation
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
1
MLD
CTresGN
CTbias
CTstim
GND
(Top View)
Typical Applications
• Load Panel GFI/RCD Breakers
• GFI Receptacles
• In−line GFI Circuits (power cords)
This document contains information on a product under development. ON Semiconductor
reserves the right to change or discontinue this product without notice.
ORDERING INFORMATION
†
Device
Package
QFN16
Shipping
NCS37005MNTWG
NCS37005MNG
NCS37005DARG
NCS37005DAG
Tape & Reel
Tube
QFN16
TSSOP20
TSSOP20
Tape & Reel
Tube
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2012
1
Publication Order Number:
April, 2012 − Rev. P0
NCS37005/D
NCS37005
−
HV
Bandgap
Brown
Out
+
AVDD/
DVDD
−
+
POR
CTresGN
IDF
Grounded Neutral
Detection
Low
Pass
Filter
Differential Current
Detection
SCRdrv
Mixer
Self
Trimmed
RC Osc
CTresD
CTstim
Control Logic and
Digital Filter
TE
Waveform
Generator
TestDin1−5
TestDout1−2
MLD
Mains Level
Detect (Zero
CTbias
G2N
Randomizer
Cross)
Figure 1. Simplified Block Diagram
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2
NCS37005
Table 1. PIN FUNCTION DESCRIPTION − QFN
Pin #
0
Name
Ground
MLD
CTtest
CTbias
CTstim
CTresD
IDF
Pad Description
QFN center slug
Mains Level Detect (Zero Cross)
1
2
Test port (Must be tied to CTbias in functional mode).
2 V reference that is connected to the external CT sensor
Differential current measurement port for external CT
Determines IV converter gain for detection threshold / matched to CT turns ratio (Differential Current)
Front end noise filter capacitor
3
4
5
6
7
NC
Tie to Ground or leave floating
8
NC
Tie to Ground or leave floating
9
NC
Tie to Ground or leave floating
10
11
12
13
14
15
16
NC
Tie to Ground or leave floating
NC
Tie to Ground or leave floating
NC
Tie to Ground or leave floating
NC
Float
NC
Float
SCRdrv
Supply
Used to trigger the solenoid at a fault detection
Power supply
Table 2. PIN FUNCTION DESCRIPTION − TSSOP
Pin #
1
Name
CTstim
Ground
CTresD
IDF
Pad Description
Differential current measurement port for external CT
2
Main ground connection for IC.
3
Determines IV converter gain for detection threshold / matched to CT turns ratio (Differential Current)
4
Front end noise filter capacitor
Test enable
5
TE
6
NC
Tie to Ground or leave floating
Tie to Ground or leave floating
Tie to Ground or leave floating
Tie to Ground or leave floating
Tie to Ground or leave floating
Float
7
NC
8
NC
9
NC
10
11
12
13
14
15
16
NC
NC
NC
Float
SCRdrv
Supply
MLD
CTbias
Used to trigger the solenoid at a fault detection
Power supply
Mains Level Detect (Zero Cross)
2 V reference that is connected to the external CT sensor
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3
NCS37005
Table 3. ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
Unit
V
Supply Voltage Range
Vs
6.0 to 19 V
−0.3 to 6.0
Input Voltage Range (Note 1)
Output Voltage Range
V
in
V
V
out
−0.3 to 6.0 V or (V + 0.3),
V
in
whichever is lower
Maximum Junction Temperature
Storage Temperature Range
T
140
−65 to 150
2
°C
°C
kV
V
J(max)
TSTG
ESD Capability, Human Body Model (Note 2)
ESD Capability, Machine Model (Note 2)
Lead Temperature Soldering
ESDHBM
ESDMM
200
T
260
°C
SLD
Reflow (SMD Styles Only), Pb−Free Versions (Note 3)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
Latchup Current Maximum Rating: v150 mA per JEDEC standard: JESD78
3. For information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D
Table 4. THERMAL CHARACTERISTICS
Rating
Symbol
Value
Unit
Thermal Characteristics, QFN16, 3x3.3 mm (Note 4)
Thermal Resistance, Junction−to−Air (Note 5)
Thermal Reference, Junction−to−Lead2 (Note 5)
°C/W
R
θJA
R
ψJL
64
Thermal Characteristics, TSOP−5 (Note 4)
Thermal Resistance, Junction−to−Air (Note 5)
R
θJA
°C/W
4. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2
2
5. Values based on copper area of 645 mm (or 1 in ) of 1 oz copper thickness and FR4 PCB substrate.
Table 5. OPERATING RANGES (Note 6)
Parameter
Conditions
Min
Typ
Max
Units
C
Operating Temperature
IDD
−40
85
2
mA
mA
V
SCR Trigger Current
8
SCR Trigger output voltage
Fault Current Sensitivity
Ground Fault Response Time
Ground Fault Response Time
Ground Fault Response Time
CT Turns Ratio
With 5 V supply
4.5
4.5
5
Ground Fault with 1% resistor for RctresD
5
5.5
150
75
mA
ms
ms
ms
5−20 mA
20−100 mA
>100 mA
25
100
300
Internal Oscillator Frequency
CT Driver Closed Loop BW
2
MHz
KHz
500
6. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
http://onsemi.com
4
NCS37005
APPLICATIONS INFORMATION
Q1
Solenoid
Rmains
Dx
Full Wave Rectifier
or
Switch mode supply
Rzc
Csup
T1
MLD
CTresGN
CTbias
Cgn
CTstim
Cidf
RctD
Figure 2. Typical Application Schematic
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5
NCS37005
RECOMMENDED EXTERNAL COMPONENTS:
Component Type
SCR
Instance
Q1
Value
Note
ON−MCR08
−
Diode
Dx
−
ON−1N4007
Capacitor
Capacitor
Resistor
Resistor
Resistor
TVS
Csup
Cidf
1 − 4.7 mF
180 − 220 nF
20 − 70 K
400 − 800 K
10 − 45 K
−
For a full bridge rectifier
Differential current filtering
Matched to current transformer
Zero cross detection resistor. Value limits current
For a full bridge rectifier
~250 − 400 V
RctD
Rzc
Rmains
T1
Filtering
Setting Trip Sensitivity
The analog signal capture portion of the IC includes a
single pole filter that can be set externally with Cidf. This
provides an additional layer of protection against false
tripping under steady state noise conditions. High frequency
steady state noise is common with pumps, motors or other
cyclic noise generators.
The CTresD resistor sets the threshold for the differential
current fault levels. Increasing CTresD causes the fault
levels to trip at lower differential currents. CT efficiency at
60 Hz must be considered.
. CTresD= 400*#Turns – Subject to CT efficiency at 60 Hz
Cidf = 220 nF = 1 KHz low pass.
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6
NCS37005
PACKAGE DIMENSIONS
TSSOP−16
CASE 948F−01
ISSUE B
16X KREF
NOTES:
M
S
S
0.10 (0.004)
T U
V
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
S
0.15 (0.006) T U
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH. PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
K
K1
16
9
2X L/2
J1
SECTION N−N
B
−U−
L
J
PIN 1
IDENT.
N
8
0.25 (0.010)
1
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
M
S
0.15 (0.006) T U
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
A
−V−
N
A
B
4.90
4.30
−−−
0.05
0.50
5.10 0.193 0.200
4.50 0.169 0.177
1.20
F
C
D
F
−−− 0.047
0.15 0.002 0.006
0.75 0.020 0.030
DETAIL E
G
H
J
J1
K
K1
L
0.65 BSC
0.026 BSC
0.18
0.09
0.09
0.19
0.19
0.28 0.007 0.011
−W−
0.20 0.004 0.008
0.16 0.004 0.006
0.30 0.007 0.012
0.25 0.007 0.010
C
0.10 (0.004)
6.40 BSC
0.252 BSC
H
DETAIL E
SEATING
PLANE
−T−
M
0
8
0
8
_
_
_
_
D
G
SOLDERING FOOTPRINT
7.06
1
0.65
PITCH
01.36X6
16X
1.26
DIMENSIONS: MILLIMETERS
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7
NCS37005
PACKAGE DIMENSIONS
QFN16 3x3, 0.5P
CASE 485G−01
ISSUE F
NOTES:
D
A
B
L
L
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L1
PIN 1
LOCATION
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTIONS
E
MILLIMETERS
DIM MIN
0.80
A1 0.00
NOM MAX
A
0.90
0.03
1.00
0.05
2X
A3
0.10
C
EXPOSED Cu
MOLD CMPD
A3
b
D
0.20 REF
0.24
3.00 BSC
1.75
0.18
0.30
1.85
1.85
2X
0.10
C
TOP VIEW
D2 1.65
E
3.00 BSC
1.75
0.50 BSC
0.18 TYP
0.40
DETAIL B
A1
(A3)
E2 1.65
e
K
L
0.05
0.05
C
DETAIL B
ALTERNATE
A
C
0.30
0.50
0.15
CONSTRUCTIONS
L1 0.00
0.08
NOTE 4
A1
SEATING
PLANE
C
SIDE VIEW
0.10 C A
B
RECOMMENDED
SOLDERING FOOTPRINT*
DETAIL A
D2
16X
L
16X
0.58
8
PACKAGE
OUTLINE
4
1
9
E2
1
16X
K
2X
1.84
2X
3.30
16
16X b
16X
0.30
e
e/2
0.10 C A
B
0.05
C
NOTE 3
BOTTOM VIEW
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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NCS37005/D
相关型号：
NCS37010MNTWG
Ground Fault Circuit Interrupter (GFCI) with Self Test and Lockout 21579-003, 3000-REEL
ONSEMI
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