NCV33064DM-5R2G [ONSEMI]
Undervoltage Sensing Circuit;
| 型号： | NCV33064DM-5R2G |
| 厂家： | 
ONSEMI |
| 描述： | Undervoltage Sensing Circuit |
| 文件： | 总11页 (文件大小：126K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MC34064, MC33064,
NCV33064
Undervoltage Sensing
Circuit
The MC34064 is an undervoltage sensing circuit specifically
designed for use as a reset controller in microprocessor−based
systems. It offers the designer an economical solution for low voltage
detection with a single external resistor. The MC34064 features a
trimmed−in−package bandgap reference, and a comparator with
precise thresholds and built-in hysteresis to prevent erratic reset
operation. The open collector reset output is capable of sinking in
excess of 10 mA, and operation is guaranteed down to 1.0 V input with
low standby current. The MC devices are packaged in 3−pin TO-92,
micro size TSOP−5, 8−pin SOIC−8 and Micro8t surface mount
packages. The NCV device is packaged in SOIC−8 and TO−92.
Applications include direct monitoring of the 5.0 V MPU/logic
power supply used in appliance, automotive, consumer and industrial
equipment.
www.onsemi.com
SOIC−8
D SUFFIX
CASE 751
8
1
1
Micro8
DM SUFFIX
CASE 846A
8
TSOP−5
SN SUFFIX
CASE 483
5
Features
1
• Trimmed−In−Package Temperature Compensated Reference
• Comparator Threshold of 4.6 V at 25°C
• Precise Comparator Thresholds Guaranteed Over Temperature
• Comparator Hysteresis Prevents Erratic Reset
• Reset Output Capable of Sinking in Excess of 10 mA
• Internal Clamp Diode for Discharging Delay Capacitor
• Guaranteed Reset Operation with 1.0 V Input
• Low Standby Current
Pin 1. Ground
2. Input
3. Reset
4. NC
5. NC
TO−92
P SUFFIX
CASE 29
• Economical TO−92, TSOP−5, SOIC−8 and Micro8 Surface Mount
Pin 1. Reset
2. Input
3. Ground
Packages
1
1
2
2
3
3
BENT LEAD
• NCV Prefix for Automotive and Other Applications Requiring Site
and Control Changes
STRAIGHT LEAD
BULK PACK
TAPE & REEL
AMMO PACK
• These Devices are Pb−Free and are RoHS Compliant
Input
Reset
PIN CONNECTIONS
1
2
3
4
8
7
6
5
Reset
N.C.
N.C.
N.C.
N.C.
Input
N.C.
Ground
(Top View)
1.2 V
ref
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
GND
Sink Only
Positive True Logic
=
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 7 of this data sheet.
This device contains 21 active transistors.
Figure 1. Representative Block Diagram
© Semiconductor Components Industries, LLC, 2016
1
Publication Order Number:
October, 2016 − Rev. 19
MC34064/D
MC34064, MC33064, NCV33064
MAXIMUM RATINGS
Rating
Symbol
Value
−1.0 to 10
10
Unit
V
Power Input Supply Voltage
Reset Output Voltage
V
in
O
V
V
Reset Output Sink Current (Note 2)
I
Internally
Limited
mA
Sink
Clamp Diode Forward Current, Reset to Input Pin (Note 2)
I
F
100
mA
Power Dissipation and Thermal Characteristics
P Suffix, Plastic Package
P
625
200
mW
°C/W
D
Maximum Power Dissipation @ T = 25°C
A
R
q
JA
Thermal Resistance, Junction−to−Air
D Suffix, Plastic Package
P
D
625
200
mW
°C/W
Maximum Power Dissipation @ T = 25°C
A
R
q
JA
Thermal Resistance, Junction−to−Air
DM Suffix, Plastic Package
520
240
mW
°C/W
P
D
Maximum Power Dissipation @ T = 25°C
R
A
q
JA
Thermal Resistance, Junction−to−Air
Operating Junction Temperature
T
+150
°C
°C
J
Operating Ambient Temperature
MC34064
T
A
0 to +70
−40 to +85
−40 to +125
MC33064
NCV33064
Storage Temperature Range
T
stg
−65 to +150
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. ESD data available upon request.
ELECTRICAL CHARACTERISTICS (For typical values T = 25°C, for min/max values T is the operating ambient temperature range
A
A
that applies [Notes 3 and 4] unless otherwise noted.)
Characteristics
Symbol
Min
Typ
Max
Unit
COMPARATOR
Threshold Voltage
V
High State Output (V Increasing)
Low State Output (V Decreasing)
Hysteresis
V
V
V
4.5
4.5
0.01
4.61
4.59
0.02
4.7
4.7
0.05
in
IH
in
IL
H
RESET OUTPUT
Output Sink Saturation
V
OL
V
(V = 4.0 V, I
= 8.0 mA)
= 2.0 mA)
= 0.1 mA)
−
−
−
0.46
0.15
−
1.0
0.4
0.1
in
Sink
Sink
Sink
(V = 4.0 V, I
in
(V = 1.0 V, I
in
Output Sink Current (V , Reset = 4.0 V)
I
10
−
27
0.02
0.9
60
0.5
1.2
mA
mA
V
in
Sink
Output Off-State Leakage (V , Reset = 5.0 V)
I
OH
in
Clamp Diode Forward Voltage, Reset to Input Pin (I = 10 mA)
V
F
0.6
F
TOTAL DEVICE
Operating Input Voltage Range
V
1.0 to 6.5
−
−
−
V
in
Quiescent Input Current (V = 5.0 V)
I
in
390
500
mA
in
2. Maximum package power dissipation limits must be observed.
3. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
4. T
= 0°C for MC34064
−40°C for MC33064
−40°C for NCV33064
T
=
+70°C for MC34064
+85°C for MC33064
+125°C for NCV33064
low
high
5. NCV prefix is for automotive and other applications requiring site and change control.
www.onsemi.com
2
MC34064, MC33064, NCV33064
10
8.0
6.0
4.0
2.0
0
5.0
R = 10 k to V
L
T = 25°C
A
R = 10 k to V
L
T = 25°C
A
in
in
4.0
3.0
2.0
1.0
0
0
2.0
4.0
6.0
8.0
10
4.560
4.580
4.600
V , INPUT VOLTAGE (V)
4.620
4.640
V , INPUT VOLTAGE (V)
in
in
Figure 2. Reset Output Voltage versus
Input Voltage
Figure 3. Reset Output Voltage versus
Input Voltage
4.630
4.620
4.610
4.600
4.590
4.580
4.570
1.0
R = 10 k to V
L
in
T = +25°C
A
Upper Threshold
High State Output
0.8
0.6
0.4
0.2
0
-40°C
+85°C
T = +25°C
A
+85°C
-40°C
Lower Threshold
Low State Output
-55
-25
0
25
50
75
100
125
0
2.0
4.0
6.0
8.0
10
T , AMBIENT TEMPERATURE (°C)
A
V , INPUT VOLTAGE (V)
in
Figure 4. Comparator Threshold Voltage
versus Temperature
Figure 5. Input Current versus Input Voltage
2.0
1.5
1.0
0.5
0
Reset
V = 4.0 V
in
V = 5.0 V to 4.0 V
in
R = 10 k
T = 25°C
A
T = 25°C
90%
A
L
T = 85°C
A
V
in
T = -40°C
A
5.0 V -
4.0 V -
V
in
10k
5.0V
4.0V
Reset
10%
REF
0
10
20
, SINK CURRENT (mA)
30
40
I
200 ns/DIV
Sink
Figure 6. Reset Output Saturation versus
Sink Current
Figure 7. Reset Delay Time
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3
MC34064, MC33064, NCV33064
80
60
40
20
0
V = 0 V
in
T = 25°C
A
0
0.4
0.8
V , FORWARD VOLTAGE (V)
1.2
1.6
Fꢀ
Figure 8. Clamp Diode Forward Current versus Voltage
+
R
Input
Reset
Power
Supply
Microprocessor
Circuit
C
-
DLY
-
+
A time delayed reset can be accomplished with the
addition of C . For systems with extremely fast
DLY
power supply rise times (<500 ns) it is recommended
1.2 V
ref
that the RC time constant be greater than 5.0 ms.
V
DLY
is the microprocessor reset input threshold.
th(MPU)
GND
1
V
t
= RC In
DLY
th(MPU)
DLY
1 -
V
in
Figure 9. Low Voltage Microprocessor Reset
TEST DATA
V
(mV)
DV
(mV)
R
(W)
R
L
(kW)
H
th
H
R
H
+
I
in
20
51
0
0
0
Input
R
L
3.4
6.8
6.8
10
10
16
16
34
34
51
51
10
1.5
4.7
1.5
2.7
1.5
2.7
1.5
2.7
1.5
2.7
1.5
Power
Supply
Microprocessor
Circuit
40
20
Reset
4.6 R
81
20
-
71
30
-
112
100
164
190
327
276
480
30
+
H
47
V
≈
+ 0.02
H
R
L
47
1.2V
ref
100
100
150
150
-6
DV
≈ 340 R x 10
th(lower)
H
Where:ꢁR ≤ 150 W
Where:ꢁR ≥ 1.5 W, ≤ 10 kW
H
GND
L
Comparator hysteresis can be increased with the addition of resistor R . The hysteresis equation has been
H
simplified and does not account for the change of input current I as V crosses the comparator threshold
in
CC
(Figure 4). An increase of the lower threshold DV
will be observed due to I which is typically 340 mA at
in
4.59ꢂV. The equations are accurate to 10% with R less than 150 W and R between 1.5 kW and 10 kW.
th(lower)
H
L
Figure 10. Low Voltage Microprocessor Reset with Additional Hysteresis
www.onsemi.com
4
MC34064, MC33064, NCV33064
+
1.0k
+
-
Input
Input
Power
Supply
Reset
Reset
-
-
+
-
+
Solar
Cells
1.2V
1.2V
ref
ref
GND
GND
Figure 11. Voltage Monitor
Figure 12. Solar Powered Battery Charger
25mH
MPSW51A
V = 11.5
in
to 14.5V
V = 5.0 V
O
I = 50 mA
+
+
O
470
1N5819
470
22
+
680
1.2k
4.7k
330
1N756
Test
Conditions
= 11.5 V to 14.5 V, I = 50 mA
Results
35 mV
12 mV
60 mVpp
77%
Input
Line Regulation
Load Regulation
Output Ripple
Efficiency
V
in
V
in
V
in
V
in
O
Reset
= 12.6 V, I = 0 mA to 50 mA
O
-
+
= 12.6 V, I = 50 mA
O
= 12.6 V, I = 50 mA
O
1.2V
ref
GND
Figure 13. Low Power Switching Regulator
V
CC
R
L
MTP3055EL
270
4.6V
Input
Reset
-
+
1.2V
ref
GND
Overheating of the logic level power MOSFET due to insufficient gate voltage can be prevented with the above
2
circuit. When the input signal is below the 4.6 V threshold of the MC34064, its output grounds the gate of the L
MOSFET.
Figure 14. MOSFET Low Voltage Gate Drive Protection
www.onsemi.com
5
MC34064, MC33064, NCV33064
ORDERING INFORMATION
†
Device
Operating Temperature Range
Package
Shipping
MC34064D−5G
SOIC−8
(Pb−Free)
98 Units / Rail
MC34064D−5R2G
MC34064DM−5R2G
MC34064P−5G
SOIC−8
(Pb−Free)
2500 Units/ Tape & Reel
4000 Units / Tape & Reel
2000 Units / Bag
Micro8
(Pb−Free)
TO−92
(Pb−Free)
T = 0°C to +70°C
A
MC34064P−5RAG
MC34064P−5RPG
MC34064P−5RMG
MC34064SN−5T1G
MC33064D−5G
TO−92
(Pb−Free)
2000 Units / Tape & Reel
2000 Units / Ammo Pack
TO−92
(Pb−Free)
TO−92
(Pb−Free)
TSOP−5
(Pb−Free)
3000 Units / Tape & Reel
98 Units / Rail
SOIC−8
(Pb−Free)
MC33064D−5R2G
MC33064DM−5R2G
MC33064P−5G
SOIC−8
(Pb−Free)
2500 Units / Tape & Reel
4000 Units / Tape & Reel
2000 Units / Bag
Micro8
(Pb−Free)
TO−92
(Pb−Free)
T = −40°C to +85°C
A
MC33064P−5RAG
MC33064P−5RPG
MC33064SN−5T1G
NCV33064D−5R2G*
NCV33064P−5RAG*
NCV33064P−5RPG*
NCV33064DM−5R2G*
TO−92
(Pb−Free)
2000 Units / Tape & Reel
2000 Units / Ammo Pack
3000 Units / Tape & Reel
2500 Units / Tape & Reel
2000 Units / Tape & Reel
2000 Units / Ammo Pack
4000 Units / Tape & Reel
TO−92
(Pb−Free)
TSOP−5
(Pb−Free)
SOIC−8
(Pb−Free)
TO−92
(Pb−Free)
T = −40°C to +125°C
A
TO−92
(Pb−Free)
Micro8
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, pleaserefer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NCV33064: T
change control.
= −40°C, T
= +125°C. Guaranteed by design. NCV prefix is for automotive and other applications requiring site and
low
high
www.onsemi.com
6
MC34064, MC33064, NCV33064
MARKING DIAGRAMS
SOIC−8
D SUFFIX
CASE 751
Micro8
DM SUFFIX
CASE 846A
TO−92
P SUFFIX
CASE 29
8
1
8
8
8
MC3x0
64P−5
ALYWG
G
NCV30
64P−5
ALYWG
G
3x064
V3064
ALYW5
G
ALYW5
Ly50
AYW G
G
VI50
AYW G
G
G
1
1
1
1
2
3
1
2 3
TSOP−5
SN SUFFIX
CASE 483
5
1
5
SRB AYWG
SSN AYWG
G
G
1
MC34064
MC33064
x
y
= 3 or 4
= C or I
A
L
= Assembly Location
= Wafer Lot
Y
W
G
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
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7
MC34064, MC33064, NCV33064
PACKAGE DIMENSIONS
SOIC−8
D SUFFIX
CASE 751−07
ISSUE AK
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
−X−
A
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
8
5
4
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
S
M
M
B
0.25 (0.010)
Y
1
K
−Y−
G
MILLIMETERS
DIM MIN MAX
INCHES
MIN
MAX
0.197
0.157
0.069
0.020
A
B
C
D
G
H
J
K
M
N
S
4.80
3.80
1.35
0.33
5.00 0.189
4.00 0.150
1.75 0.053
0.51 0.013
C
N X 45
_
SEATING
PLANE
−Z−
1.27 BSC
0.050 BSC
0.10 (0.004)
0.10
0.19
0.40
0
0.25 0.004
0.25 0.007
1.27 0.016
0.010
0.010
0.050
8
0.020
0.244
M
J
H
D
8
0
_
_
_
_
0.25
5.80
0.50 0.010
6.20 0.228
M
S
S
X
0.25 (0.010)
Z
Y
SOLDERING FOOTPRINT*
1.52
0.060
7.0
4.0
0.275
0.155
0.6
0.024
1.270
0.050
mm
inches
ǒ
Ǔ
SCALE 6:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
8
MC34064, MC33064, NCV33064
PACKAGE DIMENSIONS
Micro8
DM SUFFIX
CASE 846A−02
ISSUE J
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. 846A-01 OBSOLETE, NEW STANDARD 846A-02.
H
E
E
MILLIMETERS
INCHES
NOM
−−
0.003
0.013
0.007
0.118
DIM
A
A1
b
c
D
MIN
−−
NOM
−−
MAX
MIN
−−
MAX
0.043
0.006
0.016
0.009
0.122
0.122
PIN 1 ID
e
1.10
0.15
0.40
0.23
3.10
3.10
b 8 PL
0.05
0.25
0.13
2.90
2.90
0.08
0.002
0.010
0.005
0.114
0.114
0.33
M
S
S
0.08 (0.003)
T B
A
0.18
3.00
E
3.00
0.118
e
L
0.65 BSC
0.55
4.90
0.026 BSC
0.021
0.193
SEATING
PLANE
0.40
4.75
0.70
5.05
0.016
0.187
0.028
0.199
−T−
H
E
A
0.038 (0.0015)
L
A1
c
RECOMMENDED
SOLDERING FOOTPRINT*
8X
8X
0.48
0.80
5.25
0.65
PITCH
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
9
MC34064, MC33064, NCV33064
PACKAGE DIMENSIONS
TSOP−5
SN SUFFIX
CASE 483
ISSUE M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
NOTE 5
5X
D
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
0.20 C A B
2X
0.10
T
M
5
4
3
2X
0.20
T
B
S
1
2
K
B
A
DETAIL Z
G
A
MILLIMETERS
TOP VIEW
DIM
A
B
C
D
G
H
J
K
M
S
MIN
2.85
1.35
0.90
0.25
MAX
3.15
1.65
1.10
0.50
DETAIL Z
J
0.95 BSC
C
0.01
0.10
0.20
0
0.10
0.26
0.60
0.05
H
SEATING
PLANE
END VIEW
C
10
3.00
_
_
SIDE VIEW
2.50
SOLDERING FOOTPRINT*
1.9
0.074
0.95
0.037
2.4
0.094
1.0
0.039
0.7
0.028
mm
inches
ǒ
Ǔ
SCALE 10:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
10
MC34064, MC33064, NCV33064
PACKAGE DIMENSIONS
TO−92 (TO−226)
P SUFFIX
CASE 29−11
ISSUE AM
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
A
STRAIGHT LEAD
BULK PACK
B
R
4. LEAD DIMENSION IS UNCONTROLLED IN P AND
BEYOND DIMENSION K MINIMUM.
P
L
INCHES
DIM MIN MAX
MILLIMETERS
SEATING
PLANE
K
MIN
4.45
4.32
3.18
0.407
1.15
2.42
0.39
12.70
6.35
2.04
---
MAX
5.20
5.33
4.19
0.533
1.39
2.66
0.50
---
A
B
C
D
G
H
J
0.175
0.170
0.125
0.016
0.045
0.095
0.015
0.500
0.250
0.080
---
0.205
0.210
0.165
0.021
0.055
0.105
0.020
---
D
X X
G
J
H
V
K
L
---
---
N
P
R
V
0.105
0.100
---
2.66
2.54
---
C
SECTION X−X
0.115
0.135
2.93
3.43
1
N
---
---
N
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. CONTOUR OF PACKAGE BEYOND
DIMENSION R IS UNCONTROLLED.
A
BENT LEAD
TAPE & REEL
AMMO PACK
B
R
4. LEAD DIMENSION IS UNCONTROLLED IN P
AND BEYOND DIMENSION K MINIMUM.
P
T
SEATING
PLANE
MILLIMETERS
DIM MIN
MAX
5.20
5.33
4.19
0.54
2.80
0.50
---
K
A
B
C
D
G
J
4.45
4.32
3.18
0.40
2.40
0.39
12.70
2.04
1.50
2.93
3.43
D
X X
G
K
N
P
R
V
J
2.66
4.00
---
V
C
---
SECTION X−X
1
N
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